CN205582052U - An indoor controller for an Internet of Things smart lock - Google Patents

Abstract

The utility model relates to a thing networking intelligence lock indoor control ware. The utility model provides a power module circuit provides + the 3V3 power for master control circuit, provides + the 5V power for infrared transceiver module, provides + the 3.8V power for communication module. Mobile module is responsible for communicating through the number of pulling out or SMS and controller, sends corresponding order to and the cell -phone is initiatively inforied in the controller discovery when reporting an emergency and asking for help or increased vigilance. Host system utilizes AT order receiving and sending to give communication module, and host system receiving and sending gives infrared transceiver module's data, communication module links to each other with mobile communication network to communicate and communicate with host system in the cell -phone, infrared transceiver module carries out infrared communication with the remote end module, is handled by host system. The utility model discloses can regard as the lock control at gates such as present family, office, warehouse, computer lab, laboratory, can conveniently unblank and regard as the partly of the intelligent management of family, its effect is fairly obvious.

Description

An indoor controller for an Internet of Things smart lock

technical field

The utility model belongs to the field of information technology, and relates to an indoor controller for an intelligent lock of the Internet of Things.

Background technique

At present, with the rapid development of Internet of Things technology, it will become possible to apply Internet of Things technology to smart homes. In daily life and work, people need to open various door locks, such as home doors, office doors, warehouse doors, etc., and they must not forget to bring Key, this will bring unnecessary trouble to travel, and if the guest visits or forgets to bring the key when going out, opening the door will become very troublesome. Now mobile phones have become an indispensable item in people's lives, and they are used to carrying them with them. Using mobile networks, unlocking through mobile phones will greatly simplify people's unlocking procedures, and it can be remotely unlocked, and it also has intelligent infrared alarms and smoke alarms, etc. Function, if a stranger enters the room illegally or there is smoke and fire at home, the owner can be notified immediately, which is convenient for immediate processing.

Using the CDMA network to unlock the lock has the advantages of strong anti-interference ability and good confidentiality. The functions of infrared induction alarm and smoke alarm are integrated into the indoor controller of the Internet of Things smart lock. It is small in size and easy to use. The user can use the mobile phone to dial to unlock, can use the mobile phone to set the power-on authority, can set the power-on password, can fortify the indoor security, and can disarm. During the fortification period, if someone enters the room illegally, an infrared sensor alarm will be activated. Thousands of miles away, you can know immediately; if there is too much smoke in the room, the smoke alarm will also be activated. If there is an elderly person living alone at home, you can also set it to a safe mode. cannot take care of themselves), the infrared alarm is activated, so that the family members in other places or the management personnel of the neighborhood committee will know immediately.

Contents of the invention

Aiming at the deficiencies of the prior art, the utility model provides an indoor controller of an Internet of Things intelligent lock.

The technical scheme of the utility model is as follows:

The utility model comprises a power supply module, a communication module, an infrared transceiver module and a main control module.

The power module circuit includes primary power conversion chips U4, U7, secondary conversion chip U6, Zener diodes D1, D2, D6, an anti-reverse connection diode D6, two filter inductors L1, L2, four electrolytic capacitors C6, C8, C28, C30, four chip capacitors C26, C26, C27, C7, eight resistors R6, R7, R24, R25, R26, R27, R28, one fuse F1.

Pin 6 of the primary power module U4 is connected to the input +9V power supply through the fuse F1, pin 6 is connected to the negative pole of the Zener diode D1, the positive pole of the electrolytic capacitor C6, the positive pole of the Zener diode D1, and the negative pole of the electrolytic capacitor C6 are grounded. Pins 7, 8, and 1 of the primary power module U4 are connected to one end of the resistor R5, the other end of the resistor R5 is connected to pin 6, pin 2 of the primary power module U4 is connected to one leg of the filter inductor L1, and the other pin of the filter inductor L1 It is connected to the negative pole of diode D2, the positive pole of electrolytic capacitor C8, and one leg of resistor R6. Here, +5V is output. The positive pole of D2, the negative pole of capacitor C8, and one leg of resistor R7 are connected to ground, and the other leg of resistor R7 is connected to resistor R6. The other pin of the primary power module U4 is connected to the other pin, and connected to the 5th pin of the primary power module U4, the 3rd pin of the primary power module U4 is connected to the ground through a patch capacitor C7; the 4th pin of the primary power module U4 is grounded.

