CN204325482U - The tie-in module of a kind of sputtering target material and backboard - Google Patents
The tie-in module of a kind of sputtering target material and backboard Download PDFInfo
- Publication number
- CN204325482U CN204325482U CN201420821774.6U CN201420821774U CN204325482U CN 204325482 U CN204325482 U CN 204325482U CN 201420821774 U CN201420821774 U CN 201420821774U CN 204325482 U CN204325482 U CN 204325482U
- Authority
- CN
- China
- Prior art keywords
- target
- backboard
- groove
- assembly
- flange
- Prior art date
Links
- 239000000463 materials Substances 0.000 title claims abstract description 43
- 238000005477 sputtering target Methods 0.000 title claims abstract description 31
- 238000003825 pressing Methods 0.000 claims abstract description 10
- 230000000875 corresponding Effects 0.000 claims abstract description 5
- 108700004703 chimera Proteins 0.000 claims description 6
- 239000011295 pitches Substances 0.000 claims description 6
- 238000001513 hot isostatic pressing Methods 0.000 abstract description 7
- 238000007731 hot pressing Methods 0.000 abstract description 4
- 238000009792 diffusion process Methods 0.000 abstract description 2
- 230000002159 abnormal effects Effects 0.000 abstract 1
- 229910045601 alloys Inorganic materials 0.000 description 10
- 239000000956 alloys Substances 0.000 description 10
- REDXJYDRNCIFBQ-UHFFFAOYSA-N aluminium(3+) Chemical class data:image/svg+xml;base64,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 data:image/svg+xml;base64,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 [Al+3] REDXJYDRNCIFBQ-UHFFFAOYSA-N 0.000 description 10
- 238000003466 welding Methods 0.000 description 9
- 238000010586 diagrams Methods 0.000 description 8
- 238000004544 sputter deposition Methods 0.000 description 8
- 238000005476 soldering Methods 0.000 description 5
- 238000000034 methods Methods 0.000 description 4
- 229910000789 Aluminium-silicon alloys Inorganic materials 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 229910000838 Al alloys Inorganic materials 0.000 description 2
- 239000002826 coolants Substances 0.000 description 2
- 238000005516 engineering processes Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium Chemical compound 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- 238000004519 manufacturing process Methods 0.000 description 2
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- 239000011135 tin Substances 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N tin hydride Chemical compound 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[Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 239000011901 water Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminum Chemical compound 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 [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005755 formation reactions Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reactions Methods 0.000 description 1
- 239000002245 particles Substances 0.000 description 1
Abstract
Description
Technical field
The utility model relates to a kind of assembly of sputtering target material, is specifically related to the tie-in module of a kind of target and backboard.
Background technology
The multiple sputtering target material of industrial application is the assembly be formed by connecting by the target and backboard that meet sputtering requirement, under existing sputtering technology, target material assembly working conditions is severe, under during sputtering, target side is in high-temperature vacuum, the water coolant that backboard side then passes to certain pressure is cold by force, and therefore target material assembly both sides form huge temperature head and pressure difference, simultaneously, target side is subject to the bombardment of various particle in high-voltage electric field and high-intensity magnetic field, has amount of heat to produce.Therefore, in target manufacture, welding quality has strict demand, and welding must have good thermal conductivity, and the heat conduction that sputtering can be produced is to water coolant; Weld seam must have certain intensity, otherwise target will be caused to deform under heating condition, ftracture, and affects quality of forming film and even causes damage to sputtering machine table.
Usually, the large-area welding of existing target and backboard carries out with soldering and hot isostatic pressing (HIP) mode.Brazing solder is generally indium and tin, but limits by the fusing point of indium and tin, and this mode of connection is only suitable for the target material assembly that size is less, sputtering power is lower.When sputtering power increases to a certain degree, this target material assembly will lose efficacy because of the fusing of solder.HIP welding can ensure the high-intensity welding of target, and is applicable to high-power sputtering, but HIP technological temperature is higher, malleable target internal organizational structure, reduces target performance.In order to ensure target quality, the tie-in module of a kind of novel target and backboard need be developed.
Patent CN101564793A discloses the welding process of a kind of aluminum target blank and aluminum alloy back plate, and it is the diffusion welding method of the routine taked, and add jacket outward at target base and backboard, complex process before welding, weld cycle is long.CN102430865A discloses a kind of target material welding method of alternative soldering and the target material assembly of formation, and its adopts and backboard processes dovetail-indent and connect target base and backboard and form subassembly.The major defect of the method is that target base material can not be filled in conjunction with gap completely, and bonding strength is less than normal, thus affects target quality.In addition, the amount of finish of this subassembly is large, is easily out of shape.Therefore, design and a kind ofly ensure high quality switching performance and use properties and the convenient target processed is very necessary.
Utility model content
For the problems referred to above of prior art, the utility model provides the tie-in module of a kind of sputtering target material and backboard, realizes large-area target and welds with the fast and reliable of backboard, ensures quality product and working (machining) efficiency.
