CN204820522U - Copper metal substrate is covered in high heat conduction - Google Patents
Copper metal substrate is covered in high heat conduction Download PDFInfo
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- CN204820522U CN204820522U CN201520195439.4U CN201520195439U CN204820522U CN 204820522 U CN204820522 U CN 204820522U CN 201520195439 U CN201520195439 U CN 201520195439U CN 204820522 U CN204820522 U CN 204820522U
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- heat conduction
- high heat
- copper foil
- metal substrate
- covered
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Abstract
The utility model discloses a copper metal substrate is covered in high heat conduction is pressed by high heat conduction rubber coating copper foil and sheet metal menstruation heat to form, high heat conduction rubber coating copper foil includes the electrolytic copper foil, just high heat conduction rubber coating copper foil be the insulating heat transfer layer that coats on the alligatoring face of electrolytic copper foil forms through curing, insulating heat transfer layer is made by high heat conduction resin, high heat conduction resin is formed according to a scaling and order homogeneous mixing by epoxy, pliable and tough agent, ceramic thermal conductive filler, curing agent, promoter. Compared with the prior art, the utility model discloses a scribble the heat conduction resin that climbs to a high place on the electrolytic copper foil, then be in the same place with metal substrate hot pressing, have good heat conductivility, satisfied the demand of LED illumination.
Description
Technical field
The utility model relates to LED metal substrate manufacture technology field, is specifically related to a kind of high heat conduction and covers copper metal substrate.
Background technology
In recent years LED with energy-saving and environmental protection, the life-span is long, volume is little etc., and advantage becomes the world attracted attention.Along with the expansion in succession of China " ten ten thousand, cities " LED street lamp Demonstration And Extension project, LED large-scale application becomes the tendency of the day.As everyone knows, at work, only have the electric energy of 15% ~ 25% to be converted to luminous energy, all the other nearly all transfer thermal energy consumption to LED, cause LED component temperature to raise, have a strong impact on quality and the service life of LED.Metal matrix copper-clad laminate is shown one's talent in numerous LED-baseplate material with the thermal diffusivity of its excellence, electrical property and excellent machining property, becomes the main material of the interconnected and heat dissipation substrate of LED electrical gas.Covering copper metal substrate is a kind of composite formed through hot-pressing technique by Copper Foil, insulating barrier and sheet metal.Traditional copper metal substrate insulating barrier that covers is the FR-4 prepreg containing glass-fiber-fabric, and its thermal conductivity factor is 0.25 ~ 0.3W/mk, can not meet the demand of high-power LED illumination.
Utility model content
For addressing the aforementioned drawbacks, the purpose of this utility model is to provide a kind of high heat conduction and covers copper metal substrate, and heat conductivility is good, can meet the demand of high-power LED illumination.
For achieving the above object, the technical solution adopted in the utility model is: copper metal substrate is covered in a kind of high heat conduction, formed through hot pressing by high heat conduction adhesive coated foil and sheet metal, described high heat conduction adhesive coated foil comprises electrolytic copper foil, and described high heat conduction adhesive coated foil applies thermal insulation layer to form through curing on the alligatoring face of described electrolytic copper foil, described thermal insulation layer is made up of high thermal conductive resin, and described high thermal conductive resin is formed with order Homogeneous phase mixing according to a certain percentage by epoxy resin, flexibility agent, ceramic filler, curing agent, promoter.
Further, described high heat conduction adhesive coated foil in the process of curing successively through 110 DEG C, 140 DEG C, 170 DEG C and 140 DEG C of four temperature provinces.
Described epoxy resin adopts high low-molecular-weight to be mixed.
Plasticity flexibilizer is added with in described epoxy resin.
Described ceramic filler is crystal formation framework, comprises one or several in alundum (Al2O3), aluminium nitride and boron nitride.
Described thermal insulation layer is not containing glass-fiber-fabric.
In order to keep certain insulating properties, described insulating heat-conductive layer thickness is 80um ~ 150um.
The thickness of described electrolytic copper foil has 18um, 25um, 35um, 70um.
The beneficial effects of the utility model are: described thermal insulation layer is not due to containing glass-fiber-fabric, so thermal conductivity factor is reduced between 0.6 ~ 2.0W/mk, and heat resistance is good, and breakdown voltage also increases, and meets the instructions for use of LED; Described epoxy resin adopts high low-molecular-weight to be mixed, and ensures heat resistance and the mobility of resin system.
Compared with prior art, the utility model adopts and coat high thermal conductive resin on electrolytic copper foil, then together with metal substrate hot pressing, has good heat conductivility, meets the demand of LED illumination.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, structure of the present utility model and feature are described further.
Fig. 1 is structural representation of the present utility model.
In Fig. 1,1. electrolytic copper foil, 2. thermal insulation layer, 3 is sheet metals.
Detailed description of the invention
Shown in Fig. 1, copper metal substrate is covered in a kind of high heat conduction, formed through hot pressing by high heat conduction adhesive coated foil and sheet metal 3, described high heat conduction adhesive coated foil comprises electrolytic copper foil 1, and described high heat conduction adhesive coated foil applies thermal insulation layer 2 to form through curing on the alligatoring face of described electrolytic copper foil 1, described thermal insulation layer 2 is made up of high thermal conductive resin, and described high thermal conductive resin is formed with order Homogeneous phase mixing according to a certain percentage by epoxy resin, flexibility agent, ceramic filler, curing agent, promoter.
