CN204578945U - Thermal components for mobile devices - Google Patents

Abstract

A heat radiation component suitable for a mobile device is provided with a frame body and a heat radiation element, wherein the frame body is provided with an installation hole, the installation hole penetrates through the frame body, the heat radiation element is fixed in the installation hole, the heat radiation element is provided with two fixing sheets, the two fixing sheets are respectively formed on the heat radiation element, and the two fixing sheets can be directly fixed on the inner side surface of the installation hole respectively in a welding mode so as to achieve the effect of fixing the heat radiation element and not influencing the thickness.

Description

Thermal components for mobile devices

technical field

The utility model relates to a heat dissipation component, in particular to a heat dissipation component suitable for a mobile device, which can directly fix a thin heat pipe on a frame by welding, and can avoid affecting the thickness of the mobile device.

Background technique

Please refer to Fig. 8, the middle layer frame of mobile devices such as existing mobile phone or tablet, it has a middle frame 70, a perforation 71, a heat pipe 80 and a patch 90, and this middle frame 70 is a frame, and this perforation 71 runs through Formed on the middle frame 70, the heat pipe 80 is arranged in the perforation 71, the patch 90 is arranged on the heat pipe 80 and the bottom plate of the middle frame 70, and the heat pipe 80 can be arranged on the processor and other calculations in the mobile device. The lower part of the unit can absorb the heat energy generated by the operation unit during operation.

The thickness of existing mobile devices is getting thinner and thinner, and the thickness of each component in the mobile device is also more demanding. However, when the patch 90 is set to fix the heat pipe 80 and the bottom plate of the middle frame 70 If the overall thickness of the middle frame 70 is increased, the effect of reducing the thickness cannot be achieved, and after the back cover of the mobile device is equipped with the middle frame 70 provided with the patch 90, the back cover may bulge, which will also affect the The tightness when the back cover of the mobile device is installed.

Utility model content

The technical problem to be solved by the utility model is to provide a heat dissipation component suitable for the mobile device by improving the disadvantages of existing mobile devices that the thickness of the heat pipes will be affected, and improving its shortcomings and lacks.

In order to achieve the above purpose, the utility model provides a heat dissipation assembly suitable for a mobile device, which can directly fix the thin heat pipe on the frame by welding, which can avoid affecting the thickness of the mobile device.

The utility model provides a heat dissipation assembly suitable for a mobile device, which includes:

A frame, which has a chamber, an outer frame, a board and a mounting hole, the outer frame is located on the frame, the board is located on the frame and the outer frame surrounds the board, the mounting holes are located through the plate body; and

A heat dissipation element is arranged in the frame, and it has a heat pipe body and a fixing piece. The heat pipe body is arranged in the installation hole, and the heat pipe body has an inner chamber, an outer periphery and a bottom periphery. The cavity is located in the heat pipe body, the outer peripheral edge is located on the heat pipe body, the bottom peripheral edge is located at the bottom of the heat pipe body, and the two fixing pieces are thin sheets, respectively located on the heat pipe body, and respectively fixed in the installation holes on the inner surface of the .

The above-mentioned heat dissipation assembly suitable for mobile devices is characterized in that the installation hole has a lower fixing part and an upper fixing part, the lower fixing part is located at the bottom of the inner peripheral edge of the installation hole, and the upper fixing part is located at the installation hole. The top of the inner peripheral edge of the hole, the outer peripheral edge has two side edges and two end edges, the two side edges are respectively located on two sides of the outer peripheral edge, and the two side edges are opposite, and the two end edges are respectively located at the two ends of the outer peripheral edge.

The above-mentioned heat dissipation assembly suitable for mobile devices is characterized in that the heat dissipation element has two fixed pieces, the fixed pieces are rectangular pieces, and the two fixed pieces are respectively located on the two side edges of the heat dissipation element, and the two fixed pieces are connected to the The lower fixing parts are welded and fixed to each other.

The above-mentioned heat dissipation assembly suitable for mobile devices is characterized in that the fixed piece is an arc-shaped piece, and the two fixed pieces are respectively located on the two end edges of the heat dissipation element, and the two fixed pieces are welded and fixed on the inner surface of the installation hole superior.