For achieving the above object, the utility model provides following technical scheme:
A tie-in module for sputtering target material and backboard, this tie-in module is made up of sputtering target material portion and backboard portion;
The joint face in this sputtering target material portion has boss, boss is provided with multiple flange; The joint face in backboard portion has caulking groove, in caulking groove, is provided with multiple groove; Match with this boss in shape, the position of this caulking groove; The shape of the plurality of flange, position respectively with the plurality of fit depressions;
The surface be connected with sputtering target material between adjacent grooves is provided with a plurality of double wedge;
This sputtering target material portion and backboard portion are fitting to connection mutually, and in the assembly be connected to form, the boss of sputtering target material embeds in the caulking groove of backboard, and boss upper flange embeds in the groove in caulking groove simultaneously, and the double wedge pressing between groove embeds in sputtering target material;
Chimeric sputtering target material portion and edge, backboard portion adopt vacuum seal.
Assembly as above, preferably, the multiple flanges on described boss, each flange is ring-like, and multiple flange is annular concentric arrangement; Multiple grooves on described caulking groove, each groove is ring-like, and multiple groove is annular concentric arrangement, and its size and position are corresponding with the plurality of flange respectively.
Assembly as above, preferably, the axial cross section of described flange is rectangle, and the axial cross section of described groove is trapezoidal, base angle≤90 °, and the section area of this flange is not more than the section area of groove.
Assembly as above, preferably, on described target, each flange is wide is 1-10mm, and be highly 0.2-5mm, arrangement pitches is 1-10mm.
Assembly as above, preferably, described backboard fovea superior groove width is 1-10mm, and the degree of depth is 0.2-5mm, and arrangement pitches is 1-10mm.
Assembly as above, preferably, described raised teeth number is no less than 2, and single double wedge is wide is 0.5-5mm, and double wedge is 0.1-5mm deeply.
The beneficial effects of the utility model are embodied in the following aspects:
1, realize target to be connected with the big area of backboard, suitable material is extensive;
2, to process coordinating size comparatively wide in range for this component calls target and backboard, is beneficial to processing, improves production efficiency;
3, this assembly can adopt the multiple method such as hot isostatic pressing, isostatic cool pressing, hot pressing to carry out connection handling to target and backboard, and Heating temperature is low, and Bonding pressure is little, low for equipment requirements;
4, pass through vacuum seal target and backboard in this assembly, make junction be in vacuum state, effectively prevent the oxidation of joint face, improve bonding properties.
5, Novel convex tooth Shape Design is adopted, with coordinating of groove, flange can ensure that target material fills double wedge shape gap completely, improve bonding strength, the connection of target and backboard is carried out by the mode of pressurization, can fill in conjunction with gap completely after connection, improve the bonding strength of target and backboard, bonding strength reaches more than 30MPa, welded rate reaches more than 98%, ensure that target quality.
Accompanying drawing explanation
Fig. 1 is the axial section of target material assembly in a kind of preferred embodiments of the utility model;
Fig. 2 is target and backboard axial section separately before target material assembly shown in Fig. 1 connects;
Fig. 3 is target joint face schematic diagram, and wherein a is axial section, comprises the flange schematic diagram of partial enlargement, and b is the floor map of flange arrangement;
Fig. 4 is backboard joint face schematic diagram, and wherein a is axial section, comprises groove and the double wedge shape schematic diagram of partial enlargement; B is the floor map (wherein, convex tooth shape character is not shown in the diagram) of groove and the arrangement of double wedge shape;
Fig. 5 is target and the backboard bonding surface schematic diagram of a kind of preferred implementation of the utility model;
Fig. 6 is target and the backboard bonding surface schematic diagram of a kind of preferred implementation of the utility model;
Fig. 7 is target and backboard pressing schematic diagram after soldering and sealing.
Fig. 8 is the diagrammatic cross-section that in Fig. 6, target is connected with backboard with the target of assembly after rear panel structure pressing.
Embodiment
Below in conjunction with specific embodiment, assembly of the present utility model is described further.
The tie-in module of the high-purity Al of embodiment 1 (99.9995%) and 6061Al alloy backboard
As shown in Figure 1, this tie-in module is made up of high-purity Al sputtering target material portion I and 6061Al alloy backboard portion II, sputtering target material portion diameter 280mm; Backboard portion diameter 320mm.
As shown in Figure 2, high-purity Al target portion joint face has on round boss 1,6061Al aluminum alloy back plate portion joint face there is circular caulking groove 2.The diameter (D11) of boss 1 is equal with the diameter (D21) of caulking groove 2, is 260mm; The height (H10) of boss 1 equals the degree of depth (H20) of caulking groove 2, is 10mm.
As shown in Figure 3 a and Figure 3 b shows, the joint face 11 of boss 1 is provided with the flange 13 that multiple axial cross section is rectangle, and each flange is ring-like, and multiple flange is annular concentric arrangement; Flange height (H11) 1mm, width (L11) 1mm, arrangement pitches (L12) is 1mm.
As shown in figures 4 a and 4b, the position corresponding with flange 13, caulking groove 2 bottom surface, 6061Al alloy backboard portion is provided with multiple groove 23, and each groove is ring-like, and multiple groove is annular concentric arrangement.Groove base angle is 80 °.The surface be connected with sputtering target material between adjacent two grooves is provided with 2 double wedges 24, and as shown in Fig. 4 a-A, groove 23 degree of depth (H21) 1mm, groove 23 upper end width (L22) is 1mm, 2 double wedge total widths (L21) 1mm, double wedge dark (H22) 0.5mm, the wide 0.5mm of single double wedge.
As shown in Fig. 1, Fig. 5 and Fig. 6, after target is chimeric with backboard, boss 1 embeds in caulking groove 2, and multiple flange 13 embeds in the groove 23 of correspondence position respectively.After chimeric, sputtering target material portion and edge, backboard portion adopt vacuum seal.
Soldering and sealing can adopt the method such as hot isostatic pressing, isostatic cool pressing, hot pressing to carry out connection handling to target and backboard after connecting.
Switching performance is checked: the assembly of two kinds of profiles of tooth is carried out C-Scan scanning, finds its welded rate >=98%.Use universal tensile machine to test its bonding strength, target and backboard bonding strength are 41MPa.
The tie-in module of the high-purity AlSi alloy (99.9995%) of embodiment 2 and 5052Al alloy backboard
As shown in Figure 1, this tie-in module is made up of high-purity AlSi alloy sputtering target portion I and 5052Al alloy backboard portion II, sputtering target material portion diameter 350mm; Backboard portion diameter 400mm.
As shown in Figure 2, high-purity AlSi alloy target material portion joint face has on round boss 1,5052Al alloy backboard portion joint face there is circular caulking groove 2.The diameter (D11) of boss 1 is equal with the diameter (D21) of caulking groove 2, is 320mm; The height (H10) of boss 1 equals the degree of depth (H20) of caulking groove 2, is 15mm.
As shown in Figure 3 a and Figure 3 b shows, the joint face 11 of boss 1 is provided with the flange 13 that multiple axial cross section is rectangle, and each flange is ring-like, and multiple flange is annular concentric arrangement; Flange height (H11) 3mm, width (L11) 4mm, arrangement pitches (L12) is 4mm.
As shown in figures 4 a and 4b, the position corresponding with flange 13, caulking groove 2 bottom surface, 5052Al alloy backboard portion is provided with multiple groove 23, and each groove is ring-like, and multiple groove is annular concentric arrangement.Groove base angle is 60 °.The surface be connected with sputtering target material between adjacent two grooves is provided with a plurality of double wedge 24.
Shown in Fig. 4 a-B, double wedge quantity is 4, groove 23 degree of depth (H21) 3mm, and groove 23 upper end width (L22) is 4mm, 4 double wedge total width (L21) 4mm, double wedge dark (H22) 1mm, the wide 0.5mm of single double wedge.
As shown in Fig. 1, Fig. 5 and Fig. 6, after target is chimeric with backboard, boss 1 embeds in caulking groove 2, and multiple flange 13 embeds in the groove 23 of correspondence position respectively.After chimeric, sputtering target material portion and edge, backboard portion adopt vacuum seal.
Soldering and sealing can adopt the method such as hot isostatic pressing, isostatic cool pressing, hot pressing to carry out connection handling to target and backboard after connecting.As shown in Figure 7 and Figure 8, after pressurization, flange 13 is full of groove 23, and double wedge 24 pressing between groove embeds in sputtering target material.
Switching performance is checked: the assembly of two kinds of profiles of tooth is carried out C-Scan scanning, finds its welded rate >=98%.Use universal tensile machine to test its bonding strength, target and backboard bonding strength are 50MPa.
Claims (6)
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107457495A (en) * | 2016-06-06 | 2017-12-12 | 宁波江丰电子材料股份有限公司 | The manufacture method of backboard and its manufacture method and target material assembly |
| CN108220891A (en) * | 2016-12-14 | 2018-06-29 | 宁波江丰电子材料股份有限公司 | Long-life target material assembly and forming method thereof |
| CN108367537A (en) * | 2015-07-13 | 2018-08-03 | 雅宝公司 | The method that solid-state lithium low pressure cold is bound to metal base |
| CN108581169A (en) * | 2018-05-04 | 2018-09-28 | 宁波江丰电子材料股份有限公司 | Target material assembly and processing method |
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2014
- 2014-12-22 CN CN201420821774.6U patent/CN204325482U/en active IP Right Grant
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108367537A (en) * | 2015-07-13 | 2018-08-03 | 雅宝公司 | The method that solid-state lithium low pressure cold is bound to metal base |
| CN107457495A (en) * | 2016-06-06 | 2017-12-12 | 宁波江丰电子材料股份有限公司 | The manufacture method of backboard and its manufacture method and target material assembly |
| CN108220891A (en) * | 2016-12-14 | 2018-06-29 | 宁波江丰电子材料股份有限公司 | Long-life target material assembly and forming method thereof |
| CN108581169A (en) * | 2018-05-04 | 2018-09-28 | 宁波江丰电子材料股份有限公司 | Target material assembly and processing method |
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