Pin 1 of the first-level power module U7 is connected to the input +9V power supply through the fuse F1, and pin 1 is also grounded through the patch capacitor C27. Pin 5 of the first-level power module U7 is connected to the collector of the transistor Q6 and connected to one end of the resistor R26. The other end of the resistor R26 is connected to the input +9V, the second leg of the primary power supply module U7 is connected to one leg of the filter inductor L2, and connected to the negative pole of the Zener diode D6, and the other leg of the filter inductor L2 is connected to the positive pole of the electrolytic capacitor C28 , and connected to one leg of the resistor R27, where +3.8V power is output; the other leg of the resistor R27 is connected to one leg of the resistor R28, and connected to the 4th leg of the primary power module U7, and the other leg of the resistor R28 Grounded, the positive pole of Zener diode D6, and the negative pole of C28 grounded.

Pin 2 of the secondary power module U6 is connected to the output +5V of the primary power module U4, and grounded through capacitor C25, pin 3 is connected to capacitor C26, and connected to the positive pole of electrolytic capacitor C30, and the other end of capacitor C26 is connected with the negative pole of capacitor C30 Ground, pin 1 of the secondary power supply module U6 is grounded.

The main control module includes main control chip U1, off-chip memory U3, reset switch S1, guide pin J6, debugging pin J1, download pin J5, external interface pin J4, external wireless communication interface pin J3, two crystal Oscillators X1, X2, 6 capacitors C1, C2, C3, C4, C29, C5, 8 resistors R1, R2, R3, R4, R29, R30, R31, R32, and a light emitting diode D7.

Pins 1, 13, 19, 32, 48, and 64 of the main control chip U1 are connected to pins 3 of the secondary power module U6, pins 12, 18, 31, 47, and 63 of the main control chip U1 are grounded; pins 3 of the main control chip U1 The pin is connected to one pin of the crystal oscillator X1 and connected to one pin of the capacitor C1, the 4 pin of the main control chip U1 is connected to one pin of the resistor R1, and the other pin of the resistor R1 is connected to the other pin of the crystal oscillator X1 and connected to one pin of the capacitor C2 The other ends of capacitors C1 and C2 are connected to ground. The pins 5 and 6 of the main control chip U1 are respectively connected to the two pins of the crystal oscillator X2, and the two pins of X2 are respectively connected to the two pins of the resistor R2, and respectively connected to one pin of the capacitor C3 and C4, and the other pin of the capacitor C3 and C4 The foot is grounded. Pin 7 of the main control chip U1 is connected to one pin of the key switch S1, the other pin of the key switch S1 is connected to one pin of the resistor R31 and the capacitor C29, the other pin of the resistor R31 is connected to the 48 pin of the main control chip U1, and the capacitor C29 The other leg is grounded.

