CN205263721U - Cloud computing services ware - Google Patents
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- CN205263721U CN205263721U CN201521128394.5U CN201521128394U CN205263721U CN 205263721 U CN205263721 U CN 205263721U CN 201521128394 U CN201521128394 U CN 201521128394U CN 205263721 U CN205263721 U CN 205263721U
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 20
- 238000001816 cooling Methods 0.000 abstract description 24
- 230000009286 beneficial effect Effects 0.000 abstract description 5
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- 230000000694 effects Effects 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
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Abstract
本实用新型公开了一种云计算服务器，包括壳体和运算电路板，所述运算电路板上安装有电源适配器、主板和硬盘，所述运算电路板的端面板上设置外接接口，所述壳体包括外壳体和内壳体，所述外壳体与内壳体滑动连接，所述外壳体的侧板内壁竖直设置若干个用于安装运算电路板的第一插槽，所述内壳体上设置数量、位置与第一插槽相对应的第二插槽，当内壳体滑入外壳体时，第二插槽与第一插槽重合，所述外壳体、内壳体的底板上均设置散热装置。本实用新型的有益效果在于：有利于充分利用壳体的有效空间，集成度高，体积小方便携带，具有很好的散热性能。
The utility model discloses a cloud computing server, which comprises a casing and a computing circuit board. A power adapter, a main board and a hard disk are installed on the computing circuit board. An external interface is arranged on the end panel of the computing circuit board. The body includes an outer shell and an inner shell, the outer shell is slidably connected to the inner shell, and the inner wall of the side plate of the outer shell is vertically provided with several first slots for installing an arithmetic circuit board, and the inner shell The number and position of the second slots corresponding to the first slots are set on the top. When the inner shell slides into the outer shell, the second slots coincide with the first slots, and the outer shell and the bottom plate of the inner shell All cooling devices are provided. The beneficial effects of the utility model are: it is beneficial to make full use of the effective space of the casing, the integration degree is high, the volume is small and easy to carry, and it has good heat dissipation performance.
Description
技术领域technical field
本实用新型主要涉及云计算领域，具体是一种云计算服务器。The utility model mainly relates to the field of cloud computing, in particular to a cloud computing server.
背景技术Background technique
云计算服务器云计算利用高速互联网的传输能力，将数据的处理过程从个人计算机或服务器转移到云计算中心，并将计算能力、存储能力为用户提供服务，最大的优势就是弹性扩展，其它的功能及优势有：虚拟化，可靠性，可扩展性，按需服务，易操作性，超大规模，通用性，安全性。现有的云计算服务器以大型服务器群居多，将多个单一的服务器连在一起，通过软件协调，使这些服务器协调工作，对于某些行业而言，为了安全起见，需要中、小型的云计算服务器。Cloud Computing Server Cloud computing utilizes the transmission capacity of high-speed Internet to transfer the data processing process from personal computer or server to cloud computing center, and provide computing power and storage capacity for users. The biggest advantage is elastic expansion, other functions And the advantages are: virtualization, reliability, scalability, on-demand service, ease of operation, super-large scale, versatility, and security. Most of the existing cloud computing servers are large-scale server groups, which connect multiple single servers together and coordinate the work of these servers through software coordination. For some industries, for the sake of safety, small and medium-sized cloud computing servers are required. server.
但是现有的中小型服务器在使用过程中还存在一些问题：1、服务器的体积较大，不方便用户使用；2、服务器受内部空间限制，散热性能不好。However, there are still some problems in the use of the existing small and medium-sized servers: 1. The server has a large volume, which is inconvenient for users to use; 2. The server is limited by the internal space, and the heat dissipation performance is not good.
实用新型内容Utility model content
为解决现有技术中的不足，本实用新型提供一种云计算服务器，有利于充分利用壳体的有效空间，集成度高，体积小方便携带，具有很好的散热性能。In order to solve the deficiencies in the prior art, the utility model provides a cloud computing server, which is beneficial to make full use of the effective space of the casing, has high integration, is small in size and easy to carry, and has good heat dissipation performance.
