CN205028921U - Chip carrier installation device of chip mounting machine - Google Patents
Chip carrier installation device of chip mounting machine Download PDFInfo
- Publication number
- CN205028921U CN205028921U CN201520783875.3U CN201520783875U CN205028921U CN 205028921 U CN205028921 U CN 205028921U CN 201520783875 U CN201520783875 U CN 201520783875U CN 205028921 U CN205028921 U CN 205028921U
- Authority
- CN
- China
- Prior art keywords
- mounting panel
- chip pad
- lift cylinder
- chip carrier
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn - After Issue
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Abstract
The utility model discloses a chip carrier installation device of chip mounting machine, this chip carrier installation device of chip mounting machine include lift cylinder, lift cylinder support, connecting plate, lifter plate, push pedal, locating pin, chip carrier installation mould, chip carrier mounting panel, blend stop and mounting panel support, lift cylinder support side -mounting has the lift cylinder, the side of connecting plate is being connected to the piston rod flange board of lift cylinder, the lifter plate is being connected to the connecting plate trailing flank, the push pedal is being connected at the border on the lifter plate, plane both ends cartridge has the locating pin in the push pedal, the locating pin top is equipped with the chip carrier mounting panel, be equipped with the rectangle through -hole on the chip carrier mounting panel, the locating pin passes through rectangle through -hole pinhole on the plane under facing to chip carrier installation mould, chip carrier installation mould both sides are equipped with the blend stop, the plane right -hand member is equipped with the mounting panel support under the chip carrier mounting panel. In this way, the utility model discloses compact structure, motion stationary.
Description
Technical field
The utility model relates to field of machinery automation, particularly relates to the chip pad erecting device of a kind of chipset installation.
Background technology
Along with the development of semiconductor technology, the chip that more and more can realize difference in functionality is used to the such as electronic goods such as mobile phone and computer, make the life of people more and more convenient, except the people's livelihood, outside Military Electronics industry, energy aspect such as solar energy industry and Lighting Industry all have sizable association with semiconductor, the chip that semiconductor technology is produced can be used in above-mentioned field widely, the qualification rate of chip directly determines the quality of end product, chip can be subject to different External Force Actings in an assembling process, easily make the die stress place of concentrating produce slight crack and even cause chip rupture, in view of this, be necessary that the chip pad erecting device to existing chipset is installed is improved.
Utility model content
The technical problem that the utility model mainly solves is to provide the chip pad erecting device of a kind of chipset installation, compact conformation, stable movement.
For solving the problems of the technologies described above, the technical scheme that the utility model adopts is: provide the chip pad erecting device that a kind of chipset is installed, the chip pad erecting device of this chipset installation comprises lift cylinder, lift cylinder support, connecting plate, lifter plate, push pedal, alignment pin, chip pad installs mould, chip pad mounting panel, blend stop and mounting panel support, described lift cylinder side face is provided with lift cylinder, the piston rod flanged plate of lift cylinder is connected to the side of connecting plate, connecting plate trailing flank is connected to lifter plate, lifter plate upper edge is connected to push pedal, in push pedal, plane two ends are fitted with alignment pin, chip pad mounting panel is provided with above alignment pin, chip pad mounting panel is provided with rectangular through-hole, alignment pin faces toward the pin-and-hole on chip pad installation mould lower plane by rectangular through-hole, chip pad is installed on mould and is provided with chip pad, chip pad is installed mould both sides and is provided with blend stop, blend stop is fixed on plane on chip pad mounting panel, chip pad mounting panel lower plane right-hand member is provided with mounting panel support, chip pad mounting panel is provided with the junction of mounting panel support and is connected gusset.
The beneficial effects of the utility model are: the chip pad erecting device of a kind of chipset installation of the utility model, compact conformation, stable movement.
Accompanying drawing explanation
Fig. 1 is the structural representation of the chip pad erecting device of the utility model chipset installation;
Fig. 2 is the part-structure schematic diagram of the chip pad erecting device of the utility model chipset installation.
Embodiment
Below in conjunction with accompanying drawing, the utility model preferred embodiment is described in detail, to make the advantage of utility model and feature can be easier to be readily appreciated by one skilled in the art, thus more explicit defining is made to protection range of the present utility model.