Pin 16 of the main control chip U1 is connected to the negative pole of the light-emitting diode D7, the positive pole of the light-emitting diode D7 is connected to the resistor R32, and the other end of the resistor R32 is connected to +3V3. Pin 28 of the main control chip U1 is connected to pin 3 of the guide pin, and connected to one end of the resistor R30, the other end of the resistor R30 is connected to +3V3, pin 33 of the main control chip U1 is connected to one pin of the resistor R24, and the other end of the resistor R24 One leg is connected to the other leg of R25 and connected to the base of the transistor Q6, and the other leg of the resistor R25 is connected to the emitter of the transistor Q6 to ground. Pin 37 of the main control chip U1 is connected to one pin of the resistor R20 in the infrared transmitter module, pin 38 of the main control chip U1 is connected to pin 1 of the infrared receiving module D5, and pins 42 and 43 of the main control chip U1 are respectively connected to the external interface pin J4 Pin 5 and 6 of the main control chip U1, pin 46 of the main control chip U1 is connected to pin 3 of the download pin J5 and pin 6 of the adjustment pin J1, pin 49 of the main control chip U1 is connected to pin 2 of the download pin J5 and the adjustment pin Pin 5 of J1, pin 50 of the main control chip U1 is connected to pin 4 of the adjustment pin J1, pin 51 of the main control chip U1 is connected to the negative pole of diode D3 in the communication module, pin 52 of the main control chip U1 is connected to the negative pole of the communication module The collector of transistor Q1, pin 53 of the main control chip U1 is connected to one pin of resistor R13 in the communication module, pin 54 of the main control chip U1 is connected to one pin of R11 in the communication module, pin 55 of the main control chip U1 is connected to the debugging Pin 7 of pin J1, pin 56 of the main control chip U1 is connected to pin 3 of debugging pin J1, pin 57 of the main control chip U1 is connected to pin 7 of the off-chip memory chip U3, pin 58 of the main control chip U1 is connected to U3 6 pins, pin 59 of the main control chip U1 is connected to pin 5 of the off-chip memory U3, pin 8 of the off-chip memory U3 is connected to +3V3, and pins 1, 2, 3, and 4 of U3 are all grounded. Pin 60 of the main control chip U1 is connected to pin 1 of the guide pin J6, and connected to the resistor R29, the other end of R29 and R30 is connected to +3V3, both ends of 2 and 4 of J6 are grounded, and pin 61 of the main control chip U1 is connected to the external Pin 4 and pin 5 of the wireless communication interface pin J3, pin 1 of the download pin J5 is connected to +3V3, pin 4 of J5 is grounded, pin 6 of the external wireless communication interface pin J3 is grounded, pin 3 is connected to +3V3. Pin 8 of external interface pin J4 is connected to +5V, pin 7 of J4 is connected to +3V3, pin 4 of J4 is grounded.

The communication module includes a CDMA module U2, a SIM card module U5, a diode D3, three NPN transistors Q1, Q2, Q3, four capacitors C19, C20, C21, C22, ten resistors R8, R9, R10, R11, R12, R13, R14, R15, R16, R17, among which pins 1, 3, 5, and 28 of the CDMA module U2 are grounded, and pin 6 of the CDMA module U2 is connected to the connection point of the power module R27 and L2, which is the voltage input of the CDMA module+ 3.8VDC, pin 11 of CDMA module U2 is connected to one pin of R14, the other pin of resistor R14 is connected to pin 2 of U5, pin 12 of CDMA module U2 is connected to one pin of R15, the other pin of resistor R15 is connected to pin 3 of U5 , the 13th pin of the CDMA module U2 is connected to one pin of R17, the other pin of the resistor R17 is connected to the 6th pin of U5, the 14th pin of the CDMA module U2 is connected to one pin of R16, the other pin of the resistor R16 is connected to the 6th pin of U5, CDMA Pin 15 of module U2 is connected to the positive pole of D3 and connected to one end of resistor R10 and one end of capacitor C20, the other end of capacitor C20 is grounded, the other end of resistor R10 is connected to terminal 27 of CDMA module U2, and pin 16 of CDMA module U2 is connected to a triode The emitter of Q1, the collector of transistor Q1 is connected to pin 52 of U1 and one leg of resistor R9, the other leg of resistor R9 is connected to +3V3, the base of transistor Q1 is connected to one end of capacitor C19 and one end of resistor R8, resistor R8 The other end of the capacitor C19 is connected to the terminal 27 of U2, the other end of the capacitor C19 is grounded, the collector of the 17 pin Q2 of the CDMA module U2 is connected to one end of the capacitor C21 and one end of the resistor R12, the other end of the capacitor C21 is grounded, and the collector of the resistor R12 The other end is connected to terminal 6 of CDMA module U2, the emitter of transistor Q2 is grounded, the base of transistor Q2 is connected to one end of resistor R11, the other end of resistor R11 is connected to pin 54 of U1, the collector of pin 24 of CDMA module U2 Q3, And connected to one end of the capacitor C22, the other end of the capacitor C22 is grounded, the emitter of the transistor Q3 is grounded, the base of the transistor Q3 is connected to one end of the resistor R13, and the other end of the resistor R13 is connected to pin 53 of U1. Pins 4, 9, and 10 of the SIM card module U5 are grounded, and pin 1 of the SIM card module U5 is connected to pin 14 of the CDMA module U2.