本实用新型为实现上述目的，通过以下技术方案实现：The utility model realizes above-mentioned purpose by following technical scheme:
一种云计算服务器，包括包括壳体和运算电路板，所述运算电路板上安装有电源适配器、主板和硬盘，所述运算电路板的端面板上设置外接接口，所述壳体包括外壳体和内壳体，所述外壳体与内壳体滑动连接，所述外壳体的侧板内壁竖直设置若干个用于安装运算电路板的第一插槽，所述内壳体上设置数量、位置与第一插槽相对应的第二插槽，当内壳体滑入外壳体时，第二插槽与第一插槽重合，所述外壳体、内壳体的底板上均设置散热装置。A cloud computing server, comprising a casing and a computing circuit board, on which a power adapter, a motherboard and a hard disk are installed, an external interface is arranged on the end panel of the computing circuit board, and the casing includes an outer casing and the inner casing, the outer casing is slidingly connected with the inner casing, and the inner wall of the side plate of the outer casing is vertically provided with several first slots for installing the computing circuit board, and the number, The second slot corresponding to the first slot, when the inner shell slides into the outer shell, the second slot coincides with the first slot, and heat dissipation devices are arranged on the bottom plates of the outer shell and the inner shell .
所述外壳体的侧板顶端设置第一卡槽，所述第一卡槽内设置第一卡块，所述第一卡块上设置与第一插槽相配合的第一插块。The top of the side plate of the outer casing is provided with a first card slot, and a first card block is arranged in the first card slot, and a first insert block matched with the first slot is arranged on the first card block.
所述内壳体的侧板顶端设置第二卡槽，所述第二卡槽内设置第二卡块，所述第二卡块上设置与第二插槽相配合的第二插块。A second card slot is provided at the top of the side plate of the inner housing, and a second card block is provided in the second card slot, and a second insert block matching the second slot is provided on the second card block.
所述散热装置包括底座架，所述外壳体、内壳体上设置与底座架相对应的安装槽，所述底座架中部为中空结构，所述底座架的左右两边之间连接有两个平行的滑轨，所述滑轨上各设置若干个散热风扇，所述散热风扇上设置滑块，所述散热风扇通过滑块与滑轨滑动连接。The heat dissipation device includes a base frame, the outer shell and the inner shell are provided with mounting grooves corresponding to the base frame, the middle part of the base frame is a hollow structure, and two parallel The slide rails are provided with several cooling fans on each of the slide rails, the cooling fans are provided with sliders, and the cooling fans are slidably connected to the slide rails through the sliders.
所述外壳体的底板远离散热装置的一侧设置防滑层。An anti-slip layer is provided on the side of the bottom plate of the outer casing away from the heat sink.
对比与现有技术，本实用新型有益效果在于：Compared with the prior art, the utility model has beneficial effects as follows:
1、本实用新型将多个具备独立运算能力的运算电路板集中安装于壳体内充分利用壳体的有效空间，体积小方便携带，集成度高，运算电路板之间形成风向通道，具有很好的散热性能。1. The utility model centrally installs a plurality of computing circuit boards with independent computing capabilities in the casing to make full use of the effective space of the casing. The utility model is small in size, easy to carry, and has a high degree of integration. The wind direction channel is formed between the computing circuit boards, which has a good cooling performance.
2、本实用新型外壳体、内壳体的顶端设置相互配合的卡槽、卡块，有效防止在搬运或携带过程中运算电路板从壳体内滑落。2. The tops of the outer shell and the inner shell of the utility model are provided with engaging grooves and blocks that cooperate with each other to effectively prevent the computing circuit board from slipping from the shell during transportation or carrying.
3、本实用新型在使用时可调节散热风扇的位置，使散热风扇的位置与运算电路板相对应，解决了散热效果不佳的问题。3. The position of the cooling fan can be adjusted when the utility model is in use, so that the position of the cooling fan corresponds to the computing circuit board, which solves the problem of poor cooling effect.
