CN205065320U - High -power light source module - Google Patents

High -power light source module Download PDF

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Publication number
CN205065320U
CN205065320U CN201520886370.XU CN201520886370U CN205065320U CN 205065320 U CN205065320 U CN 205065320U CN 201520886370 U CN201520886370 U CN 201520886370U CN 205065320 U CN205065320 U CN 205065320U
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China
Prior art keywords
heat
conducting plate
circuit board
plate
light source
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CN201520886370.XU
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Chinese (zh)
Inventor
吴洪戈
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HUIZHOU ZHENGWEI PHOTOELECTRIC TECHNOLOGY Co Ltd
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HUIZHOU ZHENGWEI PHOTOELECTRIC TECHNOLOGY Co Ltd
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Priority to CN201520886370.XU priority Critical patent/CN205065320U/en
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Abstract

The utility model relates to a high -power light source module, it includes that one has the radiator of heat -conducting plate and sets up the polylith circuit board on the heat -conducting plate side by side. Be formed with forefront hole and second -line hole that the power supply source line passed on the heat -conducting plate, the one end of power cord and circuit board back that links to each other wherein, its second end passes from the forefront hole, arrive the heat -conducting plate with the one side that the circuit board was carried on the back mutually, pass the second -line hole again and get back to between circuit board and the heat -conducting plate to link to each other with another circuit board, the heat -conducting plate with polylith circuit board mutually in the back of the body one side, be provided with and prevent that water or steam from passing through the forefront hole and reacing the watertight fittings on one side of the circuit board with the second -line hole. The utility model discloses a high -power light source module only one end set up the power lead -out wire can, convenient equipment is difficult for makeing mistakes. Being provided with watertight fittings on the exerted power cord, can preventing that water or steam from passing through the line hole arrival circuit board one side on the heat -conducting plate, dampproof and waterproof is effectual.