The infrared transceiver module includes an infrared sending diode D4, an infrared receiving tube D5, an NPN transistor Q5, five resistors R20, R21, R22, R23, R33, and two capacitors C23 and C24, and the 3-pin of the infrared receiving tube D5 is grounded to the infrared receiving tube , the 2 pins of D5 are connected to one pin of R22 and connected to capacitor C23 and one pin of C24, the other pins of capacitors C23 and C24 are respectively grounded, the other pin of resistor R22 is connected to one pin of resistor R23, and connected to +5V, The other leg of resistor R23 is connected to pin 1 of D5 and to pin 38 of the main control chip U1, the base of transistor Q5 is connected to one end of R20, the other end of resistor R20 is connected to pin 37 of the main control chip U1, and the emission of transistor Q5 The pole is grounded, the collector of the triode Q5 is connected to the negative pole of the infrared emitting diode D4, one end of the resistor R21 is connected to the positive pole of the infrared emitting diode D4 after being associated with R33, and the other end is connected to +5V.

Beneficial effects of the utility model: the utility model can be used as the door lock control of homes, offices, warehouses, computer rooms, laboratories, etc., and can be easily unlocked and used as a part of home intelligent management, and its effect is very obvious.

Description of drawings

Fig. 1 is a system block diagram of the indoor controller of the intelligent lock of the Internet of Things;

Fig. 2 is the basic circuit schematic diagram of the power supply module in the controller;

Fig. 3 is the basic circuit diagram of the communication module in the controller;

Fig. 4 is the basic circuit schematic diagram of the main control module in the controller;

Figure 5 is a schematic diagram of the basic circuit of the infrared transceiver module in the controller.

detailed description

The indoor controller of the Internet of things intelligent lock will be described in detail below in conjunction with the accompanying drawings. The effect of each functional frame in accompanying drawing 1 is as follows:

Power supply module 1: provide the working voltage of the entire controller; mobile phone 2: provide commands for the controller through communication dial-up or SMS; main control module 3: perform operations such as sending and receiving, transforming, and controlling signals; communication module 4: communicate with the mobile phone Communicate with the main control module; infrared transceiver module 5: provide infrared communication with the remote terminal.

As shown in Figure 1, the power module circuit provides +3V3 power supply to the main control circuit, +5V power supply to the infrared transceiver module, and +3.8V power supply to the communication module. The mobile phone module is responsible for communicating with the controller through dial-up or SMS, sending corresponding commands, and actively notifying the mobile phone when the controller finds an alarm. The main control module uses AT commands to receive and send to the communication module, and the main control module receives and sends data to the infrared transceiver module; the communication module is connected to the mobile communication network to facilitate communication between the mobile phone and the main control module; infrared transceiver The module performs infrared communication with the remote module and is processed by the main control module.

As shown in Figure 2, the power module circuit includes primary power conversion chips U4, U7, secondary conversion chip U6, voltage regulator diodes D2, D6, an anti-reverse connection diode D6, two filter inductors L1, L2, four Electrolytic capacitors C6, C8, C28, C30, four chip capacitors C26, C26, C27, C7, eight resistors R6, R7, R24, R25, R26, R27, R28, one fuse F1; one of the primary power conversion chips U4 adopts MC34063 produced by Motorola, U7 adopts LM2576 produced by Motorola, and the secondary power conversion chip U6 adopts HT7333 produced by Hetai Company.

