CN205178938U - Power generation and heat storage device - Google Patents
Power generation and heat storage device Download PDFInfo
- Publication number
- CN205178938U CN205178938U CN201520856801.8U CN201520856801U CN205178938U CN 205178938 U CN205178938 U CN 205178938U CN 201520856801 U CN201520856801 U CN 201520856801U CN 205178938 U CN205178938 U CN 205178938U
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- fin
- support plate
- printing opacity
- heat
- district
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- 238000010248 power generation Methods 0.000 title abstract description 9
- 238000005338 heat storage Methods 0.000 title abstract description 8
- 238000007639 printing Methods 0.000 claims description 43
- 230000005611 electricity Effects 0.000 claims description 17
- 239000012530 fluid Substances 0.000 description 9
- 239000000463 material Substances 0.000 description 9
- 230000000694 effects Effects 0.000 description 6
- 238000004146 energy storage Methods 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 239000010949 copper Substances 0.000 description 5
- -1 nickel oxide compound Chemical class 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000002918 waste heat Substances 0.000 description 4
- 229910052799 carbon Inorganic materials 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000005038 ethylene vinyl acetate Substances 0.000 description 3
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229920000742 Cotton Polymers 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 2
- 229920006362 Teflon® Polymers 0.000 description 2
- HEGVYZJCELUPOJ-UHFFFAOYSA-N [N].[O].[Ti] Chemical compound [N].[O].[Ti] HEGVYZJCELUPOJ-UHFFFAOYSA-N 0.000 description 2
- 230000004308 accommodation Effects 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- UOUJSJZBMCDAEU-UHFFFAOYSA-N chromium(3+);oxygen(2-) Chemical class [O-2].[O-2].[O-2].[Cr+3].[Cr+3] UOUJSJZBMCDAEU-UHFFFAOYSA-N 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 229910021392 nanocarbon Inorganic materials 0.000 description 2
- 229910000480 nickel oxide Inorganic materials 0.000 description 2
- 230000005693 optoelectronics Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 229910003470 tongbaite Inorganic materials 0.000 description 2
- 229910002482 Cu–Ni Inorganic materials 0.000 description 1
- 239000004831 Hot glue Substances 0.000 description 1
- 229910005855 NiOx Inorganic materials 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000001172 regenerating effect Effects 0.000 description 1
- 238000010792 warming Methods 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/40—Solar thermal energy, e.g. solar towers
- Y02E10/44—Heat exchange systems
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/60—Thermal-PV hybrids
Abstract
A power generation and heat storage device comprises a light-transmitting carrier plate, a plurality of solar chips, a plurality of first heat collection fin tubes and a plurality of second heat collection fin tubes. The transparent carrier has a first region and a second region. The plurality of solar chips are arranged on the light-transmitting carrier plate, are positioned in the first area and are positioned outside the second area. The plurality of first heat collecting fin tubes correspond to the first area and are attached to the light-transmitting carrier plate. The plurality of second heat collecting fin tubes correspond to the second area and are separated from the light-transmitting carrier plate by an air gap. The power generation and heat storage device integrates a solar photovoltaic power generation mechanism and a solar heat storage mechanism, can provide a power generation function and store heat energy at the same time, and can effectively improve the utilization rate of solar energy.
Description
Technical field
The utility model relates to a kind of utilization of regenerative energy device, and relates to a kind of generating heat-storing device of applied solar energy especially.
Background technology
In the face of the problem of global warming, people start the importance paying attention to low-carbon (LC), green energy, and to promote the application of all types of renewable energy resources be global trend.The very applicable development solar energy system in area that sunshine is abundant, such as: solar water heating system and solar photoelectric electricity generation system.But, because house, building and factory building roof area are limited, be difficult to solar photoelectric electricity generation system and solar water heating system are installed simultaneously.In addition, the erection of solar photoelectric electricity generation system and solar water heating system there are differences, such as setting height(from bottom) is different, color and moulding equal, and to adopt that solar photoelectric electricity generation system and solar water heating system are also relative increases setup cost simultaneously.
Utility model content
The utility model provides a kind of generating heat-storing device, is to integrate solar photoelectric mechanism of power generation and solar energy heat-storage mechanism, can provide electricity generate function and heat energy storage simultaneously, and effectively can promote the solar energy utilization ratio of unit are.
