CN204757879U - Silicon chip calibrator - Google Patents
Silicon chip calibrator Download PDFInfo
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- CN204757879U CN204757879U CN201520334416.7U CN201520334416U CN204757879U CN 204757879 U CN204757879 U CN 204757879U CN 201520334416 U CN201520334416 U CN 201520334416U CN 204757879 U CN204757879 U CN 204757879U
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- silicon chip
- measuring table
- location
- locating slot
- groove
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- A Measuring Device Byusing Mechanical Method (AREA)
Abstract
The utility model relates to a silicon chip measuring instrument technical field especially relates to a silicon chip calibrator, and it includes chassis, measuring platform, support and meter, the upper surface on chassis is equipped with angle point constant head tank and central point constant head tank, is equipped with the silicon chip constant head tank on the measuring platform upper surface, and angle point constant head tank and central point constant head tank all are furnished with the measuring platform locating plate of geomery looks adaptation with it, and the silicon chip constant head tank is furnished with the silicon chip locating plate of geomery looks adaptation with it, through the central point rigidity of silicon chip locating plate messenger's silicon chip on measuring platform, makes central point position and the four corners rigidity of measuring platform on the chassis through the measuring platform locating plate, consequently, the central point and the angle point of silicon chip is select at random during the measurement, but is injectd by the locating plate of different positions, and the human error that tester's difference brought has been avoided to four angle points of measurement silicon chip and central point that the tester can relatively fixed when test silicon chip thickness.
Description
Technical field
The utility model relates to silicon chip surveying instrument technical field, particularly relates to a kind of silicon chip thickness gauge.
Background technology
Silicon chip is as the basic material of crystal silicon solar energy battery, its quality has very important impact to battery performance, and the thickness of silicon chip lists the scope of silicon chip Incoming Quality Control in as the index weighing Si wafer quality, in order to reduce the cost of crystal silicon solar energy battery further, the thickness of silicon chip is more and more thinner, and when silicon wafer thickness is more than the decline that will cause electricity conversion during a lower limit value; The homogeneity of silicon wafer thickness is also very important in addition, and the homogeneity of silicon wafer thickness not only affects the preparation technology of solar cell, and the silicon chip of became uneven can increase the fragment rate of each workshop section.In order to ensure the efficiency of cell piece output, needing to carry out management and control to the thickness of supplied materials silicon chip, guaranteeing that it meets test stone, thus ensure the quality of cell piece.
When measuring silicon wafer thickness, need to choose five points, generally, four angle points of tester's random selecting silicon chip and central point thereof are as measurement point, the randomness of such measurement point will cause the result just possibility difference of tester's different measuring, the data personal error collected is relatively large, affects experimental analysis.
Utility model content
The purpose of this utility model is to provide a kind of silicon chip thickness gauge, and when this silicon chip thickness gauge is measured silicon chip, measurement point is not random selecting, avoids the personal error that tester's difference is brought.
For solving the problems of the technologies described above, the utility model provides a kind of silicon chip thickness gauge, comprise chassis, measuring table, support and be installed on described support for measuring the meter of silicon wafer thickness, described support is fixed on described chassis, described meter spiral is installed on the bracket, described measuring table activity is placed on described chassis, and the lower surface of described measuring table and the upper surface on described chassis are affixed;
The upper surface on described chassis is provided with Corner character groove near the position at four angles, described Corner character groove to be centrosymmetric distribution with the central point of described chassis upper surface, described chassis upper surface is also provided with a location of the core groove, the angle point of described location of the core groove is positioned on the angle point of Corner character groove described in one of them and the line of described center chassis point;
Described Corner character groove and the rectangular structure of described location of the core groove, described Corner character groove is all parallel with side adjacent thereto on described chassis with every bar right-angle side of the rectangular structure of described location of the core groove, and the angle point of described Corner character groove and described location of the core groove is towards the direction away from described center chassis point;
Described measuring table upper surface is provided with a silicon chip locating slot, and described silicon chip locating slot is positioned at wherein one jiao of the upper surface of described measuring table;
The rectangular structure of described silicon chip locating slot, its every bar right-angle side is all parallel with side adjacent thereto on described measuring table, and the angle point of described silicon chip locating slot is towards the direction away from measuring table central point;
Described Corner character groove and location of the core groove are all furnished with the suitable measuring table location-plate of geomery with it, described silicon chip locating slot is furnished with the suitable silicon chip location-plate of geomery with it, after described measuring table location-plate inserts corresponding Corner character groove or location of the core groove, the top of described measuring table location-plate protrudes from the upper surface on described chassis, after described silicon chip location-plate inserts corresponding silicon chip locating slot, the top of described silicon chip location-plate protrudes from the upper surface of described measuring table.
