CN205141017U - Eliminate LED packaging structure and LED light source of blue light - Google Patents
Eliminate LED packaging structure and LED light source of blue light Download PDFInfo
- Publication number
- CN205141017U CN205141017U CN201520906853.1U CN201520906853U CN205141017U CN 205141017 U CN205141017 U CN 205141017U CN 201520906853 U CN201520906853 U CN 201520906853U CN 205141017 U CN205141017 U CN 205141017U
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- Prior art keywords
- luminescence chip
- led
- glass substrate
- terminal pad
- blue light
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- 238000004806 packaging method and process Methods 0.000 title abstract 4
- 238000004020 luminiscence type Methods 0.000 claims abstract description 61
- 239000000758 substrate Substances 0.000 claims abstract description 43
- 239000011521 glass Substances 0.000 claims abstract description 40
- 239000000084 colloidal system Substances 0.000 claims abstract description 20
- 238000005538 encapsulation Methods 0.000 claims description 21
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 10
- 239000000741 silica gel Substances 0.000 claims description 10
- 229910002027 silica gel Inorganic materials 0.000 claims description 10
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 4
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 239000010703 silicon Substances 0.000 claims description 4
- 239000000499 gel Substances 0.000 claims description 3
- 230000008030 elimination Effects 0.000 abstract description 7
- 238000003379 elimination reaction Methods 0.000 abstract description 7
- 238000000034 method Methods 0.000 abstract description 4
- 238000007493 shaping process Methods 0.000 abstract description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 abstract 2
- 238000005253 cladding Methods 0.000 abstract 1
- 230000003287 optical effect Effects 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 241000218202 Coptis Species 0.000 description 1
- 235000002991 Coptis groenlandica Nutrition 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 239000005341 toughened glass Substances 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 238000004383 yellowing Methods 0.000 description 1
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- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
The utility model relates to an eliminate LED packaging structure and LED light source of blue light, multiseriate luminescence chip on LED packaging structure includes glass substrate and locates glass substrate, every luminescence chip that is listed as includes a plurality of luminescence chips of establishing ties through the lead wire, and every both ends that are listed as the luminescence chip are connected to common positive bonding pad and common negative electrode bonding pad respectively, and the whole surface of glass substrate and each side all cover has the fluorescence colloid, and the fluorescence colloid still covers multiseriate luminescence chip and lead wire. Among the LED packaging structure of above -mentioned elimination blue light, there is the fluorescence colloid whole surface of base plate and side all cladding, avoid traditional blue optical phenomena from this. The luminescence chip is arranged with the form that integrates, and luminous efficacy is high, and simple structure is compact moreover, the shaping of being convenient for. In addition, this LED adopts glass substrate for light can pass through out in all directions ground, realizes that the omnidirectional is luminous, need not diversely to set up the LED chip multi -directionly, simplifies the structure from this, saves the processing procedure, reduce cost.
Description
Technical field
The utility model relates to LED field of luminescent technology, is specifically related to a kind of LED encapsulation structure and the light source thereof of eliminating blue light.
Background technology
Along with the development of LED technology, LED, due to advantages such as its power consumption is little, caloric value is little, long service life, thus obtains applying more and more widely in illumination.Owing to being limited using single LED light-emitting diode as the brightness that during light emitting source, it sends, the light emitting LED lamp that thus to engender with multiple LED light-emitting diode be on the market light emitting source.
Although existing most light emitting LED lamp can play high brightness effect, because LED chip luminescence has very strong directivity, its region illuminated is limited, and disperses unlike the light source of incandescent lamp, electricity-saving lamp.Because the directivity of LED chip luminescence is very strong, its lighting angle is narrower, can not meet some personalized instructions for uses.Settling mode common at present installs plurality of LEDs in the Luminous lamp holder of a light fixture, the direction that every LEDs is corresponding different, so forms the light dispersed.The shortcoming of this mode is apparent: cost is high, because lamp holder needs to install multiple LED, makes assembling process complicated.Some and its complex structure, manufacturing cost is high.In addition, often there is blue light in traditional white light LEDs, affects the normal coloured light of LED.
Utility model content
In view of this, provide a kind of simple and compact for structure, volume is little, is convenient to make, and specular removal, without LED encapsulation structure and the LED light source of the elimination blue light of blue light phenomenon.
