CN205645301U - Tin -plated copper wire - Google Patents
Tin -plated copper wire Download PDFInfo
- Publication number
- CN205645301U CN205645301U CN201620240558.1U CN201620240558U CN205645301U CN 205645301 U CN205645301 U CN 205645301U CN 201620240558 U CN201620240558 U CN 201620240558U CN 205645301 U CN205645301 U CN 205645301U
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- CN
- China
- Prior art keywords
- layer
- conductor
- barrier layer
- tin
- core
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Abstract
The utility model provides a tin -plated copper wire, including conductor conductor, locate the surperficial insulating layer of this conductor conductor, locate the shielding layer on this insulating layer surface, and locate the protective layer on this shielding layer surface, this conductor conductor includes the copper core, locates the barrier layer on this copper core surface to and locate the surperficial tin coating in this barrier layer, is this barrier layer zinc the evanohm layer. Above -mentioned tin -plated copper wire, owing to be equipped with this barrier layer between this the copper core among this conductor conductor and this tin coating, thus can effectively prevent this tin coating jaundice, and zinc is adopted on this barrier layer chromium alloy material for this tin -plated copper wire's weldbility is not influenced, thereby the thickness of this tin coating can the attenuate, in order to reduce former material consumption and to practice thrift manufacturing cost.
Description
Technical field
This utility model relates to Power-line technology field, particularly to a kind of tinned wird.
Background technology
Owing to the resistivity ratio of copper is relatively low, ductility is good, is not easily broken, and price is relatively cheap, so
Copper is used as the electric wire in daily life.And copper exposes and is the most easily oxidized to form Aerugo, leading of Aerugo
Electrical very poor meeting causes the resistance of copper cash to increase, and can effectively prevent insulation rubber tacky and copper copper wire tin-plating
Wire core blackout becomes fragile, and improves copper cash solderability.Therefore most for transmitting the electric wire of electric energy on market
Number is all tinned wird.
At present, in tinned wird production process, some manufacturer, in order to reduce cost, can reduce as far as possible
The thickness of tin coating, when tin coating is crossed thin, through diffusion, the thickness of tin coating can be the most thinning,
May be wholly absent eventually, and the color of tin coating also can slowly change, and present faint yellow in appearance
Or bluish yellow color.Owing to copper cash is after completing tin plating technique, high temperature stoving process can be carried out, such that plating
The diffusion velocity of tin layers is accelerated so that tin coating turns to be yellow and affects tin plating effect.
Utility model content
Based on this, the purpose of this utility model is to provide a kind of solution and causes tin coating jaundice problem because of diffusion
Tinned wird.
A kind of tinned wird, including core conductor, is located at the insulating barrier of this core conductive surface, is located at this exhausted
The screen layer on edge layer surface, and it is located at the protective layer on this screen layer surface, this core conductor includes copper core, if
In the barrier layer on this copper core surface, and being located at the tin coating of this barrier layer surface, this barrier layer is that zinc-chromium closes
Layer gold.
Further, the generation type on this barrier layer is the one in the middle of plating or spraying.
Further, this insulating barrier is half-mature polytetrafluoroethylene floor.
Further, this screen layer is the one in the middle of metallization paper tape or quasiconductor paper tape.
Further, this protective layer is the one in the middle of polyfluorinated ethylene layer or TPE layer.
Above-mentioned tinned wird, owing to being provided with this barrier layer between this copper core in this core conductor and this tin coating,
It is possible to effectively prevent this tin coating to turn to be yellow, and this barrier layer uses zinc-chromium alloy material so that this is tin plating
The solderability of copper cash is unaffected, thus the thickness of this tin coating can be thinning, with reduce raw materials consumption and
Save production cost.
Accompanying drawing explanation
Fig. 1 is the structural representation of a kind of tinned wird in this utility model first embodiment.
Fig. 2 is the schematic cross-section of Fig. 1 center line core conductor.
Fig. 3 is the schematic cross-section of this utility model the second embodiment center line core conductor.
Fig. 4 is the schematic cross-section of this utility model the 3rd embodiment center line core conductor.
Fig. 5 is the schematic cross-section of this utility model the 4th embodiment center line core conductor.
Detailed description of the invention
For the ease of understanding this utility model, below with reference to relevant drawings, this utility model is carried out more comprehensively
Description.Accompanying drawing gives some embodiments of the present utility model.But, this utility model can be to be permitted
The most different forms realizes, however it is not limited to embodiment described herein.On the contrary, provide these to implement
The purpose of example is to make to disclosure of the present utility model more thoroughly comprehensively.
It should be noted that when element is referred to as " being fixedly arranged on " another element, and it can be directly at another yuan
On part or element placed in the middle can also be there is.When an element is considered as " connection " another element, and it can
To be directly to another element or to may be simultaneously present centering elements.Term as used herein " is hung down
Straight ", " level ", "left", "right" and similar statement for illustrative purposes only.
Unless otherwise defined, all of technology used herein and scientific terminology with belong to of the present utility model
The implication that those skilled in the art are generally understood that is identical.Institute in description of the present utility model herein
The term used is intended merely to describe the purpose of specific embodiment, it is not intended that in limiting this utility model.
Term as used herein " and/or " include the arbitrary and all of of one or more relevant Listed Items
Combination.
