CN205487649U - Can promote inductance of base plate radiating effect - Google Patents

Abstract

The utility model discloses a can promote inductance of base plate radiating effect, it contains a magnetic substance subassembly, this magnetic substance subassembly is worn to establish by a current conducting plate, this current conducting plate, and the both ends of this current conducting plate expose respectively in magnetic substance subassembly both sides, and these current conducting plate both ends are equipped with a terminal portion respectively, and the root edge of this terminal portion is less than the root edge of this magnetic substance subassembly to it has an interval to make between the root edge of root edge and the magnetic substance subassembly of this terminal portion, an electronic component heat dissipating ware, this electronic component heat dissipating ware combines together with the magnetic substance subassembly, and this electronic component heat dissipating ware is equipped with conductive contact portion for combine with the ground connection facial features welding of a circuit substrate, the utility model discloses can be between magnetic substance subassembly and circuit substrate the interval space that goes out can supply to install other electronic component to the size of reducible circuit substrate, the while is usable electronic component heat dissipating ware assistance electronic component and circuit substrate heat dissipation also, reduces heat abstractor's quantity, reaches the purpose of reducing electronic product volume and reduce cost.

Description

The inductance of substrate radiating effect can be promoted

Technical field

This utility model relates to a kind of inductance, a kind of inductance promoting circuit substrate radiating effect.

Background technology

Being illustrated in figure 1 a kind of existing inductance, it has a magnetic assembly 10 and substantially in falling The conductive plate 15 of U-shape, this magnetic assembly 10 includes one first magnetic 11 and is arranged at one The second magnetic 12 above this first magnetic 11, and this magnetic assembly 10 is in the first magnetic 11 and second joints both magnetic 12 are provided with a storage tank 13, with for this conductive plate 15 House and wear this magnetic assembly 10, be provided with terminal accommodation groove 14 bottom this first magnetic 11 again, These conductive plate 15 two ends are bent to form a portion of terminal 16 respectively inwards, using the termination electrode as inductance, And the portion of terminal 16 of this conductive plate 15 buries and fastens this terminal accommodation groove 14 underground, as in figure 2 it is shown, should Inductance i.e. may utilize surface mount technology (SMT) Fast Installation in circuit substrate (PCB, a Printed Circuit Board) on 20.

It is available for installing as in figure 2 it is shown, there is usually no between the bottom of aforementioned inductance and circuit substrate 20 The space of other electronic components 21 (such as IC chip or MOS transistor), thus this inductance is with each Electronic component 21 must be dispersively installed in the diverse location of circuit substrate 20, causes circuit substrate 20 Area be difficult to reduce further, be unfavorable for the lightening of electronic product；Additionally, electronic component 21 Would generally generate heat during work, thus heat abstractor generally need to be additionally set on electronic component 21 at a high speed Such as radiating fin, consequently, it is possible to when electronic component 21 is large number of, the number of required heat abstractor Measuring the most considerable with cost, therefore, how developing one can provide other electronic components 21 to install sky Between help its induction structure dispelled the heat simultaneously, become the technical task of a high practicability and urgency.

Utility model content

Because not possessing the sky being available for installing other electronic components between existing inductance and circuit substrate Between, cause the area of circuit substrate to be difficult to reduce, too increase setting of the heat abstractor in electronic component Putting quantity and cost, therefore the purpose of this utility model is to provide one can provide other electronic components Installing space and can effectively help electronic component and circuit substrate heat radiation inductance.

In order to reach object above, the inductance of the promoted substrate radiating effect that this utility model provides, It comprises: a magnetic assembly；One conductive plate, this conductive plate wears this magnetic assembly, and this is led The two ends of electroplax are respectively exposed to magnetic assembly both sides, and this conductive plate is respectively arranged at two ends with a portion of terminal, The root edge of this portion of terminal is less than the root edge of this magnetic assembly, so that the root edge of this portion of terminal and magnetic There is between the root edge of body assembly a spacing；One electronic component radiator, this electronic component radiator with Magnetic assembly combines, and this electronic component radiator is provided with thermal conductive contact portion, is used for and a circuit base The ground plane phase solder bond of plate.

