CN205023493U - Burn record seat IC chip suction means - Google Patents
Burn record seat IC chip suction means Download PDFInfo
- Publication number
- CN205023493U CN205023493U CN201520749874.7U CN201520749874U CN205023493U CN 205023493 U CN205023493 U CN 205023493U CN 201520749874 U CN201520749874 U CN 201520749874U CN 205023493 U CN205023493 U CN 205023493U
- Authority
- CN
- China
- Prior art keywords
- chip
- seat
- horizontal
- mobile base
- grip block
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model discloses a burn record seat IC chip suction means, fever record seat including the IC chip that is used for keeping flat, it is equipped with the fixture who is used for the centre gripping tie to put the IC chip to burn the record seat, fixture is including the grip block that is located the IC chip left and right sides, grip block top is equipped with and is used for pressing the tie that the grip block loosens the IC chip and puts the clamp plate, the clamp plate center is equipped with the hole of dodging of dodging the IC chip, the flat clamp plate top of putting is equipped with the suction nozzle that is used for adsorbing the IC chip, the suction nozzle is fixed in and removes on the seat, it is furnished with the seat of removal elevating gear and removes seat translation device to remove the seat, the left and right sides connection of clamp plate bottom is put in the tie has the perpendicular actuating lever of putting respectively, the actuating lever bottom is connected with the lift cylinder of its lift of drive. The utility model discloses burn record seat IC chip suction means, its work load that can reduce the operator reduces personnel's cost, improves the productivity.
Description
Technical field
The utility model relates to socket burnt-in seat IC chip absorption device.
Background technology
Manually during burning/recording chip, need IC chip to insert in socket burnt-in seat, after burning completes, taken out in socket burnt-in seat by IC chip again, production capacity is low.
Utility model content
The purpose of this utility model is to provide a kind of socket burnt-in seat IC chip absorption device, and it can reduce the work capacity of worker, reduces personnel cost, improves production capacity.
For achieving the above object, the technical solution of the utility model is a kind of socket burnt-in seat IC chip absorption device of design, and comprise the socket burnt-in seat for depositing horizontal IC chip, described socket burnt-in seat is provided with the clamping device for clamping horizontal IC chip;
Described clamping device comprises the grip block being positioned at the horizontal IC chip left and right sides;
Be provided with for pressing grip block with the horizontal pressing plate making clamping device unclamp IC chip above described grip block;
Described pressing plate center be provided with dodge horizontal IC chip dodge hole;
The suction nozzle for adsorbing horizontal IC chip is provided with above described horizontal pressing plate;
Described suction nozzle is fixed on Mobile base;
Described Mobile base is furnished with its Mobile base jacking system moved up and down of driving;
Described Mobile base is also furnished with the Mobile base translating device driving its sway;
Bottom described horizontal pressing plate, the left and right sides connects to have respectively and perpendicular puts drive spindle;
The lift cylinder driving its lifting is connected with bottom described drive spindle.
Preferably, described Mobile base jacking system and Mobile base translating device all comprise servomotor.
Preferably, described Mobile base translating device also comprises optical centering module.
Advantage of the present utility model and beneficial effect are: provide a kind of socket burnt-in seat IC chip absorption device, it can reduce the work capacity of worker, reduce personnel cost, improve production capacity.
The working process of the utility model socket burnt-in seat IC chip absorption device is as follows: lift cylinder drives the drop-down pressing plate of drive spindle, platen presses grip block, chip is put into socket burnt-in seat by suction nozzle, and lift cylinder drives drive spindle to lift pressing plate, clamp loose grip block, horizontal IC chip clamps by grip block, after burning completes, cylinder drives the drop-down pressing plate of drive spindle again, platen presses grip block, grip block unclamps horizontal IC chip, and suction nozzle is by chip sucking-off from socket burnt-in seat.
Accompanying drawing explanation
Fig. 1 is schematic diagram of the present utility model.
Detailed description of the invention
Below in conjunction with drawings and Examples, detailed description of the invention of the present utility model is further described.Following examples only for clearly the technical solution of the utility model being described, and can not limit protection domain of the present utility model with this.