Refer to Fig. 1 and Fig. 2, the utility model embodiment comprises:
A kind of chip pad erecting device of chipset installation, the chip pad erecting device of this chipset installation comprises lift cylinder 2121, lift cylinder support 2122, connecting plate 2123, lifter plate 2124, push pedal 2125, alignment pin 2126, chip pad installs mould 2127, chip pad mounting panel 2128, blend stop 2129 and mounting panel support 21210, described lift cylinder support 2122 side is provided with lift cylinder 2121, the piston rod flanged plate of lift cylinder 2121 is connected to the side of connecting plate 2123, connecting plate 2123 trailing flank is connected to lifter plate 2124, lifter plate 2124 upper edge is connected to push pedal 2125, in push pedal 2125, plane two ends are fitted with alignment pin 2126, chip pad mounting panel 2128 is provided with above alignment pin 2126, chip pad mounting panel 2128 is provided with rectangular through-hole, alignment pin 2126 faces toward the pin-and-hole on chip pad installation mould 2127 lower plane by rectangular through-hole, chip pad is installed on mould 2127 and is provided with chip pad, chip pad is installed mould 2127 both sides and is provided with blend stop 2129, blend stop 2129 is fixed on plane on chip pad mounting panel 2128, chip pad mounting panel 2128 lower plane right-hand member is provided with mounting panel support 21210, chip pad mounting panel 2128 is provided with the junction of mounting panel support 21210 and is connected gusset.
The chip pad erecting device of the utility model chipset installation, compact conformation, stable movement.
The foregoing is only embodiment of the present utility model; not thereby the scope of the claims of the present utility model is limited; every utilize the utility model specification and accompanying drawing content to do equivalent structure or equivalent flow process conversion; or be directly or indirectly used in other relevant technical fields, be all in like manner included in scope of patent protection of the present utility model.
Claims (1)
1. the chip pad erecting device of a chipset installation, it is characterized in that: the chip pad erecting device of this chipset installation comprises lift cylinder, lift cylinder support, connecting plate, lifter plate, push pedal, alignment pin, chip pad installs mould, chip pad mounting panel, blend stop and mounting panel support, described lift cylinder side face is provided with lift cylinder, the piston rod flanged plate of lift cylinder is connected to the side of connecting plate, connecting plate trailing flank is connected to lifter plate, lifter plate upper edge is connected to push pedal, in push pedal, plane two ends are fitted with alignment pin, chip pad mounting panel is provided with above alignment pin, chip pad mounting panel is provided with rectangular through-hole, alignment pin faces toward the pin-and-hole on chip pad installation mould lower plane by rectangular through-hole, chip pad is installed on mould and is provided with chip pad, chip pad is installed mould both sides and is provided with blend stop, blend stop is fixed on plane on chip pad mounting panel, chip pad mounting panel lower plane right-hand member is provided with mounting panel support, chip pad mounting panel is provided with the junction of mounting panel support and is connected gusset.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520783875.3U CN205028921U (en) | 2015-10-12 | 2015-10-12 | Chip carrier installation device of chip mounting machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520783875.3U CN205028921U (en) | 2015-10-12 | 2015-10-12 | Chip carrier installation device of chip mounting machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205028921U true CN205028921U (en) | 2016-02-10 |
Family
ID=55261433
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520783875.3U Withdrawn - After Issue CN205028921U (en) | 2015-10-12 | 2015-10-12 | Chip carrier installation device of chip mounting machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205028921U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105336630A (en) * | 2015-10-12 | 2016-02-17 | 苏州达恩克精密机械有限公司 | Chip base installation device of chip assembly machine |
-
2015
- 2015-10-12 CN CN201520783875.3U patent/CN205028921U/en not_active Withdrawn - After Issue
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105336630A (en) * | 2015-10-12 | 2016-02-17 | 苏州达恩克精密机械有限公司 | Chip base installation device of chip assembly machine |
| CN105336630B (en) * | 2015-10-12 | 2018-03-13 | 高满珍 | The chip pad erecting device of chip kludge |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20160210 Effective date of abandoning: 20180313 |