In an embodiment of the present utility model, this magnetic assembly includes one first magnetic and It is arranged at the second magnetic above this first magnetic, and this first magnetic and the second magnetic two The joint of person is provided with a storage tank, and this conductive plate wears this magnetic assembly by storage tank.

In an embodiment of the present utility model, this conductive plate is inverted u-shaped.

In an embodiment of the present utility model, it is provided with at least one bottom this thermal conductive contact portion and climbs stannum use Shrinkage pool.

In an embodiment of the present utility model, this electronic component radiator is that the metal of inverted u-shaped dissipates Backing.

In an embodiment of the present utility model, the lateral margin of the side plate of these metal fin both sides sets respectively There is bending block holding part.

Thereby, this utility model can between magnetic assembly and circuit substrate between be separated out and be available for it is installed The space of his electronic component, thus the area size of circuit substrate can be reduced, it is possible with electronics simultaneously Element radiating device assists electronic component to dispel the heat with circuit substrate, reduces the setting of heat abstractor, Jin Erke Reach product practicality to be greatly improved, reduces electronic product volume and the purpose reducing cost.

Accompanying drawing explanation

Fig. 1 is the decomposing schematic representation of existing inductance；

Fig. 2 is the schematic diagram that existing inductance is arranged on circuit substrate with other electronic components；

Fig. 3 is decomposing schematic representation of the present utility model；

Fig. 4 is combination schematic diagram of the present utility model；

Fig. 5 can provide the schematic diagram of part electronic component installing space for this utility model.

Description of reference numerals: 10-magnetic assembly；11-the first magnetic；12-the second magnetic； 13-storage tank；14-terminal accommodation groove；15-conductive plate；16-portion of terminal；20-circuit substrate；21-electricity Sub-element；3-magnetic assembly；31-the first magnetic；32-the second magnetic；33-storage tank；4- Conductive plate；41-portion of terminal；5-electronic component radiator；51-thermal conductive contact portion；52-shrinkage pool；53-is curved Folding block holding part；6-circuit substrate；61-ground plane；7-electronic component；H-spacing.

Detailed description of the invention

As shown in Figure 3, Figure 4, this utility model provides a kind of inductance promoting substrate radiating effect, It comprises:

One magnetic assembly 3, this magnetic assembly 3 is provided with a storage tank 33, more specifically, at this In embodiment, this magnetic assembly 3 includes one first magnetic 31 and and is arranged at this first magnetic The second magnetic 32 above body 31, and this storage tank 33 is arranged at the first magnetic 31 and second The joint of both magnetics 32, in the present embodiment, this storage tank 33 is by being arranged at the second magnetic The groove of body 32 lower surface is formed, and in the embodiment that other are feasible, this storage tank 33 also may be used Formed by the groove being arranged at the first magnetic 31 top surface, naturally it is also possible to the first magnetic 31 arrange corresponding groove to form this storage tank 33 with the second magnetic 32 both of which；

One conductive plate 4, this conductive plate 4 is in inverted u-shaped, and this conductive plate 4 is worn by storage tank 33 This magnetic assembly 3, and the two ends of this conductive plate 4 are respectively exposed to magnetic assembly 3 both sides, should Conductive plate 4 is respectively arranged at two ends with a portion of terminal 41, and the root edge of this portion of terminal 41 is less than this magnetic group The root edge of part 3, so that the root edge of the root edge of this portion of terminal 41 and magnetic assembly 3 is (in this enforcement In example, the i.e. first magnetic 31 root edge) between there is spacing H, as shown in Figure 4；

As it is shown in figure 5, specifically, this spacing H can be designed to sufficiently large, thus when this practicality is new When the inductance that type provides is welded on a circuit substrate 6 by portion of terminal 41, can be by magnetic assembly 3 Upwards support from circuit substrate 6 certain altitude (i.e. spacing H), so that this utility model can be in magnetic Sufficiently large space it is separated out, in order to by other electronics of part between body assembly 3 and circuit substrate 6 Element 7 (such as IC chip or MOS transistor) is mounted on the circuit below magnetic assembly 3 On substrate 6；

