CN204012007U - A kind of TO packaging aging clamp - Google Patents
A kind of TO packaging aging clamp Download PDFInfo
- Publication number
- CN204012007U CN204012007U CN201420457386.4U CN201420457386U CN204012007U CN 204012007 U CN204012007 U CN 204012007U CN 201420457386 U CN201420457386 U CN 201420457386U CN 204012007 U CN204012007 U CN 204012007U
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- CN
- China
- Prior art keywords
- aging
- ceramic base
- base circuit
- circuit board
- capillary brass
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The utility model provides a kind of TO packaging aging clamp, comprise shell, be placed in the ceramic base circuit board of the interior slot of shell, on described ceramic base circuit board, be welded with interconnective capillary brass pipe and high-temperature cable, described capillary brass pipe is used for plugging aging chip, described high-temperature cable is used for being communicated with ceramic base circuit board and aging testing system, and described ceramic base circuit board supports by fixing support column in the enclosure.The utility model replaces burn-in sockets to place aging chip by capillary brass pipe, and ceramic base circuit is normal stable work for a long time under high temperature rated, and signal or delivery of electrical energy performance are unaffected, and have longer useful life; By the position of Rational Arrangement capillary brass pipe, can improve the reliability contacting between capillary brass pipe and aging chip in addition, therefore can overcome the deficiency in background technology, guarantee that this aging clamp device long-term work is the stability of 200 ℃.
Description
Technical field
The utility model relates to burn-in test field, specifically a kind of TO packaging aging clamp.
Background technology
At present, burn-in sockets more independently on market, its structure is mainly comprised of engineering plastics or pottery and reed, and its Main Function is for placing TO packaging.And along with the develop rapidly of electronic technology, the quantity required of chip device is in continuous increase, the quality requirement of chip is also improving constantly simultaneously, therefore a plurality of burn-in sockets is fixed on circuit board, carries out aging grip device arise at the historic moment by high-temperature cable and circuit communication.But be limited to the sheet material problem of circuit board, the high energy of the FR4 sheet material of common circuit plate is normally operated in 150 ℃ of left and right for a long time, some special sheet material as: also just the short time can be operated in 200 ℃ of left and right to the sheet materials such as aluminium base, copper base, Rogers; And at high temperature, the contact reliability between engineering plastics and reed, reed and aging chip can decrease in burn-in sockets long-term work, has a strong impact on the burn-in test quality of chip.
Summary of the invention
For the above-mentioned deficiency of prior art, the utility model provides a kind of simple and reasonable, the high temperature resistant and reliable TO packaging of test mass aging clamp.
The technical solution adopted in the utility model is:
A kind of TO packaging aging clamp, comprise shell, be placed in the ceramic base circuit board of the interior slot of shell, on described ceramic base circuit board, be welded with interconnective capillary brass pipe and high-temperature cable, described capillary brass pipe is used for plugging aging chip, described high-temperature cable is used for being communicated with ceramic base circuit board and aging testing system, and described ceramic base circuit board supports by fixing support column in the enclosure.
TO packaging aging clamp as above, a lateral edges of shell is provided with pipe clamp fixed head, on described pipe clamp fixed head, pipe clamp is installed, and described high-temperature cable is locked by described pipe clamp.
The utility model replaces burn-in sockets to place aging chip by capillary brass pipe, then by high temperature solder stick, capillary brass pipe and high-temperature cable are welded on ceramic base circuit board, on ceramic base circuit board, every group of capillary brass pipe is connected with high-temperature cable, by high-temperature cable, be connected with aging testing system again can carry out aging, ceramic base circuit is normal stable work for a long time under high temperature rated, signal or delivery of electrical energy performance are unaffected, and have longer useful life; By the position of Rational Arrangement capillary brass pipe, can improve the reliability contacting between capillary brass pipe and aging chip in addition, therefore can overcome the deficiency in background technology, guarantee that this aging clamp device long-term work is the stability of 200 ℃.
Accompanying drawing explanation
Fig. 1 is the structural representation of the utility model TO packaging aging clamp;
Fig. 2 is the generalized section of the utility model TO packaging aging clamp;
Fig. 3 is the vertical view of the utility model TO packaging aging clamp;
Fig. 4 welds the schematic diagram of capillary brass pipe and high-temperature cable on the ceramic base circuit board of the utility model TO packaging aging clamp;
Fig. 5 is that the support column of the utility model TO packaging aging clamp is installed generalized section in the enclosure.
In figure: 1-shell, 2-aging chip, 3-ceramic base circuit board, 4-pipe clamp fixed head, 5-pipe clamp, 6-high-temperature cable, 7-support column, 8-capillary brass pipe.
Embodiment
Below in conjunction with the accompanying drawing in the utility model, the technical scheme in the utility model is clearly and completely described.
Please refer to Fig. 1-3, the utility model TO packaging aging clamp shell comprises shell 1, ceramic base circuit board 3, pipe clamp fixed head 4, pipe clamp 5, high-temperature cable 6, support column 7, capillary brass pipe 8.Described ceramic base circuit board 3 is placed in the interior slot of shell 1, and described ceramic base circuit board 3 supports by the support column 7 being fixed in shell 1.On described ceramic base circuit board 3, can weld many group capillary brass pipe 3, concrete quantity can determine according to actual needs.
