CN205140773U - Compound silver alloy contact of low resistance amalgamation - Google Patents

Compound silver alloy contact of low resistance amalgamation Download PDF

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Publication number
CN205140773U
CN205140773U CN201520921046.7U CN201520921046U CN205140773U CN 205140773 U CN205140773 U CN 205140773U CN 201520921046 U CN201520921046 U CN 201520921046U CN 205140773 U CN205140773 U CN 205140773U
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CN
China
Prior art keywords
silver
alloy layer
alloy
silver alloy
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201520921046.7U
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Chinese (zh)
Inventor
虞晓波
虞夏宇
徐定汉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RUI'AN YONGMING ELECTRICAL ALLOY FACTORY
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RUI'AN YONGMING ELECTRICAL ALLOY FACTORY
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Priority to CN201520921046.7U priority Critical patent/CN205140773U/en
Application granted granted Critical
Publication of CN205140773U publication Critical patent/CN205140773U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses a compound silver alloy contact of low resistance amalgamation, including metal substrate and compound last silver alloy layer and time silver alloy layer on metal substrate top and bottom, metal substrate's inside has a through -hole, all be provided with the pure silver silk screen between last silver alloy layer and lower silver alloy layer and metal substrate's composite surface be provided with the silver wire of pure silver silk screen about connecting in the through -hole, the contact has adopted ordinary silver alloy and pure silver net compound each other with metal substrate, when effectively reducing resistance improvement conductivity, has also reduced the manufacturing cost of contact, unusual economical and practical, and performance is better than traditional compound alloy contact.

Description

A kind of low resistance split compound silver alloy contact
Technical field
The utility model relates to a kind of electrical contact, especially relates to a kind of low resistance split compound silver alloy contact.
Background technology
The structure of silver alloy contact generally comprises metallic base layer and the silver layer of mutual compound, and its silver alloy contact in the step of Compound Machining is: the operations such as first pressing, sintering, multiple pressure and cutting finishing.Due to the difference of silver layer and metallic base layer material property, and always there is complex defect in the composite surface of the two, cause the defective locations contact resistance of the reset surface of traditional silver alloy contact large, in use, the defective locations of the composite surface of silver alloy contact is the most easily burnt.
Utility model content
For solving the problem, the utility model proposes the low resistance split compound silver alloy contact that a kind of resistance is little, cost is low and the life-span is long.
The technical scheme that the utility model adopts is: a kind of low resistance split compound silver alloy contact, the upper ag alloy layer comprising metallic matrix and be compounded on metallic matrix top and bottom and lower ag alloy layer, the inside of described metallic matrix has a through hole, be provided with fine silver silk screen between the composite surface of described upper ag alloy layer and lower ag alloy layer and metallic matrix, in described through hole, be provided with the filamentary silver connecting upper and lower fine silver silk screen.
Further, the oral area of described through hole has reaming, and described fine silver silk screen is positioned at reaming place, and described upper ag alloy layer and lower ag alloy layer extend in reaming.
Further, described upper ag alloy layer and lower ag alloy layer are silver tungsten, silver-nickel or silver-colored ashbury metal.
Further, described metallic matrix is AgCuZn alloy.
Compared with prior art, it has following beneficial effect to the utility model:
Low resistance split compound silver alloy contact of the present utility model have employed common silver alloy and fine silver net and the mutual compound of metallic matrix, while effectively reducing resistance raising conductance, also reduce the production cost of contact, very economical and practical, serviceability is better than traditional composite alloy contact.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
1-metallic matrix; The upper ag alloy layer of 2-; Ag alloy layer under 3-; 4-through hole; 5-fine silver silk screen; 6-filamentary silver; 7-reaming.
Embodiment
Clearly understand to make the purpose of this utility model, technical scheme and advantage, below in conjunction with drawings and the embodiments, the utility model is further elaborated, should be understood to, embodiment described herein only in order to explain the utility model, and is not used in restriction the utility model.
A kind of low resistance split compound silver alloy contact as shown in Figure 1, the upper ag alloy layer 2 comprising metallic matrix 1 and be compounded on metallic matrix 1 top and bottom and lower ag alloy layer 3, the inside of described metallic matrix 1 has a through hole 4, be provided with fine silver silk screen 5 between the composite surface of described upper ag alloy layer 2 and lower ag alloy layer 3 and metallic matrix 1, in described through hole 4, be provided with the filamentary silver 6 connecting upper and lower fine silver silk screen 5.
Wherein, the oral area of described through hole 4 has reaming 7, and described fine silver silk screen 5 is positioned at reaming 7 place, and described upper ag alloy layer 2 and lower ag alloy layer 3 extend in reaming 7; Described upper ag alloy layer 2 and lower ag alloy layer 3 are silver tungsten, silver-nickel or silver-colored ashbury metal; Described metallic matrix 1 is AgCuZn alloy.
This use is novel is adding man-hour, first use forging press forming metal matrix 1, fine silver silk screen 5 to be placed on metallic matrix 1 and to be interconnected by filamentary silver 6, for improving the intensity of fine silver silk screen 5 and filamentary silver 6 in actual elaboration, can itself and iron wire etc. are hard between metal bind after be installed on metallic matrix 1, then use alloy for dental amalgam first pressing mode ag alloy layer in compound on metallic matrix 1 in a mold, be finally pressed into contact finished product again by sintering again.
Low resistance split compound silver alloy contact of the present utility model have employed common silver alloy and the mutual compound of fine silver net, while effectively reducing resistance raising conductance, also reduce the production cost of contact, very economical and practical, serviceability is better than traditional composite alloy contact.
Embodiment recited above is only be described preferred implementation of the present utility model, not limits design of the present utility model and scope.Under the prerequisite not departing from the utility model design concept; the various modification that this area ordinary person makes the technical solution of the utility model and improvement; protection range of the present utility model all should be dropped into; the technology contents of the utility model request protection, all records in detail in the claims.