A kind of LED encapsulation structure eliminating blue light, it comprises glass substrate and is located at the multiple row luminescence chip on glass substrate, often row luminescence chip comprises the multiple luminescence chips by lead-in wire series connection, often the two ends of row luminescence chip are connected respectively to common positive terminal pad and common negative terminal pad, the whole surface of described glass substrate and each side are all coated with fluorescent colloid, and described fluorescent colloid also covers described multiple row luminescence chip and lead-in wire.
Further, two surfaces of described glass substrate and each side wrap up by described fluorescent colloid.
Further, described multiple row luminescence chip is connected to common positive terminal pad and common negative terminal pad with parallel way.
Further, described multiple row luminescence chip the linear alignment and parallel to each other, described common positive terminal pad and common negative terminal pad are respectively wire pad, and described common positive terminal pad and common negative terminal pad are vertically connected at the two ends of multiple row luminescence chip respectively.
Further, described glass substrate has first end and the second end, often row luminescence chip extends to the second end by the first end of glass substrate, and described common negative terminal pad is positioned at the first end edge of described glass substrate, and described common positive terminal pad is positioned at the second end margin.
Further, described second end margin is also provided with positive pole exit and negative pole exit, described common negative terminal pad is walked around lateral edges and is connected to described negative pole exit, described common positive terminal pad is connected to described positive pole exit, and part or all of and all or part of of negative pole exit of described positive pole exit exposes outside described fluorescent colloid.
Further, each luminescence chip is mounted on described reinforced glass substrate, and each lead-in wire is connected to an adjacent luminescence chip by a luminescence chip.
Further, the second end of described glass substrate connects a flexible silica gel connection-peg, and described positive pole exit and negative pole exit embed and be exposed to described flexible silica gel connection-peg at least partly.
Further, two or more pin is extended in described flexible silica gel connection-peg end, and described positive pole exit and negative pole exit are exposed to the silicon gel part between described pin.
And a kind of LED light source, it comprises shell and is installed on the LED ray structure in housing, and described LED ray structure is the LED encapsulation structure eliminating blue light as mentioned above.
In the LED encapsulation structure of above-mentioned elimination blue light and light source, surface and the side of substrate are all coated with fluorescent colloid, avoid traditional blue light phenomenon thus.Enter a ground, this LED comprises multiple row luminescence chip, and often row luminescence chip comprises the multiple luminescence chips by lead-in wire series connection, by this integrated light-emitting chip form, to send high-brightness light, improve luminous efficiency, and, this integrated simple and compact for structure, be convenient to shaping.This LED adopts glass substrate, light can be transmitted from all directions, realize omnibearing luminescence, multi-direction arranges LED chip, simplified structure thus, save processing procedure, reduce costs without the need to multi-faceted.
Accompanying drawing explanation
Fig. 1 is the planar structure schematic diagram of the LED encapsulation structure of the elimination blue light of the utility model embodiment.
Fig. 2 is the side-looking structural representation of the LED encapsulation structure of the elimination blue light of the utility model embodiment.
Fig. 3 is the part A structure for amplifying schematic diagram in Fig. 1.
Fig. 4 is along the longitudinal sectional structure schematic diagram of Fig. 1.
Embodiment
Below with reference to specific embodiments and the drawings, the utility model is described in detail.
Refer to Fig. 1 to Fig. 4, the LED encapsulation structure 10 of the elimination blue light of the utility model embodiment is shown, it comprises glass substrate 11 and is located at the multiple row luminescence chip 12 on glass substrate 11, often row luminescence chip 12 comprises the multiple luminescence chips 12 by 13 series connection that go between, often the two ends of row luminescence chip 12 are connected respectively to common positive terminal pad 121 and common negative terminal pad 122, the described whole surface of glass substrate 11 and each side are all coated with fluorescent colloid 17, and described fluorescent colloid 17 also covers described multiple row luminescence chip and lead-in wire 13.
The glass substrate 11 of the present embodiment is reinforced glass substrate, and toughened glass is conducive to the rigidity, the intensity that improve ray structure, and has good security performance.Reinforced glass substrate 11 has two surfaces 101 and 102.Multiple row luminescence chip 12 is located on a surface 101.Two surfaces of glass substrate 11 and each side wrap up by described fluorescent colloid 17.Glass substrate 11 is preferably cubic glass sheet shapes.Preferably, as shown in figs. 1 and 3, multiple row luminescence chip 12 is connected to common positive terminal pad 121 and negative terminal pad 122 with parallel way.Described glass substrate 11 has first end 111 and the second end 112.Lead-in wire 13 is preferably gold thread.