Pin 6 of the primary power conversion chip U4 and pin 1 of U7 are connected to the main power input, and at the same time, connect the diode D1, capacitor C6, and C27 to ground; connect the pins 1, 7, and 8 of the power conversion chip U4, and connect the resistor R5 at the same time Connect with the input, the 2 pins of U4 are connected to the inductor L1, the other end of L1 leads to the +5V output terminal and connects the diode D2, the capacitor C8 to the ground, and the +5V output terminal connects the resistors R6 and R7 to the ground, and the connection of R6 and R7 Connect terminal 5 of U4, terminal 3 of U4 connects capacitor C7 to ground; pin 3 of power conversion chip U7 connects to ground, pin 5 of U7 connects resistor R26 to the main power input, pin 2 of U7 connects diode D6 to ground At the same time, pin 2 of U7 is connected to one end of the inductor L2, and the other end of L2 leads to the output terminal of +3.8V, and connects the capacitor C28 to the ground, and the output terminal of +3.8V connects the resistors R27 and R28 to the ground, R27, R28 The middle connection point of U6 is connected to pin 4 of U7; pin 2 of the secondary power conversion chip U6 is used as the input pin of the power supply and connected to the +5V output terminal of U4, and the capacitor C25 is connected to ground, and pin 3 of U6 outputs +3V3 power supply Controller use, and across capacitors C26, C30 to ground.

As shown in Figure 3, the main control module is composed of a main control chip U1, an off-chip memory U3, a reset switch S1, a guide pin J6, a debugging pin J1, a download pin J5, an external interface pin J4, and an external wireless communication interface. Pin J3, two crystal oscillators X1, X2, six capacitors C1, C2, C3, C4, C29, C5, eight resistors R1, R2, R3, R4, R29, R30, R31, R32, one light emitting diode D7; the main control chip U1 is STM32F103 produced by STMicroelectronics, and the off-chip memory U3 is AT24C32 produced by Microchip; pins 1, 13, 19, 32, 48, and 64 of the main control chip U1 are connected to the secondary power output +3V3, pins 12, 18, 31, 47, and 63 of U1 are grounded; pin 3 of U1 is connected to crystal oscillator X1, pin 4 of U1 is connected to resistor R1 to X1, and X1 is connected to capacitors C1 and C2 to ground; , 6 feet across the crystal oscillator X2, resistor R2, X2 across capacitors C3, C4 to the ground; U1's 28, 60 feet connected to the pin J6, used as BOOT selection; U1's 33 feet as the CDMA module power supply For switch control, connect to R24 of the power module, pins 37 and 38 of U1 are connected to the infrared transceiver module, pin 37 is used as signal sending output to the infrared sending circuit, and pin 38 is used as signal receiving from the infrared receiving circuit; 46, 49, 50 of U1 , 55, and 56 are used as the debugging ports of the main control chip, and are connected to the debugging pin J1; the 46, 49 pins of U1 are used as the SWD debugging interface and connected to the downloading pin J5, and the 57, 58, and 59 pins of U1 are connected to to off-chip memory U3.

As shown in Figure 4, the communication module includes a CDMA module U2, a SIM card module U5, a diode D3, three NPN transistors Q1, Q2, Q3, four capacitors C19, C20, C21, C22, ten resistors R8, R9, R10, R11, R12, R13, R14, R15, R16, R17; module U2 adopts the MC8332 mobile communication CDMA module produced by ZTE, the SIM socket adopts the 8+1 mobile phone card holder produced by Boxin Micro, and the transistor Q1, Q2 and Q3 use S9013 produced by Changdian Company; pins 1, 3, 5, and 28 of U2 are grounded, pin 6 of U2 is connected to the output of power module U2, that is, one end of the inductor L2, pins 11, 12, 13, and Pin 14 is connected to the SIM card module, pins 15 and 16 of U2 are serial port communication lines, connected to U1 of the main control module through a level conversion circuit, pin 17 of U2 is the reset terminal of the CDMA module, connected to The 24 pins of U1 and U2 are CDMA module switches, which are connected to U1 through the level conversion circuit, and the 27 pins of U2 provide the reference voltage of the communication module for use by the level conversion circuit.

