CN205479677U - Improved generation pole sealing device of wafer valve - Google Patents

Improved generation pole sealing device of wafer valve Download PDF

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Publication number
CN205479677U
CN205479677U CN201620254723.9U CN201620254723U CN205479677U CN 205479677 U CN205479677 U CN 205479677U CN 201620254723 U CN201620254723 U CN 201620254723U CN 205479677 U CN205479677 U CN 205479677U
Authority
CN
China
Prior art keywords
gland
valve
type
copper backing
sealing device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201620254723.9U
Other languages
Chinese (zh)
Inventor
唐明幸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JIANGSU WEIDONG MACHINERY Co Ltd
Original Assignee
JIANGSU WEIDONG MACHINERY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JIANGSU WEIDONG MACHINERY Co Ltd filed Critical JIANGSU WEIDONG MACHINERY Co Ltd
Priority to CN201620254723.9U priority Critical patent/CN205479677U/en
Application granted granted Critical
Publication of CN205479677U publication Critical patent/CN205479677U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses an improved generation pole sealing device of wafer valve, this improved generation pole sealing device include gland (1), lip type pack (2), copper backing (3) and " O " type circle (5), and clearance two lip type of installation with valve gap (4) pack (2) at valve rod (6), and two lip type pack (2) upper and lower and set up one copper backing (3) respectively to it is sealed by gland (1), interior peripheral hardware " O " the type circle (5) of copper backing (3). The utility model discloses pack with forming by gland compression lip type and seal, if not hard up " O " type circle of gland also can be guaranteed to seal, improve the sealing performance of wafer valve, improve the security of wafer valve.

Description

The modified model rod seal apparatus of flap type
Technical field
This utility model relates to flap type, is specifically related to the modified model rod seal apparatus of flap type.
Background technology
At present, the rod seal of the flap type that domestic market uses is all lip type packing seal, and this type of seals valve rod and fills out The surface roughness requirements of magazine is the highest, and is extremely difficult to the requirement of hermetic seal.
Summary of the invention
The purpose of this utility model is: provides the modified model rod seal apparatus of a kind of flap type, improves the close of flap type Sealing property, improves the safety of flap type.
Technical solution of the present utility model is: this modified model rod seal apparatus includes gland, lip type filler, copper Pad and "O"-ring, install two lip type fillers in the gap of valve rod and valve gap, two lip type fillers be respectively provided with one up and down Individual copper backing, and sealed by gland, the interior peripheral hardware "O"-ring of copper backing.
The utility model has the advantages that:
A, this rod seal apparatus include two lip type fillers, two copper backings and "O"-ring and gland, by filler pressure Lid compression lip type filler is formed and seals, if gland loosens "O"-ring it is also ensured that seal.
When B, emergency maintenance, if lip type filler can not be purchased timely, depend "O"-ring alone and valve can also be made stably to transport OK.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
In figure: 1 gland, 2 lip type fillers, 3 copper backings, 4 valve gaps, 5 "O"-rings, 6 valve rods.
Detailed description of the invention
As it is shown in figure 1, this modified model rod seal apparatus includes gland 1, lip type filler 2, copper backing 3 and "O"-ring 5, in the gap of valve rod 6 with valve gap 4, two lip type fillers 2 are installed, two lip type fillers 2 be respectively provided with a copper backing up and down 3, and sealed by gland 1, the interior peripheral hardware "O"-ring 5 of copper backing 3.

Claims (1)

1. the modified model rod seal apparatus of flap type, is characterized in that: this modified model rod seal apparatus includes gland (1), lip Type filler (2), copper backing (3) and "O"-ring (5), install two lips type filler (2) in the gap of valve rod (6) with valve gap (4), Two lips type filler (2) be respectively provided with a copper backing (3) up and down, and sealed by gland (1), copper backing (3) interior Peripheral hardware "O"-ring (5).
CN201620254723.9U 2016-03-30 2016-03-30 Improved generation pole sealing device of wafer valve Expired - Fee Related CN205479677U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201620254723.9U CN205479677U (en) 2016-03-30 2016-03-30 Improved generation pole sealing device of wafer valve

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201620254723.9U CN205479677U (en) 2016-03-30 2016-03-30 Improved generation pole sealing device of wafer valve

Publications (1)

Publication Number Publication Date
CN205479677U true CN205479677U (en) 2016-08-17

Family

ID=56648935

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201620254723.9U Expired - Fee Related CN205479677U (en) 2016-03-30 2016-03-30 Improved generation pole sealing device of wafer valve

Country Status (1)

Country Link
CN (1) CN205479677U (en)

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20160817

CF01 Termination of patent right due to non-payment of annual fee