Generating heat-storing device of the present utility model, comprises a printing opacity support plate, multiple solar chip, multiple first thermal-arrest fin pipe and multiple second thermal-arrest fin pipe.Printing opacity support plate has one first district and one second district.Described multiple solar chip is configured on printing opacity support plate, is positioned at the firstth district, and is positioned at outside the secondth district.Described multiple first thermal-arrest fin pipe corresponds to the firstth district and is attached at printing opacity support plate.Described multiple second thermal-arrest fin pipe corresponds to the secondth district and to be separated by an air gap with printing opacity support plate.
In one embodiment, each first thermal-arrest fin pipe comprises one first fin and one first body.First fin is attached at printing opacity support plate, and the first body connects the first fin.
In one embodiment, described generating heat-storing device also comprises a heat-conducting layer, is configured between the first fin and printing opacity support plate.
In one embodiment, the material of described heat-conducting layer comprises silicon, carbon or silver.
In one embodiment, each second thermal-arrest fin pipe comprises one second fin and one second body.Second fin and printing opacity support plate are separated by air gap, and wherein the second fin has the first surface towards printing opacity support plate and the second surface relative to first surface.Second body connects the second surface of the second fin.
In one embodiment, described generating heat-storing device also comprises a selectively absorbing layers, covers the first surface of the second fin.
In one embodiment, the material of selectively absorbing layers comprises nickel oxide compound, chromium oxide compounds, nitrogen oxygen titanium compound, chromium carbide compound, graphite, silicon dioxide or nano-carbon powder.
In one embodiment, the area of the second fin is greater than the area in the secondth district.
In one embodiment, the firstth district comprises side by side and spaced multiple strip regions.Described multiple solar chip forms multiple chip serial and covers strip region respectively.
In one embodiment, described generating heat-storing device also comprises an euphotic cover plate, one first encapsulated layer and one second encapsulated layer.Euphotic cover plate is configured on printing opacity support plate, to cover described multiple solar chip.First encapsulated layer is configured between euphotic cover plate and described multiple solar chip.Second encapsulated layer is configured between printing opacity support plate and described multiple solar chip, and multiple solar chip described in the first encapsulated layer and the second encapsulated layer coencapsuiation.
The beneficial effects of the utility model are, can integrate solar photoelectric mechanism of power generation and solar energy heat-storage mechanism, can provide electricity generate function and heat energy storage simultaneously, and effectively can promote the solar energy utilization ratio of unit are.
Accompanying drawing explanation
For above-mentioned feature and advantage of the present utility model can be become apparent, special embodiment below, and coordinate appended accompanying drawing to be described in detail below, wherein:
Fig. 1 illustrates the one generating heat-storing device according to an embodiment of this exposure.
Fig. 2 illustrates internal structure seen by the dorsal part of the generating heat-storing device of Fig. 1.
Fig. 3 illustrates the part section structure of the solar chip module according to Fig. 1.
Fig. 4 illustrates the local section structure of generating heat-storing device along the A-A ' face of Fig. 1 of Fig. 1.
Fig. 5 is the part sectioned view of generating heat-storing device along the A-A ' face of Fig. 1 of Fig. 1.
Embodiment
Fig. 1 illustrates the one generating heat-storing device according to an embodiment of this exposure.Fig. 2 illustrates internal structure seen by the dorsal part of the generating heat-storing device of Fig. 1.As shown in figs. 1 and 2, the generating heat-storing device 100 of the present embodiment is suitable for receiving sunlight, to generate electricity and heat energy storage.Generating heat-storing device 100 comprises solar chip module 102, housing 104 and is configured at the multiple thermal-arrest fin pipes 106 in accommodation space that solar chip module 102 and housing 104 form.Solar chip module 102 is suitable for receiving sunlight, and is electric energy by transform light energy.Multiple thermal-arrest fin pipe 106 is interconnected and can transmits working fluid, such as water or other heat-absorbing mediums, in order to manufacture hot water, or by working fluid heat energy storage and by heat transfer to outside heat-exchange system.