As shown in Figure 5, the infrared transceiver module includes an infrared sending diode D4, an infrared receiving tube D5, an NPN transistor Q5, five resistors R20, R21, R22, R23, R33, and two capacitors C23 and C24; the infrared receiving tube D5 is The IRM3638 produced by Chaoyi Company, the infrared sending tube D4 uses the IR333C/H0-L10 produced by Chaoyi Company, the transistor Q5 adopts the S9013 produced by Changdian Company, and the 1 pin of the infrared receiving tube D5 is the output terminal, which is connected to U1 The 38 pins of D5 are connected across the resistor R23 to +5V, the 2 pins of D5 are grounded across the capacitors C23 and C24, and the resistor R22 is connected to +5V, the 3 pins of D5 are grounded; the 37 pins from U1 are infrared transmission control signals , through Q5 to drive the infrared sending diode D4, resistors R21 and R23 are connected in parallel to limit the use of infrared sending current.

In the utility model, in order to adjust the infrared light transmission distance, it can be realized by changing the resistance values of the current limiting resistors R21 and R23. In the utility model, in order to reduce the interference of other light sources on the infrared receiving tube, a shielding cover is added to the infrared receiving tube for processing . The utility model uses an infrared transceiver circuit at the same time, which can ensure that the communication data is sent and received correctly; the circuit of the utility model can also receive two kinds of alarm signals, such as local indoor infrared induction alarm and smoke alarm, in addition to infrared transceiver communication with remote equipment. It is realized by sending 315MHz radio waves to the RXB13 receiving module inserted on the external wireless communication interface pin J3, and the received signal is connected to the main processor chip U1 through the 315M DATA data line; RXB13 is a wireless module produced by Jingmeirun Company. receiving module.

Using the above technical solutions, this IoT smart indoor control unit will greatly make up for the lack of smart locks. It has the function of remotely unlocking the lock with a mobile phone, has alarm functions such as illegal entry and smoke, saves power and worry, and is safe and reliable.

Claims (1)

1. an Internet of Things smart lock indoor controller, including power module, communication module, infrared ray transceiving module, master control mould Block, it is characterised in that:

Power module circuitry includes primary power source conversion chip U4, U7, two grades of conversion chip U6, Zener diode D1, D2, D6, One anti-reverse diode D6, two filter inductances L1, L2, four electrochemical capacitors C6, C8, C28, C30, four patch capacitors C26, C26, C27, C7,8 resistance R6, R7, R24, R25, R26, R27, R28, an electric fuse F1；

6 feet of primary power source module U4 connect the+9V power supply of input by electric fuse F1, and 6 feet connect Zener diode D1 negative pole, electrolysis Electric capacity C6 positive pole, the positive pole of Zener diode D1, the minus earth of electrochemical capacitor C6；The 7 of primary power source module U4,8,1 foot is even One end of connecting resistance R5, another of resistance R5 terminates 6 feet, and 2 feet of primary power source module U4 connect a foot of filter inductance L1, filtering Another foot of inductance L1 is connected with the negative pole of diode D2, the positive pole of electrochemical capacitor C8, a foot of resistance R6, output+5V herein, The positive pole of D2, the negative pole of electric capacity C8, a foot of resistance R7 are connected ground connection, and another foot of resistance R7 is connected with another foot of resistance R6, And link 5 feet of primary power source module U4,3 feet of primary power source module U4 access ground by a patch capacitor C7；Primary power source 4 foot ground connection of module U4；

1 foot of primary power source module U7 connects the+9V power supply of input by electric fuse F1,1 foot also by patch capacitor C27 ground connection, 5 feet of primary power source module U7 connect the colelctor electrode of audion Q6, and one end of connecting resistance R26, another termination input of resistance R26 + 9V, 2 feet of primary power source module U7 connect a foot of filter inductance L2, and are connected with the negative pole of Zener diode D6, filter inductance Another foot of L2 is connected with the positive pole of electrochemical capacitor C28, and links a foot of resistance R27, herein output+3.8V power supply；Resistance Another foot of R27 is connected with a foot of resistance R28, and links 4 feet of primary power source module U7, another foot ground connection of resistance R28, The positive pole of Zener diode D6, the minus earth of C28；