Claims (4)

1. a low resistance split compound silver alloy contact, it is characterized in that: comprise metallic matrix and the upper ag alloy layer that is compounded on metallic matrix top and bottom and lower ag alloy layer, the inside of described metallic matrix has a through hole, be provided with fine silver silk screen between the composite surface of described upper ag alloy layer and lower ag alloy layer and metallic matrix, in described through hole, be provided with the filamentary silver connecting upper and lower fine silver silk screen.
2. low resistance split compound silver alloy contact according to claim 1, it is characterized in that: the oral area of described through hole has reaming, described fine silver silk screen is positioned at reaming place, and described upper ag alloy layer and lower ag alloy layer extend in reaming.
3. low resistance split compound silver alloy contact according to claim 1, is characterized in that: described upper ag alloy layer and lower ag alloy layer are silver tungsten, silver-nickel or silver-colored ashbury metal.
4. low resistance split compound silver alloy contact according to claim 1, is characterized in that: described metallic matrix is AgCuZn alloy.
CN201520921046.7U 2015-11-19 2015-11-19 Compound silver alloy contact of low resistance amalgamation Expired - Fee Related CN205140773U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201520921046.7U CN205140773U (en) 2015-11-19 2015-11-19 Compound silver alloy contact of low resistance amalgamation

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201520921046.7U CN205140773U (en) 2015-11-19 2015-11-19 Compound silver alloy contact of low resistance amalgamation

Publications (1)

Publication Number Publication Date
CN205140773U true CN205140773U (en) 2016-04-06

Family

ID=55626540

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201520921046.7U Expired - Fee Related CN205140773U (en) 2015-11-19 2015-11-19 Compound silver alloy contact of low resistance amalgamation

Country Status (1)

Country Link
CN (1) CN205140773U (en)

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Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20160406

Termination date: 20181119