CN205408329U - A casing that is used for electronic equipment's casing part and is used for electronic equipment - Google Patents

A casing that is used for electronic equipment's casing part and is used for electronic equipment Download PDF

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Publication number
CN205408329U
CN205408329U CN201620171592.8U CN201620171592U CN205408329U CN 205408329 U CN205408329 U CN 205408329U CN 201620171592 U CN201620171592 U CN 201620171592U CN 205408329 U CN205408329 U CN 205408329U
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China
Prior art keywords
housing parts
housing
polymeric material
ceramic
parts
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Withdrawn - After Issue
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CN201620171592.8U
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Chinese (zh)
Inventor
J·C·浦尔
K·M·肯尼
松雪直人
D·I·纳扎罗
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Apple Inc
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Apple Computer Inc
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Priority claimed from US14/816,277 external-priority patent/US9750322B2/en
Application filed by Apple Computer Inc filed Critical Apple Computer Inc
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Abstract

The utility model relates to a casing that is used for electronic equipment's casing part and is used for electronic equipment. The utility model discloses a casing part for electronic equipment, the casing part includes: the ceramic package, including the central authorities surface, central authorities are followed on the surface central authorities extend on the surface flange that leaves and surround, the cavity is injectd to central authorities surface and flange, and polymeric material, central surface and flange coat, wherein polymeric material is combined central surface and flange, and need not the any adhesive between polymeric material and the ceramic package.

Description

Housing parts for electronic equipment and the housing for electronic equipment
Cross reference to related application
The application is in the U.S. Provisional Patent Application No.62/129 that on March 8th, 2015 submits to and title is " Co-MoldedCeramicandPolymerStructure ", the non-provisional of 868 and claimed, its complete disclosure is incorporated herein by reference.
Technical field
Present disclosure relates in general to pottery and polymer architecture, and is more particularly related to co-molded pottery and the polymer architecture of electronic equipment.
Background technology
Electronic equipment usually includes some or all sensitive and/or delicate components the housings sealing electronic equipment.This housing can have be sheared, gluing, combine or be otherwise affixed to each other with formed housing multiple mating parts and in housing enclose electronic unit.
By convention, plastics are used to the housing of electronic equipment, are at least partly because it and easily form the complicated shape needed for modern electronic equipment and geometry.But, the housing of increasing electronic equipment is made up of other material different from plastics.Such as, used due to the intensity of they excellences, optical property and aesthetic properties including the housing of glass, pottery etc..But, these materials self have shortcoming.Such as, for the little maintenance feature (such as, clip, arm, ratchet, groove) that is coupled together by housing parts, being molded as plastic sheet can relatively easy, but is likely difficult to and maybe can not use glass and pottery formation.
Utility model content
Embodiment discussed herein relates to the product with the ceramic material co-molded with polymeric material, and by method that co-molded ceramic material and polymeric material manufacture housing and/or housing parts.
In certain embodiments, the method manufacturing the housing parts for electronic equipment includes putting in a mold the first component formed by ceramic material.Mould can include defining the Part I being configured to receive the first cavity of first component and defining the Part II of the second cavity communicated with the first cavity when the mold is closed, and is the shape of the feature being joined to ceramic material.Polymeric material can be injected in the second cavity, thus forms feature from polymeric material and this feature is attached to ceramic material.Polymeric material can be cured.First component and described feature collectively form the housing parts for electronic equipment.
In certain embodiments, the method manufacturing the housing parts for electronic equipment includes fixing ceramic component in fixing device.Ceramic component can have the first side and second side relative with the first side, and can define the hole extending to the second side from the first side wherein.Polymeric material can be injected in hole so that polymeric material is substantially filled with hole, and makes the first surface of polymeric material substantially coplanar with the first side of ceramic component.Polymeric material can be cured.
In certain embodiments, disclosing a kind of housing parts for electronic equipment, described housing parts includes: ceramic package, including central surface, described central surface is surrounded by the flange being extended from described central surface, and described central surface and flange limit cavity;And polymeric material, coating central surface and flange;Wherein polymeric material is incorporated into central surface and flange, without any binding agent between polymeric material and ceramic package.
Preferably, ceramic package is the ceramic material of monoblock.
Preferably, polymeric material is co-molded with ceramic package.
Preferably, flange surrounds central surface completely.
Preferably, ceramic package is coupled to additional housing parts, and to form the housing for electronic equipment, wherein ceramic package and described additional housing parts limit the internal capacity being configured to receive electronic equipment part.
Preferably, polymeric material has substantially uniform thickness.
Preferably, polymeric material is by the mechanical coupling interaction between polymeric material and the micro structure of ceramic material to central surface and flange.
Preferably, ceramic package includes hole at central surface, and polymeric material is by the mechanical coupling interaction between polymeric material and described hole to central surface.
Preferably, described hole includes undercutting.
In certain embodiments, disclosing a kind of housing for electronic equipment, described housing includes: the first housing parts formed by ceramic material;And holding member, it being coupled to the surface of the first housing parts, described holding member includes the arm being extended and being configured to the maintenance feature that engagement is associated with the second housing parts from the first housing parts, is thus kept together by the first and second housing parts;Wherein: holding member is formed by polymeric material;And holding member and the first housing parts co-molded.
Preferably, holding member includes mounting seat;And mounting seat is molded into the surface of the first housing parts.
Preferably, mounting seat and arm are formed as global facility.
Preferably, holding member is directly coupled to the surface of the first housing parts.
Preferably, described arm also includes being configured to the breech lock of the maintenance feature of engagement the second housing parts.
Preferably, holding member also includes being extended and be configured to the additional arm that the additional maintenance feature with the second housing parts engages from the first housing parts.
Preferably, described arm and additional arm each include the slender member extended more than half of the length along the first housing parts.
In certain embodiments, the housing for electronic equipment includes the first housing parts, including: the housing parts formed by ceramic material;And holding member, it being coupled to the surface of housing parts, described holding member is extended from housing parts, and wherein said holding member is formed by polymeric material;And second housing parts, including keeping feature;Wherein holding member engages with keeping feature, thus keeps the first housing parts about the second housing parts with fixed relationship;And wherein the first housing parts and the second housing parts limit the internal capacity being configured to receive electronic equipment part.
Preferably, also including the seal between the sealing surface and the sealing surface of the second housing parts of the first housing parts, wherein the sealing surface of the first housing parts is towards the sealing surface of the second housing parts.
Preferably, seal is directly coupled to the first housing parts or the second housing parts.
Preferably, seal is injection-molded in the gap between the sealing surface of the first housing parts and the sealing surface of the second housing parts.
Preferably, holding member limits the breech lock of the maintenance feature being configured to engagement the second housing parts;And seal applies power between the first and second housing parts so that breech lock and maintenance feature keep engagement.
Preferably, feature is kept to form the shoulder engaged with breech lock.
Other embodiments is disclosed herein.The feature of various embodiments of present disclosure, use and advantage will be apparent from from the following description to embodiment as shown in the drawings.
Accompanying drawing explanation
In conjunction with accompanying drawing by described in detail below, present disclosure will readily appreciate that, the structural detail that wherein identical label instruction is identical, and wherein:
Fig. 1 depicts the illustrative perspective view of the example of the electronic equipment according to some embodiments;
Fig. 2 A depicts according to some embodiments, for the decomposition diagram of housing of electronic equipment;
Fig. 2 B-2C depicts the viewgraph of cross-section according to some embodiments, the housing of Fig. 2 A;
Fig. 3 depicts the illustrative perspective view of the example of the electronic equipment according to some embodiments;
Fig. 4 A depicts the bottom plan view according to some embodiments, the housing of Fig. 3;
Fig. 4 B-4C depicts the viewgraph of cross-section according to some embodiments, the Part I of the housing of Fig. 4 A;
Fig. 5 A-5B depicts the viewgraph of cross-section according to some embodiments, the Part I of the housing of Fig. 4 A;
Fig. 6 A-6B depicts respectively according to some embodiments, for the perspective of a part of housing of electronic equipment and viewgraph of cross-section;
Fig. 7 A-7B depicts respectively according to some embodiments, for the perspective of a part of housing of electronic equipment and viewgraph of cross-section;
Fig. 8 A-8B depicts respectively according to some embodiments, for the perspective of a part of housing of electronic equipment and viewgraph of cross-section;
Fig. 9 A-9B depicts respectively according to some embodiments, for the perspective of a part of housing of electronic equipment and viewgraph of cross-section;
Figure 10 depicts the illustrative perspective view of the example of the electronic equipment according to some embodiments;
Figure 11 A depicts according to some embodiments, for the decomposition diagram of housing of electronic equipment;
Figure 11 B-11C depicts the viewgraph of cross-section according to some embodiments, the housing of Figure 11 A;
Figure 12 depicts according to some embodiments, manufactures the method for housing parts for electronic equipment;And
Figure 13 depicts according to some embodiments, manufactures the method for housing parts for electronic equipment.
