CN203859968U - Heat radiation piece - Google Patents
Heat radiation piece Download PDFInfo
- Publication number
- CN203859968U CN203859968U CN201420118988.7U CN201420118988U CN203859968U CN 203859968 U CN203859968 U CN 203859968U CN 201420118988 U CN201420118988 U CN 201420118988U CN 203859968 U CN203859968 U CN 203859968U
- Authority
- CN
- China
- Prior art keywords
- heat
- heat radiation
- layer
- fin
- radiating substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000005855 radiation Effects 0.000 title claims abstract description 16
- 238000006243 chemical reaction Methods 0.000 claims abstract description 30
- 239000000758 substrate Substances 0.000 claims abstract description 25
- 238000005485 electric heating Methods 0.000 claims abstract description 6
- 239000010410 layer Substances 0.000 claims description 58
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 16
- 230000004888 barrier function Effects 0.000 claims description 15
- 239000000463 material Substances 0.000 claims description 9
- 239000003822 epoxy resin Substances 0.000 claims description 5
- 229920000647 polyepoxide Polymers 0.000 claims description 5
- 229920000728 polyester Polymers 0.000 claims description 5
- 239000004814 polyurethane Substances 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 4
- 239000012790 adhesive layer Substances 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 229920001577 copolymer Polymers 0.000 claims description 3
- 150000002148 esters Chemical class 0.000 claims description 3
- 229920002635 polyurethane Polymers 0.000 claims description 3
- 229920005749 polyurethane resin Polymers 0.000 claims description 3
- 229920002554 vinyl polymer Polymers 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 2
- 239000000956 alloy Substances 0.000 claims description 2
- 229910045601 alloy Inorganic materials 0.000 claims description 2
- 239000004411 aluminium Substances 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 229910002804 graphite Inorganic materials 0.000 claims description 2
- 239000010439 graphite Substances 0.000 claims description 2
- 239000011777 magnesium Substances 0.000 claims description 2
- 229910052749 magnesium Inorganic materials 0.000 claims description 2
- 238000009413 insulation Methods 0.000 abstract description 13
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 21
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 14
- 229910052799 carbon Inorganic materials 0.000 description 14
- 229910010271 silicon carbide Inorganic materials 0.000 description 9
- 229910017083 AlN Inorganic materials 0.000 description 7
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 7
- 229910052582 BN Inorganic materials 0.000 description 7
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 7
- 239000004408 titanium dioxide Substances 0.000 description 7
- 239000008187 granular material Substances 0.000 description 6
- 239000012943 hotmelt Substances 0.000 description 4
- 239000002105 nanoparticle Substances 0.000 description 4
- 229920000297 Rayon Polymers 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000005284 excitation Effects 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- -1 polyethylene Polymers 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
Abstract
The utility model is suitable for the technical field of heat radiation and discloses a heat radiation piece with an insulation function. The heat radiation piece comprises a heat radiation substrate which is provided with an insulation layer. The heat radiation piece also comprises a carrier layer arranged on the insulation layer. The carrier layer is uniformly provided with a heat conversion layer which converts heat into infrared rays. When the heat radiation piece is used, the heat radiation substrate is directly in contact with an electric heating device, thermal energy is converted into the infrared ray by the heat conversion layer, thus heat spreads, the heat radiation efficiency is high, and the insulation effect is good. Compared with the prior art, the insulation problem of a closed space can be solved, the heat radiation efficiency in active heat radiation can be taken into account, at the same time the small size of an electronic product is obtained when the passive heat radiation is adopted, the heat radiation efficiency of the electronic product is raised, the temperature of a working environment is reduced, and the heat radiation piece can be widely used in various types of electronic and electromechanical products.
Description
Technical field
The utility model relates to cooling electronic component and insulation technology field.
Background technology
Along with electronics is integrated and miniaturization, the electronic devices and components of confined space and the heat dissipation problem of electronic product are solved, but most fin is all metal base and composite material, in airtight space, electronic devices and components are very concentrated, in a large amount of production, for prevent that employee from operating not in place or being shifted and causing each other and can contact, and normally moves thereby affect product in transport or other vibrations.Therefore how to insulate and to have become problem demanding prompt solution.
Utility model content
The technical problem that the utility model mainly solves is to provide a kind of fin with good insulating performance, and this fin can improve electronic product radiating efficiency, reduces operating ambient temperature, and good insulation preformance.
The open one of the utility model has insulation function fin, and this fin comprises heat-radiating substrate, is provided with insulating barrier on heat-radiating substrate, also comprises the carrier layer of being located on insulating barrier, is evenly provided with and transfers heat to ultrared heat conversion layer in this carrier layer.