Description

High power light source module
Technical field
The utility model relates to light source module, particularly a kind of high power light source module.
Background technology
Existing high-power LED light source module generally comprises multiple being arranged side by side or the LED-baseplate of end to end setting and a radiator, each LED-baseplate draws two electric wires, draw from the two ends of radiator respectively, electric wire both positive and negative polarity is assembled to need operating personnel to identify respectively during assembling, and workload greatly and easily make mistakes.
Summary of the invention
The purpose of this utility model is to provide a kind of novel high power light source module, and it only has one end to arrange power outlet.
A kind of high power light source module, comprises a radiator with heat-conducting plate and the polylith circuit board be disposed side by side on described heat-conducting plate; Wherein, every block circuit board is provided with light source.Described heat-conducting plate is formed with the first string holes and the second string holes that power supply source line passes; The one end connecting the power line of adjacent circuit board is with after wherein one piece of circuit board is connected, its second end passes from described first string holes, arrive the one side opposing with circuit board of heat-conducting plate, then get back to circuit board and heat-conducting plate through the second string holes, and be connected with another block circuit board; At described heat-conducting plate with in the opposing one side of described polylith circuit board, be provided with anti-sealing or steam arrive circuit board side water-tight device by the first string holes and the second string holes.
As a kind of embodiment, described water-tight device is cover the waterproof gel on the first string holes, the second string holes and power line.
As another kind of embodiment, described water-tight device comprises one and is fixed on cover plate on heat-conducting plate, be formed with the electric wire host cavity for accommodating power line between described cover plate with described heat-conducting plate and be formed in the annular accepting groove around described electric wire host cavity, do not communicated with electric wire host cavity, in this annular accepting groove, holding a waterproof apron.
Preferably, described cover plate is in the one side of described heat-conducting plate and be positioned at the screw position outside annular accepting groove being formed with and not running through described cover plate, position corresponding with described screw on described heat-conducting plate is formed with fixing hole, screw is screwed into the screw of described cover plate through described fixing hole, heat-conducting plate and cover plate is coupled together.
Preferably, described cover plate is formed with the counterbore for accommodating power line in the one side of described heat-conducting plate, forms described electric wire host cavity, form described annular accepting groove around described counterbore between described counterbore and heat-conducting plate.
Preferably, described heat-conducting plate is formed with the wire casing for accommodating power line in the one side of circuit board.
Preferably, described high power light source module also comprises the polylith light guide plate be buckled on described polylith circuit board, and many water-proof silica-gels be arranged between described polylith light guide plate and heat-conducting plate, to guarantee that water and steam cannot enter light source module inside between described polylith light guide plate and heat-conducting plate.
Preferably, described light guide plate integrally extends backplate towards described heat-conducting plate or is formed with groove, described heat-conducting plate forms the groove corresponding with described backplate or groove or wall, thus between light guide plate and heat-conducting plate, is formed with the host cavity for accommodating water-proof silica-gel.The correspondence position of described light guide plate is formed with multiple fixing hole, described circuit board dual-side is formed with multiple arc notch corresponding with fixing hole on light guide plate.Described water-proof silica-gel shape is corresponding with circuit board quadrilateral shape, is enclosed within circuit board outside; Described light guide plate inner vertical extends at least two locating dowels; described circuit board and heat-conducting plate are respectively arranged with the locating hole corresponding with described at least two locating dowels; the locating dowel of described light guide plate through circuit board locating hole and insert on the locating hole of heat-conducting plate, and by fixed screw baffle, light guide plate and circuit board be fixed on heat-conducting plate circuit board be pressed between light guide plate and heat-conducting plate.
Preferably, described heat-conducting plate has test through hole, the space that described test through hole and light guide plate, heat-conducting plate and water-proof silica-gel surround communicates; Waterproof bolt is plugged with in described through hole.
Preferably, described heat-conducting plate is also formed with the described test through hole of connection and wire casing towards the side of circuit board, or is communicated with the test groove of through hole to the route of power line process.
The polylith circuit board of high power light source module of the present utility model is electrically connected by two power lines, therefore only has one end to arrange power outlet, ease of assembly, not easily makes mistakes.In addition, the power line connecting an adjacent circuit board only part is in outside below heat-conducting plate, and all the other all, between circuit board and heat-conducting plate, easily realize waterproof.And the power line exposed is provided with water-tight device, and anti-sealing or steam can arrive circuit board side by the string holes on heat-conducting plate, moistureproof and waterproof is effective.