4、本实用新型外壳体的底板远离散热装置的一侧设置防滑层，提高外壳体表面的抗滑能力。4. An anti-slip layer is provided on the side of the bottom plate of the outer shell of the utility model away from the heat dissipation device, so as to improve the anti-skid ability of the surface of the outer shell.
附图说明Description of drawings
附图1是本实用新型的结构示意图；Accompanying drawing 1 is the structural representation of the utility model;
附图2是运算电路板的结构示意图；Accompanying drawing 2 is the structural representation of computing circuit board;
附图3是壳体的结构示意图；Accompanying drawing 3 is the structural representation of housing;
附图4是散热装置的结构示意图；Accompanying drawing 4 is the structural representation of cooling device;
附图5是第一卡块的结构示意图；Accompanying drawing 5 is the structural representation of the first block;
附图6是第二卡块的结构示意图。Accompanying drawing 6 is the structural diagram of the second block.
附图中所示标号：1、壳体；11、外壳体；12、内壳体；2、运算电路板；21、电源适配器；22、主板；23、硬盘；24、外接接口；3、第一插槽；4、第二插槽；51、底座架；52、安装槽；53、滑轨；54、散热风扇；6、第一卡槽；61、第一卡块；62、第一插块；7、第二卡槽；71、第二卡块；72、第二插块。Numbers shown in the attached drawings: 1, housing; 11, outer housing; 12, inner housing; 2, computing circuit board; 21, power adapter; 22, main board; 23, hard disk; 24, external interface; 1 slot; 4, the second slot; 51, the base frame; 52, the installation slot; 53, the slide rail; 54, the cooling fan; 6, the first slot; 61, the first block; 62, the first slot 7, the second card slot; 71, the second card block; 72, the second insert block.
具体实施方式detailed description
结合附图和具体实施例，对本实用新型作进一步说明。应理解，这些实施例仅用于说明本实用新型而不用于限制本实用新型的范围。此外应理解，在阅读了本实用新型讲授的内容之后，本领域技术人员可以对本实用新型作各种改动或修改，这些等价形式同样落于本申请所附权利要求书所限定的范围。The utility model will be further described in conjunction with the accompanying drawings and specific embodiments. It should be understood that these embodiments are only used to illustrate the present utility model and are not intended to limit the scope of the present utility model. In addition, it should be understood that after reading the content taught by the utility model, those skilled in the art can make various changes or modifications to the utility model, and these equivalent forms also fall within the scope defined by the appended claims of the application.
一种云计算服务器，包括包括壳体1和运算电路板2，所述运算电路板2上安装有电源适配器21、主板22和硬盘23，所述运算电路板2的端面板上设置外接接口24，每一块运算电路板2均为一个小型的电脑主机或微型服务器，具备独立运算的能力，使用时将多块运算电路板2连接起来，共同协调运行，形成一个中、小型云计算服务器。所述壳体1包括外壳体11和内壳体12，所述外壳体11与内壳体12滑动连接，内壳体12可以沿外壳体11滑动，可以根据需要改变壳体1的长度，方便运算电路板2的安装。内壳体12的一端优选设置限位凸起，外壳体11上设置与限位凸起相配合的限位挡块，防止内壳体12从外壳体11上脱落。所述外壳体11的侧板内壁竖直设置若干个用于安装运算电路板2的第一插槽3，所述内壳体12上设置数量、位置与第一插槽3对应的第二插槽4，第二插槽4的宽度与第一插槽3相同，当内壳体12滑入外壳体11时，第二插槽4与第一插槽3重合，当需要的运算电路板2较多时可以将内壳体12从外壳体11内抽拉出来，将运算电路板2安装在第二插槽4内，将多个具备独立运算能力的运算电路板2集中安装于壳体1内，降低了整个产品的耗材及维修成本，同时保证了云计算服务器的运算能力。所述外壳体11、内壳体12的底板上均设置散热装置，散热装置位于底板上，散热风向向上，各第一插槽3之间有一定能的间距，使运算电路板2之间形成风向通道，具有很好的散热性能。