CN203933919U - 一种耳机调音结构 - Google Patents
一种耳机调音结构 Download PDFInfo
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- CN203933919U CN203933919U CN201420351661.4U CN201420351661U CN203933919U CN 203933919 U CN203933919 U CN 203933919U CN 201420351661 U CN201420351661 U CN 201420351661U CN 203933919 U CN203933919 U CN 203933919U
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Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
- H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only
- H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
- H04R1/2807—Enclosures comprising vibrating or resonating arrangements
- H04R1/2811—Enclosures comprising vibrating or resonating arrangements for loudspeaker transducers
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
- H04R1/1016—Earpieces of the intra-aural type
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
- H04R1/1058—Manufacture or assembly
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
- H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R25/00—Deaf-aid sets, i.e. electro-acoustic or electro-mechanical hearing aids; Electric tinnitus maskers providing an auditory perception
- H04R25/48—Deaf-aid sets, i.e. electro-acoustic or electro-mechanical hearing aids; Electric tinnitus maskers providing an auditory perception using constructional means for obtaining a desired frequency response
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R25/00—Deaf-aid sets, i.e. electro-acoustic or electro-mechanical hearing aids; Electric tinnitus maskers providing an auditory perception
- H04R25/65—Housing parts, e.g. shells, tips or moulds, or their manufacture
- H04R25/652—Ear tips; Ear moulds
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Health & Medical Sciences (AREA)
- Otolaryngology (AREA)
- Headphones And Earphones (AREA)
Abstract
本实用新型涉及一种耳机调音结构,所述耳机包括前壳、后壳、装设于前壳中的发声单元、套设于前壳外的弹性耳部接触体,所述前壳上开设有至少一个缺口或沟槽,结合所述弹性耳部接触体的套设,形成至少一个缝隙;或者所述弹性耳部接触体的内壁面开设有至少一个沟槽,结合所述前壳的套入设置,形成至少一个缝隙。本实用新型提供的耳机调音结构具有更佳的调整低音频率的效果,并且结构不复杂,便于制造或改造。所述耳机调音结构可适用于入耳式耳机、罩耳式耳机等多种类型的耳机。
Description
技术领域
本实用新型涉及一种耳机结构,特别涉及一种耳机新的调整低音频率的结构。
背景技术
耳机的特点就是把两只小扬声器挂在头两侧,耳朵听到的声场空间感,真实感,临场感,都有些差异。为了改善使耳机听感更符合人的生理和心理特点,就要对耳机进行声音的调整,其方法有多种如用小的海绵块使单元保持在耳朵外面一段距离上,这样每只耳朵都能听到另一边单元发出的声音,也可以把发声单元向听者的耳朵贴近前移发出声音,也可以用电子线路做声音的再生等,但上述声音调整方法使用的装置存在结构复杂、效果不佳等问题。
实用新型内容
本实用新型的目的在于提供一种低音频率调整效果更佳的耳机调音结构,并且结构不复杂,便于制造或改造。
本实用新型通过以下技术方案实现:
本实用新型涉及一种耳机调音结构,所述耳机包括前壳、后壳、装设于前壳中的发声单元、套设于前壳外的弹性耳部接触体,所述前壳上开设有至少一个缺口或沟槽,结合所述弹性耳部接触体的套设,形成至少一个缝隙;或者所述弹性耳部接触体的内壁面开设有至少一个沟槽,结合所述前壳的套入设置,形成至少一个缝隙。
进一步地,所述耳机为入耳式耳机,所述弹性耳部接触体为弹性耳塞,所述入耳式耳机还包括盖住耳机前壳的耳机前盖板。
更进一步地,所述弹性耳塞具有基环,所述前壳具有用于与所述基环装配的阶,阶与基环相互连接的接触面设置为相嵌合的凹凸结构。
进一步地,所述耳机为罩耳式耳机,所述弹性耳部接触体为弹性耳罩,所述前壳为罩耳式耳机的前壳盖。
与现有技术相比,本实用新型提供的耳机调音结构具有更佳的调整低音频率的效果,并且结构不复杂,便于制造或改造。所述耳机调音结构可适用于入耳式耳机、罩耳式耳机等多种类型的耳机。
附图说明
图1为本实用新型耳机实施例1的入耳式耳机立体剖视图
图2为本实用新型耳机实施例2的入耳式耳机立体剖视图
图3为本实用新型耳机实施例3的入耳式耳机立体剖视图
图4为本实用新型耳机实施例4的罩耳式耳机立体剖视图
图5为本实用新型耳机实施例5的罩耳式耳机立体剖视图
图6为本实用新型耳机实施例1的入耳式耳机立体分解图
图7为本实用新型耳机实施例4的罩耳式耳机立体分解图
图8为本实用新型耳机图1实施例1的入耳式耳机前壳立体图
图9为本实用新型耳机图2实施例2的入耳式耳机前壳立体图
图10为本实用新型耳机图3实施例3的入耳式耳机立体分解图
图11为本实用新型耳机实施例4的罩耳式耳机前盖立体图
图12为本实用新型耳机实施例5的罩耳式耳机前盖立体图
具体实施方式
下面结合附图具体阐明本实用新型的实施方式,附图仅供参考和说明使用,不构成对本实用新型专利保护范围的限制。
实施例1:
