CN203880658U - Improved metal heat radiation support of LED lamp, LED light source plate and integrated heat radiation type LED lamp - Google Patents

Improved metal heat radiation support of LED lamp, LED light source plate and integrated heat radiation type LED lamp Download PDF

Info

Publication number
CN203880658U
CN203880658U CN201420227806.XU CN201420227806U CN203880658U CN 203880658 U CN203880658 U CN 203880658U CN 201420227806 U CN201420227806 U CN 201420227806U CN 203880658 U CN203880658 U CN 203880658U
Authority
CN
China
Prior art keywords
led light
plate
source plate
light source
led
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201420227806.XU
Other languages
Chinese (zh)
Inventor
何润林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
XIAMEN FIREFLY ENERGY SCIENCE AND TECHNOLOGY CO., LTD.
Original Assignee
Xiamen Donglin Electronic Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to CN201420163391.4 priority Critical
Priority to CN201420163391 priority
Application filed by Xiamen Donglin Electronic Co Ltd filed Critical Xiamen Donglin Electronic Co Ltd
Priority to CN201420227806.XU priority patent/CN203880658U/en
Application granted granted Critical
Publication of CN203880658U publication Critical patent/CN203880658U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Abstract

The utility model discloses an improved metal heat radiation support of an LED lamp. A heat conduction portion is composed of warp plates and weft plates, wherein the warp plates and the weft plates are longitudinally and transversely staggered, and cube hollow-out frames are defined by the adjacent warp plates and the weft plates; a conductive portion is composed of an upper transverse plate, a lower transverse plate and conductive pieces, the upper transverse plate and the lower transverse plate are arranged above and below the heat conduction portion respectively, gaps exist between the upper transverse plate and the heat conduction portion and between the lower transverse plate and the heat conduction portion, side hollow-out frames are defined by the upper transverse plate, the lower transverse plate and the adjacent warp plates and weft plates, the conductive pieces are arranged in the cube hollow-out frames and the side hollow-out frames, the conductive pieces are connected with the weft plates on the edges of the cube hollow-out frames and the edges of the side hollow-out frames through technical connecting sides, the conductive pieces on the side hollow-out frames are further connected with the adjacent transverse plate, and gaps also exist between the conductive pieces and the edges of the cube hollow-out frames and between the conductive pieces and the edges of the side hollow-out frames. The utility model further discloses an LED light source plate with the heat radiation support and an integrated heat radiation LED lamp. The heat conduction of the metal heat radiation support, heat conduction of heat conduction gas and heat radiation of a glass bulb are integrated, and rapid and efficient integrated heat radiation is achieved.