Fig. 3 illustrates the part section structure of the solar chip module according to Fig. 1.The solar chip module 102 of the present embodiment comprises printing opacity support plate 110, is configured at the multiple solar chips 120 on printing opacity support plate 110 and covers the euphotic cover plate 130 of solar chip 120.The material of the printing opacity support plate 110 that the present embodiment is selected can comprise glass, polyethylene terephthalate (Polyethyleneterephthalate, or Teflon (Teflon) etc. PET), and the material of euphotic cover plate 130 can be glass, and anti-reflex treated can be carried out in its surface.In addition, solar chip 120 can be encapsulated by encapsulating material in advance.Specifically, first encapsulated layer 142 and the second encapsulated layer 144 lay respectively at the both sides up and down of described multiple solar chip 120, wherein the first encapsulated layer 142 is configured between euphotic cover plate 130 and described multiple solar chip 120, and the second encapsulated layer 144 is configured between printing opacity support plate 110 and described multiple solar chip 120.
At this, the first encapsulated layer 142 and the second encapsulated layer 144 can be hot melt adhesive film, such as EVA (EthyleneVinylAcetate, ethylene-vinyl acetate copolymer) film or other there is the material membrane of similar characteristics.During making, in advance solar chip 120 can be arranged between the first encapsulated layer 142 or the second encapsulated layer 144, complete after being electrically connected in series, then carry out hot pressing program, to make multiple solar chip 120 described in the first encapsulated layer 142 and the second encapsulated layer 144 coencapsuiation.Afterwards, then the first encapsulated layer 142, second encapsulated layer 144 and the solar chip 120 be encapsulated in therebetween are arranged between printing opacity support plate 110 and euphotic cover plate 130, to form solar chip module 102.
In the present embodiment, solar chip 120 is arranged as multiple chip serial 120a, wherein due to lighttight characteristic of solar chip 120 itself, and in solar chip module 102, form the first district R1 of spaced and lighttight multiple strip, and formed simultaneously and be alternately arranged with the first district R1, and not the second district R2 of multiple strips of covering by solar chip 120.Specifically, the printing opacity support plate 110 of solar chip module 102 has the first district R1 and the second district R2, and solar chip 120 is laid in the first district R1 of printing opacity support plate 110, and is positioned at outside the second district R2, and the second district R2 keeps the state of printing opacity.Thus, the solar chip 120 of the first district R1 can receive sunlight and carry out opto-electronic conversion, and the thermal-arrest fin pipe 106 being positioned at the first district R1 can collect the waste heat outside for solar chip 120 running, for heated working fluid.In addition, sunlight can arrive through the second district R2 of solar chip module 102 the thermal-arrest fin pipe 106 being positioned at the second district R2, to be collected the heat energy of sunlight by thermal-arrest fin pipe 106, and heated working fluid.Thus, the generating heat-storing device 100 of the present embodiment incorporates solar photoelectric mechanism of power generation and solar energy heat-storage mechanism, therefore can generate electricity and heat energy storage simultaneously.
In other embodiments, the serial connection of solar chip 120 and arrangement mode may change with actual demand.In other words, the size, shape, position etc. of the first district R1 and the second district R2 also may change thereupon.For example, the thermal-arrest fin pipe 106 in order to ensure the second district R2 can absorb the heat energy of enough sunlights, and the area of the second district R2 can account for the 20%-50% of the area summation of the first district R1 and the second district R2.Such as, the area of the first district R1 accounts for 60% of the area summation of the first district R1 and the second district R2, and the area of the second district R2 accounts for 40% of the area summation of the first district R1 and the second district R2.
On the other hand, in order to more effectively utilize the solar energy received by generating heat-storing device 100, the present embodiment designs the framework of thermal-arrest fin pipe 106 further.
Fig. 4 illustrates the local section structure of generating heat-storing device 100 along the A-A ' face of Fig. 1 of Fig. 1, and Fig. 5 is the part sectioned view of generating heat-storing device 100 along the A-A ' face of Fig. 1.As shown in Fig. 4 and 5, the thermal-arrest fin pipe 106 of the present embodiment comprises the first thermal-arrest fin pipe 150 being positioned at the first district R1 and the second thermal-arrest fin pipe 160 being positioned at the second district R2, wherein the first thermal-arrest fin pipe 150 is attached at the printing opacity support plate 110 (as shown in Figure 3) of solar chip module 102, effectively conducts to the first thermal-arrest fin pipe 150 to make the waste heat energy outside solar chip 120 running.More specifically, each first thermal-arrest fin pipe 150 comprises the first fin 152 and one first body 154, and wherein the first fin 152 is attached at printing opacity support plate 110, and the first body 154 connects the first fin 152, in order to transmit working fluid.In the present embodiment, first fin 152 is also attached at the printing opacity support plate 110 (as shown in Figure 3) of solar chip module 102 by heat-conducting layer 170, specifically, heat-conducting layer 170 is configured between the first fin 152 and printing opacity support plate 110, to improve the thermal conduction effect between the first fin 152 and printing opacity support plate 110.Described heat-conducting layer 170 comprises the material that silicon, carbon or silver etc. have good heat conductive effect.First fin 152 can be metal, and copper, aluminium, stainless steel or steel etc. generally can be selected to have the metal of good heat conductive effect.