A cloud computing server, comprising a housing 1 and a computing circuit board 2, a power adapter 21, a main board 22 and a hard disk 23 are installed on the computing circuit board 2, and an external interface 24 is arranged on the end panel of the computing circuit board 2 Each computing circuit board 2 is a small computer mainframe or micro server, capable of independent computing. When in use, a plurality of computing circuit boards 2 are connected together for coordinated operation to form a medium or small cloud computing server. The housing 1 includes an outer housing 11 and an inner housing 12, the outer housing 11 is slidably connected to the inner housing 12, the inner housing 12 can slide along the outer housing 11, and the length of the housing 1 can be changed as required, which is convenient Arithmetic circuit board 2 installation. One end of the inner casing 12 is preferably provided with a limiting protrusion, and a limiting stopper matched with the limiting protrusion is arranged on the outer casing 11 to prevent the inner casing 12 from falling off from the outer casing 11 . The inner wall of the side plate of the outer casing 11 is vertically provided with a plurality of first slots 3 for installing the computing circuit board 2, and the inner casing 12 is provided with second slots corresponding to the number and positions of the first slots 3. Slot 4, the width of the second slot 4 is the same as that of the first slot 3, when the inner casing 12 slides into the outer casing 11, the second slot 4 coincides with the first slot 3, when the required computing circuit board 2 In many cases, the inner casing 12 can be pulled out from the outer casing 11, the computing circuit board 2 is installed in the second slot 4, and a plurality of computing circuit boards 2 with independent computing capabilities are collectively installed in the casing 1 , reducing the cost of consumables and maintenance of the entire product, while ensuring the computing power of the cloud computing server. The bottom plates of the outer casing 11 and the inner casing 12 are equipped with cooling devices, the cooling devices are located on the bottom plates, and the direction of the cooling air is upward. The wind direction channel has good heat dissipation performance.
为了有效防止在搬运或携带过程中运算电路板2从壳体1内滑落，所述外壳体11的侧板顶端设置第一卡槽6，所述第一卡槽6内设置第一卡块61，所述第一卡块61上设置与第一插槽3相配合的第一插块62，将运算电路板2安装完成后将第一卡块61卡入第一卡槽6内，第一插块62进入相对应的第一插槽3内，对运算电路板进行限位。In order to effectively prevent the computing circuit board 2 from slipping from the housing 1 during transportation or carrying, a first card slot 6 is provided on the top of the side plate of the outer housing 11, and a first card block 61 is arranged in the first card slot 6 , the first block 61 is provided with a first insert 62 matching with the first slot 3, after the operation circuit board 2 is installed, the first block 61 is inserted into the first slot 6, the first The plug-in block 62 enters into the corresponding first slot 3 to limit the position of the computing circuit board.
为了使运算电路板2可以牢固的安装在内壳体12上，所述内壳体12的侧板顶端设置第二卡槽7，所述第二卡槽7内设置第二卡块71，所述第二卡块71上设置与第二插槽4相配合的第二插块72。In order to securely install the arithmetic circuit board 2 on the inner housing 12, a second card slot 7 is provided on the top of the side plate of the inner housing 12, and a second card block 71 is arranged in the second card slot 7, so that A second inserting block 72 matched with the second slot 4 is arranged on the second clamping block 71 .
