CN204675424U - Plate conveying device for double-layer carrying disc - Google Patents

Abstract

A double-layer carrier plate feeding device is placed on the front side of the process equipment. It includes: a machine base, an empty plate conveyor mechanism, a plate conveyor mechanism, a carrier plate elevating mechanism with an ejector rod, and a carrier plate ejection mechanism. The arm's tray transfer mechanism, the panel transfer mechanism with the panel arm, and the fully loaded tray conveyor mechanism; the double-layer carrier tray and circuit board panels are transported to the position through the empty tray conveyor mechanism and the panel conveyor mechanism respectively. The tray-carrying arm moves the double-layer carrier tray to the carrier tray lifting mechanism. After the ejector pin pushes open the upper cover of the double-layer carrier tray, the tray-carrier arm absorbs the upper cover and lifts it up; then, the plate The arm places the circuit board on the lower cover of the double-layer carrier tray, and the upper cover is placed under the carrier arm to position the circuit board between the upper and lower covers; finally, the double-layer carrier with the circuit board in it The layer carrier tray is sent into the process equipment through the fully loaded tray conveying mechanism to complete the board feeding operation. This device replaces labor, reduces labor cost-effectiveness, and helps improve process efficiency.

Description

Plate feeding device for double-layer trays

technical field

The utility model relates to a board feeding device, in particular to a board feeding device which is installed on the front side of a process equipment and can automatically put circuit board boards into a double-layer carrier tray and automatically transport them into the process equipment.

Background technique

The production process of the circuit board in the prior art includes soldering the pins of the electronic parts on the circuit board with solder balls. In the early days, this process was mostly manual. Due to mass production, automated process equipment must be used to improve work efficiency and board parts. Therefore, the soldering of electronic parts in today's circuit boards, the production process is to print a layer of solder paste on the back of the board, then insert the electronic parts, and finally send it into the reflow furnace (Reflow) to melt the tin The paste is used to form a co-metal on the component feet and the circuit board. In other words, the function of the reflow furnace is equivalent to soldering the electronic components to the circuit board. However, the circuit board needs to be heated to about 250°C in the reflow furnace, and the circuit board is easily damaged due to high temperature softening and deformation. Therefore, the current circuit board manufacturing industry usually uses a double-layer carrier to hold the board. Its benefits include (1) It can reduce the deformation of the circuit board due to high temperature softening through the reflow furnace. (2) It can be used to carry thin circuit boards or soft boards. (3) It can prevent electronic parts from falling into the reflow furnace. The double-layer carrier has an upper cover and a lower cover. Before the circuit board is sent into the reflow furnace, it must be placed between the upper cover and the lower cover of the double-layer carrier. After the reflow furnace process is completed, the circuit board The board is taken out from the double-layer tray. For a long time, the circuit board has been placed in and removed from the double-layer tray by manual operation, but this method is not in line with the competitive model of mass production in the electronics industry .

Based on the above situation, it is necessary to develop a board feeding device that can automatically place the circuit boards into the double-layer carrier tray, and then send them to the process equipment for processing, so as to meet the needs of improving process efficiency in the 3C electronics industry.

Utility model content

Therefore, the purpose of this utility model is to provide a device that can automatically place circuit board components into a double-layer carrier. Another object of the present invention is to provide a device that can automatically send the double-layer trays that have been placed into the circuit board into the process equipment. In order to achieve the above object, the utility model provides the following technologies:

A board feeding device for double-layer trays, which is used to automatically place circuit board components into the double-layer tray, and then transport the double-layer trays that have been placed into the circuit board into the process equipment to complete the circuit board The board feeding device for board processing, the board feeding device of the double-layer tray includes:

A machine base, used for installing the mechanism of the plate feeding device of the double-layer tray;

An empty disk conveying mechanism, which has a first roller conveying platform driven by a first motor, and is used to convey the double-layer carrier disk to a certain position;

A board conveying mechanism, which has a belt conveying table driven by a second motor, for conveying circuit board boards to a certain position;

A tray lifting mechanism, which has a second roller conveying platform driven by a third motor, two sets of ejector rods that can move upwards, and two sets of pressure plates with functions of front-back and up-down displacement, used to lift the double-layer trays the upper cover;