As a kind of improved plan, described Corner character groove is monocrystalline Corner character groove, and described silicon chip locating slot is monocrystalline silicon piece locating slot.
As a kind of improved plan, described Corner character groove is polycrystalline Corner character groove, and described silicon chip locating slot is polysilicon chip locating slot.
As a kind of improved plan, described Corner character groove comprises monocrystalline Corner character groove and polycrystalline Corner character groove, described monocrystalline Corner character groove, be positioned at the inside in the region that described polycrystalline Corner character groove surrounds, described silicon chip locating slot comprises monocrystalline silicon piece locating slot and polysilicon chip locating slot, and described polysilicon chip locating slot is positioned at the outside of monocrystalline silicon piece locating slot.
As a kind of improved plan, there is hollow out described measuring table lower surface and side, and measuring table upper surface is provided with the air hole running through measuring table.
As a kind of improved plan, described air hole is multiple.
Owing to have employed technique scheme, the beneficial effects of the utility model are: silicon chip thickness gauge is when measuring silicon wafer thickness, after distance between measuring table and meter is determined by the spiral on adjusting pole, open meter and carry out zero setting calibration, then silicon chip is placed on measuring table, by silicon chip locating slot and silicon chip location-plate with the use of, the center position of silicon chip on measuring table is fixed; By location of the core groove and measuring table location-plate with the use of, the center position of measuring table on chassis can be fixed; By Corner character groove and measuring table location-plate with the use of, the corner location of measuring table on chassis can be fixed; Therefore, during measurement, the central point of silicon chip and angle point are no longer random selecting, but limited by the location-plate of diverse location, tester can relatively-stationary measurement silicon chip four angle points and central point when test silicon wafer thickness, avoids the personal error that tester's difference is brought.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the utility model is further illustrated:
Fig. 1 is the structural representation of the silicon chip thickness gauge that the utility model provides;
Fig. 2 is the utility model embodiment one measuring table and chassis vertical view when measuring monocrystalline silicon piece central point;
Fig. 3 is the structural representation of the utility model embodiment two silicon chip thickness gauge;
Fig. 4 is the utility model embodiment two measuring table and chassis vertical view when measuring polysilicon chip angle point;
Fig. 5 is the structural representation of the utility model embodiment three silicon chip thickness gauge;
Fig. 6 is the utility model embodiment three measuring table and chassis vertical view when measuring polysilicon chip central point;
Wherein: 1-chassis, 2-measuring table, 3-meter, 4-support, 5-silicon chip location-plate, 51-measuring table location-plate, 6-monocrystalline silicon piece locating slot, 61-polysilicon chip locating slot, 7-location of the core groove, 81 monocrystalline Corner character grooves, 811-polycrystalline Corner character groove, 90-silicon chip central point, 91,92,93,94-monocrystalline silicon piece angle point, 911,921,931,941-polysilicon chip angle point, 10-monocrystalline silicon piece, 11-polysilicon chip, 12-air hole.
Embodiment
In order to make the purpose of this utility model, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the utility model, and be not used in restriction the utility model.