如图1、图6和图8所示,本实用新型的实施例涉及一种耳机调音结构,所述耳机为入耳式耳机,所述入耳式耳机包括前壳2、后壳3、装设于前壳中的发声单元4、套设于前壳2外的弹性耳塞1,该前壳2上开设有至少一个缺口,在本实施例中,该前壳2上开设有一个缺口202,所述前壳2上设置有前盖板5,弹性耳塞1可套设于前壳2上,该弹性耳塞1具有一基环,通过弹性耳塞1的套置装配,进而产生缝隙结构,缝隙大小决定了低音频率的调整范围,实现控制低音频率段的声音。
实施例2:
如图2和图9所示,本实施例与实施例1的不同之处在于:
在前壳2的外壳表面上开设至少一个沟槽,在本实施例中,开设有一个沟槽203,弹性耳塞1可套设于前壳沟槽203外,所述前壳2上设置有前盖板5,该弹性耳塞1内壁面套在前壳2的外壳表面,前壳2外表面上开设的沟槽203被束起进而产生缝隙结构,缝隙大小决定了低音频率的调整范围,实现控制低音频率段的声音,也可以设置1个以上的缝隙。
作为本实施例的另一种实施方式,弹性耳塞1内壁面开设至少一个沟槽,套在前壳2的外表面上,也可以形成至少一个缝隙结构。
实施例3:
如图3和图10所示,本实施例与实施例1的不同之处在于:
所述弹性耳塞1具有基环103,所述前壳2具有用于与所述基环103装配的阶205,阶205与基环103相互连接的接触面设置为相嵌合的凹凸结构,通过阶205的凹凸结构调整多个不同隙缝的尺寸。
本实施例还可以在实施例2的基础上设置弹性耳塞1的基环103和前壳2的阶的相嵌合的凹凸结构。
实施例4:
如图4、图7和图11所示,本实施例涉及一种耳机调音结构,所述耳机为罩耳式耳机,包括前壳盖2、后壳3、装设于前壳盖2上的发声单元4及套设于前壳盖2上的弹性耳罩1,该前壳盖2上开设有至少一个缺口,在本实施例中,该前壳2上开设有一个缺口202,通过弹性耳罩1的套置装配,进而产生缝隙结构,缝隙大小决定了低音频率的调整范围,实现控制低音频率段的声音。也可以设置一个以上的缝隙。
实施例5:
如图5和图12所示,本实施例与实施例4的不同之处在于:
在前壳盖2的外壳表面上开设至少一个沟槽,在本实施例中,开设有一个沟槽203,通过弹性耳罩1的套设装配,形成缝隙结构,也可以设置一个以上的缝隙。
作为本实施例的另一种实施方式,弹性耳罩1内壁面开设至少一个沟槽,套在前壳盖2的外表面上,也可以形成至少一个缝隙结构。
以上所揭露的仅为本实用新型的较佳实施例,不能以此来限定本实用新型的权利保护范围,因此依本实用新型申请专利范围所作的等同变化,仍属本实用新型所涵盖的范围。
Claims (4)
1.一种耳机调音结构,所述耳机包括前壳、后壳、装设于前壳中的发声单元、套设于前壳外的弹性耳部接触体,其特征是:
所述前壳上开设有至少一个缺口或沟槽,结合所述弹性耳部接触体的套设,形成至少一个缝隙;或者,
所述弹性耳部接触体的内壁面开设有至少一个沟槽,结合所述前壳的套入设置,形成至少一个缝隙。
2.根据权利要求1所述的耳机调音结构,其特征是:所述耳机为入耳式耳机,所述弹性耳部接触体为弹性耳塞,所述入耳式耳机还包括盖住耳机前壳的耳机前盖板。
3.根据权利要求2所述的耳机调音结构,其特征是:所述弹性耳塞具有基环,所述前壳具有用于与所述基环装配的阶,阶与基环相互连接的接触面设置为相嵌合的凹凸结构。
4.根据权利要求1所述的耳机调音结构,其特征是:所述耳机为罩耳式耳机,所述弹性耳部接触体为弹性耳罩,所述前壳为罩耳式耳机的前壳盖。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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CN201420351661.4U CN203933919U (zh) | 2014-06-27 | 2014-06-27 | 一种耳机调音结构 |
US14/529,179 US9438989B2 (en) | 2014-06-27 | 2014-10-31 | Headphone structure for adjusting audio frequencies |
Applications Claiming Priority (1)
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CN201420351661.4U CN203933919U (zh) | 2014-06-27 | 2014-06-27 | 一种耳机调音结构 |
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CN203933919U true CN203933919U (zh) | 2014-11-05 |
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CN201420351661.4U Expired - Lifetime CN203933919U (zh) | 2014-06-27 | 2014-06-27 | 一种耳机调音结构 |
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US (1) | US9438989B2 (zh) |
CN (1) | CN203933919U (zh) |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
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AU363981S (en) * | 2015-02-25 | 2015-09-07 | Lg Electronics Inc | Earphone |
USD780155S1 (en) * | 2015-07-06 | 2017-02-28 | New Audio LLC | Earphone device |
USD786221S1 (en) * | 2016-02-19 | 2017-05-09 | Adrian Stoch | Earbud |
USD786217S1 (en) * | 2016-02-19 | 2017-05-09 | Adrian Stoch | Combined necklace and earphone |
USD824359S1 (en) * | 2016-08-31 | 2018-07-31 | Harman International Industries, Incorporated | Headphone |
USD817310S1 (en) * | 2016-11-11 | 2018-05-08 | Dynamic Ear Company B.V. | Ear plug |
USD837763S1 (en) * | 2017-03-15 | 2019-01-08 | Onkyo Corporation | Headphones |
US10142720B1 (en) * | 2017-05-17 | 2018-11-27 | Bose Corporation | Headphones with external pressure equalization path |
JP1594991S (zh) * | 2017-07-21 | 2018-01-15 | ||