The technical scheme that the utility model is specifically implemented is:
As shown in Figure 1, a kind of socket burnt-in seat IC chip absorption device, comprise the socket burnt-in seat 1 for depositing horizontal IC chip, described socket burnt-in seat 1 is provided with the clamping device for clamping horizontal IC chip;
Described clamping device comprises the grip block 2 being positioned at the horizontal IC chip left and right sides;
Be provided with for pressing grip block 2 with the horizontal pressing plate 3 making clamping device unclamp IC chip above described grip block 2;
Described pressing plate 3 center be provided with dodge horizontal IC chip dodge hole;
The suction nozzle 6 for adsorbing horizontal IC chip is provided with above described horizontal pressing plate 3;
Described suction nozzle 6 is fixed on Mobile base 7;
Described Mobile base 7 is furnished with its Mobile base jacking system moved up and down of driving;
Described Mobile base 7 is also furnished with the Mobile base translating device driving its sway;
Bottom described horizontal pressing plate 3, the left and right sides connects to have respectively and perpendicular puts drive spindle 4;
The lift cylinder 5 driving its lifting is connected with bottom described drive spindle 4.
Described Mobile base jacking system and Mobile base translating device all comprise servomotor.
Described Mobile base translating device also comprises optical centering module.
The working process of the utility model socket burnt-in seat 1IC chip absorption device is as follows: lift cylinder 5 drives the drop-down pressing plate 3 of drive spindle 4, pressing plate 3 presses grip block 2, chip is put into socket burnt-in seat 1 by suction nozzle 6, and lift cylinder 5 drives drive spindle 4 to lift pressing plate 3, and pressing plate 3 unclamps grip block 2, horizontal IC chip clamps by grip block 2, after burning completes, cylinder drives the drop-down pressing plate 3 of drive spindle 4 again, and pressing plate 3 presses grip block 2, grip block 2 unclamps horizontal IC chip, and suction nozzle 6 is by chip sucking-off from socket burnt-in seat 1.
The above is only preferred implementation of the present utility model; should be understood that; for those skilled in the art; under the prerequisite not departing from the utility model know-why; can also make some improvements and modifications, these improvements and modifications also should be considered as protection domain of the present utility model.
Claims (3)
1. socket burnt-in seat IC chip absorption device, is characterized in that, comprises the socket burnt-in seat for depositing horizontal IC chip, and described socket burnt-in seat is provided with the clamping device for clamping horizontal IC chip;
Described clamping device comprises the grip block being positioned at the horizontal IC chip left and right sides;
Be provided with for pressing grip block with the horizontal pressing plate making clamping device unclamp IC chip above described grip block;
Described pressing plate center be provided with dodge horizontal IC chip dodge hole;
The suction nozzle for adsorbing horizontal IC chip is provided with above described horizontal pressing plate;
Described suction nozzle is fixed on Mobile base;
Described Mobile base is furnished with its Mobile base jacking system moved up and down of driving;
Described Mobile base is also furnished with the Mobile base translating device driving its sway;
Bottom described horizontal pressing plate, the left and right sides connects to have respectively and perpendicular puts drive spindle;
The lift cylinder driving its lifting is connected with bottom described drive spindle.
2. socket burnt-in seat IC chip absorption device according to claim 1, is characterized in that, described Mobile base jacking system and Mobile base translating device all comprise servomotor.
3. socket burnt-in seat IC chip absorption device according to claim 2, is characterized in that, described Mobile base translating device also comprises optical centering module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520749874.7U CN205023493U (en) | 2015-09-25 | 2015-09-25 | Burn record seat IC chip suction means |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520749874.7U CN205023493U (en) | 2015-09-25 | 2015-09-25 | Burn record seat IC chip suction means |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205023493U true CN205023493U (en) | 2016-02-10 |
Family
ID=55256045
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520749874.7U Expired - Fee Related CN205023493U (en) | 2015-09-25 | 2015-09-25 | Burn record seat IC chip suction means |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205023493U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108766921A (en) * | 2018-06-14 | 2018-11-06 | 广州明森科技股份有限公司 | A kind of pinpoint burning chip localization method and burning device |
-
2015
- 2015-09-25 CN CN201520749874.7U patent/CN205023493U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108766921A (en) * | 2018-06-14 | 2018-11-06 | 广州明森科技股份有限公司 | A kind of pinpoint burning chip localization method and burning device |
| CN108766921B (en) * | 2018-06-14 | 2023-10-31 | 广州明森科技股份有限公司 | Accurate-positioning chip burning positioning method and burning device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160210 Termination date: 20170925 |