Detailed description of the invention
Now will in detail with reference to representative embodiment illustrated in the accompanying drawings.Should be appreciated that as explained below is not intended to embodiment is limited to a kind of preferred embodiment.On the contrary, it is intended to cover alternative, amendment and the equivalent that can include within the spirit and scope of described embodiment as defined by the accompanying claims.
Housing for electronic equipment is made with other material in addition to plastic just more and more.Such as, housing can include the part be made up of pottery, crystal, glass, metal material etc..As specific example, the housing of wrist-watch can include the crystal element serving as the lid of the display screen for wrist-watch or watch face, and cover the ceramic segment (such as, against the part of the wrist-watch of user's skin when in the wrist being worn over user) at the back side of wrist-watch.Similarly, the housing of smart phone or tablet PC (or other electronic equipment) can include the glass or the crystal element that serve as the lid for display screen, and serves as the metal at the rear portion of equipment, pottery or other material.
This material can be difficult to form complex geometric shapes necessary to casting of electronic device.Such as, housing can be made up of multiple discrete parts, and these discrete parts are coupled together, and forms housing.In order to provide the secure connection between part, and in order to the parts for electronic equipment provide enough sealing, housing parts can include being easy to geometry or the feature of suitably the coordinating of housing parts, coupling and/or the mating feature sealed, surface, clip, shoulder or other complexity.For some materials, the geometry of these complexity is difficult or impossible to be formed from described material.Even if it addition, desired geometry can utilize specific material to realize, it also can be expensive for doing so, or can cause using too weak parts in the consumer electronics device.
As a specific example, ceramic material has many makes them use especially useful property in casting of electronic device.Such as, they can high resistance scratching, so that they are particularly suitable for frequently suffering from the electronic equipment of shock, scraping and cut, such as wearable electronic is (such as, intelligent watch, glasses etc.), stem-winder and other consumer products (include, but it is not limited to, media player, mobile computer, tablet computing device, etc.).The cover glass of the touch screen of wearable electronic can be highly suitable as specific example, the high rigidity of sapphire crystal and optical clarity (crystalline ceramic materials).Ceramic material can also be relatively light, so that hand-held or wearable electronic are more easily carried, dress and use.And, ceramic material can be capable of altimeter mirror polish, so that they are attractive in appearance especially pleasing.
But, ceramic material is generally more difficult to be formed complicated geometry than plastics, and therefore, manufacturing housing parts from ceramic material can be more difficult than to other material.Therefore, as herein described is housing parts, and wherein polymeric material is co-molded with ceramic component, to form the housing parts including pottery and polymeric material part.(as it is used herein, term " polymer " " and/or " polymeric material " include natural and the polymer of synthesis, plastics, rubber etc..) such as, ceramic shell part can be co-molded with polymeric material, it is directly coupled to ceramic material to be formed and can be used to keep about another housing parts the polymeric clip of this ceramic component.As another example, polymeric material can be co-molded with ceramic component, in order to forms plastic coating in a part for ceramic component.
As described herein, the polymeric material forming polymer features can be coupled to ceramic component by co-molding procedure, and thus polymeric material is molded against ceramic component.By being directly co-molded on ceramic component by polymeric material, polymer features can be incorporated into ceramic material, without using intermediate adhesive or other bonding agent between pottery and polymer features.Such as, replacing being formed respectively ceramic component and polymer features, then utilize glue, contact adhesive, heat-activated films, epoxy resin etc. that polymer features is adhered to pottery, polymer can mould directly against ceramic material.Therefore, if not only having included pottery but also included the part of polymer elements must separately manufactured can then utilizing binding agent to be coupled together realize such than parts to manufacture quickly and there is higher precision.In certain embodiments, polymeric material is injection-molded on ceramic component.In certain embodiments, polymeric material utilizes other technology except injection-molded to be molded into ceramic component, such as gravitational casting, or other suitable co-molding procedure any.When injection-molded is mentioned in this discussion, it will be appreciated that other molding technique can replace injection-molded in this case or additionally use.
As in any appropriate manner and/or utilize any suitable mechanism to carry out the result of co-molding procedure, polymer can be incorporated into ceramic material.In some cases, polymeric material to be molded into its ceramic material and has the finishing of the combination being suitable to facilitate between polymer and pottery.Such as, ceramic material can be polished, thus providing smooth surface, is used for allowing polymeric material be attached to it.
As another example, ceramic material can have coarse surface.In certain embodiments, more coarse (such as, grind or unpolished) surface adds the bond strength between polymeric material and ceramic material, because polymeric material can flow into flaw, crack, groove or other surface imperfection or discontinuous part.In certain embodiments, ceramic material is processed before co-molding procedure, to produce desired finishing or surface roughness.Such as, the surface of ceramic material that be co-molded with polymeric material can carry out sand milling, sandblasting, grinding or etching (chemically, mechanically or otherwise).But, in certain embodiments, the manufacture process being used for being formed ceramic material produces suitably coarse surface naturally, thus avoiding the demand to the additional process steps being ready for the surface that expectation bonds, and further increases production efficiency.
And, polymeric material flows into the flaw in ceramic component and/or irregular (such as, micro-crack, discontinuous etc.) can increase the bulk strength of pottery and polymer parts.Especially, polymeric material can reduce generation and concentrate at this feature or the stress near it, thus reduce ceramic material by ftractureing under stress, fragmentation or the probability that otherwise ruptures.
In certain embodiments, except or replace the feature of above-mentioned micro-scale, ceramic material includes the one or more macro-scale feature mutual with polymeric material, in order to polymeric material is fixed to ceramic material.Such as, ceramic component can include one or more raceway groove, hole, groove, breach or other suitable hole any, and polymeric material can flow into wherein in molding process, in order to polymer and ceramic material is secured together.As specific example, ceramic component can include the one or more blind holes being coupled on the surface of polymer elements.When ceramic component is in cavity body of mould and when polymeric material is injected in mould, polymeric material can flow into the one or more blind hole, therefore polymeric material (polymer features with result generation) is mechanical coupling to ceramic component.In certain embodiments, raceway groove in ceramic component, hole, groove (or other surface character) have complicated internal geometry (such as undercutting), which in turns increases the mechanical engagement between polymer and ceramic material, and therefore increase intensity and/or the durability of coupling therebetween.
As another example, ceramic component can include one or more projection (such as, pillar, arm, peg, projection, etc.), polymeric material is being molded about, in order to increase the intensity coupled between polymer and ceramic material and/or durability.Such as, ceramic component can include from surface outward extending peg (such as, cylindrical projections), and polymeric material when being molded against ceramic component will around this peg, thus interlocking polymer and ceramic component.
Except the manufacturing speed of increase being possibly realized by co-molded polymer and ceramic component and precision, it is also possible to can produce to have can not the geometry of (or being expensive to manufacture or complexity) and/or feature individually with pottery.For example, it may be desired to use ceramic material to be used as the housing parts of electronic equipment, as described herein, but housing parts is likely to need complicated geometry for coordinating, be directed at and/or keeping feature.More specifically, the rear portion of smart phone can be substantially flat parts, but be around circumference and can have the structure of complexity, in order to anterior properly the coupling and seal of smart mobile phone.This structure can include pin, hole, keeping arm, shoulder, flange etc..If it is desire to rear portion is made of ceramic materials, then it is likely difficult to, expensive or be not even likely to be formed such geometry (or they can provide and expection is used too weak parts).On the other hand, polymeric material is particularly suitable to form the geometry of complexity, because they can mould easily with injection-molded or other well-known forming technique.Therefore, by via polymeric material being directly co-molded on ceramic component and forming complicated feature, beneficial characteristics (such as, the hardness of pottery and aesthstic attractive force, and the flexibility of polymeric material and easily fabricated) possible with every kind of material.