Description

A kind of improvement heat dissipation metal support of LED lamp and LED light source plate and integrated heat dissipation formula LED lamp
Technical field
The utility model belongs to the technical field of LED electricity-saving lamp, special relevant with the heat dissipation metal improved support structure of LED lamp, also relevant with integrated heat dissipation formula LED modulated structure with the LED light source plate of this cooling stand of application.
Technical background
In prior art, there is a kind of LED bulb, comprise: printing opacity cell-shell, LED light emitting source, stem stem, drive circuit and lamp holder.Printing opacity cell-shell and stem stem sealing form the cell-shell body of vacuum, and cell-shell is filled with low viscosity high thermal conductivity gas (for example helium, hydrogen or helium hydrogen gaseous mixture).LED light emitting source is comprised of high thermal conductivity transparent pipe and LED chip, high thermal conductivity transparent pipe is fixedly inserted on stem stem outer surface with transparent adhesive tape, LED chip is directly fixed on the planar section of high thermal conductivity transparent pipe outer surface with crystal-bonding adhesive, then be electrically connected to drive circuit and lamp holder, then cover last layer fluorescence coating.
This LED bulb is because high thermal conductivity transparent pipe has the larger contact-making surface contacting with low viscosity high thermal conductivity gas, reduced the thermal resistance between LED chip and low viscosity high thermal conductivity gas, so during electrified light emitting, the heat that LED chip produces is through larger area high thermal conductivity transparent pipe, low viscosity high thermal conductivity gas and the heat radiation of printing opacity cell-shell, and radiating effect increases.
Carefully analyze and be not difficult to find, the effect of high thermal conductivity transparent pipe is to play mounting bracket and heat radiation, installs on the one hand for LED chip, makes on the other hand the heat of LED chip work be conducted in time.But also there is following shortcoming in this LED bulb:
One, high thermal conductivity transparent pipe is to be made by high thermal conductivity crystalline ceramics, glass or plastics, in view of the heat conductivility of crystalline ceramics, glass or plastics is far away from metal, makes the radiating effect of LED bulb still await improving;
Two, high thermal conductivity transparent pipe only has upper and lower opening, can only increasing heat radiation area, can not in pipe, form thermal convection current, and radiating effect is ideal not to the utmost;
Three, high thermal conductivity transparent pipe is once moulding, and shape is fixing, makes the size of LED light emitting source to change and arbitrarily to change according to the power of LED bulb, and processing and manufacturing cost is high.
Utility model content
The purpose of this utility model is to provide a kind of improvement heat dissipation metal support of LED lamp, significantly to improve radiating efficiency.
The purpose of this utility model is also to provide a kind of LED light source plate and integrated heat dissipation formula LED lamp, significantly to improve radiating efficiency.
In order to reach above-mentioned purpose, the technical solution of the utility model is:
An improvement heat dissipation metal support for LED lamp, comprises thermal conduction portions and current-carrying part; Thermal conduction portions is by crisscross forming through plate and latitude plate, and adjacent surrounds positive hollow out frame through plate and latitude plate; Current-carrying part is comprised of upper and lower two transverse slats and conducting strip, upper and lower two transverse slats lay respectively at the above and below of thermal conduction portions, and upper and lower two transverse slats and thermal conduction portions have gap, upper and lower two transverse slats and adjacent surround side hollow out frame through plate, latitude plate, conducting strip is arranged in positive hollow out frame and side hollow out frame, conducting strip is connected by technique fillet with the latitude plate of side hollow out edge edge with positive hollow out frame, the conducting strip that is positioned at side hollow out frame is also connected with adjacent transverse slat, and conducting strip also has gap with the edge of positive hollow out frame and side hollow out frame.
On described latitude plate, form longitudinal profile groove.
The corresponding longitudinally profile groove of described upper and lower two transverse slats also forms breach.
A kind of LED light source plate, by LED chip and above-mentioned cooling stand, formed, in the end through plate and adjacent two conducting strips of above-mentioned cooling stand, Insulating frame (injection-moulded plastic framework) is set, LED chip is placed on plate and is fixed in Insulating frame, LED chip is also electrically connected to adjacent two conducting strips by wire, is coated with luminous bisque on LED chip.
Described cooling stand is tabular, dull and stereotyped ring-type or polygon tubular etc. by bending.
An integrated heat dissipation formula LED lamp, comprises glass cell-shell, lamp holder, drive circuit and above-mentioned LED light source plate, and drive circuit is arranged in lamp holder or glass cell-shell; Glass envelope clamshell is located on lamp holder, is provided with the glass stem of setting in glass cell-shell, and glass cell-shell and glass stem form enclosed cavity at sealed bottom, falling heat-transfer gas (as helium, hydrogen or helium hydrogen gaseous mixture etc.) in enclosed cavity; Above-mentioned LED light source plate is fixed on glass stem, and the LED chip on LED light source plate is electrically connected to drive circuit and lamp holder.