The above-mentioned heat dissipation assembly suitable for a mobile device is characterized in that the heat dissipation element has two fixing pieces, the two fixing pieces are respectively located on the bottom peripheral edge, and the two fixing pieces are welded to the upper fixing portion.

The beneficial effects of the utility model are:

The utility model can avoid the need to use patches to fix the heat pipe body and the frame body, and can directly fix the two fixing pieces on the inner surface of the installation hole by welding, so as to achieve the purpose of fixing the heat pipe The main body will not affect the thickness effect at the same time.

The utility model will be described in detail below in conjunction with the accompanying drawings and specific embodiments, but not as a limitation of the utility model.

Description of drawings

Fig. 1 is the perspective view of the first embodiment of the utility model;

Fig. 2 is a partial enlarged view of the front section of the first embodiment of the utility model;

Fig. 3 is a partial enlarged view of the front section of the third embodiment of the utility model;

Fig. 4 is a three-dimensional appearance view of the heat dissipation element of the first embodiment of the present invention;

Fig. 5 is a three-dimensional appearance view of the heat dissipation element of the second embodiment of the present invention;

Fig. 6 is the front view of the heat dissipation element of the first embodiment of the utility model;

Fig. 7 is a front view of the heat dissipation element of the third embodiment of the present invention;

Fig. 8 is a partial enlarged view of the front section of the existing middle frame.

Among them, reference signs

10 frames

101 Containment Room

11 outer frame

12 board body

13 mounting holes

131 lower fixed part

132 upper fixed part

20 cooling elements

21 Heat pipe body

211 inner chamber

212 Sintering Department

213 Outer edge

2131 Side edge

2132 Edge

214 Bottom perimeter

22 fixed piece

22a Fixed piece

22b Fixed piece

70 middle frame

71 piercing

80 heat pipes

90 patches

Detailed ways

Below in conjunction with accompanying drawing, structural principle and working principle of the present invention are specifically described:

Please refer to FIG. 1 to FIG. 3 , the heat dissipation assembly suitable for mobile devices of the present invention includes a frame body 10 and a heat dissipation element 20 .

The frame 10 has a chamber 101 , an outer frame 11 , a board 12 and a mounting hole 13 . The chamber 101 is formed in the frame body 10 . The outer frame 11 is formed on the frame body 10 . The board body 12 is formed on the frame body 10 and surrounded by the outer frame 11 . The mounting hole 13 is formed through the plate body 12, the mounting hole 13 has a lower fixing portion 131 and an upper fixing portion 132, the lower fixing portion 131 is formed at the bottom of the inner periphery of the mounting hole 13, the upper The fixing portion 132 is formed on the top of the inner peripheral edge of the mounting hole 13 .

Please refer to Fig. 4 to Fig. 7, the heat dissipation element 20 can be a thin heat pipe, which is arranged in the installation hole 13, and has a heat pipe body 21 and two fixing pieces 22, and the heat pipe body 21 is arranged in the installation hole 13, and the heat pipe body 21 has an inner chamber 211, a sintered portion 212, a coolant, an outer peripheral edge 213 and a bottom peripheral edge 214, the inner chamber 211 is formed in the heat pipe body 21, the sintered portion 212 can be metal sintering powder, metal mesh, or braided metal fibers, and the sintering part 212 is disposed in the inner chamber 211 . The coolant can be water or other liquids capable of phase change, and the coolant is disposed in the inner chamber 211 . One end of the heat pipe body 21 can be closely attached to the computing unit or a heat-generating element, and absorb heat through the coolant in the inner chamber 211, and then the coolant is transformed into a gaseous state through a phase change and then floated to the The other end of the inner chamber 211 is finally condensed on the sintered part 212 through capillary phenomenon and reflowed to the end attached to the computing unit or heating element. The outer peripheral edge 213 is formed on the heat pipe body 21, and the outer peripheral edge 213 has two side edges 2131 and two end edges 2132, the two side edges 2131 are respectively formed on two sides of the outer peripheral edge 213, and the two side edges 2131 are opposite. , the two end edges 2132 are respectively formed on two ends of the outer peripheral edge 213 . The bottom peripheral edge 214 is formed on the bottom of the heat pipe body 21 . The fixing piece 22 is a thin piece, and the two fixing pieces 22 are respectively formed on the heat pipe body 21 , and the two fixing pieces 22 are respectively fixed on the inner surface of the installation hole 13 .