One electronic component radiator 5, this electronic component radiator 5 combines with magnetic assembly 3, In the present embodiment, this electronic component radiator 5 is that the metal fin of inverted u-shaped, such as copper dissipate Backing, and this metal fin cover sets that to be incorporated into magnetic assembly 3 peripheral, this electronic component radiator 5 are provided with thermal conductive contact portion 51, and (in the present embodiment, this thermal conductive contact portion 51 is metal fin two The side plate of side), as it is shown in figure 5, bottom this thermal conductive contact portion 51 for the connecing of this circuit substrate 6 Ground (Ground Plane) 61 phase solder bond, additionally, be provided with bottom this thermal conductive contact portion 51 to A few shrinkage pool 52 being used for climbing stannum, to increase bonding area, thus can improve the steadiness of welding, Also, in the present embodiment, the lateral margin of the side plate of these metal fin both sides is respectively equipped with bending block holding part 53, in order to firm support, fasten this magnetic assembly 3；

As shown in figs. 4 and 5, by said structure, this utility model can in magnetic assembly 3 with It is separated out the space being available for installing other electronic components 7 between circuit substrate 6, thus circuit can be reduced The miniaturization of the area size of substrate 6, beneficially electronic product, meanwhile, further through this electronic component The thermal conductive contact portion 51 of radiator 5 welds with circuit substrate 6 phase, thus this electronic component 7, especially Being in the electronic component 7 below magnetic assembly 3, used heat produced by its work can be by this Circuit substrate 6 conducts to thermal conductive contact portion 51, is conducted to air by electronic component radiator 5 the most again, So that this utility model can reach the purpose promoting circuit substrate 6 with electronic component 7 radiating effect, It is noted here that and typically will not produce high heat due to inducer, thus this electronic component dissipates Hot device 5 is not dissipating for inducer itself (i.e. magnetic assembly 3 and the combination of conductive plate 4) Heat and arrange, but in order to be positioned at the electronic component 7 below magnetic assembly 3 and circuit substrate 6 Heat radiation needs, consequently, it is possible to the plurality of electronic component 7 is i.e. without the most additionally arranging heat abstractor as dissipated Hot fin, thus the usage amount of heat abstractor can be reduced, and then make this utility model can reach significantly to carry High product practicality, reduce electronic product volume with reduce cost effect.

Claims (6)

1. the inductance that can promote substrate radiating effect, it is characterised in that comprise:

One magnetic assembly；

One conductive plate, this conductive plate wears this magnetic assembly, and the two ends of this conductive plate are exposed respectively In magnetic assembly both sides, this conductive plate is respectively arranged at two ends with a portion of terminal, and the root edge of this portion of terminal is low In the root edge of this magnetic assembly, so that between the root edge of the root edge of this portion of terminal and magnetic assembly There is a spacing；

One electronic component radiator, this electronic component radiator combines with magnetic assembly, this electronics Element radiating device is provided with thermal conductive contact portion, for the ground plane phase solder bond with a circuit substrate.

The inductance promoting substrate radiating effect the most according to claim 1, it is characterised in that This magnetic assembly includes one first magnetic and and is arranged at the second magnetic above this first magnetic Gonosome, and the joint of this first magnetic and the second magnetic is provided with a storage tank, this conduction Plate wears this magnetic assembly by storage tank.

The inductance promoting substrate radiating effect the most according to claim 1, it is characterised in that This conductive plate is inverted u-shaped.

The inductance promoting substrate radiating effect the most according to claim 1, it is characterised in that At least one shrinkage pool climbing stannum it is provided with bottom this thermal conductive contact portion.

The inductance promoting substrate radiating effect the most according to claim 1, it is characterised in that This electronic component radiator is the metal fin of inverted u-shaped.

The inductance promoting substrate radiating effect the most according to claim 5, it is characterised in that The lateral margin of the side plate of these metal fin both sides is respectively equipped with bending block holding part.