Accompanying drawing explanation
Fig. 1 is the decomposing schematic representation of the high power light source module of an embodiment.
Fig. 2 is the enlarged drawing in A portion in Fig. 1.
Fig. 3 is the stereogram of an embodiment cover plate.
Fig. 4 is the enlarged drawing in B portion in Fig. 1.
Detailed description of the invention
Below in conjunction with specific embodiment and accompanying drawing, the utility model high power light source module is described in further detail.
Refer to Fig. 1; in one embodiment; the polylith circuit board 53 that high power light source module of the present utility model mainly comprises a radiator 54 and is fixed on side by side on radiator 54, every block circuit board 53 is also disposed with rectangle light guide plate 51 and a rectangle baffle 52.
Light guide plate 51 upper surface is formed with multiple lens 511, and lower surface is formed with at least two locating dowel (not shown).Baffle 52 tightly sticks on light guide plate 51, it is formed with the through hole mated with lens.This baffle 52 preferably adopts stainless steel, for the protection of lens 511, improves the impact strength of high power light source module, and improves the weatherability of lens environment out of doors.Radiator 54 comprises a heat-conducting plate be substantially rectangle 541.Circuit board 53 is fixed between light guide plate 51 and heat-conducting plate 541, is provided with the LED light source corresponding with multiple lens 511.In the present embodiment; circuit board 53 and heat-conducting plate 541 are formed and the suitable locating hole of locating dowel on light guide plate 51 respectively; and by locating dowel through the also fastening successively of corresponding locating hole; can either ensure that lens 511 on light guide plate 51 and LED light source are accurately located, by fixed screw 57, light guide plate 51, baffle 52, circuit board 53 and heat-conducting plate 541 be tightened together again.
In order to realize sealing, light guide plate 51 periphery can integrally extend backplate perpendicular to light guide plate or be formed with groove, and heat-conducting plate 541 is formed the groove corresponding with the backplate of light guide plate or groove and wall, thus light guide plate 51 is buckled in after on heat-conducting plate 541, be formed with the space for holding water-proof silica-gel 55 between the two.In addition; the correspondence position of light guide plate 51 and baffle 52 is formed with multiple fixing hole; circuit board 53 dual-side is formed with multiple arc notch 531 corresponding with fixing hole on light guide plate; the shape of water-proof silica-gel 55 and the mating shapes of circuit board 53 outside; and be enclosed within circuit board 53 outside, guarantee that fixed screw 57 is positioned at outside water-proof silica-gel 55.When baffle 52, light guide plate 51 and circuit board 53 are fixed on after on heat-conducting plate 541 by fixed screw 57; water-proof silica-gel 55 is squeezed tightly between at light guide plate 51, between circuit board 53 and heat-conducting plate 541; now water-proof silica-gel 55 can produce distortion because of pressurized; gap sealing between light guide plate 51 and heat-conducting plate 541 is got up; ensure that circuit board 53 and LED light source can not make moist, guarantee light source life.
In the present embodiment, radiator 54 mainly adopts the aluminium section with certain bending, its except comprise one tightly stick in circuit board lower surface, except the heat-conducting plate 541 that is rectangle, also comprise and be basically perpendicular to two piece of second heat transfer plate 542 that heat-conducting plate integrally extends and the 3rd heat transfer plate 543 coupled together by the end of described two piece of second heat transfer plate from the dual-side of heat-conducting plate 541 lower surface.Wherein the length of the second heat transfer plate 542 is less than heat-conducting plate 541, thus the 3rd heat transfer plate 543 covering part heat-conducting plate 541, make the two ends of heat-conducting plate 541 in the state of stretching out, the heat sink benefits of this structure in improving radiating efficiency, strengthening the intensity of radiator, and effectively prevents dust, leaf, sandstone, bird dung long-term accumulated portion or inside on a heat sink.
In addition, every block circuit board 53 is also formed with the pad 538 for connecting power line 70.For convenience of describing, the one side being provided with multiple LED light source of circuit board 53 being defined as first surface, the one side opposing with first surface is defined as second.In the present embodiment, the position near one end on the first surface of every block circuit board 53 is provided with pad 538.U-shaped breach 539 is formed near the end of pad 538.And each radiator being arranged two pieces of circuit boards 53, these two pieces of circuit boards are that end to end form is by being arranged on heat-conducting plate.
Please also refer to Fig. 2, heat-conducting plate 541 is also formed with the first string holes 5411 and the second string holes 5412 that power supply source line 70 passes near the position connected of two pieces of adjacent circuit boards 53.After the one end connecting the power line 70 of adjacent circuit board is connected with the corresponding pad 538 of wherein one piece of circuit board 53, be bent between circuit board 53 and heat-conducting plate 541 from U-shaped breach 539, its second end passes from the first string holes 5411, arrive the one side opposing with circuit board 53 of heat-conducting plate 541, get back to circuit board 53 and heat-conducting plate 541 through the second string holes 5412 again, and extend to U-shaped breach 539 place of another block circuit board, be bent on the first surface of circuit board 53, be connected with corresponding pad.