2 feet of secondary power supply module U6 meet the output+5V of primary power source module U4, and by electric capacity C25 ground connection, 3 feet connect electric capacity C26, and connect the positive pole of electrochemical capacitor C30, the other end of electric capacity C26 is ground connection together with the negative pole of electric capacity C30, secondary power supply module The 1 foot ground connection of U6；

Primary power source conversion chip U4 is the MC34063 using Motorola Inc. to produce, and primary power source conversion chip U7 is to adopt The LM2576, secondary power supply conversion chip U6 produced with Motorola Inc. is the HT7333 using He Tai company to produce；

Main control module includes main control chip U1, chip external memory U3, reset switch S1, guide pin J6, debugging contact pin J1, download Contact pin J5, external interface contact pin J4, external wireless communication interface contact pin J3, two crystal oscillator X1, X2,6 electric capacity C1, C2, C3, C4, C29, C5,8 resistance R1, R2, R3, R4, R29, R30, R31, R32, light emitting diode D7；

The 1 of main control chip U1,13,19,32,48,64 feet connect 3 feet of secondary power supply module U6, the 12 of main control chip U1,18,31, 47,63 foot ground connection；3 feet of main control chip U1 connect a foot of crystal oscillator X1 and are connected with a foot of electric capacity C1,4 feet of main control chip U1 One foot of connecting resistance R1, another foot of resistance R1 connects another foot of crystal oscillator X1 and is connected with a foot of electric capacity C2, electric capacity C1, C2's Other end ground connection；The 5 of main control chip U1,6 bipods connect the bipod of crystal oscillator X2 respectively, and the bipod of X2 distinguishes again the two of connecting resistance R2 Foot, and be connected with a foot of electric capacity C3, C4 respectively, another foot ground connection of electric capacity C3, C4；7 feet of main control chip U1 connect button and open Closing a foot of S1, another foot of key switch S1 is connected with a foot of resistance R31 and electric capacity C29, and another foot of resistance R31 meets master 48 feet of control chip U1, another foot ground connection of electric capacity C29；

The negative pole of the 16 foot sending and receiving optical diode D7 of main control chip U1, the positive pole connecting resistance R32, resistance R32 of light emitting diode D7 Another termination+3V3；28 feet of main control chip U1 connect 3 feet of guide pin, and are connected with one end of resistance R30, resistance R30's One foot of the 33 foot connecting resistance R24 of another termination+3V3, main control chip U1, another foot of resistance R24 is connected with R25 mono-foot, and Receiving the base stage of audion Q6, another foot of resistance R25 is connected with the emitter stage of audion Q6 ground connection；37 feet of main control chip U1 connect A foot of resistance R20 in infrared transmission module, 38 feet of main control chip U1 meet 1 foot of infrared receiving module D5, main control chip U1 42,43 feet connect 5,6 bipods of external tapping contact pin J4 respectively, 46 feet of main control chip U1 connect 3 feet and the tune downloading contact pin J5 6 feet of formula contact pin J1,49 feet of main control chip U1 meet 2 feet and 5 feet of mode contact pin J1, the main control chip U1 downloading contact pin J5 50 feet connect 4 feet of mode contact pin J1,51 feet of main control chip U1 connect the negative pole of the diode D3 in communication module, main control chip 52 feet of U1 connect the colelctor electrode of the audion Q1 in communication module, and 53 feet of main control chip U1 meet the resistance R13 in communication module A foot, 54 feet of main control chip U1 connect a foot of the R11 in communication module, and 55 feet of main control chip U1 meet debugging contact pin J1 7 feet, 56 feet of main control chip U1 connect debugging contact pin J1 3 feet, 7 feet of the 57 foot contact pin external memory chip U3 of main control chip U1, 58 feet of main control chip U1 connect 6 feet of U3,5 feet of the 59 foot contact pin external memory U3 of main control chip U1, the 8 of chip external memory U3 Foot connects the 1 of+3V3, U3,2,3, the 4 whole ground connection of foot；60 feet of main control chip U1 connect 1 foot of guide pin J6, and with resistance R29 Being connected, 2,4 two-terminal-groundings of another termination+3V3, J6 of R29, R30,61 feet of main control chip U1 connect external wireless communication interface The 4 of contact pin J3,5 bipods, 1 foot downloading contact pin J5 connects the 4 foot ground connection of+3V3, J5,6 feet of external wireless communication interface contact pin J3 Ground connection, 3 feet meet+3V3；8 feet of external interface contact pin J4 connect 7 feet of+5V, J4 and connect the 4 foot ground connection of+3V3, J4；

