CN205620919U - Main frame machine case with function of independently dispelling heat - Google Patents
Main frame machine case with function of independently dispelling heat Download PDFInfo
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- CN205620919U CN205620919U CN201620437998.6U CN201620437998U CN205620919U CN 205620919 U CN205620919 U CN 205620919U CN 201620437998 U CN201620437998 U CN 201620437998U CN 205620919 U CN205620919 U CN 205620919U
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 29
- 238000007664 blowing Methods 0.000 claims abstract description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 15
- 239000000741 silica gel Substances 0.000 claims description 15
- 229910002027 silica gel Inorganic materials 0.000 claims description 15
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- 238000001816 cooling Methods 0.000 claims description 3
- 239000011159 matrix material Substances 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 3
- 238000009423 ventilation Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000002269 spontaneous effect Effects 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
本实用新型提供一种散热性能优良、结构简单、易于实现的具有自主散热功能的计算机主机机箱，包括机箱外壳、设置于所述机箱外壳内的线路板；在所述机箱外壳的左侧壁或右侧壁上设置有进风口和排风口；所述进风口横向设置，且所述进风口设置在所述机箱外壳的左侧壁或右侧壁的上部，所述排风口纵向设置，且所述排风口设置在所述进风口的下方；在所述进风口和排风口上均设置有网状滤网；在所述排风口内侧还设有排风扇；还包括设置于所述线路板上的散热机构，还包括控制器、至少一个温度传感器，所述温度传感器紧贴所述导热板设置，且所述温度传感器与所述控制器连接，所述排风扇、吹风扇分别通过一个继电器与所述控制器连接。
The utility model provides a computer mainframe chassis with an independent heat dissipation function, which has excellent heat dissipation performance, simple structure and is easy to realize. The right side wall is provided with an air inlet and an air outlet; the air inlet is arranged horizontally, and the air inlet is arranged on the left side wall or the upper part of the right side wall of the chassis shell, and the air outlet is arranged longitudinally, And the air outlet is arranged below the air inlet; a mesh filter is arranged on the air inlet and the air outlet; an exhaust fan is also arranged inside the air outlet; The heat dissipation mechanism on the circuit board also includes a controller and at least one temperature sensor, the temperature sensor is arranged close to the heat conducting plate, and the temperature sensor is connected to the controller, and the exhaust fan and the blowing fan pass through a A relay is connected with the controller.
Description
技术领域technical field
本实用新型涉及计算机技术领域，尤其涉及一种具有自主散热功能的计算机主机机箱。The utility model relates to the technical field of computers, in particular to a computer host case with an independent heat dissipation function.
背景技术Background technique
计算机主机箱作为计算机的控制中心对计算机起着至观重要的作用，而在其主机箱的长时间使用中，其线路板自身会产生大量的热量，而这些热量需要进行及时消除，而如果此热量不能及时的排出，轻则将导致计算机运行速度的减慢并影响计算机的稳定性，重则将导致线路板的烧坏、并发生自燃等现象，而现有技术中采用的是在主机箱中设置一个排风扇，并在主机箱的尾部设置相应的排风口解决上述问题；而现有的主机箱一般是放在桌子下面，且其主机箱的尾部与桌面侧壁临近放置，此种现象将倒置热风的散热不畅，不利于主机箱的散热，而在炎热的夏季其热量更大，更不易于散热，因此，确有必要对上述问题予以解决。As the control center of the computer, the main box of the computer plays a very important role in the computer. During the long-term use of the main box, the circuit board itself will generate a lot of heat, which needs to be eliminated in time. If this If the heat cannot be discharged in time, it will slow down the running speed of the computer and affect the stability of the computer. If it is serious, it will cause the circuit board to burn out and spontaneous combustion. Set an exhaust fan in the middle of the main box, and set corresponding exhaust outlets at the tail of the main box to solve the above problems; while the existing main box is generally placed under the table, and the tail of the main box is placed close to the side wall of the desktop, this phenomenon The heat dissipation of the inverted hot air is not smooth, which is not conducive to the heat dissipation of the main chassis, and its heat is larger in hot summer, and it is more difficult to dissipate heat. Therefore, it is really necessary to solve the above problems.
