CN204817077U - Gu arm is glued to brilliant machine point - Google Patents
Gu arm is glued to brilliant machine point Download PDFInfo
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- CN204817077U CN204817077U CN201520582599.4U CN201520582599U CN204817077U CN 204817077 U CN204817077 U CN 204817077U CN 201520582599 U CN201520582599 U CN 201520582599U CN 204817077 U CN204817077 U CN 204817077U
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- point
- dovetail groove
- glue
- fixed block
- pin body
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Abstract
The utility model provides a can avoid glue solidification to the gu arm is glued to brilliant machine point that the production harmd to the wafer is pressed to the gluey underarm of elimination point, and it includes swing arm body (1), fixed block (2), the gluey subassembly (3) of point, and point gluey subassembly (3) include the gluey needle body (4) of point, and point gluey needle body (4) are L and appear L shape horizontal component is equipped with mounting hole (5), head (6) is a bit glued to mounting hole (5) in -connection, fixed block (2) are equipped with vertical dovetail slip table (7), the point glue needle body (4) be equipped with with dovetail slip table (7) matched with dovetail guide rail (8), dovetail guide rail (8) are slided with dovetail slip table (7) and are cup jointed, fixed block (2) upper end is equipped with end cap (9), be equipped with elastomer (10) in dovetail slip table (7), elastomer (10) one end is supported at end cap (9) lower extreme, the other end supports in dovetail guide rail (8) upper end, be connected with heating collar (11) on end cap (9).
Description
Technical field
The utility model relates to semiconductor packaging device technical field, is specifically a kind of dispensing arm of die bonder.
Background technology
Light emitting diode (LightEmittingDiode, LED) be a kind of can convert electrical energy into luminous energy can light-emitting component, be called as forth generation light source, have environmental protection and energy saving advantage, along with the maturation of LED technology, LED product is in field extensive uses such as various instruction, decoration, general lightings.
At present, in the rear packaging process of emitting led production technology, usual employing LED bonder carries out wafer fixed operation, its die bond process comprises gets glue, point glue, get brilliant and put crystalline substance, and the effect of putting glue arm is got glue and puts glue action, when glue, control unit controls the top that Glue dripping head is moved to conduction lacquer disk(-sc) by transmission mechanism, Glue dripping head picks a small amount of glue, then Glue dripping head moves to above workpiece by control unit control transmission mechanism, the glue of Glue dripping head is transferred on workpiece and complete a glue process, existing spot gluing equipment is after a period of time that worked, Glue dripping head can solidify upper glue, thus have impact on the precision of a glue.
In addition, because glue arm inertia in high-speed motion is comparatively large, therefore its strength size declined is difficult to control, easily weigh wafer wounded, and weighing wounded in wafer process, produced with wafer in theory and clashed into, Glue dripping head tilts, and causes wafer discontinuity equalization, larger to the damage of wafer.
Therefore design one and can avoid glue curing, and an elimination point glue arm presses down dispensing arm of die bonder wafer being produced to damage, for the reliability important in inhibiting improving wafer.
Utility model content
Technical problem to be solved in the utility model is, overcomes the defect of prior art, provides and can avoid glue curing, and an elimination point glue arm presses down a kind of dispensing arm of die bonder wafer being produced to damage.
For solving the problems of the technologies described above, the utility model proposes a kind of dispensing arm of die bonder, it comprises swing arm body, fixed block, point glue assembly, described some glue assembly comprises a plastic pin body, described some plastic pin body is L shape, installing hole is provided with at described L shape horizontal component, Glue dripping head is connected with in described installing hole, described fixed block is provided with vertical dovetail groove slide unit, described some plastic pin body is provided with the dovetail groove guide rail matched with described dovetail groove slide unit, described dovetail groove guide rail and described dovetail groove slide unit are slidably socketed, described fixed block upper end is provided with plug, described fixed block upper end and described plug removably connect, elastomer is provided with in described dovetail groove slide unit, described elastomer one end is against described plug lower end, the other end is against described dovetail groove guide rail upper end, described plug is connected with heating collar, described heating collar is connected with control system.
After adopting said structure, compared with prior art, the utility model has the following advantages: by the elastomer arranged in dovetail groove slide unit, solving legacy equipment because of some glue arm pressure produced that declines causes wafer discontinuity equalization, damage larger defect, achieve Glue dripping head and be operationally in state flexible flexibly all the time, ensure that and stress equalization during contact wafers, avoid weighing wounded and damaging of wafer to greatest extent, improve and produce product quality, utilize the heating collar that plug is provided with simultaneously, can heat plug, and by fixed block and the heat transfer putting plastic pin body, indirect realization is to the heating of Glue dripping head, solve the defect of the easy condensation cured of traditional Glue dripping head gluing water capacity, make the mobility that glue remains good, significantly improve some glue precision.In sum, the utility model is that one can avoid glue curing, and an elimination point glue arm presses down dispensing arm of die bonder wafer being produced to damage.
