CN205231050U - Lead frame pin copper bridge type packaging structure - Google Patents

Abstract

The utility model relates to a lead frame pin copper bridge package structure, which includes a lead frame (1), the lead frame (1) includes a base island and pins, and a chip (4) is arranged on the base island, The chip (4) is connected to the pins through metal wires (5), and the pins of the lead frame (1) are fixedly provided with copper bridge pads (2) through the second solder layer (7), The copper bridge pad (2) has a bridge-shaped structure, and the bridge-shaped copper bridge pad (4) spans between the pins of the lead frame (1), and the copper bridge pad ( 4) Passive components (3) are fixedly arranged on the upper surface through the first solder layer (6). The utility model relates to a lead frame pin copper bridge package structure, which is simple in structure and convenient in operation, can effectively avoid the problem of insufficient filling between passive components and chips, has simple process and low cost, and can be used in various types Frame, no special restrictions.

Description

A lead frame pin copper bridge package structure

technical field

The utility model relates to a lead frame pin copper bridge package structure, which facilitates the conduction between frame pins and passive components, increases the reliability of products and the flexibility of other processes, and belongs to the technical field of semiconductor packaging.

Background technique

With the development of electronic technology, consumers have higher and higher requirements for electronic products, and people hope that more and more functions can be integrated on the same electronic product. To meet the requirements of high integration and miniaturization, it mainly depends on the improvement of integrated circuit products as the core components. One way to improve is to add passive components to the IC package. However, in order to add passive components in the limited area of the package, its placement is subject to many restrictions. If the passive components are installed in the same horizontal plane as the chip, the lateral width of the integrated circuit package will be greatly increased, and the difficulty of the subsequent wirebond process will also be increased.

The existing technology adds passive components to the integrated circuit package. The main method is to pre-plate copper pillars on the lead frame to form a space for the lower chip, and the passive components are stacked on the copper pillars of the lead frame through solder. , the advantage is that it can diversify and miniaturize the functions of a single package product.

But existing this method has following many defects:

1. Due to the copper pillars formed by electroplating directly on the pins when making the frame, the shape and coverage area of the copper pillars are often limited by the lead frame, the degree of change is not much, the shape of the copper pillars is not much, and the cross-pin welding more difficult to design;

2. Due to the copper pillars formed by electroplating directly on the pins when making the frame, the area of the pin bonding area becomes very small, which increases the difficulty of the ball soldering process and easily causes the second solder joint of the soldering wire to be defective ;

3. Since the copper pillars are directly plated on the pins when making the frame, the height of the copper pillars cannot be plated very high. If the lower chip is thicker, it will cause the gap between the upper passive component and the lower chip after the stack is completed. The problem of insufficient filling will occur due to the gap being too small;

4. Since the copper pillars are formed by electroplating directly on the pins when making the frame, the manufacturing cost of the frame increases, and the frame needs to be redeveloped for different products, which further increases the manufacturing cost of the frame.

Utility model content

The technical problem to be solved by the utility model is to provide a lead frame pin copper bridge package structure for the above-mentioned prior art, which has a simple structure and convenient operation, and can effectively avoid the problem of insufficient filling between passive components and chips, and The process is simple, the cost is low, and it can be used for various types of frames without special restrictions.

The technical scheme adopted by the utility model to solve the above-mentioned problems is: a lead frame pin copper bridge package structure, which includes a lead frame, the lead frame includes a base island and pins, and a chip is arranged on the base island, The chip and the pins are connected by metal wires, and the pins of the lead frame are fixed with copper bridge pads through the second solder layer, and the copper bridge pads have a bridge-shaped structure, and the bridge-shaped pads The copper bridge pad spans between the pins of the lead frame and the pins, the upper surface of the copper bridge pad is provided with a first solder layer, and the copper bridge pad is fixedly arranged on the first solder layer Passive components.

The upper surface of the copper bridge pad is provided with a glue resisting groove to prevent the solder of the solder layer on the upper surface of the copper bridge pad from overflowing.

Compared with the prior art, the utility model has the advantages of:

1. The height of the copper bridge pad of the utility model is not limited by the lead frame, and copper bridge pads of different heights can be used according to the thickness of the chip to ensure that there is enough gap between the upper passive component and the lower chip to make the filling material smooth pass.

2. The copper bridge pads of the utility model can be lapped on the pins after the ball bonding process, which can ensure that the pins have enough area for wire bonding, and will not increase the difficulty of the ball bonding process.

3. The utility model does not need to change the overall production process of the product, and the use effect is better and the stability is better;

4. The structure of the copper bridge of the utility model is relatively simple, easy to install, strong in versatility (easy to replace the copper block), simplifies the processing technology, and saves the manufacturing cost.

Description of drawings

Fig. 1 is a schematic diagram of a lead frame pin welding copper bridge package structure of the present invention.

Fig. 2 is a schematic diagram of a lead frame pin welding copper bridge product of the present invention after passive components are removed.

FIG. 3 is a schematic diagram of a glue-resisting groove on the surface of a copper bridge pad of a lead frame pin copper bridge package structure of the present invention.

in:

Lead frame 1

Copper Bridge Pad 2

Passive components 3

chip 4

Metal wire 5

First solder layer 6

Second solder layer 7

Resist groove 8.

detailed description

The utility model is described in further detail below in conjunction with the accompanying drawings.

As shown in Figures 1 to 3, a lead frame pin copper bridge package structure in this embodiment includes a lead frame 1, and the lead frame 1 includes a base island and pins, and the base island is provided with There is a chip 4, and the chip 4 is connected to the pins through a metal wire 5, and the pins of the lead frame 1 are fixedly provided with a copper bridge pad 2 through a second solder layer 7, and the copper bridge pad 2 is a bridge-shaped structure, the bridge-shaped copper bridge pad 4 spans between the pins of the lead frame 1, the upper surface of the copper bridge pad 4 is provided with a first solder layer 6, the Passive components 3 are fixedly arranged on the copper bridge pad 4 through the first solder layer 6 .

The upper surface of the copper bridge pad 2 is provided with a glue-resisting groove 8 to prevent the solder of the solder layer on the upper surface of the copper bridge pad from overflowing.

In addition to the above-mentioned embodiments, the utility model also includes other implementation modes, and any technical solution formed by equivalent transformation or equivalent replacement shall fall within the protection scope of the claims of the utility model.

Claims (2)

1. a lead frame pin copper bridge-type encapsulating structure, it is characterized in that: it comprises lead frame (1), described lead frame (1) comprises Ji Dao and pin, described Ji Dao is provided with chip (4), described chip (4) is connected by metal wire (5) with between pin, the pin of described lead frame (1) is fixedly installed copper bridge welding dish (2) by the second solder layer (7), described copper bridge welding dish (2) is in bridge shape structure, between the pin that the copper bridge welding dish (4) of described bridge shape is located at lead frame (1) and pin, described copper bridge welding dish (4) upper surface is provided with the first solder layer (6), by the first solder layer (6) is fixedly installed Passive components (3) on described copper bridge welding dish (4).

2. a kind of lead frame pin copper bridge-type encapsulating structure according to claim 1, is characterized in that: described copper bridge welding dish (2) upper surface is provided with resistance glue groove (8).