Due to the first string holes and the second string holes 5411, the existence of 5412, and power line 70 needs to extend a segment distance at the back side of heat-conducting plate 541, therefore need heat-conducting plate 541 with the opposing one side of polylith circuit board 53 on anti-sealing is set or steam arrives the water-tight device 80 of circuit board side by the first string holes 5411 and the second string holes 5412.
In the present embodiment, please also refer to Fig. 3, water-tight device 80 comprises one and is fixed on cover plate 81 on heat-conducting plate 541 and a waterproof apron 83.Cover plate 81 is formed for accommodating power supply in the one side of heat-conducting plate 541, the counterbore 811 of 70.The electric wire host cavity for accommodating power line is formed between counterbore 811 and heat-conducting plate 541.The annular accepting groove 813 do not communicated with electric wire host cavity is also formed around counterbore 811.Waterproof apron 83 is arranged in annular accepting groove 813.Cover plate 81 is in the one side of heat-conducting plate 541 and be positioned at least two screws 815 position outside annular accepting groove 813 being formed with and not running through cover plate 81.Corresponding, position corresponding with screw 815 on heat-conducting plate 541 is formed with at least two fixing holes 5413, screw 5414 is screwed into the screw 815 of cover plate through fixing hole 5413, heat-conducting plate 541 and cover plate 81 is coupled together.Also can waterproof washer be set between screw 5414 and heat-conducting plate 541.Thus, can effectively anti-sealing or steam by the first and second string holes, and fixing hole 5413 enters circuit board 53 side.
In other embodiments, water-tight device can be the waterproof gel covered on the first string holes, the second string holes and power line, also can realize same waterproof effect.In other embodiments, also the electric wire host cavity and annular accepting groove for accommodating power line can be arranged on the side towards cover plate of heat-conducting plate.Can being formed in the one side of cover plate of heat-conducting plate do not run through heat-conducting plate, for the screw of securing cover plate, corresponding, cover plate is formed with fixing hole, and screw is screwed into the screw of heat-conducting plate through the fixing hole of cover plate, heat-conducting plate and cover plate is coupled together.
In addition, heat-conducting plate 541 in the one side of circuit board, be also formed with wire casing (groove), wire casing is corresponding with the position that power line 70 extends between circuit board and heat-conducting plate, for accommodating power line, thus heat-conducting plate 541 surface closely can be affixed with circuit board, guarantees radiating effect.In the present embodiment, wire casing comprises the first wire casing 5415 and the second wire casing 5416.First wire casing 5415 extends from the first string holes 5411 towards the pad of wherein one piece of circuit board.Second wire casing 5416 extends from the second string holes 5412 towards the pad of another block circuit board.
Please also refer to Fig. 4, on heat-conducting plate 541 near one end also have string holes 532, the general supply line 75 of power circuit board 53 passes.In the present embodiment, pad or the power line 70 of the circuit board that general supply line 75 one end is corresponding with this place are connected, and then bend from U-shaped breach to heat-conducting plate 541 direction, make the other end pass string holes 532, be exposed to high power light source module-external, be connected with a connection-peg 78.For reaching the object of waterproof sealing, between general supply line 75 and string holes 532, be provided with silica gel plug assembly 59.When general supply line 75 needs to extend between heat-conducting plate 541 and circuit board 53, heat-conducting plate and circuit board should form corresponding wire casing.
Especially, heat-conducting plate 541 has test through hole 5518, in test through hole 5518, be plugged with waterproof bolt 5519.The space that test through hole 5518 surrounds with light guide plate 51, heat-conducting plate 541 and water-proof silica-gel 55 communicates.During test, the syringe needle of test syringe is inserted on waterproof bolt 5519, then high power light source module is put into water tank, inflating in high power light source module with test syringe.After extracting syringe needle, see whether each gap place of high power light source module has bubble to overflow, thus judge water resistance.Preferably, heat-conducting plate 541 is also formed with groove 5517 towards the one side of circuit board.The space that groove 5517 is communicated with test through hole 5518 and is formed between circuit board and heat-conducting plate, such as but not limited to wire casing 5415 or wire casing 5416 or power line 70 process or other paths of general supply line 75 process.So, the air entered from test through hole 5518 along the void diffusion of power line and circumferential component, thus can guarantee that the air injected in high power light source module enough tests use, guarantees the accuracy of testing.Because waterproof plug is squeezed state, the pin hole that rear waterproof plug extracted by syringe needle can close automatically, and light source module still can keep good waterproof moisture-proof effect.
In other embodiments, above-mentioned each wire casing also can be arranged on second of circuit board.Pad also can all be arranged on second of circuit board.In other embodiments, other light sources can be adopted to replace LED light source.
Although carry out in conjunction with above specific embodiment description of the present utility model, those skilled in the art can carry out many replacements, modifications and variations, be apparent according to above-mentioned content.Therefore, all like this substitute, improve and change be all included in the spirit and scope of attached claim.

