CN204053562U - A kind of tungsten copper Electronic Packaging plate clamp - Google Patents
A kind of tungsten copper Electronic Packaging plate clamp Download PDFInfo
- Publication number
- CN204053562U CN204053562U CN201420426563.2U CN201420426563U CN204053562U CN 204053562 U CN204053562 U CN 204053562U CN 201420426563 U CN201420426563 U CN 201420426563U CN 204053562 U CN204053562 U CN 204053562U
- Authority
- CN
- China
- Prior art keywords
- locating piece
- groove
- base plate
- tungsten copper
- electronic packaging
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The utility model discloses a kind of tungsten copper Electronic Packaging plate clamp.Fixture comprises a base plate, described base plate is provided with L shape locating piece, described base plate also has mutually perpendicular first groove and the second groove, the first locating piece and the second locating piece is respectively arranged with in described first groove and the second groove, described first locating piece can move in the first groove, second locating piece can move in the second groove, and described first locating piece and the second locating piece include the top shoe and sliding block that are threaded connection; Described base plate also has screwed hole, and a bolt is screwed into described screwed hole through a briquetting and is fixed on base plate by described briquetting.Tungsten copper Electronic Packaging plate clamp of the present utility model is reasonable in design, and structure is simple, is limited the movement of tungsten copper electronic seal load, clamp effective by L shape locating piece, adjustable first locating piece and the second locating piece and briquetting, simple to operate.
Description
Technical field
The utility model relates to a kind of tungsten copper Electronic Packaging plate clamp, belongs to Machining Technology field.
Background technology
Tungsten copper electronic seal load is mainly used in the heat exchange of refrigeration and air-conditioning system and automobile radiators (heat exchanger).Electronic seal load is also applied in the electronic product of heat management, often in a computer in central processor or graphic process unit.Case chip also contributes to cool electronic and opto-electronic device, and as superpower laser and light emitting diode, its physical Design is conducive to cooling fluid around, and the surface area as air contact increases.In a computer in central processor or graphic process unit, electronic seal load, for the method for these basic annexes and thermal interfacial material, can affect final intersection, disperse the temperature of processor.
As shown in Figure 1, the main finished surface of tungsten copper electronic seal load is plane and hole to the structure of tungsten copper electronic seal load.In general, the machining accuracy of plane is ensured than ensureing that the machining accuracy in hole is easy.Therefore, for tungsten copper electronic seal load, the subject matter in process is the dimensional accuracy and the positional precision that ensure hole, the fixture can fixing tungsten copper Electronic Packaging sheet exactly first needed.
Utility model content
The purpose of this utility model be to provide a kind of structure simple, clamp effective tungsten copper Electronic Packaging plate clamp.
The utility model is achieved through the following technical solutions:
A kind of tungsten copper Electronic Packaging plate clamp, comprise a base plate, described base plate is provided with L shape locating piece, described base plate also has the first groove and the second groove that are parallel to L shape locating piece two limits, moveable first locating piece and the second locating piece is respectively arranged with, the sliding block that described first locating piece and the second locating piece include sliding shoe on one and be threaded with upper sliding shoe in described first groove and the second groove; Described base plate also has screwed hole, and a bolt is screwed into described screwed hole through a briquetting and is fixed on base plate by described briquetting.
Described a kind of tungsten copper Electronic Packaging plate clamp, described base plate also has chip-removal hole.
Described a kind of tungsten copper Electronic Packaging plate clamp, on described L shape locating piece, also mark has scale.
Described a kind of tungsten copper Electronic Packaging plate clamp, described first groove and the second groove are T-shaped groove.
Described a kind of tungsten copper Electronic Packaging plate clamp, is also provided with support column below described base plate.
Described a kind of tungsten copper Electronic Packaging plate clamp, the thickness of described base plate is 2-4cm.
The beneficial effects of the utility model are: tungsten copper Electronic Packaging plate clamp of the present utility model is reasonable in design, structure is simple, limited the movement of tungsten copper electronic seal load by L shape locating piece, adjustable first locating piece and the second locating piece and briquetting, clamp effective, simple to operate.Tungsten copper Electronic Packaging plate clamp of the present utility model dismounting is simple, is convenient to safeguard and cost is lower, is applicable to large-scale production.
Accompanying drawing explanation
Fig. 1 is the structural representation of tungsten copper electronic seal load.
Top view when Fig. 2 is the utility model clamping tungsten copper Electronic Packaging plate clamp.
Fig. 3 is the right view of the utility model when being unkitted tungsten inclusion copper Electronic Packaging plate clamp.
In figure: 1, base plate, 2, L shape locating piece, the 3, first groove, the 4, second groove, the 31, first locating piece, 41, the second locating piece, 5, stud, 51, top shoe, 52, sliding block, 7, bolt, 8, briquetting, 9, chip-removal hole, 10, support column, 11, tungsten copper electronic seal load.