A tray transfer mechanism, which has a transverse track of a first slide seat, and a tray arm mounted on the first slide seat that can move up and down, and the tray arm can move smoothly with the first slide seat moves on the transverse track;

A plate transfer mechanism, which has a longitudinal track of a second slide, and a plate arm that can move up and down on the second slide, and the plate arm can move smoothly with the second slide ground moves on the longitudinal track;

A fully loaded tray conveying mechanism, which has a third roller conveying platform driven by a fourth motor, used to transport the double-layer carrier trays that have been placed in the circuit board board into the process equipment;

The board feeding device of the double-layer carrier is placed on the front side of the process equipment. When the double-layer carrier and the circuit board are respectively transported to the position by the empty tray conveying mechanism and the plate conveying mechanism, the carrier The arm is about to shift the double-layer tray to the upper mechanism of the tray, and after the two sets of ejector pins push away the upper cover of the double-layer tray, the arm of the tray is about to lift the upper cover; then, the The board arm places the circuit board board above the lower cover of the double-layer carrier, and then, the carrier arm lowers the upper cover so that the circuit board board is positioned between the upper and lower covers; finally, The double-layer carrier tray that has been placed in the circuit board is sent into the process equipment through the full-load tray conveying mechanism, and the board feeding operation of the double-layer carrier tray is completed.

Further, the tray arm of the tray transfer mechanism has a suction cup module and a gripper module at the same time.

Further, the empty tray conveying mechanism is provided with a first optical detection device, the board conveying mechanism is provided with a second optical detection device, the tray lifting mechanism is provided with a third optical detection device, and The full tray transport mechanism is provided with a fourth optical detection arrangement.

Further, the double-layer tray feeding device also includes a tray lifting mechanism, and the rear side of the process equipment is connected with a double-layer tray receiving device; the double-layer tray feeding device and Between the receiving devices of the double-layer trays, a double-layer tray return conveying device is connected to take out the circuit boards that have been processed from the double-layer trays; the double-layer trays that have been removed from the circuit boards The trays are returned one by one to the tray elevating mechanism in the double-layer tray feeding device, and then sent to the empty tray conveying mechanism, so that the double-layer trays can be put into the process again.

Because the board feeding device of this double-layer tray can automatically put the circuit board into the double-layer tray, and then automatically transport the double-layer tray with the circuit board into the process equipment to complete the board processing. Therefore, manual operations can be completely replaced, and it is beneficial to reduce labor costs and contribute to the improvement of process efficiency.

Description of drawings

Fig. 1 is a combined perspective view of the plate feeding device of the double-layer tray of the present invention, wherein the frame is omitted and not shown;

Fig. 2A is a top view of the plate feeding device of the double-layer tray in Fig. 1, wherein the machine base is shown;

Fig. 2B is a front view of the plate feeding device of the double-layer tray in Fig. 1, wherein the machine base is shown;

Fig. 3 is a combined perspective view of the empty disk conveying mechanism in Fig. 1;

Fig. 4 is a combined perspective view of the panel conveying mechanism of Fig. 1;

Fig. 5 is a combined perspective view of the tray lifting mechanism of Fig. 1;

Fig. 6 is a combined perspective view of the tray transfer mechanism in Fig. 1;

Fig. 7 is a combined perspective view of the panel transfer mechanism in Fig. 1;

Fig. 8 is a combined perspective view of the fully loaded tray conveying mechanism in Fig. 1;

Fig. 9 is a combined perspective view of the fully loaded tray conveying mechanism in Fig. 1;

10 is a combined perspective view of a double-layer tray feeding device connected with a double-layer tray receiving device and a double-layer tray return conveying device of the present invention.

Description of main component symbols:

10: base;

20: Empty tray conveying mechanism;

21: the first motor;

22: the first roller conveyor;

25: The first optical detection equipment;

30: plate conveying mechanism;

31: second motor;

32: Belt conveyor table;

33: positioning device;

34: the first baffle;

35: the second optical detection device;

40: Carrying tray lifting mechanism;

41: the third motor;

42: the second roller conveying platform;

43: Ejector;

44: pressing plate;

45: The third optical detection device;

50: tray transfer mechanism;

51: the first sliding seat;

52: horizontal track;

53: carrier arm;

54: suction cup module;

55: Gripper module;

60: plate transfer mechanism;

61: the second sliding seat;

62: longitudinal track;

63: plate arm;

70: Full-load tray conveying mechanism;

71: fourth motor;

72: the third roller conveying platform;

73: second baffle;

75: the fourth optical detection equipment;

80: Tray lifting mechanism;

81: The third sliding seat;

82: vertical track;

83: Conveyor platform;

91: double-layer tray;

92: circuit board parts;

100: a plate feeding device for double-layer trays;

200: a plate receiving device for double-layer trays;

300: double-layer tray return conveyor device.