And, because ceramic material can be relatively simple shape, so it can manufacture quickly than less expensive in other situation.As specific example, the ceramic segment of pottery and polymer shell body component can have smooth plane surface, and complicated polymeric material can be molded into this surface.Therefore, the manufacture complexity of ceramic segment can be minimized, thus causing significant efficiency and cost-benefit.It is true that in some cases, ceramic segment can be substantially rectangular prism.
Although generally speaking this discussion describes polymer features and can be used for installing and/or keeping housing parts, but these only can from some examples of polymeric material formation the feature co-molded with ceramic material.It is true that method described herein suitably forms for many different many different characteristics of purpose, such as support, compartment (such as, electronic unit can be mounted and/or be fixed therein), ornamental feature/inlay, coating/covering, etc..
And, co-molded polymer as described herein and ceramic material can produce the parts more solid and/or more tough and tensile than the like manufactured completely from pottery.Especially, ceramic material is usually unusually strong, but when being applied in load they often frangible and they tend to less deformed or deflection before breaking.That is, upon application to sufficient force, ceramic material tends to breaking rather than extending.But, some polymeric material can be harder than ceramic material, the polymer that such as high modulus carbon fiber is strengthened.When parts produce on ceramic material by being co-molded to by high modulus polymer material, when parts suffer load, the bulk deformation of high modulus polymer material meeting limiting part.By utilizing the deformation of polymeric material restriction ceramic material, parts will can stand than the bigger power that can suffer from individually with pottery.
Co-molded pottery described herein and the various additional benefit of polymer elements, structure, difference and/or feature are by apparent from the description of accompanying drawing and correspondence.Should be appreciated that as explained below is not intended to embodiment is limited to a kind of preferred embodiment.On the contrary, they are intended to cover alternative, amendment and the equivalent that can include within the spirit and scope of described embodiment as defined by the accompanying claims.
Referring now to Fig. 1, it is shown that the illustrative perspective view of an example of electronic equipment 100 (being also referred to as " equipment 100 ").Especially, equipment 100 represents smart phone.But, this is only an example of electronic equipment, and equipment 100 can be any suitable electronic equipment, including wrist-watch, laptop computer, wearable electronic, health monitoring equipment, biometric sensor, computer, audio/video player or recorder, etc..
In certain embodiments, equipment 100 can be configured as providing the electronic equipment of the information relevant to health or data, described information or data include but not limited to heart rate data, blood pressure data, temperature data, oxygen content data, diet/nutritional information, medical alert, healthy relevant prompting or information or other data relevant to health.
Equipment 100 can include housing 102.Housing 102 can form the outer surface of the internal part for equipment 100 or partial outer face and containment vessel.Housing 102 can include the first housing parts 104 and the second housing parts 106.In certain embodiments, the first housing parts 104 forms the bottom of housing, and the second housing parts 106 forms the top of housing.First and second housing parts 104,106 may be coupled together, to form housing 102, as described herein.Although Fig. 1 depicts the housing formed by two parts (such as, top casing and bottom enclosure), but this is only an example of possible housing structure.Housing can include more or less of housing parts, and can include different configuration and/or the shape of the housing parts of composition housing.
In certain embodiments, at least the first housing parts 104 is formed by ceramic material.In certain embodiments, the first housing parts 104 is monolithic ceramic material.Ceramic material includes, but it is not limited to, pottery that porcelain, aluminium oxide, beryllium oxide, cerium oxide, zirconium oxide, carbide, boride, nitride, silicide, granule are strengthened, the pottery that fiber is strengthened, the combination of oxide and non-oxidized substance and ceramic-metal composite material (ceramic metal).In certain embodiments, the second housing parts 106 is formed by any material, including polymer, metal, glass, pottery etc..In this description, ceramic material the housing parts formed is also referred to as ceramic shell part or ceramic component.
Fig. 2 A illustrates the decomposition diagram of the housing for electronic equipment, it is shown that Part II 106 separates with the first housing parts 104.In certain embodiments, the first housing parts 104 is the shell forming cavity.Cavity can by the first surface (such as, under the mounting seat 202 of holding member 200) of ceramic package with in one or more flanges of first surface outer perimeter or wall (such as, wall 216) definition.The one or more flange is extended from first surface in a first direction, in order to definition cavity.In certain embodiments, a part for the internal capacity of the housing 102 that cavity definition electronic equipment part is located therein.The shell of formation cavity is only used for an example of a part for the housing of electronic equipment, and other shape of housing parts and structure are also intended.Such as, Fig. 6 A-9A illustrates the accessory configurations of each several part that can correspond to the housing for electronic equipment.
In certain embodiments, the first housing parts 104 includes the polymeric material that is coupled to it.As shown in Figure 2 A, it is shown that the polymeric material gone out is to maintain parts 200.But, this is only an example of the polymer features being alternatively coupled to the first housing parts 104.Such as, polymeric material can be polymer coating or the surface being applied to the first housing parts 104 layer (such as, as shown by about Fig. 6 A-7B and describe), polymer window in the opening that is molded in the first housing parts 104 (such as, as shown by about Fig. 3-4C and describe), the polymer bumps that is extended from the first housing parts 104 (such as, as shown by about Fig. 8 A-8B and description), etc..
As described herein, as the result that polymeric material is directly co-molded on the first housing parts 104, polymeric material (such as, holding member 200) is coupled to the first housing parts 104.More particularly, replacing forming the first housing parts 104 and holding member 200 respectively, then again holding member 200 glue, contact adhesive, heat-activated films, epoxy resin etc. are adhered to the first housing parts 104, polymer directly can mould against ceramic material.
As it is indicated above, polymeric material can be coupled to the first housing parts 104 by the mechanical bond between polymeric material and ceramic material.Mechanical bond can be engaged by the microcosmic between material or macro-mechanical and produce.Such as, by flowing into and/or around the micro structure (such as, microscopic grooves, surface imperfection, etc.) in the first housing parts 104, mechanical bond can be produced by the liquid polymers mutual with the first housing parts 104.(liquid polymers includes the polymer being heated to make polymer flow, such as thermoplastic polymer, or is in the polymer of liquid when without any heat, such as thermosetting polymer.)
By flowing into and/or around the macrostructure (such as, undercutting, raceway groove, hole, pillar, ratchet etc.) of the first housing parts, mechanical bond can also or instead be produced by the liquid polymers mutual with the first housing parts.Microstructure and macrostructure can be manually created (such as, utilize mechanically or chemically etching, sandblasting, laser-induced thermal etching or ablation etc.), or can naturally there is (such as, due to micro-crack, dislocation and/or the surface imperfection that normally manufacture or molding cause of material).No matter it is based on microcosmic or macro-mechanical structure, polymeric material and ceramic material can form one or more interlocking structure being engaged with each other (such as, undercutting or include the geometry of undercutting), in order to polymeric material is coupled to ceramic material.
In certain embodiments, polymeric material can include producing between polymeric material and ceramic material or increasing the binding agent combined.Binding agent can include in liquid polymer material so that the process against ceramic material molded polymeric material is easy to binding agent and is combined.Therefore, it is not necessary to introduce binding agent between ceramic material and polymeric material to polymeric material be attached to ceramic material.On the contrary, polymeric material is bonded directly to ceramic material by binding agent, it is not necessary to any calking parts (such as, glue, contact adhesive etc.).In certain embodiments, binding agent utilizes liquid polymer material to homogenize.
In certain embodiments, polymeric material is thermoplastic, polymeric materials, such as polyamide, polypropylene, polystyrene, polymethyl methacrylate, polyethylene, etc..In certain embodiments, polymeric material is thermoset copolymer material, such as epoxy resin, polyester, vinyl esters, phenolic resin etc..In certain embodiments, polymeric material includes reinforcing fibre, such as carbon fiber, glass fibre, ceramic fibre, CNT, aramid fiber, etc..