Detailed description of the invention
Below in conjunction with accompanying drawing and detailed description of the invention, the utility model is described in further detail:
As shown in Figures 2 and 3, a kind of tungsten copper Electronic Packaging plate clamp of the present utility model, comprises a base plate 1, described base plate is provided with L shape locating piece 2, and on described L shape locating piece 2, also mark has scale; Described base plate 1 also has the first groove 3 and the second groove 4 being parallel to L shape locating piece 2 two limits, described first groove 3 and the second groove 4 are T-shaped groove; Be respectively arranged with moveable first locating piece 31 and the second locating piece 41 in described first groove 3 and the second groove 4, described first locating piece 31 and the second locating piece 41 include by sliding shoe 51 on one and the sliding block 52 that is threaded with upper sliding shoe 51; The described stud 5 that is threaded to connects; Described top shoe 51 is in the second groove 4, stud 5 connects the sliding block 52 outside the second groove 4 through the second groove 4, sliding block 52 can regulate the relative position with top shoe 51 by stud 5, described base plate 1 also has screwed hole, and a bolt 7 is screwed into described screwed hole through a briquetting 8 and is fixed on base plate 1 by described briquetting 8; Described base plate 1 also has chip-removal hole 9, is also provided with support column 10 below described base plate 1, the thickness of described base plate 1 is 2-4cm.
On base plate 1, the scrap produced during punching can be discharged by volume chip-removal hole 9 timely, thus increases work efficiency; Indicative function is played in the position of scale on L shape locating piece 2 to tungsten copper electronic seal load 11, and top shoe 51 is connected through T-shaped groove with sliding block 52, can reduce the length of stud 5; Support column 10 plays a supportive role to whole base plate 1, and convenient adjustment sliding block 52; The too thick waste material of thickness of base plate, increases production cost.
Tungsten copper Electronic Packaging plate clamp of the present utility model in use, as shown in Figure 2, first tungsten copper electronic seal load 11 is placed on the position near L shape locating piece 2, regulate the position of the first locating piece 31 and the second locating piece 41, by sliding block 52 is tightened to top shoe 51 direction, then the position of the first locating piece 31 and the second locating piece 41 is fixed, thus fixing tungsten copper Electronic Packaging sheet 11, again fix tungsten copper Electronic Packaging sheet 11 by briquetting 8 again, thus further can punch to tungsten copper electronic seal load 11 or other processing.
The above; it is only preferred embodiment of the present utility model; not the utility model is imposed any restrictions; every above embodiment is done according to the utility model technical spirit any simple modification, change and equivalent structure transformation, all still belong in the protection domain of technical solutions of the utility model.
Claims (6)
1. a tungsten copper Electronic Packaging plate clamp, it is characterized in that, comprise a base plate, described base plate is provided with L shape locating piece, described base plate also has the first groove and the second groove that are parallel to L shape locating piece two limits, moveable first locating piece and the second locating piece is respectively arranged with, the sliding block that described first locating piece and the second locating piece include sliding shoe on one and be threaded with upper sliding shoe in described first groove and the second groove; Described base plate also has screwed hole, and a bolt is screwed into described screwed hole through a briquetting and is fixed on base plate by described briquetting.
2. a kind of tungsten copper Electronic Packaging plate clamp according to claim 1, is characterized in that, described base plate also has chip-removal hole.
3. a kind of tungsten copper Electronic Packaging plate clamp according to claim 1, is characterized in that, on described L shape locating piece, also mark has scale.
4. a kind of tungsten copper Electronic Packaging plate clamp according to claim 1, it is characterized in that, described first groove and the second groove are T-shaped groove.
5. a kind of tungsten copper Electronic Packaging plate clamp according to claim 4, is characterized in that, be also provided with support column below described base plate.
6. a kind of tungsten copper Electronic Packaging plate clamp according to claim 5, is characterized in that, the thickness of described base plate is 2-4cm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420426563.2U CN204053562U (en) | 2014-07-31 | 2014-07-31 | A kind of tungsten copper Electronic Packaging plate clamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420426563.2U CN204053562U (en) | 2014-07-31 | 2014-07-31 | A kind of tungsten copper Electronic Packaging plate clamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204053562U true CN204053562U (en) | 2014-12-31 |
Family
ID=52195147
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420426563.2U Expired - Fee Related CN204053562U (en) | 2014-07-31 | 2014-07-31 | A kind of tungsten copper Electronic Packaging plate clamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204053562U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104128827A (en) * | 2014-07-31 | 2014-11-05 | 苏州金牛精密机械有限公司 | Tungsten copper electronic packaging chip clamp |
-
2014
- 2014-07-31 CN CN201420426563.2U patent/CN204053562U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104128827A (en) * | 2014-07-31 | 2014-11-05 | 苏州金牛精密机械有限公司 | Tungsten copper electronic packaging chip clamp |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141231 Termination date: 20150731 |
|
| EXPY | Termination of patent right or utility model |