Further, described electrolytic copper foil 1 is coated thermal insulation layer and in the process of curing, is cured 6 ~ 7min successively through 110 DEG C, 140 DEG C, 170 DEG C and 140 DEG C of four temperature provinces become high heat conduction adhesive coated foil, according to the requirement of different size, cut for subsequent use, described high heat conduction adhesive coated foil and the metal base processed laminate die-filling, at 180 DEG C, 25 ~ 30kg/cm
2pressure makes type.
Described epoxy resin adopts high low-molecular-weight to be mixed, and ensures heat resistance and the mobility of resin system.
Plasticity flexibilizer is also added with in described epoxy resin, the heat resistance of resin is had a certain impact, when the toughness reinforcing dosage of plasticity in resin system is excessive, the heat resistance of resin declines, measure less, do not have film forming and toughness reinforcing effect, determine the consumption of flexibilizer in resin system 3 ~ 5% by over one hundred batch of test, film forming and the increasing tougheness of resin can be ensured like this, can ensure that again the heat resistance of resin meets the demand of client.
Described ceramic filler is crystal formation framework, comprises one or several in alundum (Al2O3), aluminium nitride and boron nitride, can determine the number of kind and the quantity added according to different thermal conductivity factors.
Described thermal insulation layer not containing glass-fiber-fabric, so thermal conductivity factor is between 0.6 ~ 2.0W/mk, and heat resistance and breakdown voltage all good, meet the demand of LED completely.
Thermal insulation layer in the utility model is coated on roughening of copper foil face, the thickness of glue-line is determined jointly by the gap of Extruded roller and the viscosity of resin, when viscosity one timing of high thermal conductive resin, the gap of Extruded roller is larger, glue-line is thicker, when bondline thickness reaches certain value, the gap of Extruded roller does not have an impact to bondline thickness; When gap one timing of Extruded roller, the viscosity of high thermal conductive resin is larger, bondline thickness is larger, but the increase of resin viscosity must be as the criterion with the mobility of resin in glue groove, viscosity is excessive, and Resin Flow is too little, and electrolytic copper foil can be caused to occur starved phenomenon, in order to keep certain insulating properties, described insulating heat-conductive layer thickness is defined as 80um ~ 150um.
The thickness of described electrolytic copper foil has 18um, 25um, 35um, 70um, can meet the demand of different client.
The utility model is when making, for the preparation of described thermal insulation layer, first add a certain amount of acetone and silane coupler stirs, according to different thermal conductivity factor requirement, after one or more under agitation adding in the thermal conductive ceramic powder alundum (Al2O3) of certain proportion amount, boron nitride and aluminium nitride stir, add epoxy resin, stir and can obtain for 6 hours, for the preparation of described high heat conduction adhesive coated foil, on Copper Foil glue spreader, successively smooth for electrolytic copper foil is passed each roller and drying tunnel as requested, set the temperature of drying tunnel regional and start to heat, according to the thickness of Copper Foil used and the bondline thickness of requirement, regulate the gap of Extruded roller, reach after requirement until temperature, glue groove starts to drive for glue, make electrolytic copper foil alligatoring face by one deck glue can be applied uniformly after glue groove, the electrolytic copper foil being coated with one deck glue becomes uniformity by thickness after Extruded roller, by curing of zones of different temperature, high heat conduction adhesive coated foil can be obtained, high heat conduction adhesive coated foil and sheet metal laminate die-filling, at pressure 25 ~ 30kg/cm
2, temperature 190 DEG C, insulation 90min can obtain high heat conduction metal-based copper-clad plate.
Described above is only preferred embodiment of the present utility model; above-mentioned specific embodiment is not to restriction of the present utility model; all those of ordinary skill in the art, according to describing retouching, the amendment made above or equivalent replacing, all belong to protection domain of the present utility model.
Claims (5)
1. copper metal substrate is covered in a high heat conduction, it is characterized in that: be formed through hot pressing by high heat conduction adhesive coated foil and sheet metal, described high heat conduction adhesive coated foil comprises electrolytic copper foil, and described high heat conduction adhesive coated foil applies thermal insulation layer to form through curing on the alligatoring face of described electrolytic copper foil, described thermal insulation layer is made up of high thermal conductive resin.
2. copper metal substrate is covered in high heat conduction according to claim 1, it is characterized in that: described high heat conduction adhesive coated foil in the process of curing successively through 110 DEG C, 140 DEG C, 170 DEG C and 140 DEG C of four temperature provinces.
3. copper metal substrate is covered in high heat conduction according to claim 1, it is characterized in that: described thermal insulation layer is not containing glass-fiber-fabric.
4. copper metal substrate is covered in high heat conduction according to claim 1, it is characterized in that: described insulating heat-conductive layer thickness is 80um ~ 150um.
5. copper metal substrate is covered in high heat conduction according to claim 1, it is characterized in that: the thickness of described electrolytic copper foil has 18um, 25um, 35um, 70um.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520195439.4U CN204820522U (en) | 2015-04-02 | 2015-04-02 | Copper metal substrate is covered in high heat conduction |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520195439.4U CN204820522U (en) | 2015-04-02 | 2015-04-02 | Copper metal substrate is covered in high heat conduction |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204820522U true CN204820522U (en) | 2015-12-02 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520195439.4U Expired - Fee Related CN204820522U (en) | 2015-04-02 | 2015-04-02 | Copper metal substrate is covered in high heat conduction |
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| CN (1) | CN204820522U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110265537A (en) * | 2019-05-17 | 2019-09-20 | 电子科技大学中山学院 | Substrate, substrate production method and encapsulating structure |
-
2015
- 2015-04-02 CN CN201520195439.4U patent/CN204820522U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110265537A (en) * | 2019-05-17 | 2019-09-20 | 电子科技大学中山学院 | Substrate, substrate production method and encapsulating structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20151202 Termination date: 20160402 |