On the other hand, in order to avoid heat energy is accumulated around the junction of the printing opacity support plate 110 (as shown in Figure 3) of the second thermal-arrest fin pipe 160 and solar chip module 102, and the working fluid that cannot effectively be passed in the second thermal-arrest fin pipe 160, the present embodiment makes described multiple second thermal-arrest fin pipe 160 and the printing opacity support plate 110 (as shown in Figure 3) of solar chip module 102 be separated by air gap g.In one embodiment, air gap g is more than or equal to 3mm.More specifically, each second thermal-arrest fin pipe 160 comprises one second fin 162 and one second body 164, and wherein the second fin 162 and the printing opacity support plate 110 (as shown in Figure 3) of solar chip module 102 are separated by air gap g.Second fin 162 has the first surface 160a towards printing opacity the support plate 110 and second surface 160b relative to first surface 162a.Second body 164 connects the second surface 160b of the second fin 162.Because the second fin 162 and the printing opacity support plate 110 (as shown in Figure 3) of solar chip module 102 are separated by air gap g, therefore the problem of the aforementioned heat energy accumulation mentioned can be avoided, contribute to preventing hot loss of energy, and significantly promote solar energy utilization ratio.
In addition, the present embodiment can configure a selectively absorbing layers 180 at the first surface 160a of the second fin 162, and selectively absorbing layers 180 is the first surface 160a covering the second fin 162, to improve the heat absorption efficiency of the second fin 162 relative to sunlight.At this, selectively absorbing layers 180 is a sandwich construction, in sandwich construction, its material can comprise nickel oxide compound (the multiple-level stack mode as Ni-NiOx/Cu-Ni/Al), chromium oxide compounds (the multiple-level stack mode as CrN-CrxOy/Cu), nitrogen oxygen titanium compound (the multiple-level stack mode as TiNxOy/Cu), chromium carbide compound (the multiple-level stack mode as Cu-Cr-C/Cu), graphite, silicon dioxide or nano-carbon powder etc., or other have the material of same or similar photothermal deformation effect.The photo-thermal conversion efficiency of the selectively absorbing layers 180 selected by the present embodiment can be greater than 85%.In addition, the second fin 162 can be metal, and copper, aluminium, stainless steel or steel etc. generally can be selected to have the metal of good heat conductive effect.
In order to collect the light by the second district R2 as much as possible, second fin 162 and the area of selectively absorbing layers 180 of the present embodiment can be more than or equal to the area of the second district R2, or as shown in Figure 5, the width W 1 of the second fin 162 can be more than or equal to the width W 2 of the second district R2.In one embodiment, the area (or width W 1) of the second fin 162 can be more than or equal to 120% of the area (or width W 2) of the second district R2.
In addition, in the accommodation space that solar chip module 102 and housing 104 are formed, can stuffed heat insulated/insulation material, as foamed cotton, glass fibre cotton etc., to avoid the heat energy loss in the first fin pipe 150 and the second fin pipe 160, further promote the effect of heat accumulation.