Support and lower carriage are installed in the top and bottom of described glass stem, and the two ends of above-mentioned LED light source plate are arranged on upper bracket and lower carriage, and above-mentioned LED light source plate is vertical shape by bending and forms light beam around glass stem.
On described glass stem, be also fixedly nested with honeycomb metal radiator, in the barrel of honeycomb metal radiator, form honeycomb, on the barrel of honeycomb metal radiator, also offer louvre, above-mentioned LED light source plate is vertical shape by bending and forms light beam around being fixed on the barrel of honeycomb metal radiator.
On described glass stem, be also fixedly nested with honeycomb metal radiator, in the barrel of honeycomb metal radiator, form honeycomb, on the barrel of honeycomb metal radiator, also offer louvre, above-mentioned LED light source plate is directly fixed on the top of honeycomb metal radiator, or above-mentioned LED light source plate is fixed on aluminium sheet and aluminium sheet is fixed on the top of honeycomb metal radiator.
Described honeycomb is that in the barrel of honeycomb metal radiator, side direction glass stem extends to form radially sheet, radially on sheet, is also circumferentially formed arc sheet.
On described glass stem, be also fixedly nested with foam metal, above-mentioned LED light source plate is vertical shape by bending and on foam metal, forms light beam around being fixed on.
On described glass stem, be also fixedly nested with foam metal, above-mentioned LED light source plate is directly fixed on the top of foam metal, or above-mentioned LED light source plate is fixed on aluminium sheet and aluminium sheet is fixed on the top of foam metal.
The below of the below of described LED light source plate, LED light source plate and honeycomb metal radiator or the below of LED light source plate and foam metal, go back provided with fan.
Described drive circuit is arranged in glass cell-shell, and the vigour part of drive circuit is directly welded on the cooling stand of LED light source plate.
Adopt after such scheme, the utility model compared with prior art, has the following advantages:
One, by heat dissipation metal support (as copper), replace high thermal conductivity transparent pipe, utilize the high thermal conductivity of metal, the radiating effect of LED bulb is greatly improved;
Two, the pedestal of existing LED chip only plays the installation effect of supporting, so existing LED chip also needs the special heat sink LED chip work calories derivation that supplies that increases except metal base, and pedestal only leaves few part in the LED of moulding light source grain afterwards in encapsulation, extremely most pedestal can be used as waste material and abandon after encapsulation, cause the cost of existing LED chip encapsulation high, consumption is large, and waste is serious; Compare with existing LED chip encapsulating structure, heat dissipation metal support of the present utility model both provided support to facilitate the encapsulation of LED chip, provide again heat-radiation belt to facilitate LED chip work calories to derive, so the utility model raw material is fully used, saved the heat sink of prior art, radiating effect but improves greatly;
Three, heat dissipation metal support or further coordinate honeycomb metal radiator, foam metal and fan etc., can not only increasing heat radiation area, can also form thermal convection current in inside, and radiating effect is better;
Four, heat dissipation metal support can require bending to be the form that varies in size according to the power designs of LED bulb, for the LED chip of different numbers is installed, makes corresponding LED light emitting source, convenient processing and manufacture, and cost is low.
Key of the present utility model is to integrate the conduction of heat dissipation metal support heat, heat-conducting gas heat conduction and glass cell-shell to dispel the heat, the heat of LED chip work is fully spread through heat dissipation metal support, fully contact with heat-conducting gas, by glass cell-shell, fully distributed again, realize integrated heat dissipation quickly and efficiently.The utility model is specially adapted to make high-power LED bulb, and bulb type is not limit, as bulb lamp, mercury lamp, candle lamp, Down lamp, shot-light, BR lamp, MR lamp etc.
Below in conjunction with drawings and Examples, the utility model is described in further detail.
Accompanying drawing explanation
Fig. 1 is the structural representation of the utility model heat dissipation metal support;
Figure 1A is the partial enlarged drawing of Fig. 1;
Fig. 2 is the structural representation that framework is moulded in the injection moulding of the utility model heat dissipation metal support;
Fig. 2 B is the partial enlarged drawing of Fig. 2;
Fig. 3 is that the structural representation that excises technique fillet after framework is moulded in the injection moulding of the utility model heat dissipation metal support;
Fig. 3 C is the partial enlarged drawing of Fig. 3;
Fig. 4 is the structural representation of the utility model heat dissipation metal support die bond;
Fig. 4 D is the partial enlarged drawing of Fig. 4;
Fig. 5 is the structural representation of the utility model heat dissipation metal support binding gold thread;
Fig. 5 E is the partial enlarged drawing of Fig. 5;
Fig. 6 is the structural representation of the utility model heat dissipation metal support dot fluorescent powder;
Fig. 6 F is the partial enlarged drawing of Fig. 6;
Fig. 7 is the structural representation that the utility model heat dissipation metal support is cut out;
Fig. 7 G is the partial enlarged drawing of Fig. 7;
Fig. 8 is the square flat structure schematic diagram of the utility model LED light source plate;