为了增加散热效果，所述散热装置包括底座架51，所述外壳体11、内壳体12上设置与底座架51相对应的安装槽52，所述底座架51中部为中空结构，所述底座架51的左右两边之间连接有两个平行的滑轨53，所述滑轨53上各设置若干个散热风扇54，所述散热风扇54上设置滑块，所述散热风扇54通过滑块与滑轨53滑动连接，在使用时可调节散热风扇54的位置，当壳体1内安装的运算电路板2较多时将散热风扇54间隔摆放，当壳体1内的运算电路板2较少时集中摆放，使散热风扇54的位置与运算电路板2相对应，解决了散热效果不佳的问题，还可以有选择的关闭不需要的散热风扇54，节约能源。In order to increase the heat dissipation effect, the heat dissipation device includes a base frame 51, the outer shell 11 and the inner shell 12 are provided with mounting grooves 52 corresponding to the base frame 51, the middle part of the base frame 51 is a hollow structure, and the base Two parallel slide rails 53 are connected between the left and right sides of frame 51, and several heat dissipation fans 54 are respectively arranged on the slide rails 53, and slide blocks are arranged on the heat dissipation fans 54, and the heat dissipation fans 54 pass through the slide blocks and The slide rail 53 is slidingly connected, and the position of the cooling fan 54 can be adjusted during use. When there are many computing circuit boards 2 installed in the casing 1, the cooling fans 54 are placed at intervals; when there are few computing circuit boards 2 in the casing 1 When centrally placed, the position of cooling fan 54 is corresponding to computing circuit board 2, which solves the problem of poor cooling effect, and can also selectively close unnecessary cooling fans 54 to save energy.
为了提高外壳体11表面的抗滑能力，所述外壳体11的底板远离散热装置的一侧设置防滑层。In order to improve the anti-slip capability of the surface of the outer casing 11 , an anti-slip layer is provided on the side of the bottom plate of the outer casing 11 away from the heat sink.
实施例：Example:
一种云计算服务器，包括包括壳体1和运算电路板2，所述运算电路板2上安装有电源适配器21、主板22和硬盘23，所述运算电路板2的端面板上设置外接接口24，每一块运算电路板2均为一个小型的电脑主机或微型服务器，具备独立运算的能力，使用时将多块运算电路板2连接起来，共同协调运行，形成一个中、小型云计算服务器。所述壳体1包括外壳体11和内壳体12，所述外壳体11与内壳体12滑动连接，内壳体12可以沿外壳体11滑动，可以根据需要改变壳体1的长度，方便运算电路板2的安装。内壳体12的一端优选设置限位凸起，外壳体11上设置与限位凸起相配合的限位挡块，防止内壳体12从外壳体11上脱落。所述外壳体11的侧板内壁竖直设置若干个用于安装运算电路板2的第一插槽3，所述内壳体12上设置数量、位置与第一插槽3对应的第二插槽4，第二插槽4的宽度与第一插槽3相同，当内壳体12滑入外壳体11时，第二插槽4与第一插槽3重合，当需要的运算电路板2较多时可以将内壳体12从外壳体11内抽拉出来，将运算电路板2安装在第二插槽4内，将多个具备独立运算能力的运算电路板2集中安装于壳体1内，降低了整个产品的耗材及维修成本，同时保证了云计算服务器的运算能力。所述外壳体11的侧板顶端设置第一卡槽6，所述第一卡槽6内设置第一卡块61，所述第一卡块61上设置与第一插槽3相配合的第一插块62，所述内壳体12的侧板顶端设置第二卡槽7，所述第二卡槽7内设置第二卡块71，所述第二卡块71上设置与第二插槽4相配合的第二插块72。所述外壳体11、内壳体12的底板上均设置散热装置，散热装置位于底板上，散热风向向上，各第一插槽3之间有一定能的间距，使运算电路板2之间形成风向通道，具有很好的散热性能。所述散热装置包括底座架51，所述外壳体11、内壳体12上设置与底座架51相对应的安装槽52，所述底座架51中部为中空结构，所述底座架51的左右两边之间连接有两个平行的滑轨53，所述滑轨53上各设置若干个散热风扇54，所述散热风扇54上设置滑块，所述散热风扇54通过滑块与滑轨53滑动连接。所述外壳体11的底板远离散热装置的一侧设置防滑层。本实施例的有益效果在于：外壳体11、内壳体12的顶端设置相互配合的卡槽、卡块，有效防止在搬运或携带过程中运算电路板2从壳体1内滑落；在使用时可调节散热风扇54的位置，使散热风扇54的位置与运算电路板2相对应，解决了散热效果不佳的问题；外壳体11的底板远离散热装置的一侧设置防滑层，提高外壳体11表面的抗滑能力。A cloud computing server, comprising a housing 1 and a computing circuit board 2, a power adapter 21, a main board 22 and a hard disk 23 are installed on the computing circuit board 2, and an external interface 24 is arranged on the end panel of the computing circuit board 2 Each computing circuit board 2 is a small computer mainframe or micro server, capable of independent computing. When in use, a plurality of computing circuit boards 2 are connected together for coordinated operation to form a medium or small cloud computing server. The housing 1 includes an outer housing 11 and an inner housing 12, the outer housing 11 is slidably connected to the inner housing 12, the inner housing 12 can slide along the outer housing 11, and the length of the housing 1 can be changed as required, which is convenient Arithmetic circuit board 2 installation. One end of the inner casing 12 is preferably provided with a limiting protrusion, and a limiting stopper matched with the limiting protrusion is arranged