CN204249124U - For the cutter sweep of silicon single crystal rod - Google Patents

For the cutter sweep of silicon single crystal rod Download PDF

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Publication number
CN204249124U
CN204249124U CN201420734929.2U CN201420734929U CN204249124U CN 204249124 U CN204249124 U CN 204249124U CN 201420734929 U CN201420734929 U CN 201420734929U CN 204249124 U CN204249124 U CN 204249124U
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CN
China
Prior art keywords
line roller
workbench
steel wire
cutter sweep
gripper shoe
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201420734929.2U
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Chinese (zh)
Inventor
陈五奎
李军
陈辉
耿荣军
徐文州
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Leshan Topraycell Co Ltd
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Leshan Topraycell Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
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Application filed by Leshan Topraycell Co Ltd filed Critical Leshan Topraycell Co Ltd
Priority to CN201420734929.2U priority Critical patent/CN204249124U/en
Application granted granted Critical
Publication of CN204249124U publication Critical patent/CN204249124U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses a kind of can minimizing and cut loss and the easy to operate cutter sweep for silicon single crystal rod.This cutter sweep, comprise support, workbench, multiple steel wire cutter sweep is provided with above described workbench, the upper surface of described workbench is provided with multiple gripper shoe parallel to each other, described gripper shoe is along the setting of the steel wire direction of motion and the surface of the surface of gripper shoe and workbench is orthogonal, in described each gripper shoe, identical position is provided with multiple semicircular breach, and the radius of described breach is identical with the radius of silicon rod.The whole process operation of this cutter sweep is very convenient, and adopts steel wire cutting silicon rod, and the monocrystalline caused loss is very little, can be greatly cost-saving, meanwhile, the silicon rod cross section unusual light that steel wire cuts out, can use without the need to carrying out process to cut surface, decreasing cross section treatment process.Be adapted at solar cell process equipment field to apply.

Description

For the cutter sweep of silicon single crystal rod
Technical field
The utility model relates to solar cell process equipment field, especially a kind of cutter sweep for silicon single crystal rod.
Background technology
21 century, world energy sources crisis facilitates the development of photovoltaic market, and crystal silicon solar energy battery is the leading products of photovoltaic industry.Along with countries in the world are to the further attention of solar photovoltaic industry, particularly developed country has formulated a series of support policy, encourage to develop solar energy, in addition, along with the continuous expansion of silicon solar cell application surface, the demand of solar cell is increasing, and the demand of silicon single crystal material is also just increasing.
Monocrystalline silicon is a kind of semi-conducting material, and be generally used for and manufacture integrated circuit and other electronic components, monocrystalline silicon growing technology has two kinds: one is zone-melting process, and another kind is vertical pulling method, and wherein vertical pulling method makes the current method generally adopted.
The method of monocrystalline growth with czochralski silicon is as follows: the silica crucible highly purified polycrystalline silicon raw material being put into single crystal growing furnace, then heat fused under the protection of slumpability gas is had in low vacuum, the monocrystalline silicon in particular growth direction (being also called seed crystal) is had to load in seed crystal clamping device one, and seed crystal is contacted with silicon solution, the temperature of adjustment molten silicon solution, make it close to melting temperature, then seed crystal is driven to stretch in the silicon solution of melting and to rotate from top to bottom, then slowly upper lifting seed is brilliant, now, monocrystalline silicon enters the growth of conical section, when the diameter of cone is close to aimed dia, improve the hoisting velocity of seed crystal, monocrystalline silicon body diameter is made no longer to increase and enter the middle part growth phase of crystal, at the end of monocrystalline silicon body growth is close, improve the hoisting velocity of seed crystal again, monocrystalline silicon body departs from molten silicon gradually, form lower cone and terminate growth.The monocrystalline silicon grown out in this way, its shape is two sections of tapered cylinders, is cut into slices by this cylinder, namely obtains single-crystal semiconductor raw material, and this circular single crystal silicon chip just can as the material of integrated circuit or solar energy.
In photovoltaic industry, adopt the general volume of silicon single crystal rod made of vertical pulling method comparatively large, could use after usually needing silicon single crystal rod to cut into the crystal block of small volume.
At present, cutting for silicon single crystal rod mainly adopts diamond saw blade cutting, because the thickness of diamond saw blade is generally about 3mm, if with the diamond saw blade cutting silicon single crystal rod that 3mm is thick, just have the kerf loss of 3mm, that is the thick monocrystal material of 3mm is wasted to I haven't seen you for ages, the utilization rate of monocrystalline is lower, and monocrystalline is expensive, the low production cost of monocrystalline silicon that will cause of Single Crystal Utilization Ratio increases greatly, and, use diamond saw blade to cut height and cut seed crystal, the cut surface of seed crystal is rough, also need to carry out subsequent handling process to cut surface, not only complex procedures and cost are also comparatively, in addition, existing cutter sweep complex structure, cutting is got up very inconvenient.
Utility model content
Technical problem to be solved in the utility model is to provide a kind of can minimizing and cuts loss and the easy to operate cutter sweep for silicon single crystal rod.
The utility model solves the technical scheme that its technical problem adopts: this is used for the cutter sweep of silicon single crystal rod, comprise support, workbench, multiple steel wire cutter sweep is provided with above described workbench, described steel wire cutter sweep comprises initiatively line roller, steel wire without a head, First Line roller, second line roller, 3rd line roller, described First Line roller, second line roller is arranged on the side of workbench and First Line roller is arranged on the top of the second line roller, described 3rd line roller is arranged on the opposite side of workbench, initiatively line roller walked around successively by described steel wire without a head, First Line roller, 3rd line roller, second line roller, initiatively line roller iterative cycles moves, the centre position of described workbench lower surface is fixed with sleeve, screw mandrel is provided with in described sleeve, described screw mandrel is connected with bush whorl, the lower end of described screw mandrel is fixed on support by bearing, described screw mandrel is connected with the drive motors rotated for screw mandrel, the upper surface of described workbench is provided with multiple gripper shoe parallel to each other, described gripper shoe is along the setting of the steel wire direction of motion and the surface of the surface of gripper shoe and workbench is orthogonal, in described each gripper shoe, identical position is provided with multiple semicircular breach, the radius of described breach is identical with the radius of silicon rod.
Further, the surface of described active line roller, First Line roller, the second line roller, the 3rd line roller is provided with wire casing.
Further, be provided with many support bars below described workbench, one end of described support bar is fixed on the lower surface of workbench, and the other end is fixed on the outer surface of sleeve.
Further, described gripper shoe is fixing on the table by demountable structure.
The beneficial effects of the utility model are: this is used for the cutter sweep of silicon single crystal rod in use, only need put into semicircular breach by needing the silicon single crystal rod of cutting, then initiatively line roller is made to rotate and then drive steel wire high-speed mobile, now, screw mandrel is driven to rotate by drive motors, because screw mandrel is connected with bush whorl, thus screw mandrel rotates and sleeve can be made to move along screw mandrel axial direction, and then push work platform moves up, silicon single crystal rod is contacted with steel wire gradually, after silicon single crystal rod contacts with the steel wire of high-speed mobile, steel wire cuts silicon single crystal rod, workbench continues to move up and knows that silicon rod is completely severed, after silicon single crystal rod is cut-off, drive motors reversely rotates, screw mandrel band moving sleeve moves down, and then workbench moves down, move to after keeping a safe distance with steel wire, the silicon rod of well cutting is taken off, put into the silicon rod of new needs cutting again, repetition above-mentioned steps, whole process operation is very convenient, and adopt steel wire cutting silicon rod, because steel wire is thinner, the monocrystalline loss caused is very little, can be greatly cost-saving, simultaneously, the silicon rod cross section unusual light that steel wire cuts out, can use without the need to carrying out process to cut surface, decrease cross section treatment process, reduce further production cost, improve production efficiency.
Accompanying drawing explanation
Fig. 1 is the structural representation of the utility model for the cutter sweep of silicon single crystal rod;
Fig. 2 is the left side view of Fig. 1;
Be labeled as in figure: support 1, workbench 2, steel wire cutter sweep 3, initiatively line roller 301, steel wire without a head 302, First Line roller 303, second line roller 304, the 3rd line roller 305, sleeve 4, screw mandrel 5, gripper shoe 6, breach 7, support bar 8.
Detailed description of the invention
Below in conjunction with accompanying drawing, the utility model is further illustrated.
As Fig. 1, shown in 2, this is used for the cutter sweep of silicon single crystal rod, comprise support 1, workbench 2, multiple steel wire cutter sweep 3 is provided with above described workbench 2, described steel wire cutter sweep 3 comprises initiatively line roller 301, steel wire 302 without a head, First Line roller 303, second line roller 304, 3rd line roller 305, described First Line roller 303, second line roller 304 is arranged on the side of workbench 2 and First Line roller 303 is arranged on the top of the second line roller 304, described 3rd line roller 305 is arranged on the opposite side of workbench 2, initiatively line roller 301 walked around successively by described steel wire without a head 302, First Line roller 303, 3rd line roller 305, second line roller 304, initiatively line roller 301 iterative cycles moves, the centre position of described workbench 2 lower surface is fixed with sleeve 4, screw mandrel 5 is provided with in described sleeve 4, described screw mandrel 5 is threaded with sleeve 4, the lower end of described screw mandrel 5 is fixed on support 1 by bearing, described screw mandrel 5 is connected with the drive motors rotated for screw mandrel 5, the upper surface of described workbench 2 is provided with multiple gripper shoe 6 parallel to each other, described gripper shoe 6 is along the setting of the steel wire direction of motion and the surface of the surface of gripper shoe 6 and workbench 2 is orthogonal, in described each gripper shoe 6, identical position is provided with multiple semicircular breach 7, the radius of described breach 7 is identical with the radius of silicon rod.This is used for the cutter sweep of silicon single crystal rod in use, only need put into semicircular breach 7 by needing the silicon single crystal rod of cutting, then initiatively line roller 301 is made to rotate and then drive steel wire high-speed mobile, now, screw mandrel 5 is driven to rotate by drive motors, because screw mandrel 5 is threaded with sleeve 4, thus screw mandrel 5 rotates and sleeve 4 can be made to move along screw mandrel 5 axial direction, and then push work platform 2 moves up, silicon single crystal rod is contacted with steel wire gradually, after silicon single crystal rod contacts with the steel wire of high-speed mobile, steel wire cuts silicon single crystal rod, workbench 2 continues to move up and knows that silicon rod is completely severed, after silicon single crystal rod is cut-off, drive motors reversely rotates, screw mandrel 5 is with moving sleeve 4 to move down, and then workbench 2 moves down, move to after keeping a safe distance with steel wire, the silicon rod of well cutting is taken off, put into the silicon rod of new needs cutting again, repetition above-mentioned steps, whole process operation is very convenient, and adopt steel wire cutting silicon rod, because steel wire is thinner, the monocrystalline loss caused is very little, can be greatly cost-saving, simultaneously, the silicon rod cross section unusual light that steel wire cuts out, can use without the need to carrying out process to cut surface, decrease cross section treatment process, reduce further production cost, improve production efficiency.
In order to avoid steel wire to be leapt up position in the process of high-speed mobile, the surface of described active line roller 301, First Line roller 303, second line roller 304, the 3rd line roller 305 is provided with wire casing, steel wire is limited in wire casing, because steel wire is in tight state, because cannot skid off in wire casing, the quick movement that steel wire is stable can be ensured.
Whether workbench 2 steadily can move and have a great impact for steel wire cutting silicon rod, therefore workbench 2 steadily movement in uphill process must be ensured, because workbench 2 is generally heavier, in order to ensure that workbench 2 is steady when rising and decline, many support bars 8 are provided with below described workbench 2, one end of described support bar 8 is fixed on the lower surface of workbench 2, and the other end is fixed on the outer surface of sleeve 4.
In addition, conveniently adjust the position of gripper shoe 6, to adapt to the silicon rod of different size, described gripper shoe 6 is fixed on workbench 2 by demountable structure.Described demountable structure can be bolt arrangement, also can be realized by the structure of buckle, as preferably: described gripper shoe 6 is fixed with base, described base has multiple bolt hole, described workbench 2 also has multiple bolt hole, can very easily gripper shoe 6 be dismantled and be fixed like this.

Claims (4)

1. for the cutter sweep of silicon single crystal rod, it is characterized in that: comprise support (1), workbench (2), described workbench (2) top is provided with multiple steel wire cutter sweep (3), described steel wire cutter sweep (3) comprises initiatively line roller (301), steel wire without a head (302), First Line roller (303), second line roller (304), 3rd line roller (305), described First Line roller (303), second line roller (304) is arranged on the side of workbench (2) and First Line roller (303) is arranged on the top of the second line roller (304), described 3rd line roller (305) is arranged on the opposite side of workbench (2), described steel wire without a head (302) walks around initiatively line roller (301) successively, First Line roller (303), 3rd line roller (305), second line roller (304), initiatively line roller (301) iterative cycles moves, the centre position of described workbench (2) lower surface is fixed with sleeve (4), screw mandrel (5) is provided with in described sleeve (4), described screw mandrel (5) and sleeve (4) are threaded connection, the lower end of described screw mandrel (5) is fixed on support (1) by bearing, described screw mandrel (5) is connected with the drive motors rotated for screw mandrel (5), the upper surface of described workbench (2) is provided with multiple gripper shoe parallel to each other (6), described gripper shoe (6) is along the setting of the steel wire direction of motion and the surface of the surface of gripper shoe (6) and workbench (2) is orthogonal, the upper identical position of described each gripper shoe (6) is provided with multiple semicircular breach (7), the radius of described breach (7) is identical with the radius of silicon rod.
2., as claimed in claim 1 for the cutter sweep of silicon single crystal rod, it is characterized in that: the surface of described active line roller (301), First Line roller (303), the second line roller (304), the 3rd line roller (305) is provided with wire casing.
3. as claimed in claim 2 for the cutter sweep of silicon single crystal rod, it is characterized in that: described workbench (2) below is provided with many support bars (8), one end of described support bar (8) is fixed on the lower surface of workbench (2), and the other end is fixed on the outer surface of sleeve (4).
4., as claimed in claim 3 for the cutter sweep of silicon single crystal rod, it is characterized in that: described gripper shoe (6) is fixed on workbench (2) by demountable structure.
CN201420734929.2U 2014-11-27 2014-11-27 For the cutter sweep of silicon single crystal rod Expired - Fee Related CN204249124U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201420734929.2U CN204249124U (en) 2014-11-27 2014-11-27 For the cutter sweep of silicon single crystal rod

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106426580A (en) * 2016-10-19 2017-02-22 成都迅德科技有限公司 Silicon single crystal rod electric cutting-off device based on diamond wire roller
CN107584687A (en) * 2017-10-31 2018-01-16 乐山新天源太阳能科技有限公司 Annular diamond wire extracting machine
CN108890902A (en) * 2018-08-31 2018-11-27 江苏英锐半导体有限公司 A kind of silicon single crystal rod cutter device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106426580A (en) * 2016-10-19 2017-02-22 成都迅德科技有限公司 Silicon single crystal rod electric cutting-off device based on diamond wire roller
CN107584687A (en) * 2017-10-31 2018-01-16 乐山新天源太阳能科技有限公司 Annular diamond wire extracting machine
CN107584687B (en) * 2017-10-31 2024-03-26 乐山新天源太阳能科技有限公司 Annular diamond wire squaring machine
CN108890902A (en) * 2018-08-31 2018-11-27 江苏英锐半导体有限公司 A kind of silicon single crystal rod cutter device

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GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20150408

Termination date: 20201127