CN205104487U - Many level module unit based on crimping formula IGBT - Google Patents

Abstract

The utility model discloses a multi-level module unit based on a crimping type IGBT, comprising an energy storage capacitor, a control box component, a pressing mechanism component, a vacuum contactor, an upper support plate, a lower support plate, a positioning block, and a base , Bottom plate; the energy storage capacitor is installed on one end of the bottom plate, the base and the vacuum contactor are fixed together through the lower support plate and installed on the other end of the bottom plate through the positioning block, the pressing mechanism assembly is installed on the base, and the upper front side of the pressing mechanism is connected The upper support plate; the side of the control box assembly close to the pressing mechanism is respectively connected and fixed with the upper support plate and the lower support plate, and the wire groove is installed on the inner side of the base. In the structure of the utility model, the primary components and secondary control boards are arranged in partitions to meet the requirements of high voltage resistance, high current resistance, strong electromagnetic interference resistance, good heat dissipation performance of electric equipment, and operability and reliability of electrical wiring. maintenance features.

Description

Multi-level modular unit based on press-fit IGBT

technical field

The utility model relates to a multi-level module unit based on a crimping type IGBT, which belongs to the technical field of accessories for electric equipment.

Background technique

The current flexible DC transmission and reactive power compensation systems mostly adopt modular design. The multi-level module unit is the core unit in the flexible DC transmission and reactive power compensation system, and its performance is related to the performance of the entire system.

The current multi-level module units mostly use devices with general withstand voltage and flow capacity, resulting in insufficient withstand voltage and flow capacity of a single sub-module, limited capacity of a single module, and a large number of sub-modules required in the project. Reliability is reduced, and it is difficult to realize a large-capacity system. At the same time, the layout of many multi-level module units is relatively chaotic. The layout of primary components and secondary boards is mixed. The actions of primary components often cause interference and influence on secondary boards, which seriously reduces the reliability of sub-module operation. The maintenance of the board is also relatively complicated. If it is necessary to replace or even pull out the water connector of the sub-module and pull out the sub-module, the workload on site will greatly increase, and the risk of water leakage from the branch water pipe will also increase.

Utility model content

Purpose: In order to overcome the deficiencies in the prior art, the utility model provides a multi-level module unit based on crimping IGBT. At the same time, the module structure is compact, the primary components and secondary boards are arranged in partitions, the boards can be easily maintained, the stability, reliability and maintainability of the system are improved, and the operation and maintenance risks are reduced.

Technical solution: In order to solve the above-mentioned technical problems, the technical solution adopted in the utility model is:

A multi-level module unit based on a crimping IGBT, characterized in that it includes an energy storage capacitor, a control box assembly, a pressing mechanism assembly, a vacuum contactor, an upper support plate, a lower support plate, a positioning block, a base, Bottom plate; the energy storage capacitor is installed on one end of the bottom plate, the base and the vacuum contactor are fixed together through the lower support plate and installed on the other end of the bottom plate through the positioning block, the pressing mechanism assembly is installed on the base, and the front side of the upper part of the pressing mechanism is connected to the The support plate; the side of the control box assembly close to the pressing mechanism is respectively connected and fixed with the upper support plate and the lower support plate.

The multi-level module unit based on the pressure-connection IGBT is characterized in that: the pressing mechanism assembly includes an upper pressing plate, a disc spring, a spacer, an IGBT, a radiator, a busbar, Resistor, lower press-fit plate; the corresponding positions of the four corners of the upper press-fit plate and the lower press-fit plate are connected by screws, and the disc spring, spacer, IGBT, radiator, busbar, and resistor are crimped and fixed together;

The multi-level module unit based on crimping type IGBT is characterized in that: the control box assembly includes a shell, a control board assembly, and a power board assembly; the control board assembly and the power board assembly are respectively fixed in the housing.

The multi-level module unit based on crimping IGBT is characterized in that: the pressing mechanism components are arranged horizontally, and the crimping contact surfaces of the C pole and E pole of the IGBT and the heat dissipation surface of the radiator are all perpendicular to Horizontal plane and parallel to the depth direction of the multi-level modular unit.

The multi-level module unit based on pressure-connection IGBT is characterized in that: the number of IGBTs in the pressing mechanism assembly is 2 or 4.

The multi-level module unit based on the pressure-connection IGBT is characterized in that the pressing mechanism component also includes a thyristor.