Say further, described heat conversion layer at least comprises the carbon granule of nanometer or Subnano-class.
Say further, carborundum, boron nitride, aluminium nitride, aluminium oxide, titanium dioxide or the carbon granule that described heat conversion layer also comprises nanometer or Subnano-class wherein one or more.
Say further, the density of described carrier layer is greater than the density of each material of composition heat conversion layer.
Say further, described heat-radiating substrate, for heat radiation conduction material, comprises aluminium, copper, magnesium and alloy thereof, graphite and goods thereof
Say further, described insulating barrier is insulation high-temperature-resistant material, preferably polyethylene, polypropylene.Polyvinyl chloride etc.
Say further, between described insulating barrier and heat-radiating substrate, be provided with adhesive layer.
Say further, the area of described insulating barrier is greater than heat-radiating substrate area.
Brief description of the drawings
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, to the accompanying drawing of required use in embodiment or description of the Prior Art be briefly described below, apparently, and describe in accompanying drawing be embodiment more of the present utility model, to those skilled in the art, do not paying under the prerequisite of creative work, can also obtain other accompanying drawings according to these accompanying drawings.
Fig. 1 is the utility model fin embodiment 1 cross-sectional view.
Fig. 2 is the utility model fin embodiment 2 cross-sectional view.
Below in conjunction with embodiment, and with reference to accompanying drawing, realization, functional characteristics and advantage to the utility model object are described further.
Embodiment
In order to make the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with the accompanying drawing in the utility model embodiment, technical scheme in the utility model embodiment is clearly and completely described, obviously, described embodiment is utility model part embodiment, instead of whole embodiment.Based on the embodiment in the utility model, the every other embodiment that those of ordinary skill in the art obtain under the prerequisite of not making creative work, belongs to the scope that the utility model is protected.
As shown in Figure 1, the utility model provides a kind of fin with insulation function, and this fin comprises heat-radiating substrate 3, is provided with carrier layer 2 in these heat-radiating substrate 3 one sides, on this section of body layer 2, is evenly distributed with and transfers heat to ultrared heat conversion layer 1.On these heat-radiating substrate 3 another sides and heat conversion layer 1, be also provided with insulating barrier 4.1 and 4.2.Aforementioned dielectric layer 4.1 and 4.1 is bonded together, and area is greater than the area of heat-radiating substrate.
Specifically, be provided with and transfer heat to ultrared heat conversion layer 1 at the surface uniform of carrier layer 2, this heat conversion layer 1 at least comprises the carbon of nanometer or Subnano-class, carborundum, boron nitride, aluminium nitride, aluminium oxide, titanium dioxide or the carbon granule that can also comprise as required nanometer or Subnano-class wherein one or more.
Described carrier layer 2 is for heat conversion layer 1 is fixed on to electric heating device 5, and this carrier layer 2 can comprise polyurethane series (PU), epoxy resin (EPOXY), polyurethane resin system (HYHRID), polyester (POLYESTER) or fluoroolefins-vinyl ethers (ester) copolymer coating (FEVE) etc.In the time that heat conversion layer 1 is mainly made up of carbon, carborundum, boron nitride, aluminium nitride, aluminium oxide, titanium dioxide and the carbon granule of nanometer or Subnano-class, its nano-sized carbon that is 5-30% containing weight ratio, weight ratio is the carborundum of 10-20%, weight ratio is the boron nitride of 10-20%, weight ratio is the aluminium nitride of 10-20%, the titanium dioxide that the aluminium oxide that weight ratio is 5-10% and weight ratio are 5-30%.The thickness 10um-100um of described carrier layer 2, this carrier layer is unsuitable thick, and due to this carrier layer 2, normally heat transference efficiency is not too high, therefore the thickness of carrier layer is unsuitable excessive, conduct to heat conversion layer otherwise affect heat, and then affect the excitation energy of heat conversion layer, affect radiating efficiency.The density of described carrier layer 2 is greater than the density of each material of composition heat conversion layer, can be conveniently will more evenly be located at carrier layer 2 surfaces by nanometer or sub-nano-sized carbon or the lighter material of carborundum isodensity by hot melt characteristic.
When use, this fin is directly contacted with electric heating device, as shown in Figure 1, can be by being located at viscose glue on insulating barrier 4.1 directly and thermoelectric heating device is fixed.Because the area of insulating barrier is greater than the area of its plate that dispels the heat, thus intercept contacting of electronic devices and components and heat-radiating substrate, thus solve Insulation Problems.Separately, because heat conversion layer forms homogeneous texture by the mode that adopts hot melt, therefore heat conversion layer is located on heat-radiating substrate 3, is facilitated better user directly to use.