As improvement, described some plastic pin body and described Glue dripping head removably connect, the front end of described some plastic pin body is provided with the breach communicated with described installing hole, and the through hole running through its two relative side is set in front end, screw is provided with in described through hole, described through hole is run through by screw, and adjust loose described screw, expand the size of described installing hole, be convenient for changing or move up and down and regulate described Glue dripping head, to change or after regulating described Glue dripping head position, only need just can Glue dripping head position described in quick lock in by described screw-driving.
As improvement, described some plastic pin body is provided with blind hole, described blind hole interpolation has temperature detector, described temperature detector is connected with described control system, the temperature that described temperature detector detects, and be converted into the signal of telecommunication, feed back to described control system, the temperature data that described control system sets according to user, the signal of telecommunication of the described temperature detector feedback that contrast receives, automatically controls the operation of described heating collar, makes the temperature on described Glue dripping head be unlikely to too high or too low, guarantee the stable physical property of glue, significantly improve some glue precision.
Accompanying drawing explanation
Fig. 1 is a kind of dispensing arm of die bonder explosive view of the utility model.
Fig. 2 is a kind of dispensing arm of die bonder heating system of the utility model schematic diagram.
Shown in figure, 1, swing arm body, 2, fixed block, 3, some glue assembly, 4, plastic pin body is put, 5, installing hole, 6, Glue dripping head, 7, dovetail groove slide unit, 8, dovetail groove guide rail, 9, plug, 10, elastomer, 11 heating collars, 12, control system, 13 breach, 14, through hole, 15, screw, 16, blind hole, 17, temperature detector, 18, through hole, 19, hold-down screw.
Detailed description of the invention
Below the utility model is described in further detail:
A kind of dispensing arm of die bonder of the utility model, it comprises swing arm body 1, fixed block 2, point glue assembly 3, point glue assembly 3 comprises a plastic pin body 4, point plastic pin body 4 is L shape, installing hole 5 is provided with at described L shape horizontal component, Glue dripping head 6 is connected with in installing hole 5, fixed block 2 is provided with vertical dovetail groove slide unit 7, point plastic pin body 4 is provided with the dovetail groove guide rail 8 matched with dovetail groove slide unit 7, dovetail groove guide rail 8 and dovetail groove slide unit 7 are slidably socketed, fixed block 2 upper end is provided with plug 9, fixed block 2 upper end and plug 9 removably connect, elastomer 10 is provided with in dovetail groove slide unit 7, elastomer 10 one end is against plug 9 lower end, the other end is against dovetail groove guide rail 8 upper end, plug 9 is connected with heating collar 11, described heating collar is connected 12 with control system.
Point plastic pin body 4 removably connects with Glue dripping head 6, and the front end of some plastic pin body 4 is provided with the breach 13 communicated with installing hole 5, and arranges the through hole 14 running through its two relative side in front end, is provided with screw 15 in through hole 14.
Point plastic pin body 4 is provided with blind hole 16, and blind hole 16 interpolation has temperature detector 17, and temperature detector 17 is connected with control system 12.
Dovetail groove slide unit 7 lower end closed, upper end is provided with the plug 9 removably connected, plug 9 top is cylinder, bottom is the dovetail groove guide rail matched with dovetail groove slide unit 7, dovetail groove slide unit 7 upper end is provided with through hole 18, hold-down screw 19 is provided with in through hole 18, after plug 9 inserts, can by tightening hold-down screw 19, like this can anti-stop plastic pin body 4 slide time, upwards or downwards skid off dovetail groove slide unit 7, during work, swing arm body 1 moves downward, Glue dripping head 6 and contact wafers, produce reasoning upwards, point plastic pin body 4 upward sliding, elastomer 10 is squeezed, make its elastic shrinkage, absorb swing arm body 1 and press down the pressure produced in process, avoid weighing wounded and damaging of wafer, after end-of-job, Glue dripping head 6 does not stress, elastomer 10 extends downwards, point plastic pin body 4 slide downward, recover stressed front state, start subsequent work circulation, through hole 14 is run through by screw 15, and adjust unscrew 15, expand the size of installing hole 5, be convenient for changing or move up and down and regulate Glue dripping head 6, to change or after regulating Glue dripping head 6 position, only screw 15 need be tightened just can quick lock in Glue dripping head 6 position, utilize the heating collar 11 and temperature detector 17 that arrange, and be connected with control system 12 respectively, the temperature data that control system 12 sets according to user, the signal of telecommunication that the temperature detector 17 that contrast receives feeds back, the operation of automatic control heating collar 11, the temperature of on Glue dripping head 6 is made to be unlikely to too high or too low, guarantee the stable physical property of glue, significantly improve some glue precision.