Main control chip U1 be use ST Microelectronics produce STM32F103, chip external memory U3 be use Microchip The AT24C32 that company produces；

Communication module include CDMA module U2, SIM module U5, diode D3, three NPN audion Q1, Q2, Q3, four electric capacity C19, C20, C21, C22, ten resistance R8, R9, R10, R11, R12, R13, R14, R15, R16, R17, Wherein the 1 of CDMA module U2,3,5,28 foot ground connection, 6 feet of CDMA module U2 connect the junction point of power module R27 Yu L2, for Voltage input+the 3.8VDC of CDMA module, 11 feet of CDMA module U2 connect a foot of R14, and another foot of resistance R14 connects the 2 of U5 Foot, 12 feet of CDMA module U2 connect a foot of R15, and another foot of resistance R15 connects 3 feet of U5, and 13 feet of CDMA module U2 meet R17 A foot, another foot of resistance R17 connects 6 feet of U5, and 14 feet of CDMA module U2 connect a foot of R16, and another foot of resistance R16 connects 6 feet of U5,15 feet of CDMA module U2 connect the positive pole of D3 and are connected with one end, one end of electric capacity C20 of resistance R10, electric capacity C20 Other end ground connection, resistance R10 another termination CDMA module U2 27 ends, 16 feet of CDMA module U2 connect audion Q1 launch Pole, the colelctor electrode of audion Q1 connects 52 feet of U1 a foot of connecting resistance R9, and another foot of resistance R9 meets+3V3, audion Q1's Base stage connects one end and one end of resistance R8 of electric capacity C19,27 ends of another termination U2 of resistance R8, the other end of electric capacity C19 Ground connection, the colelctor electrode of 17 foot Q2 of CDMA module U2, and be connected with one end of electric capacity C21 and one end of resistance R12, electric capacity The other end ground connection of C21,6 ends of another termination CDMA module U2 of resistance R12, the grounded emitter of audion Q2, audion One end of the base stage connecting resistance R11 of Q2,54 feet of another termination U1 of resistance R11, the colelctor electrode of 24 foot Q3 of CDMA module U2, And be connected with one end of electric capacity C22, the other end ground connection of electric capacity C22, the grounded emitter of audion Q3, the base stage of audion Q3 One end of connecting resistance R13,53 feet of another termination U1 of resistance R13；The 4 of SIM module U5,9,10 foot ground connection, SIM module 1 foot of U5 connects 14 feet of CDMA module U2；

CDMA module U2 is the MC8332 mobile communication CDMA module using Zhong Xing company to produce, and SIM module U5 uses rich letter The 8+1 mobile phone card seat that micro-company produces；

Infrared ray transceiving module include infrared transmission diode D4, infrared receiving tube D5, NPN audion Q5,5 resistance R20, R21, R22, R23, R33, two electric capacity C23, C24, the wherein 3 foot ground connection infrared receiving tubes of infrared receiving tube D5,2 feet of D5 connect One foot of one foot shunt-wound capacitance C23 and C24 of R22, another foot of electric capacity C23, C24 ground connection, another foot of resistance R22 respectively Being connected with a foot of resistance R23, and meet+5V, another foot of resistance R23 connects 1 foot of D5 and is connected to 38 feet of main control chip U1, The base stage of audion Q5 connects one end of R20,37 feet of another termination main control chip U1 of resistance R20, the emitter stage of audion Q5 Ground connection, the colelctor electrode of audion Q5 connects the negative pole of infrared-emitting diode D4, and after resistance R21 with R33 associates, one terminates infrared Send the positive pole of diode D4, another termination+5V.