CN205644423U - Computer chip water cooling plant - Google Patents

Abstract

The utility model discloses a computer chip water cooling device, which comprises a heat conduction plate, a vertical cooling device and a circulation pipeline. plate array, the left and right sides of the cavity are respectively provided with a water outlet pipe head and a water inlet pipe head. The heat dissipation device includes a heat dissipation chamber, and an inlet joint and an outlet joint are arranged on the heat dissipation chamber. A flat tube array composed of hollow flat tubes is arranged on the heat dissipation chamber, and heat dissipation fins are arranged between adjacent flat pipes. Constituting a heat dissipation fin array, the utility model has high heat exchange efficiency, simple structure, low processing cost, obvious effect, strong practicability, avoids burning of computer chips due to overheating, and prolongs the service life of the machine.

Description

A computer chip water cooling device

technical field

The utility model relates to a water cooling device, in particular to a computer chip water cooling device.

Background technique

A computer, commonly known as a computer, is an electronic computing machine used for high-speed calculations. It can perform numerical calculations, logical calculations, and has storage and memory functions. It is a modern intelligent electronic device that can run according to the program and process massive data automatically and at high speed. Composed of hardware systems and software systems, computers without any software installed are called bare metal. It can be divided into five categories: supercomputers, industrial control computers, network computers, personal computers, and embedded computers. The more advanced computers include biological computers, photonic computers, quantum computers, etc.; It is not good, and it is worse in high temperature environment, and computer chips are easy to absorb dust in the environment.

Utility model content

The purpose of this utility model is to provide a computer chip water cooling device to solve the problems raised in the above-mentioned background technology.

In order to achieve the above object, the utility model provides the following technical solutions:

A water-cooling device for computer chips, comprising a heat conduction plate, a vertical cooling device and a circulation pipeline, a cavity is provided in the middle above the heat conduction plate, and a spoiler horizontal plate array composed of spoiler horizontal plates is arranged in the cavity, and the cavity The left and right sides are respectively equipped with a water outlet pipe head and a water inlet pipe head. Both the water outlet pipe head and the water inlet pipe head are connected with a vertical cooling device through a cooling pipe. The vertical cooling device is located on the left and right sides of the cavity. The heat dissipation chamber is provided with an inlet joint and an outlet joint, and a flat tube array composed of hollow flat tubes is provided on the heat dissipation chamber, and heat dissipation fins are arranged between adjacent flat pipes, and the heat dissipation fins form a heat dissipation fin array. , the vertical cooling devices are connected with circulation pipes, the circulation pipes are provided with a circulation pump, and the circulation pump is located above the cavity, and at the same time, a cross-flow fan is provided outside the vertical heat dissipation devices.

Further, the heat conduction plate is an aluminum alloy plate, and the surface is plated with silver.

Further, the heat dissipation fins are made of aluminum alloy.

Compared with the prior art, the utility model has the advantages of high heat exchange efficiency, simple structure, low processing cost, obvious effect, strong practicability, avoids burning of computer chips due to overheating, and prolongs the service life of the machine.

Description of drawings

Fig. 1 is a schematic structural diagram of a computer chip water cooling device.

Fig. 2 is a structural schematic diagram of a vertical cooling device in a computer chip water cooling device.

detailed description

The technical solution of this patent will be further described in detail below in conjunction with specific embodiments.

Please refer to Fig. 1-2, a kind of computer chip water-cooling device, comprises heat-conducting plate 1, vertical cooling device 4 and circulating pipeline 5, and described heat-conducting plate 1 is provided with cavity 2 in the upper middle part, and cavity 2 is provided with The spoiler horizontal plate array 21 composed of flow horizontal plates 22 adheres the heat conduction plate 1 to the upper surface of the chip through silica gel. When the refrigerant enters the heat conduction plate 1, the refrigerant acts on the staggered spoiler horizontal plates 22 Next, the refrigerant quickly takes away the heat of the chip. The left and right sides of the cavity 2 are respectively provided with a water outlet head 23 and an inlet pipe head 24. Device 4, the vertical heat dissipation device 4 is located on the left and right sides of the cavity 2, the vertical heat dissipation device 4 includes a heat dissipation chamber 41, the heat dissipation chamber 41 is provided with an inlet joint 43 and an outlet joint 44, and the heat dissipation chamber 41 is provided with a hollow A flat tube array 42 composed of flat tubes 45, heat dissipation fins 46 are arranged between adjacent flat tubes 45, and the heat dissipation fins 46 form a heat dissipation fin array to ensure the pertinence and high efficiency of heat dissipation. Vertical heat dissipation device 4 A circulation pipeline 5 is connected between them, and a circulation pump 51 is arranged on the circulation pipeline 5, and the circulation pump 51 is located above the cavity 2. At the same time, a cross-flow fan 6 is arranged on the outside of the vertical cooling device 4, which strengthens the heat dissipation effect of the present utility model. .

The preferred implementation of this patent has been described in detail above, but this patent is not limited to the above-mentioned implementation. Within the scope of knowledge of those of ordinary skill in the art, various implementations can be made without departing from the purpose of this patent. kind of change.

Claims (3)

1. A computer chip water-cooling device, comprising a heat conducting plate, a vertical cooling device and a circulation pipeline, is characterized in that a cavity is provided in the middle part above the heat conducting plate, and a spoiler composed of a spoiler horizontal plate is provided in the cavity Horizontal plate array, the left and right sides of the cavity are respectively provided with outlet pipe heads and water inlet pipe heads, both of which are connected with vertical cooling devices through cooling pipes, and the vertical cooling devices are located on the left and right sides of the cavity, The vertical heat dissipation device includes a heat dissipation chamber, and the heat dissipation chamber is provided with an inlet joint and an outlet joint. The heat dissipation chamber is provided with a flat tube array composed of hollow flat tubes, and heat dissipation fins are arranged between adjacent flat pipes. The fins form an array of heat dissipation fins, a circulation pipe is connected between the vertical heat dissipation devices, a circulation pump is arranged on the circulation pipe, and the circulation pump is located above the cavity, and a cross-flow fan is provided outside the vertical heat dissipation device. 2. The computer chip water-cooling device according to claim 1, wherein the heat conducting plate is an aluminum alloy plate, and the surface is plated with silver. 3. The computer chip water-cooling device according to claim 1, wherein the heat dissipation fins are made of aluminum alloy.