Detailed ways

In order to make the technical solution of the utility model can be expressed more clearly, the utility model will be further described below in conjunction with the accompanying drawings.

As shown in Fig. 1 to Fig. 10, it is the board feeding device of the double-layer tray of the present invention. First of all, please refer to Fig. 1, Fig. 2A, and Fig. 2B. The plate feeding device of the utility model is set on the front side of the process equipment mainly based on the reflow furnace (Reflow). The purpose of the setting is It is used to automatically put the circuit board parts into the double-layer carrier, and then automatically transport the double-layer carrier with the circuit board parts into the process equipment to complete the board processing; it includes a machine base 10, an empty Carrier conveying mechanism 20, a plate conveying mechanism 30, a carrier lifting mechanism 40, a carrier transfer mechanism 50, a plate transfer mechanism 60, a full tray conveying mechanism 70, and a carrier lifting mechanism 80; Among them, the base 10 is used to install the mechanism of the device, and to enable the various mechanisms to stably transport, absorb or clamp the circuit board board and the double-layer tray; the empty tray conveying mechanism 20 , is used to send the double-layer tray into the device and transport it to a location; the board conveying mechanism 30 is used to send the unprocessed circuit board board from the outside into the device and transport it to a location; The tray lifting mechanism 40 is used to lift the upper cover of the double-layer tray, so that the upper cover is disengaged from the engagement with the lower cover; the tray transfer mechanism 50 is used to remove the double-layer tray from the The empty tray conveying mechanism is shifted to the tray lifting mechanism. When the upper cover of the double-layer tray is lifted, it is used to absorb and lift the upper cover, so that the circuit board can be easily placed into the double-layer tray Middle; the plate transfer mechanism 60 is used to grab the circuit board plate on the plate conveying mechanism 30 and put it into the double-layer tray; the full tray conveying mechanism 70 is used to The double-layer trays that have been inserted into the circuit board components are sent into the process equipment;

As shown in Fig. 3, it is an assembly diagram of the empty tray conveying mechanism 20, which has a first motor 21 driving a first roller conveying platform 22 formed by a plurality of supporting rollers, and the double-layer tray is formed from the first roller conveying platform 22 into the front end, and the first roller conveying platform 22 sends the double-layer tray to the location, and the first optical detection device 25 is further provided at the front and rear ends of the first roller conveying platform 22 to control the front-end mechanism. The timing of feeding the double-layer tray, and controlling the opening and closing timing of the first motor 21 to position the double-layer tray at the correct working position;

As shown in Figure 4, it is a combination diagram of the plate conveying mechanism 30, which has a belt conveying platform 32 formed by a second motor 31 driven by a belt, a positioning device 33, and a first baffle plate 34, the circuit board plate 92 is inserted from the front end of the belt conveying platform 32, and conveyed through the belt conveying platform 32, the positioning device 33 is driven by the cylinder, and can laterally position the circuit board parts 92 of different specifications, and the first baffle plate 34 is set At the tail end of the belt conveyor 32, the circuit board 92 can be longitudinally positioned at a fixed position, and a second optical detection device 35 is provided at the front and rear ends of the belt conveyor 32 to control the circuit board of the front-end mechanism. The timing of feeding the component 92, and controlling the opening and closing of the second motor 31 and the lifting timing of the first baffle plate 34 to position the circuit board panel 92 at the correct working position;

As shown in FIG. 5 , it is an assembly diagram of the tray lifting mechanism 40 , which has a second roller conveying platform 42 formed by driving a plurality of supporting rollers with a third motor 41 , and two groups are located below the second roller conveying platform 42 and The ejector rod 43 with the function of upward support, and two sets of pressure plates 44 located on both sides of the second roller conveying platform 42 and having the functions of front and rear and up and down displacement, when the double-layer carrier is sent to the second roller conveying platform 42, The pressing plate 44 will press down the lower cover of the double-layer tray, and the push rod 43 will support the upper cover of the double-layer tray, so that the upper cover will break away from the engagement with the lower cover, and the second roller conveying platform 42 will The front and rear ends are further equipped with a third optical detection device 45 to control the actuation timing of the pressing plate 44 and the ejector rod 43, and control the opening and closing timing of the third motor 41 so that the double-layer tray is sent out of the mechanism in due course;