The multi-level module unit based on crimping type IGBT is characterized in that: a wire groove is installed on the inner side of the base, extending to the inside of the control box assembly for secondary wiring.

Beneficial effects: The utility model provides a multi-level module unit based on a crimping IGBT, which adopts a crimping power device and a modular design. The primary components and secondary components are arranged in partitions, and the modules take into account mechanical strength and overvoltage. With insulation coordination, reasonable layout and heat dissipation performance of key components, operability and reliability of electrical wiring between components, etc., all components and components are integrated together, which has the advantages of quick installation, convenient maintenance, and small footprint , Compact structure and so on. After adopting the above-mentioned scheme, a large-capacity flexible DC transmission system or reactive power compensation system can be realized, which solves the problem of interference and influence of the action of the primary components on the secondary board caused by the unreasonable layout of the multi-level module unit and the board card On-site commissioning and maintenance are inconvenient.

Description of drawings

Fig. 1 is the structural representation of the utility model;

Fig. 2 is a schematic structural view of the pressing mechanism assembly in the utility model;

Fig. 3 is a schematic diagram of the internal structure of the control box assembly in the utility model;

In the figure: energy storage capacitor 101, pressing mechanism assembly 102, upper support plate 103, control box assembly 104, lower support plate 105, vacuum contactor 106, wire groove 107, positioning block 108, base 109, bottom plate 110; Mounting plate 201, disc spring 202, cushion block 203, IGBT204, radiator 205, busbar 206, resistor 207, lower press mounting plate 208; shell 301, control board assembly 302, power supply board assembly 303.

detailed description

Below in conjunction with specific embodiment the utility model is described further.

As shown in Figure 1, the utility model provides a multi-level module unit based on a crimping IGBT, including an energy storage capacitor 101, a control box assembly 104, a pressing mechanism assembly 102, a vacuum contactor 106, and an upper support plate 103, lower support plate 105, positioning block 108, wire groove 107, base 109, base plate 110; energy storage capacitor 101 is installed on one end of base plate 110, and base 109 and vacuum contactor 106 are fixed together by lower support plate 105 and passed The positioning block 108 is installed on the other end of the base plate 110, the pressing mechanism assembly 102 is installed above the base 109, the upper support plate 103 is installed in the front of the pressing mechanism 102, the control box assembly 104 is installed in the upper support plate 103, the lower support plate 105 fronts, and the wires The slot 107 is installed inside the base 109 .

As shown in Figure 2, the pressing mechanism assembly 102 includes an upper pressing plate 201, a disc spring 202, a pad 203, an IGBT 204, a radiator 205, a bus bar 206, a resistor 207, a lower pressing plate, and Plate 208; the corresponding positions of the four corners of the upper press-fit plate 201 and the lower press-fit plate 208 are connected by screws, and the disc spring 202, pad 203, IGBT204, radiator 205, busbar 206, and resistor 207 are crimped and fixed together;

The pressing mechanism assembly 102 is arranged laterally, and the crimping contact surfaces of the C pole and the E pole of the IGBT204 and the heat dissipation surface of the radiator 205 are both perpendicular to the horizontal plane and parallel to the depth direction of the multilevel module unit. In this way, both the AC busbar and the DC busbar are perpendicular to the horizontal plane, which facilitates the connection with the energy storage capacitor and adjacent modules.

Wherein, the number of IGBTs in the pressing mechanism assembly is 2 or 4, and the shape of the IGBT can be square or circular, and a thyristor can also be crimped in the pressing mechanism assembly.

As shown in FIG. 3 , the control box assembly 104 includes a housing 301 , a control board assembly 302 , and a power board assembly 303 ; the control board assembly 302 and the power board assembly 303 are respectively fixed in the housing 301 . It is installed in front of the whole module and can be installed or disassembled on the module as a whole. The control board and the power board in the control box assembly can be installed and removed separately.

The partition arrangement of primary components and secondary components is realized: the above-mentioned control box components are located in front of the entire module and are isolated from primary components. The partition arrangement of the primary components and secondary components effectively shields the interference to the secondary side when the primary side power devices operate, and also facilitates the overall installation and disassembly of the secondary components and the separate disassembly and maintenance of each board.