Returning to Fig. 2 A, holding member 200 includes mounting seat 202 and the first arm 204 and the second arm 206 being each extended from mounting seat 202.First and second arms 204,206 are connected to the periphery of the first housing parts 104 via mounting seat 202.
First and second arms 204,206 are configured to engage with the maintenance feature of the second housing parts 106, in order to the first housing parts 104 is remained to the second housing parts 106.In certain embodiments, as shown in Figure 2 A, the first and second arms 204,206 can be the elongated member extended along the substantially all length of the first housing parts 104.In certain embodiments, the first and second arms 204,206 along the first housing parts 104 length more than half extend.
Fig. 2 B and 2C depicts the viewgraph of cross-section by the housing 102 obtained of the line 2B-2B in Fig. 2 A.Especially, Fig. 2 B illustrates the first housing parts 104 separated with the second housing parts 106, and Fig. 2 C illustrates the housing of assembling, and wherein the first housing parts 104 is kept about the second housing parts 106.When the first housing parts 104 is kept about the second housing section 106, the first housing parts 104 can be kept and be in fixed relationship with the second housing parts 106.
As shown in Figure 2 B, the first and second arms 204,206 of holding member 200 are extended from mounting seat 202.First and second arms 204,206 include the first and second latch components 210,212 respectively.The maintenance feature 218,220 that latch component is configured to the second housing parts 106 engages, in order to kept together by the first and second housing parts 104,106.
In certain embodiments, housing 102 includes the seal 214 that is arranged between sealing surface 222 and the sealing surface 224 of the second housing parts 106 of the first housing parts 104.The sealing surface of the first and second housing parts can face each other so that when housing parts is assemblied together so that when forming housing 102, they all contact with seal 214.Seal 214 can by any suitable encapsulant, such as elastomer, foam etc., is formed.
In certain embodiments, seal 214 seals up the gap between the first and second housing parts.Seal 214 can be used to prevent or limit the inside that fragment, dampness, air or other material enter and/or spill housing.
In certain embodiments, seal 214 can be compressed between the first and second housing parts 104,106 so that seal 214 gives the power tending to separately housing parts.This separating force applies again locking or latching force between the maintenance feature 218,220 of latch component 210,212 and second housing parts 106 of holding member 200.
Seal 214 can be single global facility (such as, monoblock encapsulant, all as applied to and/or be attached to the RUBBER O-ring of sealing surface or the continuous sealing material of housing parts).As an alternative, seal 214 can be formed by multiple discrete components (such as foam between housing parts, elastomer, polymer or other encapsulant each).
In certain embodiments, seal 214 is coupled in the middle of the first and second housing parts 104,106 one or two.Such as, seal 214 can utilize binding agent (such as, glue, contact adhesive etc.) to be coupled to the sealing surface 222 of the first housing parts 104.
As described herein, polymeric material is (such as, holding member 200) the first housing parts 104 can be coupled to by co-molding procedure, thus polymeric material is molded (such as, utilizing injection-molded, gravitational casting etc.) against the first housing parts 104.Such as, as described herein, (being formed by ceramic material) first housing parts 104 can be introduced into mould, this mould has the first cavity being configured to receive the first housing parts 104 (or its part), and is configured with the second cavity of the shape of the feature being coupled to the first housing parts 104.When housing 102, the second cavity corresponds to holding member 200, but further feature and shape are also intended.
Owing to being difficult to be formed the geometry of complexity from ceramic material, and the rigidity of some ceramic materials and fragility, it is thus possible to it is difficult or impossible to form the one-piece parts simultaneously including the first housing parts 104 and holding member 200.Such as, if arm 204 and 206 is manufactured by ceramic material, then they are likely to too not flexible, to such an extent as to the first housing parts 104 can not be coupled to the second housing parts 106.Specifically, when the first and second housing parts are coupled together, when latch component 210,212 is when keeping sliding on feature 218,220, polymeric arms 204,206 can deflect.If arm is formed by ceramic material, then when latch component 210,212 is when keeping sliding on feature 218,220, arm is likely to too crisp to such an extent as to can not deflect, and latch component 210,212 or arm 204,206 can just fractures.
In Fig. 1-2 C, polymer features is configured to the inside at shell.But it is not necessarily the case that so.Especially, the benefit of co-molded polymeric material and ceramic material is for being also useful in the polymer features of hull outside (or being otherwise in device external).Such as, intelligent watch (such as shown with reference to Fig. 3 and describe) can include via one or more watchbands being connected to housing with attachment structures.Although Wristwatch case can be formed by ceramic material (at least in part), but it can be useful for being formed with attachment structures from polymeric material.Such as, the complex geometric shapes with attachment structures can be more easily formed than from pottery from polymer, or, in certain embodiments, ceramic material is too crisp possibly for being used as band attachment structures.Therefore, in the way of to be co-molded on the first housing parts 104 identical with holding element 200, can be formed by polymeric material being co-molded to the ceramic material of housing with attachment structures.
Referring now to Fig. 3, it is shown that the illustrative perspective view of an example of electronic equipment 300 (being also referred to as " equipment 300 ").Especially, equipment 300 represents wrist-watch, such as intelligent watch.But, this is only an example of electronic equipment, and equipment 300 can be any suitable electronic equipment, including smart phone, laptop computer, wearable electronic, health monitoring equipment, biometric sensor, computer, audio/video player or recorder etc..
Equipment 300 can include housing 302, is similar to above-mentioned housing 102.Housing 302 may be constructed the outer surface of the internal part for equipment 300 or partial outer face and containment vessel.Housing 302 can include the first housing parts 304 and the second housing parts 306.In certain embodiments, the first housing parts 304 forms the bottom of housing, and the second housing parts 306 forms the top of housing.First and second housing parts 304,306 may be coupled together, to form housing 302.In certain embodiments, at least the first housing parts 304 is formed by ceramic material.In certain embodiments, the second housing parts 306 is formed by any material, including polymer, metal, glass, pottery etc..
In certain embodiments, equipment 300 can be configured as providing the electronic equipment of the information relevant to health or data, described information or data such as, but not limited to heart rate data, blood pressure data, temperature data, oxygen content data, diet/nutritional information, medical alert, healthy relevant prompting or information or other data relevant to health.Therefore, equipment 300 can include for detecting the sensor that can directly or indirectly determine this information relevant to health or data from it.
More specifically, in certain embodiments, equipment 300 includes the sensor of the signal of the detection health transmitting from user and/or reflection.Additionally, equipment 300 can include operating together in conjunction with sensor to be imparted on the health of user or emitter therein by signal (such as, it is seen that light, infrared/electromagnetic radiation etc.).Then, sensor can detect signal how by user physical effects (such as, by the light quantity of the skin reflex of user, the signal of telecommunication decay caused by the skin of user, etc.).
This sensor and/or emitter can be placed in the housing 302 of equipment.But, the housing 302 of contact user's body, and especially, the first housing parts 304, certain material can stop, hinder or otherwise prevention signal travels to and fro between sensor and/or emitter.Such as, when the first housing parts 304 is made up of opaque ceramic material, the skin that optical pickocff or emitter will be unable to user communicates.Therefore, housing 302 (and, more specifically, the first housing parts 304) window 308 can be included, by it, sensor and/or emitter can communicate with the health of user.
Fig. 4 A depicts the bottom plan view of housing 302, it is shown that the window 308 in the first housing parts 304.In certain embodiments, as shown in Figure 4 A, sensor/emitter 400 may be located in housing 302 above window 308 and near it.Sensor/emitter 400 is sensed by window 308 and/or is launched signal.Sensor/emitter 400 can be the combination of sensor, emitter or sensor and emitter.But, for ease of reference, sensor/emitter 400 is called for short sensor 400 here.When the signal that sensor detection enters housing 302 via window 308 is mentioned in description, it will be appreciated that this description also analogy ground is emitted through window 308 suitable in emitter and passes the signal of housing 302.