Claims (10)

1. a high power light source module, comprises a radiator with heat-conducting plate and the polylith circuit board be disposed side by side on described heat-conducting plate; Wherein, every block circuit board is provided with light source; It is characterized in that:
Described heat-conducting plate is formed with the first string holes and the second string holes that power supply source line passes; The one end connecting the power line of adjacent circuit board is with after wherein one piece of circuit board is connected, its second end passes from described first string holes, arrive the one side opposing with circuit board of heat-conducting plate, then get back to circuit board and heat-conducting plate through the second string holes, and be connected with another block circuit board; At described heat-conducting plate with in the opposing one side of described polylith circuit board, be provided with anti-sealing or steam arrive circuit board side water-tight device by the first string holes and the second string holes.
2. high power light source module according to claim 1, is characterized in that, described water-tight device is cover the waterproof gel on the first string holes, the second string holes and power line.
3. high power light source module according to claim 1, it is characterized in that, described water-tight device comprises one and is fixed on cover plate on heat-conducting plate, be formed with the electric wire host cavity for accommodating power line between described cover plate with described heat-conducting plate and be formed in the annular accepting groove around described electric wire host cavity, do not communicated with electric wire host cavity, in this annular accepting groove, holding a waterproof apron.
4. high power light source module according to claim 3, it is characterized in that, described cover plate is in the one side of described heat-conducting plate and be positioned at the screw position outside annular accepting groove being formed with and not running through described cover plate, position corresponding with described screw on described heat-conducting plate is formed with fixing hole, screw is screwed into the screw of described cover plate through described fixing hole, heat-conducting plate and cover plate is coupled together.
5. high power light source module according to claim 4, it is characterized in that, described cover plate is formed with the counterbore for accommodating power line in the one side of described heat-conducting plate, forms described electric wire host cavity, form described annular accepting groove around described counterbore between described counterbore and heat-conducting plate.
6. the high power light source module according to claim 1 or 3, is characterized in that, described heat-conducting plate is formed with the wire casing for accommodating power line in the one side of circuit board.
7. high power light source module according to claim 6, it is characterized in that, also comprise the polylith light guide plate be buckled on described polylith circuit board, and many water-proof silica-gels be arranged between described polylith light guide plate and heat-conducting plate, to guarantee that water and steam cannot enter light source module inside between described polylith light guide plate and heat-conducting plate.
8. high power light source module according to claim 7, it is characterized in that, described light guide plate integrally extends backplate towards described heat-conducting plate or is formed with groove, described heat-conducting plate forms the groove corresponding with described backplate or groove or wall, thus between light guide plate and heat-conducting plate, is formed with the host cavity for accommodating water-proof silica-gel; The correspondence position of described light guide plate is formed with multiple fixing hole, described circuit board dual-side is formed with multiple arc notch corresponding with fixing hole on light guide plate; Described water-proof silica-gel shape is corresponding with circuit board quadrilateral shape, is enclosed within circuit board outside; Described light guide plate inner vertical extends at least two locating dowels; described circuit board and heat-conducting plate are respectively arranged with the locating hole corresponding with described at least two locating dowels; the locating dowel of described light guide plate through circuit board locating hole and insert on the locating hole of heat-conducting plate, and by fixed screw baffle, light guide plate and circuit board be fixed on heat-conducting plate circuit board be pressed between light guide plate and heat-conducting plate.
9. high power light source module according to claim 7, is characterized in that, described heat-conducting plate has test through hole, and the space that described test through hole and light guide plate, heat-conducting plate and water-proof silica-gel surround communicates; Waterproof bolt is plugged with in described through hole.
10. high power light source module according to claim 9, is characterized in that, described heat-conducting plate is also formed with the described test through hole of connection and wire casing towards the side of circuit board, or is communicated with the test groove of through hole to the route of power line process.
CN201520886370.XU 2015-11-09 2015-11-09 High -power light source module Active CN205065320U (en)

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Application Number Priority Date Filing Date Title
CN201520886370.XU CN205065320U (en) 2015-11-09 2015-11-09 High -power light source module

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Application Number Priority Date Filing Date Title
CN201520886370.XU CN205065320U (en) 2015-11-09 2015-11-09 High -power light source module

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CN205065320U true CN205065320U (en) 2016-03-02

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CN201520886370.XU Active CN205065320U (en) 2015-11-09 2015-11-09 High -power light source module

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106132183A (en) * 2016-06-28 2016-11-16 广东欧珀移动通信有限公司 Pcb board assembly and the mobile terminal with it

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106132183A (en) * 2016-06-28 2016-11-16 广东欧珀移动通信有限公司 Pcb board assembly and the mobile terminal with it
CN106132183B (en) * 2016-06-28 2018-07-10 广东欧珀移动通信有限公司 Pcb board component and with its mobile terminal

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