Fig. 8-1st, the square flat structure of the utility model LED light source plate is used schematic diagram;
Fig. 9 is the dull and stereotyped circulus schematic diagram of the utility model LED light source plate;
Figure 10 is the polygon tubular structure schematic diagram of the utility model LED light source plate;
Figure 11 is the polygon tubular docking structure schematic diagram of the utility model LED light source plate;
Figure 12 is that the polygon tubular structure of the utility model LED light source plate is used schematic diagram;
Figure 13 is the whole cut-away view of the utility model integrated heat dissipation formula LED lamp embodiment mono-(bulb lamp);
Figure 14 is the internal structure schematic diagram of Figure 13;
Figure 15 is the internal structure top view of Figure 13;
Figure 16 is the whole cut-away view of the utility model integrated heat dissipation formula LED lamp embodiment bis-(bulb lamps);
Figure 17 is the internal structure schematic diagram of Figure 16;
Figure 18 is the whole cut-away view of the utility model integrated heat dissipation formula LED lamp embodiment tri-(mercury lamps);
Figure 19 is the internal structure perspective exploded view of Figure 18;
Figure 20 is the structural representation of foam metal;
Figure 21 is the whole cut-away view of the utility model integrated heat dissipation formula LED lamp embodiment tetra-(PAR lamps);
Figure 22 is the internal structure three-dimensional exploded view of Figure 21;
Figure 23 is the whole cut-away view of the utility model integrated heat dissipation formula LED lamp embodiment five (BR lamps);
Figure 24 is the whole cut-away view of the utility model integrated heat dissipation formula LED lamp embodiment six (MR lamps);
Figure 25 is the whole cut-away view of the utility model integrated heat dissipation formula LED lamp embodiment seven (pluggable T8 fluorescent tubes);
Figure 26 is the internal structure schematic diagram of Figure 25;
Figure 27 is the whole cut-away view of the utility model integrated heat dissipation formula LED lamp embodiment eight (screw type T8 fluorescent tubes);
Figure 28 is the whole cut-away view of the utility model integrated heat dissipation formula LED lamp embodiment nine (bulb lamps).
Label declaration
Glass cell-shell 1, enclosed cavity 11, heat-conducting gas 12, lamp holder 2, drive circuit 3, LED chip 4, aluminium sheet 5, glass stem 6, upper bracket 61, lower carriage 62, honeycomb metal radiator 7, radially sheet 71, arc sheet 72, louvre 73, fan 8, foam metal 9;
Cooling stand 300, thermal conduction portions 310, through plate 311, latitude plate 312, positive hollow out frame 313, longitudinal profile groove 314, current-carrying part 320, transverse slat 321,322, conducting strip 323, side hollow out frame 324, technique fillet 325, gap 326, gap 327, breach 328, Insulating frame 330;
LED light source plate 400, gold thread 410, fluorescent material 420.
The specific embodiment
As shown in Fig. 1 and Figure 1A, the improvement heat dissipation metal support 300 of a kind of LED lamp that the utility model discloses, is by punch forming, comprises thermal conduction portions 310 and current-carrying part 320.Thermal conduction portions 310 is by crisscross forming through plate 311 and latitude plate 312, and adjacent surrounds positive hollow out frame 313 through plate 311 and latitude plate 312.Current-carrying part 320 is by upper and lower two transverse slats 321, 322 and conducting strip 323 form, upper and lower two transverse slats 321 and 322 lay respectively at the above and below of thermal conduction portions 310, and upper and lower two transverse slats 321 and 322 and thermal conduction portions 310 have gap 326, upper and lower two transverse slats 321, 322 and adjacent through plate 311, latitude plate 312 surrounds side hollow out frame 324, conducting strip 323 is arranged in positive hollow out frame 313 and side hollow out frame 324, conducting strip 323 is connected by technique fillet 325 with the latitude plate 312 at side hollow out frame 324 edges with positive hollow out frame 313, the conducting strip 323 that is positioned at side hollow out frame 324 is also connected with 322 with adjacent transverse slat 321, conducting strip 323 also has gap 327 with the edge of positive hollow out frame 313 and side hollow out frame 324.Technique fillet 325 removal that will be stamped after LED chip 4 encapsulation, make thermal conduction portions 310 through plate 311 and latitude plate 312 not with two transverse slats 321,322 up and down and conducting strip 324 conductings of current-carrying part 320.
For convenient intercepting and splicing, the utility model further forms longitudinal profile groove 314 on latitude plate 312, and on upper and lower two transverse slats 312 and 322, corresponding longitudinally profile groove 314 also forms breach 328, and the longitudinal profile groove 314 on latitude plate 312 is also conducive to heat loss through convection.
When the improvement heat dissipation metal support 300 of LED lamp of the present utility model is applied to process LED light source plate 400, as shown in Fig. 2 and Fig. 2 B, first in the end through plate 311 and adjacent two conducting strips 323 of cooling stand 300, the plastic frame that Insulating frame 330(can be injection molding moulding is set, or adopt other insulating materials to make Insulating frame 330), for another example shown in Fig. 3 and Fig. 3 C, in technique fillet 325(Fig. 3 C of punching press excision cooling stand 300, be shown in broken lines and represent punching press excision), make through plate 311 and latitude plate 312 and upper and lower two transverse slats 321, 322 and conducting strip 324 all disconnect and not conducting, then as shown in Fig. 4 and Fig. 4 D, LED chip 4 is placed on plate 311 and is fixed in Insulating frame 330, for another example shown in Fig. 5 and Fig. 5 E, LED chip 4 is electrically connected to two adjacent conducting strips 323 by wire (gold thread 410), as shown in Fig. 6 and Fig. 6 F, on LED chip 4, be coated with again luminous bisque (fluorescent material 420).So make a kind of LED light source plate 400 that the utility model discloses.