In the first embodiment of the present utility model, the heat dissipation element 20 has two fixing pieces 22, the fixing pieces 22 are rectangular pieces, and the two fixing pieces 22 are respectively formed on the two side edges 2131 of the heat dissipation element 20, and The two fixing pieces 22 are welded and fixed to the lower fixing portion 131 , as shown in FIG. 2 , FIG. 4 and FIG. 6 .

In the second embodiment of the present utility model, the fixing piece 22a is an arc-shaped piece, and the two fixing pieces 22a are respectively formed on the two ends 2132 of the heat dissipation element 20, and the two fixing pieces 22a are welded and fixed in the installation hole 13 on the inside surface, as shown in Figure 5.

Wherein, in the third embodiment of the present utility model, the heat dissipation element 20 has two fixing pieces 22b, and the two fixing pieces 22b are respectively formed on the bottom peripheral edge 214, and the two fixing pieces 22b are welded and fixed to the upper fixing portion 132, As shown in Figure 3 and Figure 7.

Through the above technical means, the utility model has the advantage that the fixing sheet 22 is formed on the heat pipe body 21 and fixed on the inner surface of the installation hole 13, which can avoid the need to use a patch to attach the heat pipe body 21 to the heat pipe body 21. The frames 10 are fixed to each other, and the two fixing pieces 22 can be directly fixed on the inner surface of the installation hole 13 by welding, so as to achieve the effect of fixing the heat pipe body 21 without affecting the thickness.

Of course, the utility model can also have other various embodiments, and those skilled in the art can make various corresponding changes and deformations according to the utility model without departing from the spirit and essence of the utility model, but These corresponding changes and deformations should all belong to the protection scope of the appended claims of the present utility model.

Claims (5)

1. A cooling assembly suitable for mobile devices, characterized in that it comprises: A frame, which has a chamber, an outer frame, a board and a mounting hole, the outer frame is located on the frame, the board is located on the frame and the outer frame surrounds the board, the mounting holes are located through the plate body; and A heat dissipation element is arranged in the frame, and it has a heat pipe body and a fixing piece. The heat pipe body is arranged in the installation hole, and the heat pipe body has an inner chamber, an outer periphery and a bottom periphery. The cavity is located in the heat pipe body, the outer peripheral edge is located on the heat pipe body, the bottom peripheral edge is located at the bottom of the heat pipe body, and the two fixing pieces are thin sheets, respectively located on the heat pipe body, and respectively fixed in the installation holes on the inner surface of the . 2. The heat dissipation assembly suitable for mobile devices according to claim 1, wherein the mounting hole has a lower fixing portion and an upper fixing portion, the lower fixing portion is located at the bottom of the inner periphery of the mounting hole, the The upper fixing part is located on the top of the inner peripheral edge of the installation hole. The outer peripheral edge has two side edges and two end edges. both ends of the outer periphery. 3. The heat dissipation assembly suitable for mobile devices according to claim 1 or 2, wherein the heat dissipation element has two fixing pieces, the fixing pieces are rectangular pieces, and the two fixing pieces are respectively located on two sides of the heat dissipation element. on the side edge, and the two fixing pieces and the lower fixing part are welded and fixed to each other. 4. The heat dissipation assembly suitable for mobile devices as claimed in claim 1 or 2, wherein the fixed piece is an arc-shaped piece, and the two fixed pieces are respectively located on the two end edges of the heat dissipation element, and the two fixed pieces are welded fixed on the inner surface of the mounting hole. 5. The heat dissipation assembly suitable for mobile devices as claimed in claim 1 or 2, wherein the heat dissipation element has two fixing pieces, the two fixing pieces are respectively located on the bottom peripheral edge, and the two fixing pieces are connected to the upper fixing portion welded to each other.