Embodiment one
As shown in Figure 1, silicon chip thickness gauge of the present utility model, comprise chassis 1, measuring table 2, support 4 and be installed on support 4 for measuring the meter 3 of silicon wafer thickness, support 4 is fixed on chassis 1, measuring table 2 activity is placed on chassis 1, and the lower surface of measuring table 2 and the upper surface on chassis 1 are affixed;
The upper surface on chassis 1 is provided with Corner character groove near the position at four angles, Corner character groove to be centrosymmetric distribution with the central point of chassis 1 upper surface, chassis 1 upper surface is also provided with a location of the core groove 7, the angle point of location of the core groove 7 is positioned on the angle point of one of them Corner character groove and the line of chassis 1 central point;
Corner character groove and location of the core groove 7 at right angles structure, every bar right-angle side of Corner character groove and the rectangular structure of location of the core groove 7 is all parallel with side adjacent thereto on chassis 1, and the angle point of Corner character groove and location of the core groove 7 is towards the direction away from chassis 1 central point;
Measuring table 2 upper surface is provided with a silicon chip locating slot, and silicon chip locating slot is positioned at wherein one jiao of the upper surface of measuring table 2;
The rectangular structure of silicon chip locating slot, its every bar right-angle side is all parallel with side adjacent thereto on measuring table 2, and the angle point of silicon chip locating slot is towards the direction away from measuring table 2 central point;
Corner character groove and location of the core groove 7 are all furnished with the suitable measuring table location-plate 51 of geomery with it, silicon chip locating slot is furnished with the suitable silicon chip location-plate 5 of geomery with it, after measuring table location-plate 51 inserts corresponding Corner character groove or location of the core groove 7, the top of measuring table location-plate 51 protrudes from the upper surface on chassis 1, after silicon chip location-plate 5 inserts corresponding silicon chip locating slot, the top of silicon chip location-plate 5 protrudes from the upper surface of measuring table 2.
On above-described embodiment basis, measuring table 2 bottom center position hollow out, measuring table 2 upper surface is provided with the air hole 12 running through measuring table 2.When being placed on measuring table 2 by silicon chip, the air between silicon chip and measuring table 2 can be discharged by air hole 12, makes silicon chip and measuring table 2 close contact, reduces measuring error.
Wherein, above-mentioned air hole 12 can arrange multiple, such as 9.Air is discharged more smooth and easy and thorough, silicon chip is contacted more closely with measuring table 2, further reduces measuring error.
Wherein, this silicon chip thickness gauge may be used for the measurement to monocrystalline silicon piece 10, also may be used for the measurement to polysilicon chip 11, certainly, this thicknessmeter preferred both can carry out thickness measure to monocrystalline silicon piece 10, also can measure polysilicon chip 11, on this silicon chip thickness gauge, namely arranges corresponding two covers measure structure and carry out corresponding combination and can realize, followingly provide corresponding specific embodiment and be described, do not repeat them here.
Shown in composition graphs 1 and Fig. 2, when this silicon chip is monocrystalline silicon piece 10, concrete operation step is as follows:
Because the utility model has above structure, when tester tests monocrystalline silicon piece 10 thickness, after distance between measuring table 2 and meter 3 is determined by the spiral on adjusting pole 4, open meter 3 and carry out zero setting calibration, then monocrystalline silicon piece 10 is placed on measuring table 2, silicon chip location-plate 5 is inserted in monocrystalline silicon piece locating slot 6, the top of silicon chip location-plate 5 protrudes from the upper surface of measuring table 2, mobile monocrystalline silicon piece 10, two right-angle sides making monocrystalline silicon piece 10 adjacent are respectively near two right-angle sides of silicon chip location-plate 5, now, monocrystalline silicon piece 10 is just in time in the center of measuring table 2, measuring table location-plate 51 is inserted in the One On The Chassis location of the core groove 7, the top of measuring table location-plate 51 protrudes from the upper surface on chassis 1, start silicon chip thickness gauge, meter 3 probe drops to monocrystalline silicon piece 10 and measures, probe just in time touches the central point 90 of monocrystalline silicon piece 10, record crystal silicon chip 10 central point 90 thickness data, central point 90 measure complete after, take out measuring table location-plate 51, be inserted in monocrystalline Corner character groove 81, traverse measurement platform 2, two right-angle sides of measuring table 2 and two right-angle sides of measuring table location-plate 51 are fitted tightly, start silicon chip thickness gauge, meter 3 probe drops to monocrystalline silicon piece 10 and measures, probe just in time touches the monocrystalline silicon piece angle point 91 of monocrystalline silicon piece 10, measure the thickness at monocrystalline silicon piece angle point 91 place, the thickness data of record crystal silicon chip angle point 91, monocrystalline silicon piece angle point 92,93 is consistent with the metering system of monocrystalline silicon piece angle point 91 with the metering system at 94 places.