For the plate of LED light source shown in Fig. 6 400, upper and lower two transverse slats 321 and 322 connect respectively positive source and negative pole, and in whole LED light source plate 400, all LED chips 4 of each latitude plate 312 are connected mutually, and all latitude plates 312 are parallel with one another, this LED light source plate 400 is parallel form.
For LED light source plate 400 shown in Fig. 7 and Fig. 7 G, in the structure shown in Fig. 5, by cutting out (be shown in broken lines in Fig. 7 G and represent punching press excision) and encapsulation, change electrode direction, make all LED chips 4 of whole LED light source plate 400 be mutual series connection, this LED light source plate 400 is series connection form.
Like this, conducting strip 323 is equivalent to the pedestal of existing LED light source grain, thermal conduction portions 310 through plate 311 and latitude plate 312, can replace the heat sink heat conduction and heat radiation of realizing LED chip 4 of existing LED light source grain.The utility model makes full use of the leftover pieces (through plate 311 and latitude plate 312) that tradition can be discarded, and raw material is fully used, and radiating effect but improves greatly.And, the utility model is by the feature of heat dissipation metal support 300, LED light source plate 400 can be tabular (Fig. 8, Fig. 8-1st, increases heat-dissipating aluminium plate 5), or be dull and stereotyped ring-type (Fig. 9) by splicing, or be polygon tubular (Figure 10, Figure 11 is the polygon tubular docking of Figure 10, Figure 12 increases honeycomb metal radiator 7 in the polygon tubular of Figure 10) etc. by bending.
As shown in FIG. 13 to 15, the embodiment mono-of a kind of integrated heat dissipation formula LED lamp that the utility model discloses is bulb lamp, comprises that glass cell-shell 1, lamp holder 2, drive circuit 3 and LED light source plate 400(LED chip 4 and cooling stand 300 form).Drive circuit 3 is arranged on lamp holder 2.Glass cell-shell 1 is located on lamp holder 2, is provided with the glass stem 6 of setting in glass cell-shell 1, and glass cell-shell 1 and glass stem 6 form enclosed cavity 11, the interior falling heat-transfer gas 12 of enclosed cavity 11 at sealed bottom.Support 61 and lower carriage 62 are installed in the top and bottom of glass stem 6.LED light source plate 400 is fixed on glass stem 6, specifically, the two ends of LED light source plate 400 are erect and are arranged on upper bracket 61 and lower carriage 62, LED chip 4 on LED light source plate 400 is electrically connected to drive circuit 3 and lamp holder 2, and LED light source plate 400 is vertical shape by bending and forms light beam around glass stem 6.The heat producing during LED chip 4 work, fully spreads through the large area of cooling stand 300, fully contacts, more fully distributed by the large surface of glass cell-shell 1 with heat-conducting gas 12, realizes integrated heat dissipation quickly and efficiently.
As shown in Figure 16 to Figure 17, the embodiment bis-of a kind of integrated heat dissipation formula LED lamp that the utility model discloses is bulb lamp, also comprises that glass cell-shell 1, lamp holder 2, drive circuit 3 and LED light source plate 400(LED chip 4 and cooling stand 300 form).Drive circuit 3 is arranged on lamp holder 2.Glass cell-shell 1 is located on lamp holder 2, is provided with the glass stem 6 of setting in glass cell-shell 1, and glass cell-shell 1 and glass stem 6 form enclosed cavity 11, the interior falling heat-transfer gas 12 of enclosed cavity 11 at sealed bottom.Support 61 and lower carriage 62 are installed in the top and bottom of glass stem 6.LED light source plate 400 is fixed on glass stem 6, and the LED chip 4 on LED light source plate 400 is electrically connected to drive circuit 3 and lamp holder 2.This embodiment bis-with the difference of embodiment mono-is, on the upper bracket 61 of glass stem 6 and lower carriage 62, be also fixedly nested with honeycomb metal radiator 7, in the barrel of honeycomb metal radiator 7, form honeycomb, honeycomb can have a lot of concrete forms, honeycomb shown in figure is, in the barrel of honeycomb metal radiator 7, side direction glass stem 6 extends to form radially sheet 71, radially on sheet 71, be also circumferentially formed arc sheet 72, on the barrel of honeycomb metal radiator 7, also offer louvre 73 so that thermal convection current, LED light source plate 400 is vertical shape by bending and forms light beam around being fixed on the barrel of honeycomb metal radiator 7.The heat producing during LED chip 4 work, fully spreads through the large area of cooling stand 300 and honeycomb metal radiator 7, fully contacts, more fully distributed by the large surface of glass cell-shell 1 with heat-conducting gas 12, realizes integrated heat dissipation quickly and efficiently.