As shown in Figure 6, it is an assembly diagram of the tray transfer mechanism 50, which has a transverse track 52 of a first slide 51, and a tray arm 53 mounted on the first slide 51 that can move up and down , and the tray arm 53 can move smoothly on the transverse rail 52 along with the first slide 51, the tray arm 53 has a suction cup module 54 and a gripper module 55 at the same time, and the gripper module 55 is to grasp The double-layer tray 91 of the upper and lower covers, the suction cup module 34 is used to absorb the upper cover of the double-layer tray 91;

As shown in FIG. 7 , it is an assembly diagram of the plate transfer mechanism 60, which has a longitudinal rail 62 of a second slide 61, and a plate arm 63 that can move up and down on the second slide 61. , and the panel arm 63 can move smoothly on the longitudinal rail 62 along with the second slide 61, the panel arm 63 is used to grab the circuit board panel 92 on the panel conveying mechanism and place it placed in the double-layer tray, and then moved back to its original position;

As shown in Figure 8, it is a combination diagram of a full-load tray conveying mechanism 70, which has a third roller conveying platform 72 formed by a fourth motor 71 driving a plurality of supporting rollers, and a rear end of the third roller conveying platform 72. The second baffle plate 73, when the circuit board board has been placed in the double-layer tray and the upper and lower covers have been engaged, the tray lifting mechanism will send the double-layer tray to the third roller conveying platform 72 The front end of the third roller conveyor 72 is then sent into the process equipment, and the fourth optical detection device 75 is installed at the front and rear ends of the third roller conveyor 72 to control the front end of the tray lifting mechanism. The feeding timing of the layer tray, and the timing of controlling the opening and closing of the fourth motor 71 and the lifting timing of the second baffle plate 73, so that the double-layer tray can be sent into the process equipment in a timely manner;

As shown in FIG. 9 , it is a combination diagram of the tray lifting mechanism 80, which has a vertical rail 82 of a third slide 81, and a conveying platform 83 mounted on the third slide 81 that can move up and down. The double-layer trays 91 are placed on the conveying platform 83 and through the displacement of the third sliding seat 81, the recycled double-layer trays 91 can be transported to the empty tray conveying mechanism.

As shown in Figure 10, it is a combination diagram of a double-layer tray receiving device 200 connected to a double-layer tray receiving device 100 and a double-layer tray return conveying device 300. In the board device 200, the circuit board boards that have completed the manufacturing process will be taken out from the double-layer tray and placed on the tray to be removed by a trolley, and the double-layer tray 91 after the circuit board boards are removed will pass through the double-layer tray. The disk return conveying device 300 is used to return and convey the disks one by one to the disk lifting mechanism 80 and the empty disk conveying mechanism 20 in the device 100, so as to be put into the process again.

This device is placed on the front side of the reflow furnace process equipment, and is used to put the circuit board parts into the double-layer tray, and then transport the double-layer tray with the circuit board parts into the process equipment. The steps are described in a~h in detail:

a) The double-layer tray 91 returned by the tray lifting mechanism 80 and the circuit board board 92 inserted from the outside are transported to the positioning through the empty tray conveying mechanism 20 and the board conveying mechanism 30 respectively. the

b) The tray arm 53 grabs the double-layer tray 91 on the empty tray conveying mechanism 20 with the gripper module 55 and shifts it to the tray lifting mechanism 40 .

c) The two sets of pressing plates 44 act to press down the lower cover of the double-layer tray 91 , and the two sets of push rods 43 push open the upper cover of the double-layer tray 91 .

d) The tray arm 53 uses the suction cup module 54 to absorb the upper cover of the double-layer tray 91 while lifting it up.

e) The board arm 63 absorbs the circuit board board 92 on the board conveying mechanism 30 and places it on the lower cover of the double-layer tray 91 . the

f) The carrier arm 53 lowers the upper cover so that the circuit board member 92 is positioned between the upper and lower covers, and the upper and lower covers of the double-layer carrier 91 are engaged with each other.

g) The tray lifting mechanism 40 sends the double-layer tray 91 that has been placed into the circuit board 92 into the front end of the full-load tray delivery mechanism 70, and then passes through the third roller delivery platform of the full-load tray delivery mechanism 70 72 Send the double-layer tray 91 into the process equipment.

h) Repeat steps a to g.

