CN204927348U

CN204927348U - Novel packaging structure of LED

Info

Publication number: CN204927348U
Application number: CN201520608075.8U
Authority: CN
Inventors: 邓亦林
Original assignee: Dongguan Hongjin Electronic Co Ltd
Current assignee: Dongguan Hongjin Electronic Co Ltd
Priority date: 2015-08-13
Filing date: 2015-08-13
Publication date: 2015-12-30
Anticipated expiration: 2025-08-13

Abstract

The utility model relates to a lighting apparatus's technical field discloses a novel packaging structure of LED, including a base plate, be equipped with a plurality of mated electrode pins on the base plate, at every luminescent wafer that is equipped with on to one of them electrode pin in the electrode pin, one side that the mated electrode pin electric connection of this luminescent wafer through corresponding respectively, qieyu base plate set up the luminescent wafer covers a resin package layer, the utility model discloses need not to arrange the in addition light source of other colours provides convenient when using for the user.

Description

LED novel package structure

Technical field

The utility model relates to the technical field of lighting apparatus, espespecially a kind of LED novel package structure.

Background technology

LED(light-emitting diode) encapsulate the encapsulation referring to luminescence chip, comparing integrated antenna package has relatively big difference.The encapsulation of LED not only requirement can protect wick, but also can printing opacity, so the encapsulation of LED has special requirement to encapsulating material.

Existing LED encapsulation structure, the general luminescent wafer only including RGB tri-kinds of constant color, this kind of encapsulating structure glow color is fixed, in use, user often will arrange in pairs or groups the light source of other colors as required in addition, with the needs that satisfied reality uses, this is the unnecessary trouble of user's increase to a certain extent.

Summary of the invention

The purpose of this utility model is overcome weak point of the prior art and provide a kind of LED novel package structure, this encapsulating structure without the need to the light source of other colors of arranging in pairs or groups in addition, for providing conveniently when user uses.

For achieving the above object, the utility model adopts following technical scheme:

A kind of LED novel package structure, comprise a substrate, described substrate is provided with some paired electrode pins, a wherein electrode pin in often pair of electrode pin is provided with luminescent wafer, respectively this luminescent wafer is electrically connected by corresponding paired electrode pin, and covers a resin-encapsulated layer in the one side that substrate arranges luminescent wafer.

Described substrate is a platy structure be made up of high heat-conducting ceramic, and it is outside that the electrode pin two sides be located on this substrate is exposed to substrate respective surfaces, forms conducting surface, and respectively this conducting surface is used for being electrically connected with wire or luminescent wafer.

Described substrate includes four pairs of electrode pins, respectively the rectangular array of this electrode pin is arranged, and the size of each electrode pin is consistent.

Described each luminescent wafer is all electrically connected on the respective electrode pin in each paired electrode pin by two gold threads respectively, and respectively this luminescent wafer forms cascaded structure with corresponding paired electrode pin.

Even and the smooth whole surface of the substrate be covered in of described resin-encapsulated layer.

The beneficial effects of the utility model are: its structure is simple, by the mode that luminescent wafer parallel with one another between multi-group electrode pin, each is connected with corresponding paired electrode pin, make each luminescent wafer both can be luminous separately, also can two or more combination in any luminous, user only needs to need to select according to light color, without the need to the light source of other colors of arranging in pairs or groups in addition, for providing when user uses conveniently.

Accompanying drawing explanation

Fig. 1 is the plan structure schematic diagram of the utility model.

Fig. 2 be the utility model look up structural representation.

Fig. 3 is the circuit connecting relation schematic diagram of the utility model.

Embodiment

Below in conjunction with Figure of description, the utility model is described in further detail:

As Figure 1-3, the utility model, about a kind of LED novel package structure, comprises a substrate 1, and this substrate 1 is a platy structure be made up of high heat-conducting ceramic.

As Figure 1-3, substrate 1 is provided with some paired electrode pins 2, it is outside that electrode pin 2 two sides be located on this substrate 1 is exposed to substrate 1 respective surfaces, form conducting surface, respectively this conducting surface is used for being electrically connected with wire or luminescent wafer 3, wherein, substrate 1 includes four pairs of electrode pins 2, respectively the rectangular array of this electrode pin 2 is arranged, and the size of each electrode pin 2 is consistent.

As Figure 1-3, a wherein electrode pin 2 in often pair of electrode pin 2 is provided with luminescent wafer 3, respectively this luminescent wafer 3 is electrically connected by corresponding paired electrode pin 2, each luminescent wafer 3 is all electrically connected on the respective electrode pin 2 in each paired electrode pin 2 by two gold threads 4 respectively, respectively this luminescent wafer 3 forms cascaded structure with corresponding paired electrode pin 2, wherein, corresponding four pairs of electrode pins 2 are respectively equipped with four luminescent wafers 3, the color of these four luminescent wafers 3 is respectively red, green, blue three kinds of fixing looks and a replaceable look, luminescent wafer 3 color of this replaceable look is white, purple or other colors, do not give from limit at this.

As shown in Figure 1-2, the one side arranging luminescent wafer 3 in substrate 1 covers a resin-encapsulated layer, and the even and smooth whole surface of substrate 1 be covered in of this resin-encapsulated layer, this resin-encapsulated layer is not shown.

In use, adopt parallel way to be connected between each pair of electrode pin 2, the luminescent wafer 3 making to be series in corresponding paired electrode pin 2 can be independently luminous, can also illuminated in combination two or more any, for providing convenience when user uses.

The above is only to preferred embodiment of the present utility model; not scope of the present utility model is limited; therefore under the prerequisite not departing from the utility model design spirit; the equivalence change that the common engineers and technicians in this area do structure described in the utility model, feature and principle or decoration, all should fall in protection range that the utility model applies for a patent.

Claims

1. a LED novel package structure, comprise a substrate, it is characterized in that: described substrate is provided with some paired electrode pins, a wherein electrode pin in often pair of electrode pin is provided with luminescent wafer, respectively this luminescent wafer is electrically connected by corresponding paired electrode pin, and covers a resin-encapsulated layer in the one side that substrate arranges luminescent wafer.

2. LED novel package structure according to claim 1, it is characterized in that: described substrate is a platy structure be made up of high heat-conducting ceramic, it is outside that the electrode pin two sides be located on this substrate is exposed to substrate respective surfaces, form conducting surface, respectively this conducting surface is used for being electrically connected with wire or luminescent wafer.

3. LED novel package structure according to claim 1, is characterized in that: described substrate includes four pairs of electrode pins, and respectively the rectangular array of this electrode pin is arranged, and the size of each electrode pin is consistent.

4. the LED novel package structure according to claim 1 or 3, it is characterized in that: described each luminescent wafer is all electrically connected on the respective electrode pin in each paired electrode pin by two gold threads respectively, and respectively this luminescent wafer forms cascaded structure with corresponding paired electrode pin.

5. LED novel package structure according to claim 1, is characterized in that: the even and smooth whole surface of the substrate be covered in of described resin-encapsulated layer.