USD864151S1 (en) * | 2017-10-20 | 2019-10-22 | Shenzhen Fogaap Technologies Co., Ltd. | Earphones |
USD862412S1 (en) * | 2017-11-29 | 2019-10-08 | Harman International Industries, Incorporated | Headphone |
USD862422S1 (en) | 2017-12-29 | 2019-10-08 | Harman International Industries, Incorporated | Headphone |
US10536764B2 (en) * | 2018-01-08 | 2020-01-14 | Bose Corporation | Integrating wax guards into earphone ear tips |
USD872061S1 (en) * | 2018-05-21 | 2020-01-07 | Shenzhen Tuopu Global Technology Co., Ltd | Earphone |
JP1628023S (zh) * | 2018-09-27 | 2019-04-01 | ||
USD885362S1 (en) * | 2018-10-18 | 2020-05-26 | Hmd Global Oy | Earphones and case |
USD913264S1 (en) * | 2019-02-11 | 2021-03-16 | Lg Electronics Inc. | Wireless earphone |
USD902887S1 (en) * | 2019-04-19 | 2020-11-24 | Shenzhen Yuangu Technology Co., Ltd. | Pair of wireless earphones and casing |
USD895578S1 (en) * | 2019-04-30 | 2020-09-08 | Shenzhen Ginto E-commerce Co., Limited | Wireless earphone |
USD906297S1 (en) | 2019-09-13 | 2020-12-29 | Apple Inc. | Pair of earphones |
USD909347S1 (en) | 2019-09-20 | 2021-02-02 | Apple Inc. | Earphone |
USD881165S1 (en) * | 2019-12-18 | 2020-04-14 | elago CO. LTD | Earphone protective cover |
CN212970035U (zh) * | 2020-07-03 | 2021-04-13 | 惠阳东美音响制品有限公司 | 耳机结构 |
USD943557S1 (en) * | 2020-10-12 | 2022-02-15 | Hangzhou Daimeng Technology Limited Company | Earphone protective cover |
JP1693614S (zh) * | 2020-12-04 | 2021-08-30 | ||
KR102440468B1 (ko) * | 2021-06-17 | 2022-09-06 | 부전전자 주식회사 | 실리콘 폼 재질의 플랜지를 구비한 이어팁 |
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US3999020A (en) * | 1975-10-29 | 1976-12-21 | Koss Corporation | Transducer with variable frequency response |
US5729605A (en) * | 1995-06-19 | 1998-03-17 | Plantronics, Inc. | Headset with user adjustable frequency response |
US8594351B2 (en) * | 2006-06-30 | 2013-11-26 | Bose Corporation | Equalized earphones |
CN102625991B (zh) * | 2009-08-25 | 2015-07-29 | 莫列斯公司 | 耳机 |
US20120114160A1 (en) * | 2010-11-09 | 2012-05-10 | Cheng Uei Precision Industry Co., Ltd. | Tunable earphone |
TWI471020B (zh) * | 2011-09-26 | 2015-01-21 | Chien Chuan Pan | 具可活動切換結構之多聲道掛載式揚聲裝置及其組裝方法 |
US8837765B2 (en) * | 2013-01-14 | 2014-09-16 | Cheng Uei Precision Industry Co., Ltd. | Tunable earphone |
US20150016653A1 (en) * | 2013-07-15 | 2015-01-15 | Dexin Corporation | Tunable headphone |
-
2014
- 2014-06-27 CN CN201420351661.4U patent/CN203933919U/zh not_active Expired - Lifetime
- 2014-10-31 US US14/529,179 patent/US9438989B2/en active Active
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US20150382099A1 (en) | 2015-12-31 |
US9438989B2 (en) | 2016-09-06 |
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Address after: 516223 Dongfeng management area, Xinxu Town, Huiyang District, Huizhou City, Guangdong Province Patentee after: Dongsheng (Huizhou) Electronics Co.,Ltd. Address before: 516226 Dongmei earphone factory, Dongfeng management area, Xinxu Town, Huiyang District, Huizhou City, Guangdong Province Patentee before: Huiyang Dongmei Audio Products Co.,Ltd. |
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Granted publication date: 20141105 |
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