The above is only better embodiment of the present utility model, therefore all equivalences done according to structure, feature and the principle described in the utility model patent claim change or modify, and are included in the utility model patent claim.
Claims (3)
1. a dispensing arm of die bonder, it comprises swing arm body (1), fixed block (2), point glue assembly (3), it is characterized in that, point glue assembly (3) comprises a plastic pin body (4), point plastic pin body (4) is L shape, installing hole (5) is provided with at described L shape horizontal component, Glue dripping head (6) is connected with in installing hole (5), fixed block (2) is provided with vertical dovetail groove slide unit (7), point plastic pin body (4) is provided with the dovetail groove guide rail (8) matched with dovetail groove slide unit (7), dovetail groove guide rail (8) and dovetail groove slide unit (7) are slidably socketed, fixed block (2) upper end is provided with plug (9), fixed block (2) upper end and plug (9) removably connect, elastomer (10) is provided with in dovetail groove slide unit (7), elastomer (10) one end is against plug (9) lower end, the other end is against dovetail groove guide rail (8) upper end, plug (9) is connected with heating collar (11), described heating collar is connected with control system (12).
2. a kind of dispensing arm of die bonder according to claim 1, it is characterized in that, point plastic pin body (4) and Glue dripping head (6) removably connect, the front end of some plastic pin body (4) is provided with the breach (13) communicated with installing hole (5), and the through hole (14) running through its two relative side is set in front end, be provided with screw (15) in through hole (14).
3. a kind of dispensing arm of die bonder according to claim 1, it is characterized in that, point plastic pin body (4) is provided with blind hole (16), and blind hole 16 interpolation has temperature detector (17), and temperature detector (17) is connected with control system (12).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520582599.4U CN204817077U (en) | 2015-08-05 | 2015-08-05 | Gu arm is glued to brilliant machine point |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520582599.4U CN204817077U (en) | 2015-08-05 | 2015-08-05 | Gu arm is glued to brilliant machine point |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204817077U true CN204817077U (en) | 2015-12-02 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520582599.4U Expired - Fee Related CN204817077U (en) | 2015-08-05 | 2015-08-05 | Gu arm is glued to brilliant machine point |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204817077U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106513253A (en) * | 2016-11-23 | 2017-03-22 | 东莞市天蓝智能装备有限公司 | Lithium battery dispenser |
| CN108656568A (en) * | 2018-04-23 | 2018-10-16 | 广州蓝圣智能科技有限公司 | A kind of automatic rubberizing equipment stood for automobile tail fin group on production line |
| CN108855785A (en) * | 2018-08-28 | 2018-11-23 | 扬州扬杰电子科技股份有限公司 | A kind of point rubber moulding group with limit and buffer unit |
| CN111013944A (en) * | 2019-12-16 | 2020-04-17 | 河南裕展精密科技有限公司 | Glue dispensing device and glue dispensing equipment comprising same |
-
2015
- 2015-08-05 CN CN201520582599.4U patent/CN204817077U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106513253A (en) * | 2016-11-23 | 2017-03-22 | 东莞市天蓝智能装备有限公司 | Lithium battery dispenser |
| CN108656568A (en) * | 2018-04-23 | 2018-10-16 | 广州蓝圣智能科技有限公司 | A kind of automatic rubberizing equipment stood for automobile tail fin group on production line |
| CN108855785A (en) * | 2018-08-28 | 2018-11-23 | 扬州扬杰电子科技股份有限公司 | A kind of point rubber moulding group with limit and buffer unit |
| CN108855785B (en) * | 2018-08-28 | 2024-05-17 | 扬州扬杰电子科技股份有限公司 | Dispensing module with limiting and buffering device |
| CN111013944A (en) * | 2019-12-16 | 2020-04-17 | 河南裕展精密科技有限公司 | Glue dispensing device and glue dispensing equipment comprising same |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP03 | Change of name, title or address |
Address after: Jiaxing City, Zhejiang province 314400 Haining Economic Development Zone Haining City Jinli Road No. 2 Building 2 layer three Patentee after: ZHEJIANG WEIWEI OPTOELECTRONIC TECHNOLOGY CO., LTD. Address before: Haining city Chang Street Jinli road Jiaxing City, Zhejiang province 314400 No. 2 Patentee before: ZHEJIANG WEIWEI OPTOELECTRONIC CO., LTD. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20151202 Termination date: 20180805 |