Owing to have employed the technical scheme of embodiment one, central point 90 and the monocrystalline silicon piece angle point 91,92,93 and 94 of monocrystalline silicon piece 10 are no longer tester's random selecting, but limited by silicon chip location-plate 5 and measuring table location-plate 51, tester can four angle points of relatively-stationary measurement monocrystalline silicon piece 10 and central point when testing monocrystalline silicon piece 10 thickness, measurement point is not random selecting, avoids the personal error that tester's difference is brought.
Embodiment two
As shown in Figure 3 and Figure 4, measure the thickness of polysilicon chip 11, the position of Corner character groove and silicon chip locating slot is described different from embodiment one, polysilicon chip Corner character groove 811 is positioned at outside monocrystalline silicon piece Corner character groove 81, and polysilicon chip locating slot 61 is positioned at outside monocrystalline silicon piece locating slot 6, be described for the thickness measuring polysilicon chip angle point 911 place below;
When tester measures the thickness at polysilicon chip angle point 911 place, polysilicon chip 11 is placed on measuring table 2, polysilicon chip 11 is made just in time to be in the center of measuring table 2 by silicon chip location-plate 5, measuring table location-plate 51 is inserted in polycrystalline Corner character groove 811, traverse measurement platform 2, two right-angle sides of measuring table 2 and two right-angle sides of measuring table location-plate 51 are fitted tightly, start silicon chip thickness gauge, meter 3 probe drops to polysilicon chip 11 and measures, probe just in time touches the polysilicon chip angle point 911 of polysilicon chip 11, measure the thickness at polysilicon chip angle point 911 place, the thickness data of record polysilicon chip angle point 911, polysilicon chip angle point 921,931 is consistent with the metering system of polysilicon chip angle point 911 with the metering system at 941 places.
Owing to have employed the technical scheme of embodiment two, central point 90 and the polysilicon chip angle point 911,921,931 and 941 of polysilicon chip 11 are no longer tester's random selecting, but limited by silicon chip location-plate 5 and measuring table location-plate 51, tester can relatively-stationary measurement polysilicon chip 11 4 angle points and central point when testing polysilicon chip 11 thickness, measurement point is not random selecting, avoids the personal error that tester's difference is brought.
Embodiment three
On the basis of embodiment one, as shown in Figure 5 and Figure 6, embodiment three combines the scheme of embodiment one and embodiment two, and the silicon chip thickness gauge of embodiment three both can have been measured monocrystalline silicon piece 10 and also can measure polysilicon chip 11.Embodiment San Tong method has monocrystalline silicon piece locating slot 6 and polysilicon chip locating slot 61, and monocrystalline Corner character groove 81 and polycrystalline Corner character groove 811, therefore can measure monocrystalline silicon piece 10 and polysilicon chip 11 respectively.Fig. 6 is the measuring table 2 of the utility model embodiment three when measuring polysilicon chip 11 central point and chassis 1 vertical view, and measuring method, with the measuring method of embodiment two, no longer describes in detail.
The beneficial effect of embodiment three is:
Owing to have employed the technical scheme of embodiment three, this silicon chip thickness gauge both can measure monocrystalline silicon piece 10 also can measure polysilicon chip 11, and the central point of silicon chip and silicon chip angle point are no longer tester's random selecting, but limited by silicon chip location-plate 5 and measuring table location-plate 51, tester can relatively-stationary measurement silicon chip four angle points and central point when test silicon wafer thickness, measurement point is not random selecting, and close contact between silicon chip and measuring table 2, reduce measuring error, avoid the personal error that tester's difference is brought, achieve dual-use simultaneously, provide cost savings.
Three preferred embodiments of the above utility model, are not limited to the utility model, and all any amendments done within spirit of the present utility model and principle, equivalent replacement and improvement etc., all should be included within the utility model protection domain.