As shown in Figure 18 to Figure 19, the embodiment tri-of a kind of integrated heat dissipation formula LED lamp that the utility model discloses is mercury lamp (profile is different with embodiment bis-from embodiment mono-), also comprises that glass cell-shell 1, lamp holder 2, drive circuit 3, LED chip 4 and LED light source plate 400(LED chip 4 and cooling stand 300 form).Drive circuit 3 is arranged on lamp holder 2.Glass cell-shell 1 is located on lamp holder 2, is provided with the glass stem 6 of setting in glass cell-shell 1, and glass cell-shell 1 and glass stem 6 form enclosed cavity 11, the interior falling heat-transfer gas 12 of enclosed cavity 11 at sealed bottom.Support 61 and lower carriage 62 are installed in the top and bottom of glass stem 6.LED light source plate 400 is fixed on glass stem 6, and the LED chip 4 on LED light source plate 400 is electrically connected to drive circuit 3 and lamp holder 2.This embodiment tri-with the difference (the same with embodiment bis-) of embodiment mono-is, on the upper bracket 61 of glass stem 6 and lower carriage 62, be also fixedly nested with honeycomb metal radiator 7, in the barrel of honeycomb metal radiator 7, form honeycomb, honeycomb can have a lot of concrete forms, honeycomb shown in figure is, in the barrel of honeycomb metal radiator 7, side direction glass stem 6 extends to form radially sheet 71, radially on sheet 71, be also circumferentially formed arc sheet 72, on the barrel of honeycomb metal radiator 7, also offer louvre 73 so that thermal convection current, LED light source plate 400 is vertical shape by bending and forms light beam around being fixed on the barrel of honeycomb metal radiator 7.In addition, this embodiment tri-is also different from embodiment bis-, and provided with fan 8 is gone back in the below of LED light source plate 400 and honeycomb metal radiator 7.The heat producing during LED chip 4 work, large area through cooling stand 300 and honeycomb metal radiator 7 fully spreads, and fully contacts, and coordinate fan 8 to strengthen thermal convection current with heat-conducting gas 12, large surface by glass cell-shell 1 fully distributes again, realizes integrated heat dissipation quickly and efficiently.
Coordinate shown in Figure 20, honeycomb metal radiator 7 of the present utility model also can be replaced by foam metal 9, improves radiating effect, and effect is identical.
As shown in Figure 21 to Figure 22, the embodiment tetra-of a kind of integrated heat dissipation formula LED lamp that the utility model discloses is PAR lamp, as shown in figure 23, the embodiment five of a kind of integrated heat dissipation formula LED lamp that the utility model discloses is BR lamp, the embodiment six of a kind of integrated heat dissipation formula LED lamp that as shown in figure 24, the utility model discloses is MR lamp.Embodiment tetra-to embodiment six also comprises that glass cell-shell 1, lamp holder 2, drive circuit 3 and LED light source plate 400(LED chip 4 and cooling stand 300 form).Drive circuit 3 is arranged on lamp holder 2.Glass cell-shell 1 is located on lamp holder 2, is provided with the glass stem 6 of setting in glass cell-shell 1, and glass cell-shell 1 and glass stem 6 form enclosed cavity 11, the interior falling heat-transfer gas 12 of enclosed cavity 11 at sealed bottom.LED light source plate 400 is fixed on glass stem 6, specifically, on glass stem 6, be also fixedly nested with honeycomb metal radiator 7, in the barrel of honeycomb metal radiator 7, form honeycomb, honeycomb can have a lot of concrete forms (as previously mentioned), on the barrel of honeycomb metal radiator 7, also offer louvre 73 so that thermal convection current, LED light source plate 400 is fixed on aluminium sheet 5 (sees Fig. 8-1), and aluminium sheet 5 is fixed on the top of honeycomb metal radiator 7, LED light source plate 400 also can directly be fixed on the top of honeycomb metal radiator 7.LED chip 4 on LED light source plate 400 is electrically connected to drive circuit 3 and lamp holder 2.The heat producing during LED chip 4 work, fully spreads through the large area of cooling stand 300 and honeycomb metal radiator 7, fully contacts, more fully distributed by the large surface of glass cell-shell 1 with heat-conducting gas 12, realizes integrated heat dissipation quickly and efficiently.
As shown in Figure 25 to Figure 26, the embodiment seven of a kind of integrated heat dissipation formula LED lamp that the utility model discloses is pluggable T8 fluorescent tube, as shown in figure 27, the embodiment eight of a kind of integrated heat dissipation formula LED lamp that the utility model discloses is screw type T8 fluorescent tube, also all comprise glass cell-shell 1, lamp holder 2, drive circuit 3, LED light source plate 400 and glass stem 6, correlation between this embodiment seven and each member of embodiment eight is identical with embodiment mono-, at this, do not repeat, difference is that the bulb type using is different.The heat producing during LED chip 4 work, fully spreads through the large area of cooling stand 300, fully contact, more fully distributed by the large surface after 1 expansion of glass cell-shell with heat-conducting gas 12, realizes integrated heat dissipation quickly and efficiently.
As shown in figure 28, the embodiment nine of a kind of integrated heat dissipation formula LED lamp that the utility model discloses is bulb lamp, also comprise glass cell-shell 1, lamp holder 2, drive circuit 3, LED light source plate 400 and glass stem 6, correlation between each member of this embodiment nine is identical with embodiment mono-, at this, does not repeat.This embodiment nine with the difference of embodiment mono-is, drive circuit 3 is arranged in glass cell-shell 1, specifically the vigour part of drive circuit 3 is directly welded on to the inner side of cooling stand 300.The heat producing during 3 work of LED chip 4 and drive circuit, fully spreads through the large area of cooling stand 300, fully contact, more fully distributed by the large surface after 1 expansion of glass cell-shell with heat-conducting gas 12, realizes integrated heat dissipation quickly and efficiently.This embodiment nine can extend glass cell-shell 1 as far as possible to lamp holder 2, increase glazed area, and illuminating effect is better.
Above-described embodiment and graphic and non-limiting product form of the present utility model and style, suitable variation or modification that any person of an ordinary skill in the technical field does it, all should be considered as not departing from patent category of the present utility model.