Refer to Fig. 1 and Fig. 2, a kind of tinned wird provided in first embodiment in this utility model, including
Core conductor 10, is located at the insulating barrier 11 on this core conductor 10 surface, is located at the screen on this insulating barrier 11 surface
Cover layer 12, and be located at the protective layer 13 on this screen layer 12 surface.
This core conductor 10 includes copper core 101, is located at the barrier layer 102, Yi Jishe on this copper core 101 surface
In the tin coating 103 on this surface, barrier layer 102, this barrier layer 102 is zinc-chromium alloy layer.This barrier layer 102
The mode using plating or spraying is formed at the surface of this copper core 101.
This insulating barrier 11 uses half-mature politef to make, for by this core conductor 10 and the earth or its
Keep apart between its conductor, to ensure the conveying of electric energy.
This screen layer 12 uses metallization paper tape or quasiconductor paper tape to make, for produced by this tinned wird
The electromagnetic-field-shielded inside at electric wire, prevents the other element of electromagnetic field effects.
This protective layer 13 uses polyfluorinated ethylene or TPE to make, and is used for protecting this tinned wird miscellaneous from the external world
Matter and the intrusion of moisture, and prevent external force from directly damaging this tinned wird.
To sum up, in this utility model above-described embodiment, due to this copper core 101 in this core conductor 10 with should
It is provided with this barrier layer 102 between tin coating 103, it is possible to effectively prevent this tin coating 103 to turn to be yellow, and is somebody's turn to do
Barrier layer 102 uses zinc-chromium alloy material so that the solderability of this tinned wird is unaffected, thus this plating
The thickness of tin layers 103 can be thinning, to reduce raw materials consumption and to save production cost.
Refer to Fig. 3, show for the cross section of this core conductor 10 in this utility model tinned wird the second embodiment
Being intended to, this core conductor 10 in the present embodiment is more or less the same with this core conductor 10 in first embodiment,
This core conductor 10 that difference is in the present embodiment is on the basis of first embodiment, in this copper core 101
And being provided with nanometer adhesive aid layer 104 between this barrier layer 102, this nanometer adhesive aid layer 104 can be effective
Prevent this barrier layer 102 from coming off from this copper core 101.
Refer to Fig. 4, show for the cross section of this core conductor 10 in this utility model tinned wird the second embodiment
Being intended to, this core conductor 10 in the present embodiment is more or less the same with this core conductor 10 in first embodiment,
This core conductor 10 that difference is in the present embodiment is on the basis of first embodiment, on this barrier layer
This nanometer adhesive aid layer 105 it is provided with, this nanometer adhesive aid layer 105 energy between 102 and this tin coating 103
Enough effectively prevent this tin coating 103 from coming off from this barrier layer 102.
Refer to Fig. 5, show for the cross section of this core conductor 10 in this utility model tinned wird the second embodiment
Being intended to, this core conductor 10 in the present embodiment is more or less the same with this core conductor 10 in first embodiment,
This core conductor 10 that difference is in the present embodiment is on the basis of first embodiment, in this copper core 101
And it is provided with adhesive aid layer 106 between this barrier layer 102, between this barrier layer 102 and this tin coating 103
Being provided with adhesive aid layer 107, this nanometer adhesive aid layer 106 can effectively prevent this barrier layer 102 from this copper
Come off on core 101, this nanometer adhesive aid layer 107 can effectively this tin coating 103 from this barrier layer 102
On come off.
Embodiment described above only have expressed several embodiments of the present utility model, its describe more concrete and
In detail, but therefore can not be interpreted as the restriction to this utility model the scope of the claims.It should be pointed out that,
For the person of ordinary skill of the art, without departing from the concept of the premise utility, it is also possible to
Making some deformation and improvement, these broadly fall into protection domain of the present utility model.Therefore, this utility model
The protection domain of patent should be as the criterion with claims.
Claims (5)
1. a tinned wird, including core conductor, is located at the insulating barrier of this core conductive surface, is located at this
The screen layer of surface of insulating layer, and it is located at the protective layer on this screen layer surface, it is characterised in that: this core is led
Body includes copper core, is located at the barrier layer on this copper core surface, and is located at the tin coating of this barrier layer surface, should
Barrier layer is zinc-chromium alloy layer.
Tinned wird the most according to claim 1, it is characterised in that the generation type on this barrier layer is
One in the middle of plating or spraying.
Tinned wird the most according to claim 1, it is characterised in that this insulating barrier is half-mature polytetrafluoro
Pvdf layer.
Tinned wird the most according to claim 1, it is characterised in that this screen layer is metallization paper tape
Or the one in the middle of quasiconductor paper tape.
Tinned wird the most according to claim 1, it is characterised in that this protective layer is polyfluorinated ethylene
One in the middle of layer or TPE layer.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201620240558.1U CN205645301U (en) | 2016-03-25 | 2016-03-25 | Tin -plated copper wire |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201620240558.1U CN205645301U (en) | 2016-03-25 | 2016-03-25 | Tin -plated copper wire |
Publications (1)
Publication Number | Publication Date |
---|---|
CN205645301U true CN205645301U (en) | 2016-10-12 |
Family
ID=57073986
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201620240558.1U Expired - Fee Related CN205645301U (en) | 2016-03-25 | 2016-03-25 | Tin -plated copper wire |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN205645301U (en) |
-
2016
- 2016-03-25 CN CN201620240558.1U patent/CN205645301U/en not_active Expired - Fee Related
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20161012 Termination date: 20170325 |
|
CF01 | Termination of patent right due to non-payment of annual fee |