The utility model realizes the overall installation and disassembly of the secondary components and the separate disassembly and maintenance of each board: the secondary component, that is, the control box component, is installed in front of the whole module, including the control board and the power supply board; the control box Components can be installed or removed from the module as a whole. The integrated operation of secondary components optimizes the process of module production and installation, reduces the risk of damage to boards due to human contact during assembly, and facilitates maintenance and replacement. At the same time, the control board and the power board in the control box assembly can be disassembled and maintained separately.

The assembly process of this embodiment is as follows:

Firstly, place the lower press-fit plate 208 in the pre-designed tooling, place the resistor 207, busbar 206, heat sink 205, IGBT204, spacer 203, disc spring 202, and upper press-fit plate 201 in the designed order. put away;

Next, tighten the four screws through the upper press-fit plate 201 to the lower press-fit plate 208 respectively, and apply the pressing force required by the device;

Next, the base 109 is fixed on the upper press-fit plate 201 and the lower press-fit plate 208, and the wire groove 107 is fixed on the inner side of the base 109;

Next, the vacuum contactor 106 is installed on the lower support plate 105;

Next, the lower support plate 105 equipped with the vacuum contactor 106 is installed on the base 109, and the upper support plate 103 is installed on the upper front side of the pressing mechanism assembly;

Next, install the general-purpose M16 lugs on the top of the upper press-fit plate 201 and the top of the lower press-fit plate 208 for hoisting, hoist the installed structure to the right, and fix it with the bottom plate 110 on which the positioning block 108 has been installed;

Next, the energy storage capacitor 101 is hoisted on the bottom plate 110;

Next, a connecting copper bar is installed between the AC busbar 206 and the vacuum contactor 106;

Then, the control box assembly 104 is assembled, and the control box assembly 104 is composed of a shell 301, a control board assembly 302, and a power board assembly 303; the control board assembly 302 and the power board assembly 303 are assembled, and the control board assembly 302 and the power board assembly are assembled. The power board assembly 303 is mounted on the housing 301 .

Finally, the assembled control box assembly 104 is connected and installed on the upper support plate 103 and the lower support plate 105 in front of the module, and all wiring is completed.

The above is only a preferred embodiment of the utility model, it should be pointed out that for those of ordinary skill in the art, without departing from the principle of the utility model, some improvements and modifications can also be made. Retouching should also be regarded as the scope of protection of the present utility model.

Claims (7)

1. A multi-level module unit based on crimping type IGBT, characterized in that it includes energy storage capacitors, control box components, pressing mechanism components, vacuum contactors, upper support plates, lower support plates, positioning blocks, Base, base plate; the energy storage capacitor is installed at one end of the base plate, the base and the vacuum contactor are fixed together through the lower support plate and installed on the other end of the base plate through the positioning block, the pressing mechanism assembly is installed on the base, and the upper front side of the pressing mechanism Connect the upper support plate; the side of the control box assembly close to the pressing mechanism is respectively connected and fixed with the upper support plate and the lower support plate. 2. The multi-level module unit based on press-fit IGBT according to claim 1, characterized in that: the pressing mechanism assembly includes an upper pressing plate, a disc spring, a spacer, an IGBT, Radiator, busbar, resistor, lower press-fit plate; the corresponding positions of the four corners of the upper press-fit plate and the lower press-fit plate are connected by screws, and the disc spring, spacer, IGBT, radiator, busbar, and resistor are crimped and fixed together . 3. The multi-level module unit based on crimping IGBT according to claim 1, characterized in that: the control box assembly includes a housing, a control board assembly, and a power supply board assembly; the control board assembly and the power board components are respectively fixed in the casing. 4. The multi-level module unit based on crimping IGBT according to claim 2, characterized in that: said pressing mechanism assembly is arranged horizontally, the crimping contact surfaces of C pole and E pole of IGBT and radiator The heat dissipation surfaces are all perpendicular to the horizontal plane and parallel to the depth direction of the multi-level module unit. 5. The multi-level module unit based on press-fit IGBT according to claim 2, characterized in that: the number of IGBTs in the pressing mechanism assembly is 2 or 4. 6. The multi-level module unit based on press-contact IGBT according to claim 2, characterized in that: the pressing mechanism assembly further includes a thyristor. 7. The multi-level module unit based on crimping IGBT according to claim 1 or 2, characterized in that: a wire groove is installed inside the base, extending to the inside of the control box assembly for secondary wiring .