发明内容Contents of the invention
本实用新型的目的在于克服现有技术的不足，适应现实需要，提供一种散热性能优良、结构简单、易于实现的具有自主散热功能的计算机主机机箱。The purpose of the utility model is to overcome the deficiencies of the prior art, meet the needs of the reality, and provide a computer mainframe chassis with an independent heat dissipation function, which has excellent heat dissipation performance, simple structure and is easy to realize.
为了实现本实用新型的目的，本实用新型所采用的技术方案为：In order to realize the purpose of the utility model, the technical scheme adopted in the utility model is:
设计一种具有自主散热功能的计算机主机机箱，包括机箱外壳、设置于所述机箱外壳内的线路板；在所述机箱外壳的左侧壁或右侧壁上设置有进风口和排风口；所述进风口横向设置，且所述进风口设置在所述机箱外壳的左侧壁或右侧壁的上部，所述排风口纵向设置，且所述排风口设置在所述进风口的下方；在所述进风口和排风口上均设置有网状滤网；在所述排风口内侧还设有排风扇；Design a computer mainframe chassis with independent heat dissipation function, including a chassis shell, a circuit board arranged in the chassis shell; an air inlet and an air exhaust port are arranged on the left side wall or the right side wall of the chassis shell; The air inlet is arranged horizontally, and the air inlet is arranged on the upper part of the left side wall or the right side wall of the chassis shell, and the air outlet is arranged longitudinally, and the air outlet is arranged on the upper part of the air inlet. Below; the air inlet and the air outlet are provided with a mesh filter; the inside of the air outlet is also provided with an exhaust fan;
优选的，还包括设置于所述线路板上的散热机构，所述散热机构包括导热板、由导热硅胶制成的导热硅胶板；所述导热硅胶板紧贴所述线路板的背部设置，且所述导热板压在所述导热硅胶板上；还包括垂直设置在所述导热板上的若干个散热片，各散热片呈S形结构；在所述线路板的同一侧还设置有至少两个吹风扇；Preferably, it also includes a heat dissipation mechanism arranged on the circuit board, the heat dissipation mechanism includes a heat conduction plate, a heat conduction silica gel plate made of heat conduction silica gel; the heat conduction silica gel plate is arranged close to the back of the circuit board, and The heat conduction plate is pressed against the heat conduction silica gel plate; it also includes several heat sinks vertically arranged on the heat conduction plate, each heat sink has an S-shaped structure; at least two heat sinks are also arranged on the same side of the circuit board a blower fan;
优选的，还包括控制器、至少一个温度传感器，所述温度传感器紧贴所述导热板设置，且所述温度传感器与所述控制器连接，所述排风扇、吹风扇分别通过一个继电器与所述控制器连接。Preferably, it also includes a controller and at least one temperature sensor, the temperature sensor is arranged close to the heat conduction plate, and the temperature sensor is connected to the controller, and the exhaust fan and the blowing fan are respectively connected to the Controller connection.
优选的，在各散热片上还设有贯通该散热片两侧的通孔。Preferably, through holes penetrating both sides of the heat sink are also provided on each heat sink.
优选的，所述导热板、散热片均由导热塑料板制成，且所述导热板、散热片一体化构成。Preferably, both the heat conduction plate and the heat sink are made of heat conduction plastic plates, and the heat conduction plate and the heat sink are integrally formed.
优选的，所述导热板、散热片均由铝板制成，且所述导热板、散热片一体化构成。Preferably, both the heat conduction plate and the heat dissipation fin are made of aluminum plate, and the heat conduction plate and the heat dissipation fin are integrally formed.
优选的，所述导热硅胶板的厚度为2.5mm。Preferably, the thickness of the thermally conductive silica gel plate is 2.5mm.
优选的，所述散热片呈矩阵排列设置。Preferably, the heat sinks are arranged in a matrix.
优选的，所述导热板与所述线路板通过螺栓固定。Preferably, the heat conducting plate and the circuit board are fixed by bolts.
本实用新型的有益效果在于：The beneficial effects of the utility model are:
本设计与现有技术相比，其结构设计新颖、合理、易于实现，同时，本设计在使用中可以对线路板所产生的热量进行自动的排出，并可实现自动化温度监测的功能，为线路板的安全运行提供了可靠的保障，同时本设计的主机箱在使用中可以进行解决现有主机箱尾部的排风口通风不畅的问题，大大提高了计算机的稳定性和安全性，为计算机的安全、稳定运行提供了可靠的保障。Compared with the existing technology, this design has a novel, reasonable and easy-to-implement structural design. At the same time, this design can automatically discharge the heat generated by the circuit board during use, and can realize the function of automatic temperature monitoring. The safe operation of the board provides a reliable guarantee. At the same time, the main box of this design can solve the problem of poor ventilation of the exhaust outlet at the tail of the existing main box during use, which greatly improves the stability and safety of the computer. The safe and stable operation provides a reliable guarantee.
