CN205425509U - Novel refrigeration device - Google Patents
Novel refrigeration device Download PDFInfo
- Publication number
- CN205425509U CN205425509U CN201521041364.0U CN201521041364U CN205425509U CN 205425509 U CN205425509 U CN 205425509U CN 201521041364 U CN201521041364 U CN 201521041364U CN 205425509 U CN205425509 U CN 205425509U
- Authority
- CN
- China
- Prior art keywords
- semiconductor chilling
- box body
- chilling plate
- water
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000005057 refrigeration Methods 0.000 title claims abstract description 27
- 239000004065 semiconductor Substances 0.000 claims abstract description 42
- 235000012149 noodles Nutrition 0.000 claims abstract description 9
- 238000001816 cooling Methods 0.000 claims abstract description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 33
- 230000017525 heat dissipation Effects 0.000 abstract 4
- 230000037250 Clearance Effects 0.000 abstract 2
- 230000035512 clearance Effects 0.000 abstract 2
- 230000033228 biological regulation Effects 0.000 abstract 1
- 238000010276 construction Methods 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000003574 free electron Substances 0.000 description 2
- 206010019345 Heat stroke Diseases 0.000 description 1
- 230000005679 Peltier effect Effects 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002427 irreversible Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Abstract
The utility model discloses a novel refrigeration device, including the box body, the inside of box body is provided with the semiconductor refrigeration piece, and its design point lies in: the huyashi -chuuka (cold chinese -style noodles) and/or the hot side side of semiconductor refrigeration piece are provided with the heat dissipation baffle, and the semiconductor refrigeration piece has more than two or two, leaves the clearance between two adjacent semiconductor refrigeration pieces, and a heat dissipation baffle sets up and form a set of cooling unit in a clearance, and heat dissipation baffle one side faces the huyashi -chuuka (cold chinese -style noodles) side of a semiconductor refrigeration piece, and heat dissipation baffle opposite side faces the hot side side of another semiconductor refrigeration piece. The utility model aims at providing a novel refrigeration device, its simple structure, refrigeration efficiency is high, and convenient to use adopts semiconductor refrigeration, realizes the regulation and control of cold and hot temperature.
Description
Technical field:
This utility model relates to semiconductor temperature-lowering device technical field, is specifically related to a kind of Novel refrigeration device.
Background technology:
During the broiling summer with cold winter, outdoor cold and hot meeting brings certain impact to work and the life of people.The when of heat, meeting heatstroke, can catch a cold the when of cold.
Utility model content:
The purpose of this utility model is to provide a kind of Novel refrigeration device, its simple in construction, and refrigerating efficiency is high, easy to use, uses semiconductor refrigerating, it is achieved cold and hot temperature adjusting.
In order to solve the problem existing for background technology, this utility model is by the following technical solutions:
A kind of Novel refrigeration device, includes box body, box body be internally provided with semiconductor chilling plate, it is characterised in that: huyashi-chuuka (cold chinese-style noodles) and/or the hot side side of described semiconductor chilling plate are provided with thermal transfer plate；Described semiconductor chilling plate has more than two panels or two panels, gap is left between adjacent two panels semiconductor chilling plate, one described thermal transfer plate forms one group of refrigeration unit in being arranged on a gap, thermal transfer plate side faces the huyashi-chuuka (cold chinese-style noodles) side of semiconductor cooling piece, and thermal transfer plate opposite side faces the hot side side of another semiconductor chilling plate.
A kind of Novel refrigeration device, it is characterized in that: described box body is provided with water inlet and outlet, the outside of box body is integrated with power supply, water pump, and power supply is powered to water pump and semiconductor chilling plate, and described thermal transfer plate has until the prolongation of water inlet.
A kind of Novel refrigeration device, it is characterized in that: in described box body, be provided with dividing plate, formed between dividing plate and described semiconductor chilling plate and allow the hot switching path of water water conservancy diversion, allow the sponge strip being close to blue ice bar bag fully absorb cold water or hot water so that it is sufficient heat exchange can be reached.
A kind of Novel refrigeration device, it is characterised in that: described power supply has external charging inlet, can arrange or solar panels by external charge.
Semiconductor chilling plate operation principle in this utility model: 1, peltier effect: when the loop being made up of by different conductors electric current, in addition to producing irreversible Joule heat, along with the difference of the sense of current, heat absorption, exothermic phenomenon can occur in the joint of different conductor respectively.If electric current flows to, from one end A that free electron number is higher, one end B that free electron number is relatively low, then the temperature of B end will raise；Otherwise, the temperature of B end will reduce.The most do not produce water or its unnecessary material, and can unlimited number of use.
This utility model has the advantages that
1, simple in construction, uses semiconductor refrigerating and heats and the combination of water circulation, it is achieved cold and hot temperature adjusting.