Described shell 1 is made by metallic aluminium material, and described ceramic base circuit board 3 is made by ceramic material, and described capillary brass pipe 3 can adopt high brass pipe, and its surface gold-plating is processed.
On described ceramic base circuit board 3, weld interconnective capillary brass pipe 8 and high-temperature cable 6, high-temperature cable 6 is locked by pipe clamp 5.One lateral edges of shell 1 is provided with pipe clamp fixed head 4, and pipe clamp 5 is arranged on pipe clamp fixed head 4.Described capillary brass pipe 8 is for plugging aging chip 2, and described high-temperature cable 6 is for being communicated with ceramic base circuit board 3 and aging testing system (as the CPU for burn-in test).
Manufacture craft of the present utility model is as follows: first according to diameter and the length of aging chip 2 pins, select the capillary brass pipe 8 of appropriate size, flat is pinched into in one end of capillary brass pipe 8, seal port, prevent that from then on the pin of aging chip 2 from holding and passing.Second step is that the capillary brass pipe processing 8 use high temperature solder sticks are welded on ceramic base circuit board 3, then high-temperature cable 6 is welded on ceramic base circuit board 3 with high temperature solder stick according to circuit definition, specifically can be with reference to figure 4.Support column 7 is screwed in shell 1, for supporting ceramic base circuit board 3 (as shown in Figure 5).The ceramic base circuit board 3 finally welding being completed inserts in the interior slot of shell, and high-temperature cable 6 is locked on pipe clamp fixed head 4 by pipe clamp 5, and pipe clamp fixed head 4 is arranged on shell 1.
The utility model replaces burn-in sockets by capillary brass pipe 8, be used for placing aging chip 2, then by high temperature solder stick, capillary brass pipe 8 and high-temperature cable 6 are welded on ceramic base circuit board 3, on ceramic base circuit board 3, every group of capillary brass pipe 8 is connected with high-temperature cable 6, then by high-temperature cable 6, be connected with aging testing system (as the CPU for burn-in test) carry out aging.Ceramic base circuit 3 is normal stable work for a long time under high temperature rated, and signal or delivery of electrical energy performance are unaffected, and have longer useful life.Simultaneously when processing ceramic base circuit board according to the spacing of aging device TO packaged chip pin, the position of Rational Arrangement capillary brass pipe, can improve the reliability contacting between capillary brass pipe and aging chip, therefore can overcome the deficiency in background technology, guarantee that this aging clamp device long-term work is the stability of 200 ℃.
The above; it is only embodiment of the present utility model; but protection range of the present utility model is not limited to this; anyly belong to those skilled in the art in the technical scope that the utility model discloses; the variation that can expect easily or replacement, within all should being encompassed in protection range of the present utility model.Therefore, protection range of the present utility model should be as the criterion with the protection range of claim.
Claims (2)
1. a TO packaging aging clamp, it is characterized in that: comprise shell (1), be placed in the ceramic base circuit board (3) of the interior slot of shell (1), on described ceramic base circuit board (3), be welded with interconnective capillary brass pipe (8) and high-temperature cable (6), described capillary brass pipe (8) is for plugging aging chip (2), described high-temperature cable (6) is for being communicated with ceramic base circuit board (3) and aging testing system, and described ceramic base circuit board (3) supports by the support column (7) being fixed in shell (1).
2. TO packaging aging clamp as claimed in claim 1, it is characterized in that: a lateral edges of shell (1) is provided with pipe clamp fixed head (4), pipe clamp (5) is installed on described pipe clamp fixed head (4), and described high-temperature cable (6) is by described pipe clamp (5) locking.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420457386.4U CN204012007U (en) | 2014-08-13 | 2014-08-13 | A kind of TO packaging aging clamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420457386.4U CN204012007U (en) | 2014-08-13 | 2014-08-13 | A kind of TO packaging aging clamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204012007U true CN204012007U (en) | 2014-12-10 |
Family
ID=52051951
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420457386.4U Active CN204012007U (en) | 2014-08-13 | 2014-08-13 | A kind of TO packaging aging clamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204012007U (en) |
-
2014
- 2014-08-13 CN CN201420457386.4U patent/CN204012007U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CB03 | Change of inventor or designer information |
Inventor after: Wang Huiwen Inventor after: Xiao Na Inventor after: Guo Chen Inventor after: Zhou Zhaoyang Inventor after: Yan Liming Inventor before: Wang Huiwen Inventor before: Xiao Na Inventor before: Zhou Zhaoyang Inventor before: Yan Liming |
|
| COR | Change of bibliographic data | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 430074 Wuhan Province, East Lake City Development Zone, high tech Avenue, No. 999, No. Patentee after: WUHAN JUANLONG TECHNOLOGY CO., LTD. Address before: 430074 Wuhan Province, East Lake City Development Zone, high tech Avenue, No. 999, No. Patentee before: WUHAN JUNNO TECHNOLOGIES CO., LTD. |