Preferably, two surfaces 101 and 102 are formed with multiple row luminescence chip 12 respectively.Further, two surfaces 101 and 102 of described glass substrate and each side wrap up by described fluorescent colloid 17.Like this, all wrap by whole glass substrate 11, make the blue light of luminescence chip 12 self there is no a bit leakage, as shown in Figures 2 and 4.
Further, described multiple row luminescence chip 12 the linear alignment and parallel to each other, namely the multiple luminescence chips 12 often arranged arrange a row or column, and two ends are connected to common positive terminal pad 121 and common negative terminal pad 122, and common positive terminal pad 121 and common negative terminal pad 122 are respectively wire pad.Common positive terminal pad 121 and common negative terminal pad 122 are vertically connected at the two ends of multiple row luminescence chip 12 respectively.Namely often the two ends of row luminescence chip 12 are connected to common positive terminal pad 121 and common negative terminal pad 122.Preferably, described multiple row luminescence chip 12 between the column and the column apart from equal, the spacing of the adjacent luminescence chip 12 of each row luminescence chip 12 is identical.In the present embodiment, each luminescence chip 12 is mounted on described glass substrate 11, and each lead-in wire 13 is connected to an adjacent luminescence chip 12 by a luminescence chip 12.
Further, often row luminescence chip 12 extends to the second end 112 by the first end 111 of glass substrate 11, described common negative terminal pad 122 is positioned at first end 111 edge of described glass substrate 11, preferably be parallel to described first end edge, described common positive terminal pad 121 is positioned at the second end margin, is preferably parallel to described second end margin.The edge of the second end 112 is also provided with positive pole exit 15 and negative pole exit 16, and described common negative terminal pad 122 is walked around lateral edges and is connected to described negative pole exit 16, and described common positive terminal pad 121 is connected to described positive pole exit 15.
In addition, fluorescent colloid 17 is covered in the whole surface of the substrate 11 arranging luminescence chip 12, and expose described positive pole exit 15 partly or entirely and negative pole exit 16 all or part of.Further, the second end 112 of glass substrate 11 connects a flexible silica gel connection-peg 19, and described positive pole exit 15 and negative pole exit 16 embed and be exposed to described flexible silica gel connection-peg 19 at least partly.Two or more pin 192 is extended in flexible silica gel connection-peg 19 end, and described positive pole exit and negative pole exit are exposed to the silicon gel part between described pin 192.Described flexible silica gel connection-peg 19 is preferably bi-component organic silicon glue, and itself and substrate 11 cementability are good, flexible, be convenient to be installed in light fixture, and the light transmittance keeping it higher, refractive index and thermal stability, also there is stress little, non yellowing, and atmospheric aging, the features such as moisture absorption is low.
Embodiment of the present utility model also provides a kind of LED light source, and it comprises shell and is installed on the LED ray structure in housing, and described LED ray structure is the LED encapsulation structure 10 eliminating blue light as mentioned above.Shell adopts common housing, sets as required, has spherical as LED bulb, has divergent contour etc., can be used as street lamp etc., be not limited to this.
Do not have coated side in traditional LED structure, LED chip is blue chip normally, will send the light of itself, will occur blue light thus without fluorescent colloid 17.In the LED encapsulation structure 10 of above-mentioned elimination blue light, the surface of substrate 11 and side are all coated with fluorescent colloid 17, or even there is fluorescent colloid 17 on two surfaces, avoid traditional blue light phenomenon thus.Enter a ground, this LED structure 10 comprises multiple row luminescence chip 12, and often row luminescence chip 12 comprises the multiple luminescence chips 12 by 13 series connection that go between, by this integrated light-emitting chip form, to send high-brightness light, improve luminous efficiency, and, this integrated simple and compact for structure, be convenient to shaping.This LED structure 10 adopts glass substrate 11, light can be transmitted from all directions, realize omnibearing luminescence, multi-direction arranges LED chip, simplified structure thus, save processing procedure, reduce costs without the need to multi-faceted.
It should be noted that; the utility model is not limited to above-mentioned execution mode; according to creative spirit of the present utility model; those skilled in the art can also make other changes; these changes done according to creative spirit of the present utility model, all should be included within the utility model scope required for protection.