2, between two block semiconductor cooling pieces, it is designed with thermal transfer plate, thermal transfer plate has prolongation, until water inlet, polylith semiconductor chilling plate works simultaneously and is greatly improved refrigerating efficiency, the effect of thermal transfer plate: increase film-cooled heat, the heat that semiconductor chilling plate another side produces quickly is conducted, thus improves refrigerating efficiency.
3, being provided with dividing plate in box body, multiple dividing plates are used for water conservancy diversion, allow water flow, and current are fully and semiconductor chilling plate carries out heat exchange so that heat exchange more fully acts on.
Accompanying drawing illustrates:
Fig. 1 is this utility model structural representation.
Fig. 2 is the structural representation that this utility model is applied in combination with heat exchange bag.
Detailed description of the invention:
Referring to Fig. 1 and Fig. 2, this detailed description of the invention by the following technical solutions:
A kind of Novel refrigeration device, includes box body 1, box body 1 be internally provided with semiconductor chilling plate 2, huyashi-chuuka (cold chinese-style noodles) and/or the hot side side of semiconductor chilling plate 2 are provided with thermal transfer plate 5；Semiconductor chilling plate has more than two panels or two panels, gap is left between adjacent two panels semiconductor chilling plate, one thermal transfer plate 5 forms one group of refrigeration unit in being arranged on a gap, thermal transfer plate 5 side faces the huyashi-chuuka (cold chinese-style noodles) side of semiconductor cooling piece 2, and thermal transfer plate 5 opposite side faces the hot side side of another semiconductor chilling plate 2.Box body 1 is provided with water inlet 11 and outlet 12, is integrated with power supply 3, water pump 4 in box body 1, and power supply 3 is powered to water pump 4 and semiconductor chilling plate 2, and power supply 3 has external charging inlet, can arrange or solar panels by external charge.Thermal transfer plate 5 has until prolongation 51 at water inlet 11.
For sufficient heat exchange, dividing plate 7 it is provided with in box body 1, formed between multiple dividing plates 7 and semiconductor chilling plate 2 and allow the hot switching path of water water conservancy diversion, allow the refrigeration hot switching path 31 of water water conservancy diversion particularly as follows: formed between one group of dividing plate 7 and semiconductor chilling plate 2 huyashi-chuuka (cold chinese-style noodles) side, formed between another group dividing plate 7 and semiconductor chilling plate 2 hot side side allow water water conservancy diversion heat hot switching path 32.
Referring to Fig. 2, this utility model uses embodiment as follows:
Water pump 4 is connected with heat exchange bag 6 by circulation pipe 8, and the other end of heat exchange bag 6 connects several heat exchange bag 6 by circulation pipe 8, is connected to box body 1 eventually through water inlet 11 backflow.Heat exchange bag 6 is arranged on some positions such as clothes, medicated cap.
This detailed description of the invention has the advantages that its simple in construction, uses semiconductor refrigerating and heats, it is achieved cold and hot temperature adjusting, bringing comfort to health.
Claims (4)
1. a Novel refrigeration device, includes box body, box body be internally provided with semiconductor chilling plate, it is characterised in that: huyashi-chuuka (cold chinese-style noodles) and/or the hot side side of described semiconductor chilling plate are provided with thermal transfer plate；Described semiconductor chilling plate has more than two panels or two panels, gap is left between adjacent two panels semiconductor chilling plate, one described thermal transfer plate forms one group of refrigeration unit in being arranged on a gap, thermal transfer plate side faces the huyashi-chuuka (cold chinese-style noodles) side of semiconductor cooling piece, and thermal transfer plate opposite side faces the hot side side of another semiconductor chilling plate.
A kind of Novel refrigeration device, it is characterized in that: described box body is provided with water inlet and outlet, the outside of box body is integrated with power supply, water pump, and power supply is powered to water pump and semiconductor chilling plate, and described thermal transfer plate has until the prolongation of water inlet.
A kind of Novel refrigeration device, it is characterized in that: in described box body, be provided with dividing plate, formed between multiple dividing plates and described semiconductor chilling plate and allow the hot switching path of water water conservancy diversion, the sponge strip being close to blue ice bar bag is allowed to fully absorb cold water or hot water so that it is sufficient heat exchange can be reached.
A kind of Novel refrigeration device, it is characterised in that: described power supply has external charging inlet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521041364.0U CN205425509U (en) | 2015-12-03 | 2015-12-03 | Novel refrigeration device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521041364.0U CN205425509U (en) | 2015-12-03 | 2015-12-03 | Novel refrigeration device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205425509U true CN205425509U (en) | 2016-08-03 |
Family
ID=56516900
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201521041364.0U Expired - Fee Related CN205425509U (en) | 2015-12-03 | 2015-12-03 | Novel refrigeration device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205425509U (en) |
-
2015
- 2015-12-03 CN CN201521041364.0U patent/CN205425509U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160803 Termination date: 20191203 |