Claims (6)
1. a silicon chip thickness gauge, it is characterized in that, comprise chassis (1), measuring table (2), support (4) and be installed on described support (4) for measuring the meter (3) of silicon wafer thickness, described support (4) is fixed on described chassis (1), described meter (3) spiral is arranged on described support (4), described measuring table (2) activity is placed on described chassis (1), and the lower surface of described measuring table (2) and the upper surface of described chassis (1) are affixed;
The upper surface on described chassis (1) is provided with Corner character groove near the position at four angles, described Corner character groove to be centrosymmetric distribution with the central point of described chassis (1) upper surface, described chassis (1) upper surface is also provided with a location of the core groove (7), the angle point of described location of the core groove (7) is positioned on the angle point of Corner character groove described in one of them and the line of described chassis (1) central point;
Described Corner character groove and described location of the core groove (7) at right angles structure, all upper with described chassis (1) side adjacent thereto of every bar right-angle side of described Corner character groove and the rectangular structure of described location of the core groove (7) is parallel, and the angle point of described Corner character groove and described location of the core groove (7) is towards the direction away from described chassis (1) central point;
Described measuring table (2) upper surface is provided with a silicon chip locating slot, and described silicon chip locating slot is positioned at wherein one jiao of the upper surface of described measuring table (2);
The rectangular structure of described silicon chip locating slot, all upper with described measuring table (2) side adjacent thereto of its every bar right-angle side is parallel, and the angle point of described silicon chip locating slot is towards the direction away from measuring table (2) central point;
Described Corner character groove and location of the core groove (7) are all furnished with the suitable measuring table location-plate (51) of geomery with it, described silicon chip locating slot is furnished with the suitable silicon chip location-plate (5) of geomery with it, after described measuring table location-plate (51) inserts corresponding Corner character groove or location of the core groove (7), the top of described measuring table location-plate (51) protrudes from the upper surface of described chassis (1), after described silicon chip location-plate (5) inserts corresponding silicon chip locating slot, the top of described silicon chip location-plate (5) protrudes from the upper surface of described measuring table (2).
2. silicon chip thickness gauge according to claim 1, is characterized in that, described Corner character groove is monocrystalline Corner character groove (81), and described silicon chip locating slot is monocrystalline silicon piece locating slot (6).
3. silicon chip thickness gauge according to claim 1, is characterized in that, described Corner character groove is polycrystalline Corner character groove (811), and described silicon chip locating slot is polysilicon chip locating slot (61).
4. silicon chip thickness gauge according to claim 1, it is characterized in that, described Corner character groove comprises monocrystalline Corner character groove (81) and polycrystalline Corner character groove (811), described monocrystalline Corner character groove (81) is positioned at the inside in the region that described polycrystalline Corner character groove (811) surrounds, described silicon chip locating slot comprises monocrystalline silicon piece locating slot (6) and polysilicon chip locating slot (61), and described polysilicon chip locating slot (61) is positioned at the outside of monocrystalline silicon piece locating slot (6).
5. silicon chip thickness gauge according to any one of claim 1 to 4, it is characterized in that, there is hollow out described measuring table (2) lower surface and side, and measuring table (2) upper surface is provided with the air hole (12) running through measuring table (2).
6. silicon chip thickness gauge according to claim 5, is characterized in that, described air hole (12) is for multiple.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520334416.7U CN204757879U (en) | 2015-05-21 | 2015-05-21 | Silicon chip calibrator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520334416.7U CN204757879U (en) | 2015-05-21 | 2015-05-21 | Silicon chip calibrator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204757879U true CN204757879U (en) | 2015-11-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520334416.7U Expired - Fee Related CN204757879U (en) | 2015-05-21 | 2015-05-21 | Silicon chip calibrator |
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| CN (1) | CN204757879U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111121585A (en) * | 2019-11-19 | 2020-05-08 | 上海复合材料科技有限公司 | Thickness measurement method, system, medium and device suitable for adapter |
-
2015
- 2015-05-21 CN CN201520334416.7U patent/CN204757879U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111121585A (en) * | 2019-11-19 | 2020-05-08 | 上海复合材料科技有限公司 | Thickness measurement method, system, medium and device suitable for adapter |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20151111 Termination date: 20180521 |