Claims (10)
1. eliminate the LED encapsulation structure of blue light for one kind, it is characterized in that, described LED structure comprises glass substrate and is located at the multiple row luminescence chip on glass substrate, often row luminescence chip comprises the multiple luminescence chips by lead-in wire series connection, often the two ends of row luminescence chip are connected respectively to common positive terminal pad and common negative terminal pad, the whole surface of described glass substrate and each side are all coated with fluorescent colloid, and described fluorescent colloid also covers described multiple row luminescence chip and lead-in wire.
2. the as claimed in claim 1 LED encapsulation structure eliminating blue light, is characterized in that, two surfaces of described glass substrate and each side wrap up by described fluorescent colloid.
3. the LED encapsulation structure eliminating blue light as claimed in claim 1, it is characterized in that, described multiple row luminescence chip is connected to common positive terminal pad and common negative terminal pad with parallel way.
4. the LED encapsulation structure eliminating blue light as claimed in claim 3, it is characterized in that, described multiple row luminescence chip the linear alignment and parallel to each other, described common positive terminal pad and common negative terminal pad are respectively wire pad, and described common positive terminal pad and common negative terminal pad are vertically connected at the two ends of multiple row luminescence chip respectively.
5. the LED encapsulation structure eliminating blue light as claimed in claim 4, it is characterized in that, described glass substrate has first end and the second end, often row luminescence chip extends to the second end by the first end of glass substrate, described common negative terminal pad is positioned at the first end edge of described glass substrate, and described common positive terminal pad is positioned at the second end margin.
6. the LED encapsulation structure eliminating blue light as claimed in claim 5, it is characterized in that, described second end margin is also provided with positive pole exit and negative pole exit, described common negative terminal pad is walked around lateral edges and is connected to described negative pole exit, described common positive terminal pad is connected to described positive pole exit, and part or all of and all or part of of negative pole exit of described positive pole exit exposes outside described fluorescent colloid.
7. the LED encapsulation structure eliminating blue light as claimed in claim 1, it is characterized in that, each luminescence chip is mounted on described glass substrate, and each lead-in wire is connected to an adjacent luminescence chip by a luminescence chip.
8. the LED encapsulation structure eliminating blue light as claimed in claim 6, it is characterized in that, second end of described glass substrate connects a flexible silica gel connection-peg, and described positive pole exit and negative pole exit embed and be exposed to described flexible silica gel connection-peg at least partly.
9. the LED encapsulation structure eliminating blue light as claimed in claim 8, it is characterized in that, two or more pin is extended in described flexible silica gel connection-peg end, and described positive pole exit and negative pole exit are exposed to the silicon gel part between described pin.
10. a LED light source, it comprises shell and is installed on the LED ray structure in housing, it is characterized in that, described LED ray structure is for eliminating the LED encapsulation structure of blue light described in any one of claim 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520906853.1U CN205141017U (en) | 2015-11-07 | 2015-11-07 | Eliminate LED packaging structure and LED light source of blue light |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520906853.1U CN205141017U (en) | 2015-11-07 | 2015-11-07 | Eliminate LED packaging structure and LED light source of blue light |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205141017U true CN205141017U (en) | 2016-04-06 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520906853.1U Expired - Fee Related CN205141017U (en) | 2015-11-07 | 2015-11-07 | Eliminate LED packaging structure and LED light source of blue light |
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| Country | Link |
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| CN (1) | CN205141017U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109899725A (en) * | 2019-03-13 | 2019-06-18 | 辽宁海浪防爆电器有限责任公司 | A kind of ceiling type LED anti-explosion lamp for toilet |
-
2015
- 2015-11-07 CN CN201520906853.1U patent/CN205141017U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109899725A (en) * | 2019-03-13 | 2019-06-18 | 辽宁海浪防爆电器有限责任公司 | A kind of ceiling type LED anti-explosion lamp for toilet |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 518000 Guangdong City, Longgang Province Dragon Street, Dragon Industrial Zone, Liuzhou Road, No. three, building D, building No. 101 (building two) () Patentee after: SHENZHEN BINYING PHOTOELECTRIC CO.,LTD. Address before: Longgang District of Shenzhen City, Guangdong province 518000 Dragon Street New Community Building No. 3 District 17 charge treasure Patentee before: SHENZHEN BINYING OPTOELECTRONIC TECHNOLOGY Co.,Ltd. |
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| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160406 Termination date: 20211107 |