CN204872100U - Silicon chip storage device - Google Patents

Silicon chip storage device Download PDF

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Publication number
CN204872100U
CN204872100U CN201520570984.7U CN201520570984U CN204872100U CN 204872100 U CN204872100 U CN 204872100U CN 201520570984 U CN201520570984 U CN 201520570984U CN 204872100 U CN204872100 U CN 204872100U
Authority
CN
China
Prior art keywords
baffle
silicon chip
base plate
bottom plate
thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201520570984.7U
Other languages
Chinese (zh)
Inventor
杨红
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jiangsu Aoneng Photoelectric Science & Technology Co Ltd
Original Assignee
Jiangsu Aoneng Photoelectric Science & Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jiangsu Aoneng Photoelectric Science & Technology Co Ltd filed Critical Jiangsu Aoneng Photoelectric Science & Technology Co Ltd
Priority to CN201520570984.7U priority Critical patent/CN204872100U/en
Application granted granted Critical
Publication of CN204872100U publication Critical patent/CN204872100U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Silicon Compounds (AREA)

Abstract

The application discloses silicon chip storage device, the receiver top end opening, including the bottom plate of rectangle and respectively from the adjacent both sides of bottom plate reason is perpendicular first baffle and the second baffle that sets up upwards, and first baffle and second baffle enclose into an opening space, the end plate thickness along its diagonal gradually the nature increase, the bottom plate is less than the thickness at the second end at the thickness of first end, first end and second end are located respectively the cornerwise both ends of bottom plate, first end is close to the junction of first baffle and second baffle. The utility model discloses a receiver has removed rectangle box body two adjacent sides, and the silicon chip is difficult for causing breach, breakage, the slope of receiver bottom plate sets up, can obviously improve the speed of placing the silicon chip.

Description

Silicon chip accommodation device
Technical field
The application belongs to technical field of solar cell manufacturing, particularly relates to a kind of silicon chip accommodation device.
Background technology
After current silicon chip has detected, silicon chip leaves in the foam box of cuboid, and silicon chip width dimensions is 156mm, and foam box width dimensions is 157mm.Silicon chip is put into foam box and is easily caused breach, fragment.
In view of this, be necessary to provide a kind of novel silicon chip accommodation device.
Utility model content
The purpose of this utility model is to provide a kind of silicon chip accommodation device, to overcome deficiency of the prior art.
For achieving the above object, the utility model provides following technical scheme:
The embodiment of the present application discloses a kind of silicon chip accommodation device, described receiver top end opening, comprise rectangle base plate and respectively from two edges upwards vertically disposed first baffle plate and the second baffle that described base plate is adjacent, first baffle plate and second baffle surround an open space, the thickness of described base plate is along the gradually property increase of its diagonal, described base plate is less than the thickness at the second end at the thickness of first end, described first end and the second end lay respectively at the cornerwise two ends of described base plate, and described first end is near the joint of described first baffle plate and second baffle.
Preferably, in above-mentioned silicon chip accommodation device, the material of described base plate, the first baffle plate and second baffle is foam.
Compared with prior art, the utility model has the advantage of: receiver of the present utility model eliminates two adjacent sides of rectangular box, and silicon chip not easily causes breach, fragmentation; Receiver base plate is obliquely installed, and can significantly improve the speed of placing silicon chip.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present application or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, the accompanying drawing that the following describes is only some embodiments recorded in the application, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Figure 1 shows that the structural representation of silicon chip accommodation device in the utility model specific embodiment.
Detailed description of the invention
Below in conjunction with the accompanying drawing in the utility model embodiment, be described in detail the technical scheme in the utility model embodiment, obviously, described embodiment is only the utility model part embodiment, instead of whole embodiments.Based on the embodiment in the utility model, the every other embodiment that those of ordinary skill in the art obtain under the prerequisite not making creative work, all belongs to the scope of the utility model protection.
Shown in ginseng Fig. 1, silicon chip accommodation device, receiver top end opening, comprise rectangle base plate 1 and respectively from two edges upwards vertically disposed first baffle plate 2 and the second baffle 3 that base plate is adjacent, first baffle plate and second baffle surround an open space, and the thickness of base plate is along the gradually property increase of its diagonal, and base plate 1 is less than the thickness at the second end at the thickness of first end, first end and the second end lay respectively at the cornerwise two ends of base plate, and first end is near the joint of the first baffle plate 2 and second baffle 3.
In this technical scheme, two edges that base plate is wherein adjacent do not arrange baffle plate, and receiver eliminates two adjacent sides of rectangular box, and silicon chip not easily causes breach, fragmentation.Receiver base plate is obliquely installed, and can significantly improve the speed of placing silicon chip.
Further, the material of base plate 1, first baffle plate 2 and second baffle 3 is foam.
In this technical scheme, adopt foam, not easily wearing and tearing are caused to silicon chip, and cost is low, lightweight.
It should be noted that, in this article, the such as relational terms of first and second grades and so on is only used for an entity or operation to separate with another entity or operational zone, and not necessarily requires or imply the relation that there is any this reality between these entities or operation or sequentially.And, term " comprises ", " comprising " or its any other variant are intended to contain comprising of nonexcludability, thus make to comprise the process of a series of key element, method, article or equipment and not only comprise those key elements, but also comprise other key elements clearly do not listed, or also comprise by the intrinsic key element of this process, method, article or equipment.When not more restrictions, the key element limited by statement " comprising ... ", and be not precluded within process, method, article or the equipment comprising described key element and also there is other identical element.
The above is only the detailed description of the invention of the application; it should be pointed out that for those skilled in the art, under the prerequisite not departing from the application's principle; can also make some improvements and modifications, these improvements and modifications also should be considered as the protection domain of the application.

Claims (2)

1. a silicon chip accommodation device, it is characterized in that, described receiver top end opening, comprise rectangle base plate and respectively from two edges upwards vertically disposed first baffle plate and the second baffle that described base plate is adjacent, first baffle plate and second baffle surround an open space, the thickness of described base plate is along the gradually property increase of its diagonal, described base plate is less than the thickness at the second end at the thickness of first end, described first end and the second end lay respectively at the cornerwise two ends of described base plate, and described first end is near the joint of described first baffle plate and second baffle.
2. silicon chip accommodation device according to claim 1, is characterized in that: the material of described base plate, the first baffle plate and second baffle is foam.
CN201520570984.7U 2015-07-31 2015-07-31 Silicon chip storage device Expired - Fee Related CN204872100U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201520570984.7U CN204872100U (en) 2015-07-31 2015-07-31 Silicon chip storage device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201520570984.7U CN204872100U (en) 2015-07-31 2015-07-31 Silicon chip storage device

Publications (1)

Publication Number Publication Date
CN204872100U true CN204872100U (en) 2015-12-16

Family

ID=54816501

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201520570984.7U Expired - Fee Related CN204872100U (en) 2015-07-31 2015-07-31 Silicon chip storage device

Country Status (1)

Country Link
CN (1) CN204872100U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105173402A (en) * 2015-07-31 2015-12-23 江苏奥能光电科技有限公司 Silicon wafer storage device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105173402A (en) * 2015-07-31 2015-12-23 江苏奥能光电科技有限公司 Silicon wafer storage device

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20151216

Termination date: 20180731

CF01 Termination of patent right due to non-payment of annual fee