Claims (12)

1. an improvement heat dissipation metal support for LED lamp, is characterized in that: comprise thermal conduction portions and current-carrying part; Thermal conduction portions is by crisscross forming through plate and latitude plate, and adjacent surrounds positive hollow out frame through plate and latitude plate; Current-carrying part is comprised of upper and lower two transverse slats and conducting strip, upper and lower two transverse slats lay respectively at the above and below of thermal conduction portions, and upper and lower two transverse slats and thermal conduction portions have gap, upper and lower two transverse slats and adjacent surround side hollow out frame through plate, latitude plate, conducting strip is arranged in positive hollow out frame and side hollow out frame, conducting strip is connected by technique fillet with the latitude plate of side hollow out edge edge with positive hollow out frame, the conducting strip that is positioned at side hollow out frame is also connected with adjacent transverse slat, and conducting strip also has gap with the edge of positive hollow out frame and side hollow out frame.
2. the improvement heat dissipation metal support of a kind of LED lamp as claimed in claim 1, is characterized in that: on described latitude plate, form longitudinal profile groove.
3. the improvement heat dissipation metal support of a kind of LED lamp as claimed in claim 1, is characterized in that: the corresponding longitudinally profile groove of described upper and lower two transverse slats also forms breach.
4. a LED light source plate, it is characterized in that: by LED chip and cooling stand as claimed in claim 1, formed, the end through plate and adjacent two conducting strips at above-mentioned cooling stand arranges Insulating frame, LED chip is placed on plate and is fixed in Insulating frame, LED chip is also electrically connected to adjacent two conducting strips by wire, is coated with luminous bisque on LED chip.
5. a kind of LED light source plate as claimed in claim 4, is characterized in that: described cooling stand is tabular, dull and stereotyped ring-type or polygon tubular by bending.
6. an integrated heat dissipation formula LED lamp, is characterized in that: comprise glass cell-shell, lamp holder, drive circuit and LED light source plate as claimed in claim 4, drive circuit is arranged in lamp holder or glass cell-shell; Glass envelope clamshell is located on lamp holder, is provided with the glass stem of setting in glass cell-shell, and glass cell-shell and glass stem form enclosed cavity at sealed bottom, falling heat-transfer gas in enclosed cavity; Above-mentioned LED light source plate is fixed on glass stem, and the LED chip on LED light source plate is electrically connected to drive circuit and lamp holder.
7. a kind of integrated heat dissipation formula LED lamp as claimed in claim 6, it is characterized in that: support and lower carriage are installed in the top and bottom of described glass stem, the two ends of above-mentioned LED light source plate are arranged on upper bracket and lower carriage, and above-mentioned LED light source plate is vertical shape by bending and forms light beam around glass stem.
8. a kind of integrated heat dissipation formula LED lamp as claimed in claim 6, it is characterized in that: on described glass stem, be also fixedly nested with honeycomb metal radiator, in the barrel of honeycomb metal radiator, form honeycomb, on the barrel of honeycomb metal radiator, also offer louvre, above-mentioned LED light source plate is vertical shape by bending and forms light beam around being fixed on the barrel of honeycomb metal radiator, or above-mentioned LED light source plate is directly fixed on the top of honeycomb metal radiator, or above-mentioned LED light source plate is fixed on aluminium sheet and aluminium sheet is fixed on the top of honeycomb metal radiator.
9. a kind of integrated heat dissipation formula LED lamp as claimed in claim 8, is characterized in that: described honeycomb is that in the barrel of honeycomb metal radiator, side direction glass stem extends to form radially sheet, radially on sheet, is also circumferentially formed arc sheet.
10. a kind of integrated heat dissipation formula LED lamp as claimed in claim 6, it is characterized in that: on described glass stem, be also fixedly nested with foam metal, above-mentioned LED light source plate is vertical shape by bending and on foam metal, forms light beam around being fixed on, or above-mentioned LED light source plate is directly fixed on the top of foam metal, or above-mentioned LED light source plate is fixed on aluminium sheet and aluminium sheet is fixed on the top of foam metal.
11. a kind of integrated heat dissipation formula LED lamps as described in any one in claim 6 to 10, it is characterized in that: the below of the below of described LED light source plate, LED light source plate and honeycomb metal radiator or the below of LED light source plate and foam metal, go back provided with fan.
12. a kind of integrated heat dissipation formula LED lamps as claimed in claim 6, it is characterized in that: described drive circuit is arranged in glass cell-shell, and the vigour part of drive circuit are directly welded on the cooling stand of LED light source plate.
CN201420227806.XU 2014-04-04 2014-05-06 Improved metal heat radiation support of LED lamp, LED light source plate and integrated heat radiation type LED lamp Expired - Fee Related CN203880658U (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN201420163391.4 2014-04-04
CN201420163391 2014-04-04
CN201420227806.XU CN203880658U (en) 2014-04-04 2014-05-06 Improved metal heat radiation support of LED lamp, LED light source plate and integrated heat radiation type LED lamp