In certain embodiments, window 308, by optically transparent material, such as transparent polymer, is formed.But, window 308 can be had the material of expectation and/or required absorbance by the signal specific used for sensor 400 and be formed.Such as, if emitter is configured to launch radio wave, then window 308 can be formed by the polymeric material of the material more freely transmission radio wave than the remainder forming the first housing parts 304.As another example, if sensor is configured to sensing visible ray, then window 308 can be formed by transparent or semitransparent polymeric material.In certain embodiments, polymeric material has the electromagnetic transmission rate higher than ceramic material in specific bands of a spectrum.In certain embodiments, window 308 is transparent pottery, crystal or glass material, and the first housing parts 304 is around the polymeric material of window 308 molding.
As noted above, sensor 400 can be used for detecting the information relevant to health by equipment 300, such as heart rate data, blood pressure data, temperature data, oxygen content data, blood glucose level data, etc..Therefore, window 308 is configured to facilitate signal passing through between the outside of sensor 400 and housing 302.In other embodiments, window 308 is configured to be easy to passing through of signal for any purpose.Such as, sensor 400 can be imaging sensor (such as, for digital camera), and in this case, window 308 can be configured to allow light and through window 308 and arrive imaging sensor.As another example, sensor/emitter 400 can be antenna (such as, for radio communication), and it is configured to launch and/or detection electromagnetic signal.Therefore, window 308 can be configured to allow radio frequency (" RF ") signal by window 308.
Fig. 4 B is the viewgraph of cross-section by the line 4B-4B of Fig. 4 A the first housing parts 304 obtained.Fig. 4 B illustrates sensor 400 adjacently positioned with window 308 on the inner side of the first housing parts 304.Sensor 400 is deployed and be sensed by sensor 400 so that signal can pass through window 308 and/or launch from sensor 400, though this signal may not effectively (or completely) sensed by the first housing parts 304 and/or launch.
Being similar to the above description for holding member 200, window 308 can be the polymeric material co-molded with ceramic first housing parts 304.Such as, window 308 can be molded directly in the opening (such as, hole) in the first housing parts 304.More specifically, as described below, first housing parts 304 with the hole extending to outside from inner side can be formed by ceramic material, is then put into mould.Then, polymeric material can be injected into, pours into or be otherwise directed into hole so that polymeric material is attached to ceramic material (such as, the ceramic wall in the hole that polymeric material is bonded directly in the first housing parts 304).When being removed from mould, window 308 can be filled up completely with the hole in the first housing parts 304.Such as, the inner surface 414 of window 308 can be substantially coplanar with the inner surface 410 of the first housing parts 304, and the outer surface 416 of window can be substantially coplanar with the outer surface 412 of the first housing parts 304.As an alternative, the hole in the first housing parts 304 can only partially be filled by window 308.Such as, in the middle of the inner surface of window 308 and outer surface, one or two inner surface that can be respectively relative to the first housing parts 304 or outer surface are recessed.
In certain embodiments, the hole that window 308 is injected in the first housing parts 304 therein is counterbore (counterbored).More specifically, the first cylindrical part 404 that hole can include extending from the inner surface 410 of the first housing parts 304 and point between the inner surface and outer surface of the first housing parts terminates.Hole also includes having and the first cylindrical part different-diameter and second cylindrical part 402 coaxial with the first cylindrical part 404, wherein the second cylindrical part 402 extend from the outer surface 412 of the first housing parts 304 and first cylindrical part 404 terminate point engage the first cylindrical part 404 (such as, between inner surface and the outer surface of the first housing parts 304).As shown in Figure 4 B, the first cylindrical part 404 has the diameter bigger than the second cylindrical part 402.
Polymeric material is co-molded to the advantage that can be provided over other manufacture method in the hole in the first housing parts 304.Such as, number of components and number of assembling steps for the first housing parts 304 (and thus be accordingly used in equipment 300) can reduce, because co-molding procedure produces one-piece parts, and does not need the hand assembled of pre-formed polymer window and preforming ceramic shell parts.Polymeric material is co-molded in hole and can also eliminate the demand to the binding agent for polymeric material being adhered to ceramic material, thus reduce further manufacture complexity, time and cost, and also create parts that are possible more robust and that resist beyond thought disintegration.
And, co-molding procedure can produce to manufacture or assemble method better seal than other between window and housing parts.If desired for when sealing against the wearable electronic of the wrist-watch of water or other pollutant and health monitoring equipment, this can be even more important when all, and for the parts against user's placed are even more important.For example, it is contemplated that the wearable electronic to use at the volley should be sealed, in case the intrusion of sweat and water.
In addition it may be difficult to maintain sufficiently high manufacturing tolerance in the pottery and polymer elements of preforming, good fit with what guarantee between parts.Such as, when window 308 of the first housing parts 304 in figure 4b, the even little deviation of the size of polymer window and/or housing parts it is likely difficult to and/or expensively manufactured by pre-formed polymer window tight tolerance required in the hole being enclosed in the first housing parts 304, because may result in the gap between window and housing or opening.Similarly, when holding member 200 in fig. 2, it may be difficult to and/or expensively manufacture and snugly fit into the polymer holding member 200 in the cavity of the first housing parts 104.In addition, because polymeric material is ostium in co-molding procedure, so the dimensional tolerance of ceramic component can be reduced, because, if they need not be coupled to another rigid element, then need not be so accurate or accurate with the part of the pottery of polymer complex.Such as, if can be looser than the window of preforming to be installed in hole by what need to the diameter in hole, circularity and/or axially aligned tolerance.
In certain embodiments, the geometry in hole is configured such that polymeric material mechanically remains into the first housing parts.Fig. 4 C is the viewgraph of cross-section by the first housing parts 304 obtained of the line 4B-4B in Fig. 4 A, it is shown that in hole, machinery keeps the geometry of polymeric material.Especially, the first housing parts 304 includes the hole of frusto-conically shaped portion 408 that the inner surface 410 having from the first housing parts 304 extends and point between the inner surface and outer surface of the first housing parts terminates.This hole also includes the cylindrical part 406 coaxial with frusto-conically shaped portion 408, point joint frusto-conically shaped portion 408 (such as, between inner surface and the outer surface of the first housing parts 304) that wherein cylindrical part 406 extends from the outer surface 412 of the first housing parts 304 and terminates at frusto-conically shaped portion 408.
The diameter of the frusto-conically shaped portion 408 opening part in inner surface 410 is less than the diameter at the some place engaging cylindrical part 406 at frusto-conically shaped portion 408.In other words, frusto-conically shaped portion 408 forms the undercutting preventing window 308 to be removed from hole in the direction of inward faces 410.Additionally, frusto-conically shaped portion 408 engages the diameter diameter more than cylindrical part at the some place of cylindrical part 406 at frusto-conically shaped portion 408.The shoulder formed in this region prevents window 308 to be removed from hole in the direction of outward surface 412.
Window 308 is firmly held in hole by the combination of the shoulder within the inclined plane of frusto-conically shaped portion 408 and hole, thus producing housing parts solid, excellent sealing.But, when utilizing the window of rigidity, preforming, it may be difficult to maybe can not realize this or similar geometry.Because at co-molding procedure described herein by liquid polymers hand-hole, then it flow to fill whole hole, regardless of its internal geometry, so all complex geometric shapes as shown in FIG. 4 C are possible.The intensity of consequent housing parts and the quality of window aperture seal body are possibly for routine use requiring high durability intensity and the wearable device effectively sealed of fragment, dampness, sweat or other pollutant is particularly useful.
In certain embodiments, co-molding procedure produces surface blemish or too much polymeric material on window.Fig. 5 A-5B is the viewgraph of cross-section by the first housing parts 304 obtained of the line 4B-4B in Fig. 4 A, illustrated multi-polymer material and it how can be processed to not disturb the operation of window 308 and/or be adjacent to the ability of installing component (such as, sensor 400) with window 308.Specifically, Fig. 5 A illustrates the window 308 on the inner surface 504 of window 308 with cast gate 500.Cast gate 500 can be the projection of the polymeric material at the some place in the hole that polymeric material is injected in the first housing parts 304 by nozzle.
In certain embodiments, injection-molding apparatus can be configured such that cast gate 500 is positioned on shoulder 502 so that by the path of window 308 not by too much clogged with material or otherwise hinder.In this case, cast gate 500 can be stayed on window 308.
In certain embodiments, cast gate 500 is removed so that the inner surface 504 of window 308 and the inner surface 410 of the first housing parts 304 are coplanar, as shown in Figure 5 B.Cast gate 500 can be removed by any suitable process, including machining, polishing, grinding, polishing, laser ablation and/or cutting.When cast gate 500 is removed, injection-molding apparatus can be configured such that cast gate 500 is at the center of window 308, on shoulder 502 or what its suitable location positioning in office.
Although shown with reference to Fig. 3-5B and that describe housing and housing parts are described for wrist-watch or other wearable electronic, but these are only example implementation, and parts as above and manufacturing theory (such as, co-molded pottery and polymer elements) are also applied for miscellaneous equipment.Such as, pottery and polymeric material can be co-molded, to produce the housing parts for smart phone, tablet PC, laptop computer, stem-winder or other suitable equipment any.
Several examples of polymer features that can be co-molded with ceramic component are described above.Specifically, Fig. 2 A-2C illustrates the polymer holding element 200 being co-molded to ceramic shell part, and Fig. 3-5B illustrates the polymer window 308 in the hole being co-molded in ceramic shell part.But, additional polymer features can also be produced by co-molded polymeric material and ceramic component.Such as, Fig. 6 A-9B draws the additional examples of the polymer features co-molded with ceramic component.
Fig. 6 A-6B depicts perspective and the viewgraph of cross-section of the housing parts 600 for electronic equipment respectively.Housing parts 600 includes ceramic segment 602 and polymer moieties 604.Ceramic segment 602 could be for the bottom of the housing of the electronic equipment of such as intelligent watch.Ceramic segment 602 is the shell forming cavity, and wherein this cavity is defined by the central surface being at least partially surrounded by the rim.Polymer moieties 604 is co-molded (such as, against central surface and flange) against the inner surface of shell.Especially, the inner surface of polymer moieties 604 coated ceramic shell, thus forming the base portion of the central surface from the cavity feature (such as, being coated with the part of the flange of shell) being extended and the central surface being coated with or otherwise contacting cavity.In certain embodiments, as depicted in figure 6b, polymer moieties has and evenly or substantially goes up uniform thickness.In other embodiments, the thickness of polymer moieties 604 changes across the surface of polymer moieties.
Fig. 7 A-7B depicts perspective and the viewgraph of cross-section of the housing parts 700 for electronic equipment respectively.Housing parts 700 includes ceramic segment 702 and polymer moieties 704.As it can be seen, the surface coextensive of polymer moieties 704 and ceramic segment 702, but this is optional.Such as, polymer moieties 704 can only cover the part on the surface of ceramic segment 702.Just as the polymer moieties 604 in Fig. 6 A-6B, polymer moieties 704 is coated with the surface of housing parts 700, and can have single continuous print thickness, or can have different thickness in different positions.Ceramic segment 702 or polymer moieties 704 are used as the outer surface of housing.Such as, ceramic segment 702 can form the inner surface of housing, and polymer moieties 704 can form the outer surface of housing, or vice versa.
In certain embodiments, as illustrated with reference to Fig. 6 A-7B (and Fig. 9 B being discussed below) and describing, coated ceramic housing parts adds intensity and/or the toughness of housing parts.This can also allow the ceramic segment making housing 600,700,900 thinner, maintains simultaneously or improve intensity and/or the toughness of global facility.In some cases, if ceramic material is thinner, then ceramic material (before breaking) can bend bigger amount.That is, when specific power is applied in, compared with the thicker part accepting identical power, relatively thin parts will be more in the front curve broken.Therefore, by reducing the thickness of the ceramic segment of housing and polymeric material being co-molded to ceramic segment, some benefit of ceramic material can realize (such as in parts, excellent finishing, hardness, aesthstic etc.), also reduce simultaneously on parts impact or other power causes the probability of component breakage.Especially, utilize a thin layer ceramic material (such as, feasible one layer of thinner ceramic material than when lacking polymeric material) flexibility of the increase of ceramic material that produces allows the parts to bend bigger amount before breaking, so that parts are more flexible.
In addition, because co-molding procedure causes combining closely between polymeric material and ceramic material, so, if ceramic material fragmentation, cracking or otherwise rupture, then polymeric material can maintain the structural intergrity of housing parts, and even broken potsherd is kept together so that user is not damaged by they.
Fig. 8 A-8B depicts perspective and the viewgraph of cross-section of the housing parts 800 for electronic equipment respectively.Housing parts 800 includes ceramic segment 802 and polymer moieties 804.Ceramic segment 802 is the shell forming cavity, and wherein this cavity is defined by the central surface surrounded by flange 806.By co-molded polymer moieties 804 and ceramic segment 802, polymer moieties 804 is coupled to wall 806.Polymer moieties 804 is formed can be used for relative to wall 806, for instance, engage the clip of another housing parts or the undercutting of breech lock.
The undercutting formed by polymer moieties 804 is another example being likely difficult to the complex geometric shapes only formed from ceramic material.Especially, it may be difficult to mould, machine or otherwise form the ceramic component with undercutting as shown in Figure 8.And, even if defining this geometry, the fragility (and stress concentration around the corner) of ceramic material also can make undercutting excessively fragile for some purposes.Therefore, co-molded polymeric material and ceramic segment 802 allow the geometry of this complexity manufactured more simply and can produce the higher parts more possible than independent pottery.
Fig. 9 A-9B depicts perspective view and the viewgraph of cross-section of the housing parts 900 for electronic equipment respectively.Housing parts 900 includes ceramic segment 902 and polymer moieties 904.Polymer moieties 904 is co-molded with ceramic segment 902, in order to polymer moieties 904 is coupled to ceramic segment 902.Housing parts 900 is similar to the first housing parts 104 (Fig. 2 A-2C) as herein described, but lacks the wall 216 forming cavity.Polymer moieties 904 is to maintain parts, all holding members 200 as described herein.In certain embodiments, polymer moieties 904 is used to housing parts 900 is remained to another housing parts, to form the housing for electronic equipment.Such as, housing parts 900 can be coupled to the housing parts 800 in Fig. 8 A-8B, to seal the internal capacity that can comprise electronic equipment part.
Referring now to Figure 10, it is shown that the illustrative perspective view of an example of electronic equipment 1000 (being also referred to as " equipment 1000 ").Especially, equipment 1000 represents tablet PC.
Equipment 1000 can include housing 1002.The internal part that housing 1002 can be equipment 1000 forms outer surface or partial outer face and containment vessel.Housing 1002 can include the first housing parts 1004 and the second housing parts 1006.In certain embodiments, the first housing parts 1004 forms the bottom of housing, and the second housing parts 1006 forms the top of housing.In certain embodiments, at least the first housing parts 1004 is formed by ceramic material.In certain embodiments, the second housing parts 1006 is formed by any material, including polymer, metal, glass, pottery etc..First and second housing parts 1004,1006 can utilize polymer to keep together with feature (such as about shown by Fig. 8 A-9B and those of description) is coupled to, to form housing 1002.
Figure 11 A depicts the decomposition diagram of housing 1002, it is shown that the Part II 1006 separated with Part I 1004.First housing parts 1004 includes the polymer holding member 1008 being coupled to it.As described herein, directly it is co-molded to the result on the first housing parts 1004 as polymeric material, polymer holding member 1008 is coupled to the first housing parts 1004.
Holding member 1008 includes mounting seat 1010 and the first arm 1012 and the second arm 1014 being each extended from mounting seat 1010.First and second arms are configured to engage with the maintenance feature of the second housing parts 1006, in order to the first housing parts 1004 is remained to the second housing parts 1006, as shown in fig. 11C.
Figure 11 B and 11C depicts the viewgraph of cross-section by the housing 1002 obtained of the line 11B-11B in Figure 11 A.Especially, Figure 11 B illustrates the first housing parts 1004 separated with the second housing parts 1006, and Figure 11 C illustrates the housing assembled, and wherein the first housing parts 1004 keeps about the second housing parts 1006.Especially, the first and second arms 1012,1014 include the first and second latch components 1016,1018 respectively.The maintenance feature 1020,1022 that latch component is configured to the second housing parts 1006 engages, in order to kept together by the first and second housing parts 1004,1006.As illustrated by about Fig. 8 A-8B, keep feature 1020 and 1022 can be formed by the polymeric material co-molded with the second housing parts 1006.
In certain embodiments, housing 1002 includes the seal 1024 between the first housing parts 1004 and the second housing parts 1006, as mentioned above.
The various examples of the ceramic component with the polymer features being molded into it are described above.As noted, co-molded pottery and polymer produce these parts and can provide many benefits.It is difficult, for example, to or can not individually can be formed from the polymeric material being molded directly into ceramic component from the feature of pottery generation and geometry.And, because polymeric material is directly co-molded to ceramic component, so the parts that existing pottery has again polymer features can be generated, reduce built-up time simultaneously, reduce number of components and reduce the manufacturing tolerance needed for each part.Therefore, it is however generally that, manufacture, by being co-molded on ceramic material by polymer features, the parts being used for electronic equipment, such as housing parts, be useful.
Figure 12 depicts the illustrative methods 1200 manufacturing the housing parts for electronic equipment.At square frame 1202, ceramic material the first component formed is placed in mould.Mould includes defining the Part I being configured to receive the first cavity of first component and defining the Part II of the second cavity communicated with the first cavity when the mold is closed.Part II can also include one or more cast gate, and by it, polymeric material can be introduced into the second cavity.Mould can be used in two parts mould in polymer injection molding process.
First cavity can have the shape complementary with first component so that first component is packed tightly in the first cavity and is supported equably by cavity.By this way, if deformed or bent, being likely to ceramic component that is crisp and that be prone to fracture can be properly supported during follow-up moulding process.
Second cavity can have the shape of the feature being joined to ceramic material.Such as, the second cavity can be to maintain the shape (Fig. 2 A) of parts 200, or to be applied to the plate on the surface of ceramic component or the shape (Fig. 7 A-7B) of coating.Second cavity can also be the shape of further feature, including not in features described herein.
As an alternative, the effect of the first and second cavitys can overturn.Such as, the second cavity can have the shape complementary with first component so that first component is packed tightly in the second cavity and is supported equably by cavity, and the first cavity can be the shape of the feature being joined to ceramic material.
When mould is closed when ceramic component is in the first cavity (such as, the first and second parts of mould keep together), the second cavity can directly be opened on the surface of ceramic component.Therefore, the polymeric material injecting the second cavity can contact and be molded against ceramic component.Therefore, polymeric material can the second cavity of ceramic material and mould at least some of between introduce, to produce polymer features.
At square frame 1204, polymeric material is injected into the second cavity, thus forms feature from polymeric material and this feature is attached to ceramic material.In certain embodiments, polymeric material is thermoset copolymer material.In certain embodiments, polymeric material is thermoplastic, polymeric materials.In certain embodiments, polymeric material is the combination in any of these or other type polymer.
In certain embodiments, polymeric material is injected the second cavity and can include when being with or without injection additonal pressure is applied to polymeric material.Especially, polymeric material can utilize polymeric material pressure to force its injection molding machine (or other process) entering cavity body of mould to be injected into the second cavity.In other cases, polymeric material can inject in the second cavity by polymeric material is under atmospheric pressure poured into mould simply.
As the result of the molding process of polymeric material and/or solidification, polymeric material can be bonded directly to ceramic material.This combination can occur based on the mechanically or chemically bonding (or other mechanism of attachment any) between ceramic material and the surface of polymeric material.Such as, polymeric material can be mechanically coupled to be etched, veining, fluting, machining or otherwise roughening ceramic surface, without space binding agent, glue etc..For the ease of this combination, the surface of first component can be processed before first component is placed into mould, to produce coarse surface.In certain embodiments, surface is no need to produce coarse surface and be treated separately.On the contrary, manufacturing the result of the process of ceramic component as (such as, from casting, molding or other suitable manufacture/formation technology any), surface can have suitable finishing.
In certain embodiments, the first housing parts includes grappling cavity and/or grappling projection that polymer features is mechanically secured to first component.Grappling cavity can be that blind hole, raceway groove, groove or polymeric material can flow into other shape any therein or geometry.Grappling projection can be that pillar, sharp shaped material or polymeric material can in other shape any flowed about or geometries.When polymeric material is injected at square frame 1204, polymeric material can flow into grappling cavity and/or flow around grappling projection.Once polymeric material is cured (square frame 1206 below), rigid polymer feature just can be anchored into the first casing member, and this is because the coupling of grappling cavity/projection at least in part.
At square frame 1206, polymeric material is cured.In certain embodiments, cured polymer material includes cooling polymer material.Polymeric material can be cooled when housing parts is still within mould at least in part.
Once polymeric material be cured at least in part (such as, chemically, by heat or otherwise), housing parts just can be removed from mould.Polymer features is configured as with the complementary holding feature on the additional housing component of electronic equipment (such as wherein, holding member 200) in the embodiment that coordinates, after housing parts removes from mould, housing parts is alternatively coupled to this additional housing component.Before coupling housing parts with additional housing component, electronic equipment part can be introduced into the internal capacity of one or two housing parts so that electronic equipment part keeps in the housing when housing is assembled.
Figure 13 depicts the illustrative methods 1300 manufacturing the housing parts for electronic equipment.Such as, method 1300 can be used to form the ceramic shell parts with polymer window, such as herein in regard to those described in Fig. 3-5B.
At square frame 1302, ceramic component is fixed in fixing device.Ceramic component can have the first side and second side relative with the first side.Ceramic component can define the hole extending to the second side from the first side wherein.Hole can be defined by single cylindrical part, two coaxial cylindrical portion (such as, counterbore) with different-diameter or other shape any.
At square frame 1304, polymeric material is injected into (pressurization being with or without polymeric material) hole.As it is indicated above, polymeric material can be thermoplasticity or the thermosetting polymer combination in any of type polymer (or these or other).Polymeric material can be substantially filled with hole, and makes the first surface of polymeric material substantially coplanar with the first side of ceramic component.
At square frame 1306, polymeric material is cured.In certain embodiments, cured polymer material includes cooling polymer material.Polymeric material can be cooled when ceramic component remains secured in fixing device at least in part.
In certain embodiments, fixing device includes molded surface.When being fixed in fixing device at square frame 1302 ceramic component, ceramic component can be placed against molded surface so that hole is molded surface in the first side of ceramic component and seals.In other words, molded surface seals and at one end seals hole so that be molded from the polymeric material of end opposite hand-hole against molded surface.At molded surface substantially coplanar with the first side of the ceramic component in bore region, the polymeric material injected the window formed can be equally substantially coplanar with the first side of ceramic component.In other words, window and ceramic component form continuous print, smooth surface, as the outer surface of housing.
As pointed by above with respect to Fig. 5 A-5B, molding process can leave projection, cavity or other less desirable surface character or defect (such as, being injected into the polymeric material in hole) in polymer window.Such as, cast gate is likely to stay on the surface of window.Therefore, in certain embodiments, after cured polymer material at least in part, cast gate is removed from the second surface of polymeric material.Cast gate can be removed by any suitable process, including machining, polishing, grinding, polishing, laser ablation, cutting etc..In certain embodiments, the process being used to removing cast gate causes the surface of substantially coplanar with the second side of ceramic component window.
Such as, cast gate can remove by being ground away by cast gate, leaves substantially coplanar with the second side of ceramic component window surface.By this way, the both sides that window is relative can be substantially flat.
In certain embodiments, after polymeric material is cured, sensor and/or emitter (such as, sensor 400) can be installed on the second side of the ceramic component adjacent with the second surface of polymeric material.Exemplary sensors and/or emitter are described in this article.
After manufacturing housing parts by co-molded polymeric material and ceramic material (such as, as described by about method 1200 and 1300), may determine that polymer moieties does not properly form, defective, not in desired tolerance, or otherwise unavailable or undesirably.This determine and can be made as the result checked by machine, people or man-machine combination.
This determine if made, then polymeric material can be removed from ceramic material so that ceramic material can be again co-molded with polymeric material.Because the character of some ceramic materials (such as, high-melting-point and hardness), polymeric material can be removed in every way.Such as, in certain embodiments, housing parts heated (such as, in a furnace, or utilize other suitable heater any) so that polymeric material melts, blow, evaporation, or be otherwise removed from ceramic material.As another example, in certain embodiments, the directed housing parts of laser, with fusing or otherwise ablative polymer material.As also having another example, by guiding on polymeric material by High-Pressure Water, water jet can be used to remove polymeric material.In aforesaid every kind of situation, polymeric material can be removed not damaging ceramic material (or do not damage ceramic material to such degree, to such an extent as to make it not be amenable to attempt at least again co-molded with polymeric material) when.In certain embodiments, after removing polymeric material from ceramic material, ceramic material stands in the middle of the random suitable combination of method 1200, method 1300 or process step discussed herein one or more.
In order to explain, description above uses specific term to provide a thorough understanding of the embodiments.But, the skilled person will be apparent that, described specific detail is not configured to put into practice described embodiment and required.Therefore, the above description of specific embodiments described herein illustrate that and the purpose that describes and provide.They are not detailed or embodiment to be limited to disclosed precise forms.For those of ordinary skills will it will be apparent that in view of above teaching, many modifications and variations be possible.

Claims (22)

1. the housing parts for electronic equipment, it is characterised in that described housing parts includes:
Ceramic package, including central surface, described central surface is surrounded by the flange being extended from described central surface, and described central surface and flange limit cavity;And
Polymeric material, coating central surface and flange;
Wherein polymeric material is incorporated into central surface and flange, without any binding agent between polymeric material and ceramic package.
2. housing parts as claimed in claim 1, it is characterised in that ceramic package is the ceramic material of monoblock.
3. housing parts as claimed in claim 1, it is characterised in that polymeric material is co-molded with ceramic package.
4. housing parts as claimed in claim 1, it is characterised in that flange surrounds central surface completely.
5. housing parts as claimed in claim 1, it is characterized in that ceramic package is coupled to additional housing parts, to form the housing for electronic equipment, wherein ceramic package and described additional housing parts limit the internal capacity being configured to receive electronic equipment part.
6. housing parts as claimed in claim 1, it is characterised in that polymeric material has substantially uniform thickness.
7. housing parts as claimed in claim 1, it is characterised in that polymeric material is by the mechanical coupling interaction between polymeric material and the micro structure of ceramic material to central surface and flange.
8. housing parts as claimed in claim 1, it is characterised in that ceramic package includes hole at central surface, and polymeric material is by the mechanical coupling interaction between polymeric material and described hole to central surface.
9. housing parts as claimed in claim 8, it is characterised in that described hole includes undercutting.
10. the housing for electronic equipment, it is characterised in that described housing includes:
The first housing parts formed by ceramic material;And
Holding member, is coupled to the surface of the first housing parts, and described holding member includes the arm being extended and being configured to the maintenance feature that engagement is associated with the second housing parts from the first housing parts, is thus kept together by the first and second housing parts;Wherein:
Holding member is formed by polymeric material;And
Holding member and the first housing parts are co-molded.
11. housing as claimed in claim 10, it is characterised in that:
Holding member includes mounting seat;And
Mounting seat is molded into the surface of the first housing parts.
12. housing as claimed in claim 11, it is characterised in that mounting seat and arm are formed as global facility.
13. housing as claimed in claim 10, it is characterised in that holding member is directly coupled to the surface of the first housing parts.
14. housing as claimed in claim 10, it is characterised in that arm also includes the breech lock being configured to the maintenance feature of engagement the second housing parts.
15. housing as claimed in claim 10, it is characterised in that holding member also includes being extended and be configured to the additional arm that the additional maintenance feature with the second housing parts engages from the first housing parts.
16. housing as claimed in claim 15, it is characterised in that described arm and additional arm each include the slender member extended more than half of the length along the first housing parts.
17. the housing for electronic equipment, it is characterised in that described housing includes:
First housing parts, including:
The housing parts formed by ceramic material;And
Holding member, is coupled to the surface of housing parts, and described holding member is extended from housing parts, and wherein said holding member is formed by polymeric material;And
Second housing parts, including keeping feature;
Wherein holding member engages with keeping feature, thus keeps the first housing parts about the second housing parts with fixed relationship;And
Wherein the first housing parts and the second housing parts limit the internal capacity being configured to receive electronic equipment part.
18. housing as claimed in claim 17, it is characterised in that also include the seal between the sealing surface and the sealing surface of the second housing parts of the first housing parts, wherein the sealing surface of the first housing parts is towards the sealing surface of the second housing parts.
19. housing as claimed in claim 18, it is characterised in that seal is directly coupled to the first housing parts or the second housing parts.
20. housing as claimed in claim 18, it is characterised in that seal is injection-molded in the gap between the sealing surface of the first housing parts and the sealing surface of the second housing parts.
21. housing as claimed in claim 18, it is characterised in that:
Holding member limits the breech lock of the maintenance feature being configured to engagement the second housing parts;And
Seal applies power between the first and second housing parts so that breech lock and maintenance feature keep engagement.
22. housing as claimed in claim 21, it is characterised in that keep feature to form the shoulder engaged with breech lock.
CN201620171592.8U 2015-03-08 2016-03-07 A casing that is used for electronic equipment's casing part and is used for electronic equipment Withdrawn - After Issue CN205408329U (en)

Applications Claiming Priority (4)

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US201562129868P 2015-03-08 2015-03-08
US62/129,868 2015-03-08
US14/816,277 US9750322B2 (en) 2015-03-08 2015-08-03 Co-molded ceramic and polymer structure
US14/816,277 2015-08-03

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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105960116A (en) * 2015-03-08 2016-09-21 苹果公司 Co-molded ceramic and polymer structure
CN107031138A (en) * 2017-04-01 2017-08-11 广东新秀新材料股份有限公司 Impact resistant composite material shell and preparation method thereof
CN107517556A (en) * 2017-09-21 2017-12-26 广东欧珀移动通信有限公司 Cover plate of electronic equipment and preparation method thereof and electronic equipment
CN107683055A (en) * 2017-09-21 2018-02-09 广东欧珀移动通信有限公司 Cover plate of electronic equipment and preparation method thereof and electronic equipment
WO2019075645A1 (en) * 2017-10-17 2019-04-25 Huawei Technologies Co., Ltd. Sealing method
CN110324995A (en) * 2018-03-29 2019-10-11 比亚迪股份有限公司 A kind of electronic equipment shell and electronic equipment
CN111546552A (en) * 2019-02-08 2020-08-18 柯惠Lp公司 Fully encapsulated electronic device and printed circuit board

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105960116A (en) * 2015-03-08 2016-09-21 苹果公司 Co-molded ceramic and polymer structure
CN107031138A (en) * 2017-04-01 2017-08-11 广东新秀新材料股份有限公司 Impact resistant composite material shell and preparation method thereof
CN107031138B (en) * 2017-04-01 2019-10-11 广东新秀新材料股份有限公司 Impact resistant composite material shell and preparation method thereof
CN107517556A (en) * 2017-09-21 2017-12-26 广东欧珀移动通信有限公司 Cover plate of electronic equipment and preparation method thereof and electronic equipment
CN107683055A (en) * 2017-09-21 2018-02-09 广东欧珀移动通信有限公司 Cover plate of electronic equipment and preparation method thereof and electronic equipment
WO2019075645A1 (en) * 2017-10-17 2019-04-25 Huawei Technologies Co., Ltd. Sealing method
US11648765B2 (en) 2017-10-17 2023-05-16 Huawei Technologies Co., Ltd. Sealing method
CN110324995A (en) * 2018-03-29 2019-10-11 比亚迪股份有限公司 A kind of electronic equipment shell and electronic equipment
CN110324995B (en) * 2018-03-29 2021-04-20 比亚迪股份有限公司 Electronic equipment shell and electronic equipment
CN111546552A (en) * 2019-02-08 2020-08-18 柯惠Lp公司 Fully encapsulated electronic device and printed circuit board

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