on the outer casing 11 to prevent the inner casing 12 from falling off from the outer casing 11 . The inner wall of the side plate of the outer casing 11 is vertically provided with a plurality of first slots 3 for installing the computing circuit board 2, and the inner casing 12 is provided with second slots corresponding to the number and positions of the first slots 3. Slot 4, the width of the second slot 4 is the same as that of the first slot 3, when the inner casing 12 slides into the outer casing 11, the second slot 4 coincides with the first slot 3, when the required computing circuit board 2 In many cases, the inner casing 12 can be pulled out from the outer casing 11, the computing circuit board 2 is installed in the second slot 4, and a plurality of computing circuit boards 2 with independent computing capabilities are collectively installed in the casing 1 , reducing the cost of consumables and maintenance of the entire product, while ensuring the computing power of the cloud computing server. The top of the side plate of the outer casing 11 is provided with a first card slot 6, and a first card block 61 is arranged in the first card slot 6, and a first card block 61 is provided on the first card block 61 to match with the first slot 3. An insertion block 62, the top of the side plate of the inner casing 12 is provided with a second card slot 7, and a second card block 71 is arranged in the second card slot 7, and the second card block 71 is provided with the second card slot 71. The slot 4 matches the second plug 72 . The bottom plates of the outer casing 11 and the inner casing 12 are equipped with cooling devices, the cooling devices are located on the bottom plates, and the direction of the cooling air is upward. The wind direction channel has good heat dissipation performance. The heat dissipation device includes a base frame 51, the outer shell 11 and the inner shell 12 are provided with mounting grooves 52 corresponding to the base frame 51, the middle part of the base frame 51 is a hollow structure, and the left and right sides of the base frame 51 Two parallel slide rails 53 are connected between them, and several cooling fans 54 are arranged on each of the slide rails 53, and sliders are arranged on the cooling fans 54, and the cooling fans 54 are slidably connected with the slide rails 53 through sliders. . An anti-slip layer is provided on a side of the bottom plate of the outer shell 11 away from the heat sink. The beneficial effect of this embodiment is that: the tops of the outer shell 11 and the inner shell 12 are provided with engaging slots and blocks that cooperate with each other, effectively preventing the computing circuit board 2 from slipping from the shell 1 during transportation or carrying; The position of the heat dissipation fan 54 can be adjusted so that the position of the heat dissipation fan 54 corresponds to the computing circuit board 2, which solves the problem of poor heat dissipation; The slip resistance of the surface.
Claims (5)
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| CN201521128394.5U CN205263721U (en) | 2015-12-30 | 2015-12-30 | Cloud computing services ware |
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| CN201521128394.5U CN205263721U (en) | 2015-12-30 | 2015-12-30 | Cloud computing services ware |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107577319A (en) * | 2017-10-24 | 2018-01-12 | 北京中热能源科技有限公司 | A kind of liquid immersion type server |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107577319A (en) * | 2017-10-24 | 2018-01-12 | 北京中热能源科技有限公司 | A kind of liquid immersion type server |
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