In sum, the solar chip module of the generating heat-storing device of this exposure is respectively arranged with the firstth district of solar chip and is not provided with the secondth district of solar chip.The solar chip in the firstth district can receive sunlight and carry out opto-electronic conversion, and is attached at printing opacity support plate at the first thermal-arrest fin pipe in the firstth district, to collect the waste heat outside for solar chip running, for heated working fluid.In addition, the secondth district of solar chip module is not provided with solar chip, and therefore sunlight can arrive the second thermal-arrest fin pipe through the secondth district of solar chip module.Second thermal-arrest fin pipe can collect the heat energy of sunlight, with heated working fluid.Because the first thermal-arrest fin pipe in the firstth district is attached at printing opacity support plate, the waste heat outside solar chip running therefore can be made effectively to conduct to the first thermal-arrest fin pipe.And, because the second thermal-arrest fin pipe in the secondth district and printing opacity support plate are separated by air gap, therefore heat energy can be avoided to accumulate around the junction of the second thermal-arrest fin pipe and printing opacity support plate and the working fluid that cannot effectively be passed in the second thermal-arrest fin pipe, to prevent the loss of heat energy.Thus, the generating heat-storing device of this exposure can effectively integrate solar photoelectric mechanism of power generation and solar energy heat-storage mechanism, not only can generate electricity and heat energy storage simultaneously, significantly can also promote the solar energy utilization ratio of unit are.
Although the utility model discloses as above with embodiment; so itself and be not used to limit the utility model; have in any art and usually know the knowledgeable; not departing from spirit and scope of the present utility model; when doing a little change and retouching, therefore protection range of the present utility model is when being as the criterion of defining depending on accompanying right.
Claims (8)
1. generate electricity a heat-storing device, it is characterized in that, comprising:
One printing opacity support plate, has one first district and one second district;
Multiple solar chip, be configured on this printing opacity support plate, described solar chip is positioned at this firstth district, and is positioned at outside this secondth district;
Multiple first thermal-arrest fin pipe, is attached at this printing opacity support plate corresponding to this firstth district; And
Multiple second thermal-arrest fin pipe, to be separated by an air gap with this printing opacity support plate corresponding to this secondth district.
2. generate electricity heat-storing device as claimed in claim 1, it is characterized in that, wherein respectively this first thermal-arrest fin pipe comprises:
One first fin, is attached at this printing opacity support plate; And
One first body, connects this first fin.
3. generate electricity heat-storing device as claimed in claim 2, it is characterized in that, also comprise a heat-conducting layer, is configured between this first fin and this printing opacity support plate.
4. generate electricity heat-storing device as claimed in claim 1, it is characterized in that, wherein respectively this second thermal-arrest fin pipe comprises:
One second fin, to be separated by this air gap with this printing opacity support plate, wherein this second fin has the first surface towards this printing opacity support plate and the second surface relative to this first surface; And
One second body, connects this second surface of this second fin.
5. generate electricity heat-storing device as claimed in claim 4, it is characterized in that, also comprise a selectively absorbing layers, covers this first surface of this second fin.
6. generate electricity heat-storing device as claimed in claim 4, and it is characterized in that, wherein the area of this second fin is greater than the area in this secondth district.
7. generate electricity heat-storing device as claimed in claim 1, it is characterized in that, wherein this firstth district comprises side by side and spaced multiple strip regions, and described solar chip forms multiple chip serial and covers described strip region respectively.
8. generate electricity heat-storing device as claimed in claim 1, it is characterized in that, also comprise:
One euphotic cover plate, is configured on this printing opacity support plate, to cover described solar chip;
One first encapsulated layer, is configured between this euphotic cover plate and described solar chip; And
One second encapsulated layer, is configured between this printing opacity support plate and described solar chip, and solar chip described in this first encapsulated layer and this second encapsulated layer coencapsuiation.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW104215037U TWM520132U (en) | 2015-09-17 | 2015-09-17 | Electric power generation and heat storage device |
| TW104215037 | 2015-09-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205178938U true CN205178938U (en) | 2016-04-20 |
Family
ID=55742868
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520856801.8U Active CN205178938U (en) | 2015-09-17 | 2015-10-30 | Power generation and heat storage device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN205178938U (en) |
| TW (1) | TWM520132U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110943693A (en) * | 2019-12-18 | 2020-03-31 | 梁雪芽 | Novel photovoltaic and photo-thermal integrated system and control method thereof |
-
2015
- 2015-09-17 TW TW104215037U patent/TWM520132U/en unknown
- 2015-10-30 CN CN201520856801.8U patent/CN205178938U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110943693A (en) * | 2019-12-18 | 2020-03-31 | 梁雪芽 | Novel photovoltaic and photo-thermal integrated system and control method thereof |
| CN110943693B (en) * | 2019-12-18 | 2021-06-04 | 梁雪芽 | Novel photovoltaic and photo-thermal integrated system and control method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| TWM520132U (en) | 2016-04-11 |
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| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |