CN204131905U - Electronic equipment - Google Patents

Electronic equipment Download PDF

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Publication number
CN204131905U
CN204131905U CN201420539623.1U CN201420539623U CN204131905U CN 204131905 U CN204131905 U CN 204131905U CN 201420539623 U CN201420539623 U CN 201420539623U CN 204131905 U CN204131905 U CN 204131905U
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Prior art keywords
heat pipe
electronic equipment
heat
tube
projection
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CN201420539623.1U
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Chinese (zh)
Inventor
曹伟杰
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Lenovo Beijing Ltd
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Lenovo Beijing Ltd
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Priority to CN201420539623.1U priority Critical patent/CN204131905U/en
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Abstract

The utility model relates to a kind of electronic equipment, and it comprises: casing; Function element, it is arranged in described casing; Heat abstractor, it is arranged in described casing, and described heat abstractor is in the radiating end of described function element; Wherein, described heat abstractor comprises heat pipe; Described heat pipe comprises tube wall and is arranged on the projection in described tube wall; Described projection offers at least one groove.The technical scheme that the utility model provides is by the projection in the tube wall of described heat pipe offers groove, add the area of dissipation in thermotube wall, thus effectively can improve the heat transfer efficiency of heat pipe, the thermal resistance of reduction heat pipe, even if heat pipe thickness reduces, also can ensure the heat conductivility of heat pipe, guarantee the normal operation of electronic equipment.

Description

Electronic equipment
Technical field
The utility model relates to a kind of electronic equipment.
Background technology
Heat pipe is the heat conducting element relying on the phase transformation of therein working fluid to realize heat conduction, and it has the good characteristics such as high-termal conductivity, good heat conduction effect, is widely used.
In recent years, along with the development of electronic technology, the high frequency of electronic equipment, high speed and integrated circuit intensive and microminiaturized, unit volume electronic device caloric value is increased severely, the features such as efficient with it, the compact and flexibility and reliability of hot pipe technique, be applicable to solving current electronic equipment because of performance boost the heat dissipation problem that derives.
But, constantly lightening along with electronic equipment, the thickness of heat pipe is needed to be reduced to 1.0mm from 1.5mm,, directly the heat conductivility of heat pipe can be caused to be deteriorated the lower thickness of heat pipe, make heat conduction that the function element of electronic equipment internal can not distribute rapidly by heat pipe in air, affect the normal operation of electronic equipment.
Utility model content
Main purpose of the present utility model is, provides a kind of electronic equipment of new structure, to improve heat pipe for thermal conductivity efficiency, reduces the thermal resistance of heat pipe.
The purpose of this utility model and solve its technical problem and realize by the following technical solutions.
The utility model proposes a kind of electronic equipment, comprising:
Casing;
Function element, it is arranged in described casing;
Heat abstractor, it is arranged in described casing, and described heat abstractor is in the radiating end of described function element;
Wherein, described heat abstractor comprises heat pipe;
Described heat pipe comprises tube wall and is arranged on the projection in described tube wall;
Described projection offers at least one groove.
Optionally, aforesaid electronic equipment, wherein, described projection is rectangular preiection or arc convex.
Optionally, aforesaid electronic equipment, wherein,
The described projection be arranged in described tube wall is two;
Two described projections are relative, make the circulation passage in described thermotube wall be " ∞ " shape.
Optionally, aforesaid electronic equipment, wherein, described groove is rectangle or circular arc.
Optionally, aforesaid electronic equipment, wherein, the cross section of described heat pipe is circular, oval or rectangle.
Optionally, aforesaid electronic equipment, wherein, the outer surface of tube wall of described heat pipe is coated with layers of copper.
Optionally, aforesaid electronic equipment, wherein, described heat pipe is aluminum pipe.
Optionally, aforesaid electronic equipment, wherein, described electronic equipment is notebook computer, mobile phone or panel computer.
By technique scheme, the electronic equipment that the utility model provides at least has following advantages:
The technical scheme that the utility model provides is by the projection in the tube wall of described heat pipe offers groove, add the area of dissipation in thermotube wall, thus effectively can improve the heat transfer efficiency of heat pipe, the thermal resistance of reduction heat pipe, even if heat pipe thickness reduces, also can ensure the heat conductivility of heat pipe, guarantee the normal operation of electronic equipment.
Above-mentioned explanation is only the general introduction of technical solutions of the utility model, in order to better understand technological means of the present utility model, and can be implemented according to the content of specification, coordinates accompanying drawing to be described in detail as follows below with preferred embodiment of the present utility model.
Accompanying drawing explanation
Fig. 1 is the structural representation of the electronic equipment of the utility model one embodiment;
Fig. 2 is the first structural representation realized of heat pipe in the electronic equipment of the utility model one embodiment;
Fig. 3 is the structural representation that the second of heat pipe in the electronic equipment of the utility model one embodiment realizes;
Fig. 4 is the third structural representation realized of heat pipe in the electronic equipment of the utility model one embodiment.
Embodiment
The utility model embodiment is by providing a kind of electronic equipment, solve the problem of the heat pipe for thermal conductivity poor performance caused because thermotube wall is thinning that prior art exists, improve the heat transfer efficiency of heat pipe, even if the tube wall of heat pipe is thinning, also can ensure the new energy of the heat conduction of heat pipe.
The technical scheme of the utility model embodiment is for solving the problems of the technologies described above, and general thought is as follows:
In the technical scheme that the utility model embodiment provides, described electronic equipment comprises:
Casing;
Function element, it is arranged in described casing;
Heat abstractor, it is arranged in described casing, and described heat abstractor is in the radiating end of described function element;
Wherein, described heat abstractor comprises heat pipe;
Described heat pipe comprises tube wall and is arranged on the projection in described tube wall;
Described projection offers at least one groove.
The technical scheme that the utility model provides is by the projection in the tube wall of described heat pipe offers groove, add the area of dissipation in thermotube wall, thus effectively can improve the heat transfer efficiency of heat pipe, the thermal resistance of reduction heat pipe, even if heat pipe thickness reduces, also can ensure the heat conductivility of heat pipe, guarantee the normal operation of electronic equipment.
For further setting forth the utility model for the technological means reaching predetermined utility model object and take and effect, below in conjunction with accompanying drawing and preferred embodiment, to according to its embodiment of testing stand, structure, feature and the effect thereof that the utility model proposes, be described in detail as follows.In the following description, the not necessarily same embodiment that different " embodiment " or " embodiment " refers to.In addition, special characteristic, structure or feature in one or more embodiment can be combined by any suitable form.
As depicted in figs. 1 and 2, the structural representation of electronic equipment that provides of the utility model one embodiment.As shown in Figure 1, described electronic equipment comprises: casing 1, function element 2 and heat abstractor 3.Wherein, described function element 2 is arranged in described casing 1.Described function element can comprise: CPU, internal memory, memory etc.At least its computing function and data processing function can be realized by electronic equipment described in described function element 2.Described heat abstractor 3 is arranged in described casing 1.Described heat abstractor 3 is in the radiating end of described function element 2.The heat absorbing end of such as described heat abstractor can be attached to the heating side of described function element.Described heat abstractor 3 comprises heat pipe 31, and as shown in Figure 2, described heat pipe 31 comprises tube wall 311 and is arranged on the projection 312 in described tube wall 311, offers at least one groove 313 on described protruding 312.
Here it should be noted that: in actual applications, the described projection that in the described electronic equipment mentioned herein, the tube wall of heat pipe is arranged is also called capillary structure.Structure and the operation principle of heat abstractor are as follows:
Normally first fill with suitable working media after being evacuated in heat pipe.Described working media can be the liquid that latent heat is higher, such as: water, alcohol, ammoniacal liquor and composition thereof.One end of heat pipe is evaporation section, the other end is condensation segment, adiabatic section can be arranged between evaporation section and condensation segment according to application needs, when heat pipe evaporator section is heated, working media in capillary structure evaporates gasification by liquid and forms steam, steam is at the condensation segment of slight pressure difference flows by action to heat pipe, condense into and the working media of liquid, thus releasing heat, the working media of liquid flow back into evaporation section by the capillarity of capillary structure again, circulation like this, heat constantly reaches condensation segment by the evaporation section of heat pipe, and the low-temperature receiver of the section of being condensed one end absorbs.
It can thus be appreciated that, in the conduction process realizing heat pipe, comprise following six main process that are mutually related:
1, heat passes to working media liquid in heat pipe by thermotube wall and capillary structure;
2, liquid working media is evaporated to the working media of gaseous state at evaporation section;
3, the working media of gaseous state flows to condensation segment from evaporation section;
4, the working media of gaseous state becomes liquid working media at condensation segment;
5, heat passes to low-temperature receiver by capillary structure, working media and thermotube wall;
6, in capillary structure because capillarity makes the working media of condensed liquid state be back to evaporation section.
As can be seen from above-mentioned conduction process, capillary structure plays an important role in conduction process.
Therefore, the technical scheme that the present embodiment provides is by the projection in the tube wall of described heat pipe offers groove, add the area of dissipation in thermotube wall, thus effectively can improve the heat transfer efficiency of heat pipe, the thermal resistance of reduction heat pipe, even if heat pipe thickness reduces, also can ensure the heat conductivility of heat pipe, guarantee the normal operation of electronic equipment.
Further, described protruding 312 (also or claim capillary structure) is rectangular preiection (as shown in Figure 3), or arc convex (as shown in Figure 2).Certainly, described projection can also be other arbitrary shapes, and this enforcement does not do concrete restriction to this.
As shown in Figures 2 and 3, being arranged on described protruding 312 in described tube wall 311 described in mentioning in above-described embodiment is two, and two described protruding 312 are oppositely arranged.The gap h of energy Circulation medium is left between two described protruding 312.The large I of gap h between described two described protruding 312 is determined according to the radiating requirements of reality.
Further, groove 313 described in above-described embodiment can be rectangle (as shown in Figures 2 and 3) or circular arc (as shown in Figure 4), certainly, described groove can also be other shapes except described rectangle and described circular arc, as long as can be increased the area of dissipation of inside heat pipe by described groove.Here you need to add is that: in order to further increase the area of dissipation of described inside heat pipe, also the bottom land of described groove can be arranged to waveform, zigzag etc.
The cross section of described heat pipe can be circular, ellipse, track type (as shown in Figure 2 and Figure 4) or rectangle (as shown in Figure 3).
The outer surface of tube wall of described heat pipe is coated with layers of copper, further can be improved the thermal conductivity of heat pipe by copper facing, and then improves the thermal diffusivity of heat pipe.Wherein, described heat pipe can adopt aluminum pipe.
Further, the electronic equipment described in above-described embodiment can be notebook computer, mobile phone or panel computer.
The present embodiment, by opening one or more groove in projection, can increase the capillarity area of capillary structure in hot pipe, and can increase the space of heat pipe inner chamber body; Can increase by the capillarity area increased the speed (abbreviation back-flow velocity) that the working media improving condensed liquid state is back to evaporation section, improve the backflow of working media, increase the backflow limit; The working media that can improve gaseous state by the space (evaporation channel) increasing heat pipe inner chamber body flows to the speed (abbreviation evaporation rate) of condensation segment from evaporation section.
Below by testing and being described in further detail adopting heat pipes for heat transfer power of the present utility model in conjunction with form.
As shown above, do not add the heat pipe of groove, thickness is 1.5mm, and when length is 150mm, the maximal heat transfer power of heat pipe is 32w, and do not add the heat pipe of groove, thickness is reduced to 1mm, and when length is 150mm, the maximal heat transfer power reduction of heat pipe is 20w; Adopt the present embodiment to add the heat pipe of groove, namely when thickness is reduced to 1mm, when length is 150mm, the maximal heat transfer power adding the heat pipe of groove is 30w.
Known by above-mentioned experiment, the heat pipe adopting the present embodiment to add groove can improve the heat radiation limit of about 50%, the maximum heat radiation power of the heat pipe not adding the 1mm thickness of groove can be reached 30w from 20w, meet the cooling requirements of electronic devices and components.
Last it is noted that above embodiment is only in order to illustrate the technical solution of the utility model, be not intended to limit; Although be described in detail the utility model with reference to previous embodiment, those of ordinary skill in the art is to be understood that: it still can be modified to the technical scheme described in foregoing embodiments, or carries out equivalent replacement to wherein portion of techniques feature; And these amendments or replacement, do not make the essence of appropriate technical solution depart from the spirit and scope of each embodiment technical scheme of the utility model.

Claims (8)

1. an electronic equipment, is characterized in that, comprising:
Casing;
Function element, it is arranged in described casing;
Heat abstractor, it is arranged in described casing, and described heat abstractor is in the radiating end of described function element;
Wherein, described heat abstractor comprises heat pipe;
Described heat pipe comprises tube wall and is arranged on the projection in described tube wall;
Described projection offers at least one groove.
2. electronic equipment according to claim 1, is characterized in that, described projection is rectangular preiection or arc convex.
3. electronic equipment according to claim 1 and 2, is characterized in that,
The described projection be arranged in described tube wall is two, and two described projections are oppositely arranged;
The gap of energy Circulation medium is left between two described projections.
4. electronic equipment according to claim 1 and 2, is characterized in that, described groove is rectangle or circular arc.
5. electronic equipment according to claim 1 and 2, is characterized in that, the cross section of described heat pipe is circular, oval or rectangle.
6. electronic equipment according to claim 1, is characterized in that, the outer surface of tube wall of described heat pipe is coated with layers of copper.
7. electronic equipment according to claim 6, is characterized in that, described heat pipe is aluminum pipe.
8. electronic equipment according to claim 1 and 2, is characterized in that, described electronic equipment is notebook computer, mobile phone or panel computer.
CN201420539623.1U 2014-09-18 2014-09-18 Electronic equipment Active CN204131905U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201420539623.1U CN204131905U (en) 2014-09-18 2014-09-18 Electronic equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201420539623.1U CN204131905U (en) 2014-09-18 2014-09-18 Electronic equipment

Publications (1)

Publication Number Publication Date
CN204131905U true CN204131905U (en) 2015-01-28

Family

ID=52388216

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201420539623.1U Active CN204131905U (en) 2014-09-18 2014-09-18 Electronic equipment

Country Status (1)

Country Link
CN (1) CN204131905U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104735960A (en) * 2015-02-20 2015-06-24 东莞市同迅金属科技有限公司 Heat dissipation device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104735960A (en) * 2015-02-20 2015-06-24 东莞市同迅金属科技有限公司 Heat dissipation device
CN104735960B (en) * 2015-02-20 2018-05-01 东莞市同迅金属科技有限公司 A kind of radiator

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