附图说明Description of drawings
图1为本实用新型的主要结构示意图；Fig. 1 is the main structural representation of the utility model;
图2为本实用新型中的线路板及其上的散热机构截面状态主要结构示意图；Fig. 2 is the main structure schematic diagram of the section state of the circuit board and the cooling mechanism on it in the utility model;
图3为本实用新型中的散热机构剖面状态主要结构示意图；Fig. 3 is a schematic diagram of the main structure of the sectional state of the heat dissipation mechanism in the utility model;
图4为本实用新型中的散热片主要结构示意图；Fig. 4 is a schematic diagram of the main structure of the heat sink in the utility model;
图中：1.线路板；2.导热硅胶板；3.导热板；4、5.螺栓；6.散热片；7.通孔；8.风扇；9、10.温度传感器；11.机箱外壳的左侧；12.排风口；13.进风口；14.排风扇。In the figure: 1. circuit board; 2. heat conduction silicone plate; 3. heat conduction plate; 4, 5. bolts; 6. heat sink; 7. through hole; 8. fan; 12. Air outlet; 13. Air inlet; 14. Exhaust fan.
具体实施方式detailed description
下面结合附图和实施例对本实用新型进一步说明：Below in conjunction with accompanying drawing and embodiment the utility model is further described:
实施例1：一种具有自主散热功能的计算机主机机箱，参见图1至图4；包括机箱外壳、设置于所述机箱外壳内的线路板1；在所述机箱外壳的左侧壁或右侧壁上设置有进风口13和排风口12；所述进风口13横向设置，且所述进风口13设置在所述机箱外壳的左侧壁或右侧壁的上部，所述排风口12纵向设置，且所述排风口12设置在所述进风口的下方；在所述进风口和排风口上均设置有网状滤网；在所述排风口内侧还设有排风扇14。Embodiment 1: A computer mainframe chassis with independent heat dissipation function, see Figures 1 to 4; including a chassis shell, a circuit board 1 arranged in the chassis shell; on the left side wall or the right side of the chassis shell An air inlet 13 and an air outlet 12 are arranged on the wall; the air inlet 13 is arranged horizontally, and the air inlet 13 is arranged on the left side wall or the upper part of the right side wall of the chassis shell, and the air outlet 12 It is vertically arranged, and the air outlet 12 is arranged below the air inlet; a mesh filter is arranged on the air inlet and the air outlet; an exhaust fan 14 is also arranged inside the air outlet.
本设计它还包括设置于所述线路板1上的散热机构，所述的散热机构包括导热板3、由导热硅胶制成的导热硅胶板2；所述导热硅胶板2紧贴所述线路板1的背部设置，且所述导热板3压在所述导热硅胶板2上；还包括垂直设置在所述导热板上的若干个散热片6，各散热片6呈S形结构；本设计中为了提高散热的性能，本设计在各散热片6上还设有贯通该散热片两侧的通孔7。本设计中，所述的导热硅胶板的厚度为2.0mm～3.0mm，所述的散热片呈矩阵排列设置；同时，所述导热板、散热片一体化构成，且所述的导热板、散热片均由导热塑料板制成或者均由铝板制成；而所述的导热板与所述线路板通过螺栓固定。This design also includes a heat dissipation mechanism arranged on the circuit board 1, the heat dissipation mechanism includes a heat conduction plate 3, a heat conduction silica gel plate 2 made of heat conduction silica gel; the heat conduction silica gel plate 2 is close to the circuit board 1, and the heat conduction plate 3 is pressed on the heat conduction silica gel plate 2; it also includes several heat sinks 6 arranged vertically on the heat conduction plate, and each heat sink 6 has an S-shaped structure; in this design In order to improve the performance of heat dissipation, each heat sink 6 is also provided with through holes 7 passing through both sides of the heat sink in this design. In this design, the thickness of the heat-conducting silica gel plate is 2.0mm-3.0mm, and the heat-dissipating fins are arranged in a matrix; at the same time, the heat-conducting plate and the heat-dissipating fins are integrally formed, and the heat-conducting plate, heat-dissipating fins The sheets are all made of heat-conducting plastic plates or aluminum plates; and the heat-conducting plates and the circuit boards are fixed by bolts.