According to the aforementioned operation steps, it can be known that this device is placed on the front side of the process equipment, and no human assistance is needed during the board feeding process. The utility model can put the circuit board board 92 into the double-layer tray 91, and The double-layer tray 91 that has been placed in the circuit board parts 92 is automatically sent to the process equipment, so as to reduce the cost of labor and thus contribute to the improvement of process efficiency.

The above-mentioned embodiments only express various implementation modes of the present utility model, and the description thereof is relatively specific and detailed, but it should not be construed as limiting the patent scope of the present utility model. It should be noted that those skilled in the art can make several modifications and improvements without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the scope of protection of the utility model patent should be based on the appended claims.

Claims (4)

1. A board feeding device for a double-layer tray, which is used to automatically place the circuit board parts into the double-layer tray, and then transport the double-layer tray that has been placed into the circuit board into the process equipment to complete The board feeding device for circuit board processing is characterized in that the board feeding device for the double-layer tray includes: A machine base, used for installing the mechanism of the plate feeding device of the double-layer tray; An empty disk conveying mechanism, which has a first roller conveying platform driven by a first motor, and is used to convey the double-layer carrier disk to a certain position; A board conveying mechanism, which has a belt conveying table driven by a second motor, for conveying circuit board boards to a certain position; A tray lifting mechanism, which has a second roller conveying platform driven by a third motor, two sets of ejector rods that can move upwards, and two sets of pressure plates with functions of front-back and up-down displacement, used to lift the double-layer trays the upper cover; A tray transfer mechanism, which has a transverse track of a first slide seat, and a tray arm mounted on the first slide seat that can move up and down, and the tray arm can move smoothly with the first slide seat moves on the transverse track; A plate transfer mechanism, which has a longitudinal track of a second slide, and a plate arm that can move up and down on the second slide, and the plate arm can move smoothly with the second slide ground moves on the longitudinal track; A fully loaded tray conveying mechanism, which has a third roller conveying platform driven by a fourth motor, used to transport the double-layer carrier trays that have been placed in the circuit board board into the process equipment; The board feeding device of the double-layer tray is placed on the front side of the process equipment. When the double-layer tray and the circuit board are respectively transported to the position by the empty tray conveying mechanism and the board conveying mechanism, the tray The arm is about to shift the double-layer tray to the upper mechanism of the tray, and after the two sets of ejector pins push away the upper cover of the double-layer tray, the arm of the tray is about to lift the upper cover; then, the The board arm places the circuit board board above the lower cover of the double-layer carrier, and then, the carrier arm lowers the upper cover so that the circuit board board is positioned between the upper and lower covers; finally, The double-layer carrier tray that has been placed in the circuit board is sent into the process equipment through the full-load tray conveying mechanism, and the board feeding operation of the double-layer carrier tray is completed. 2 . The plate feeding device for double-layer trays according to claim 1 , wherein the tray arm of the tray transfer mechanism has a suction cup module and a gripper module at the same time. 3 . 3. The plate feeding device for double-layer trays according to claim 1, wherein the empty tray conveying mechanism is provided with a first optical detection device, and the plate conveying mechanism is provided with a second optical detection device The device, the tray lifting mechanism is provided with a third optical detection device, and the full tray transport mechanism is provided with a fourth optical detection device. 4. The device for feeding double-layer trays according to any one of claims 1 to 3, further comprising a tray lifting mechanism, the rear side of the process equipment is connected to a double-layer tray The receiving device of the double-layer carrier; between the board feeding device of the double-layer carrier and the receiving device of the double-layer carrier, a double-layer carrier return conveying device is connected to automatically transfer the circuit board parts that have completed the process Take out from the double-layer carrier tray; the double-layer carrier trays that have been removed from the circuit board parts are returned one by one to the carrier lifting mechanism in the plate delivery device of the double-layer carrier tray, and then transported to the empty tray conveying mechanism, Put the double-layer tray into the process again.