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201420227806.XU CN203880658U (en) 2014-04-04 2014-05-06 Improved metal heat radiation support of LED lamp, LED light source plate and integrated heat radiation type LED lamp

Publications (1)

Publication Number Publication Date
CN203880658U true CN203880658U (en) 2014-10-15

Family

ID=51681149

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201420227806.XU Expired - Fee Related CN203880658U (en) 2014-04-04 2014-05-06 Improved metal heat radiation support of LED lamp, LED light source plate and integrated heat radiation type LED lamp

Country Status (1)

Country Link
CN (1) CN203880658U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108954023A (en) * 2017-05-17 2018-12-07 爱丽思欧雅玛株式会社 LED light

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108954023A (en) * 2017-05-17 2018-12-07 爱丽思欧雅玛株式会社 LED light
CN108954023B (en) * 2017-05-17 2020-08-11 爱丽思欧雅玛株式会社 LED lamp

Similar Documents

Publication Publication Date Title
CN103968347A (en) Metal heat dissipating support of LED lamp, LED light source plate and integration heat dissipating type LED lamp
CN103953861A (en) Integrated heat radiation type LED (light emitting diode) bulb
CN101818866B (en) Led lamp
CN105387355A (en) Parallel-connection type light emitting diode (LED) illuminants and LED illuminating lamp
US20110232886A1 (en) Heat dissipation housing for led lamp
CN203880659U (en) Metal radiating support of LED lamp, LED light source board and integrated radiating-type LED lamp
CN203823499U (en) Integrated heat dissipation type LED bulb
CN203880658U (en) Improved metal heat radiation support of LED lamp, LED light source plate and integrated heat radiation type LED lamp
CN102200258A (en) Radiating shell of light emitting diode light fixture
CN203223778U (en) High-power light-emitting diode (LED) bulb lamp
CN203395774U (en) LED (light emitting diode) street lamp
CN201306628Y (en) A overall heat yield big power LED sun lamp
CN202228962U (en) LED (Light Emitting Diode) lamp
CN104728633A (en) Electric bulb with single-end three-face substrate LED light emitting unit
CN205226920U (en) Parallelly connected type LED luminous element and LED light
CN201436449U (en) Led light source
CN202580797U (en) Modular LED (Light Emitting Diode) lamp structure
CN203880441U (en) LED filament lamp for dissipating heat through glass sheets
CN103398359A (en) Mr16 led lamp cup
CN203893122U (en) LED (Light Emitting Diode) lamp radiator
CN203215559U (en) Multiple-lamp-strip light-emitting diode (LED) light source encapsulation structure
CN104728635A (en) Electric bulb with single-end seven-face substrate LED light emitting unit
CN203177119U (en) LED (Light Emitting Diode) spot lamp with ventilation and heat dissipation structure
CN202902226U (en) Rolling groove type radiator
CN108006452B (en) Big ball bubble lamp of built-in power

Legal Events

Date Code Title Description
GR01 Patent grant
C14 Grant of patent or utility model
ASS Succession or assignment of patent right

Owner name: XIAMEN YINGHUOCHONG ENERGY SAVING TECHNOLOGY CO.,

Free format text: FORMER OWNER: DONGLIN ELECTRONICS CO., LTD., XIAMEN CITY

Effective date: 20141028

C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20141028

Address after: Haicang District of Xiamen City, Fujian province 361000 Dongfu Road No. 2881 Daxi engineering plastics plant 1-5 layer 14# project

Patentee after: XIAMEN FIREFLY ENERGY SCIENCE AND TECHNOLOGY CO., LTD.

Address before: 361000, Fujian Province, Xiamen City, Huli District, Qishan, two North Road, No. 1000, building fireflies

Patentee before: Donglin Electronics Co., Ltd., Xiamen City

CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20141015

Termination date: 20160506

CF01 Termination of patent right due to non-payment of annual fee