进一步的，本设计还在在所述线路板的同一侧还设置有两个吹风扇8；还包括控制器、温度传感器9、10，所述温度传感器9、10紧贴所述导热板3设置，且所述温度传感器9、10与所述控制器连接，而所述的排风扇14、吹风扇8分别通过一个继电器与所述控制器连接。Further, this design is also provided with two blowing fans 8 on the same side of the circuit board; it also includes a controller, temperature sensors 9, 10, and the temperature sensors 9, 10 are arranged close to the heat conducting plate 3 , and the temperature sensors 9 and 10 are connected to the controller, and the exhaust fan 14 and blowing fan 8 are respectively connected to the controller through a relay.
本设计在使用中，在其正常情况下，可以仅开启一个排风扇进行常规散热，而一旦线路板的温度过高，并达到温度传感器和控制器所设定的温度，其控制器将控制两个吹风扇8全部开启，以增加热风的散热性能；同时本设计将进风口设置在机箱外壳的左侧壁或右侧壁的上部，在使用中既可以有效的进风，同时通过本设计的排风口又可以将机箱外壳内的热风排出，解决了现有机箱通风不畅、散热性能低的技术问题。In use of this design, under its normal condition, only one exhaust fan can be turned on for conventional heat dissipation, and once the temperature of the circuit board is too high and reaches the temperature set by the temperature sensor and the controller, its controller will control two Blowing fan 8 is all opened, to increase the heat dissipation performance of hot air; At the same time, this design sets the air inlet on the left side wall or the top of the right side wall of the chassis shell, which can effectively enter the air in use, and simultaneously pass through the exhaust of this design. The air outlet can discharge the hot air in the chassis shell, which solves the technical problems of poor ventilation and low heat dissipation performance of the existing chassis.
本实用新型的实施例公布的是较佳的实施例，但并不局限于此，本领域的普通技术人员，极易根据上述实施例，领会本实用新型的精神，并做出不同的引申和变化，但只要不脱离本实用新型的精神，都在本实用新型的保护范围内。The embodiments of the utility model disclosed are preferred embodiments, but are not limited thereto. Those skilled in the art can easily comprehend the spirit of the utility model according to the above-mentioned embodiments, and make different extensions and Change, but as long as it does not depart from the spirit of the utility model, it is all within the protection scope of the utility model.
Claims (7)
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| Application Number | Priority Date | Filing Date | Title |
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| CN201620437998.6U CN205620919U (en) | 2016-05-10 | 2016-05-10 | Main frame machine case with function of independently dispelling heat |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109240457A (en) * | 2018-11-29 | 2019-01-18 | 大连景竣科技有限公司 | Middle tower type computer host structure and heat dissipation method |
| CN111308544A (en) * | 2020-02-19 | 2020-06-19 | 广东电网有限责任公司 | Prevent external damage response positioner based on sound is gathered |
| CN111986429A (en) * | 2020-07-28 | 2020-11-24 | 中国长城科技集团股份有限公司 | Computer spontaneous combustion alarm method and device, electronic equipment and storage medium |
| CN115209710A (en) * | 2022-08-18 | 2022-10-18 | 深圳市集和诚科技开发有限公司 | Heat abstractor and industrial computer |
-
2016
- 2016-05-10 CN CN201620437998.6U patent/CN205620919U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109240457A (en) * | 2018-11-29 | 2019-01-18 | 大连景竣科技有限公司 | Middle tower type computer host structure and heat dissipation method |
| CN111308544A (en) * | 2020-02-19 | 2020-06-19 | 广东电网有限责任公司 | Prevent external damage response positioner based on sound is gathered |
| CN111986429A (en) * | 2020-07-28 | 2020-11-24 | 中国长城科技集团股份有限公司 | Computer spontaneous combustion alarm method and device, electronic equipment and storage medium |
| CN115209710A (en) * | 2022-08-18 | 2022-10-18 | 深圳市集和诚科技开发有限公司 | Heat abstractor and industrial computer |
| CN115209710B (en) * | 2022-08-18 | 2025-11-28 | 深圳市集和诚科技开发有限公司 | Heat abstractor and industrial computer |
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