As shown in Figure 2, the utility model also provides a kind of fin with insulation function, and this fin comprises heat-radiating substrate 3, is provided with carrier layer 2 in these heat-radiating substrate 3 one sides, on this section of body layer 2, is evenly distributed with and transfers heat to ultrared heat conversion layer 1.On these heat-radiating substrate 3 another sides, be also provided with insulating barrier 4.And area is greater than the area of heat-radiating substrate.
Specifically, be provided with and transfer heat to ultrared heat conversion layer 1 at the surface uniform of carrier layer 2, this heat conversion layer 1 at least comprises the carbon of nanometer or Subnano-class, carborundum, boron nitride, aluminium nitride, aluminium oxide, titanium dioxide or the carbon granule that can also comprise as required nanometer or Subnano-class wherein one or more.
Described carrier layer 2 is for heat conversion layer 1 is fixed on to electric heating device 5, and this carrier layer 2 can comprise polyurethane series (PU), epoxy resin (EPOXY), polyurethane resin system (HYHRID), polyester (POLYESTER) or fluoroolefins-vinyl ethers (ester) copolymer coating (FEVE) etc.In the time that heat conversion layer 1 is mainly made up of carbon, carborundum, boron nitride, aluminium nitride, aluminium oxide, titanium dioxide and the carbon granule of nanometer or Subnano-class, its nano-sized carbon that is 5-30% containing weight ratio, weight ratio is the carborundum of 10-20%, weight ratio is the boron nitride of 10-20%, weight ratio is the aluminium nitride of 10-20%, the titanium dioxide that the aluminium oxide that weight ratio is 5-10% and weight ratio are 5-30%.The thickness 10um-100um of described carrier layer 2, this carrier layer is unsuitable thick, and due to this carrier layer 2, normally heat transference efficiency is not too high, therefore the thickness of carrier layer is unsuitable excessive, conduct to heat conversion layer otherwise affect heat, and then affect the excitation energy of heat conversion layer, affect radiating efficiency.The density of described carrier layer 2 is greater than the density of each material of composition heat conversion layer, can be conveniently will more evenly be located at carrier layer 2 surfaces by nanometer or sub-nano-sized carbon or the lighter material of carborundum isodensity by hot melt characteristic.
When use, this fin is directly or indirectly contacted with electric heating device, as shown in Figure 2, viscose glue that can be by being located at insulating barrier 4 directly and thermoelectric heating device fix.Because insulating barrier area is greater than heat-radiating substrate area, after installation, can there is knuckle in insulating barrier, thereby intercept contacting of fin and heater members and other electronic devices and components, thereby solve Insulation Problems.Separately, because heat conversion layer forms homogeneous texture by the mode that adopts hot melt, therefore heat conversion layer is located on heat-radiating substrate 3, is facilitated better user directly to use.
Above embodiment only, in order to the technical solution of the utility model to be described, is not intended to limit; Although the utility model is had been described in detail with reference to previous embodiment, those of ordinary skill in the art is to be understood that: its technical scheme that still can record aforementioned each embodiment is modified, or part technical characterictic is wherein equal to replacement, and these amendments or replacement do not make the essence of appropriate technical solution depart from the spirit and scope of the each embodiment technical scheme of the utility model.
Claims (7)
1. a fin, the heat that directly or indirectly contact produces electric heating device scatters, and this fin comprises heat-radiating substrate, it is characterized in that:
At least simultaneously be provided with carrier layer at this heat-radiating substrate, in this carrier layer, be evenly distributed with and transfer heat to ultrared heat conversion layer, on this heat-radiating substrate, be also provided with insulating barrier.
2. fin according to claim 1, is characterized in that:
Described insulating barrier area is greater than heat conversion layer area.
3. fin according to claim 1, is characterized in that:
Between described insulating barrier and heat-radiating substrate, be provided with adhesive layer.
4. fin according to claim 1, is characterized in that:
Described carrier layer is polyurethane series, epoxy resin, polyurethane resin system, polyester, fluoroolefins-vinyl ethers (ester) copolymer coating.
5. according to the fin described in claim 1 or 4, it is characterized in that:
The density of described carrier layer is greater than the density of each material of composition heat conversion layer.
6. fin according to claim 1, is characterized in that:
Described heat-radiating substrate, for heat radiation conduction material, comprises aluminium, copper, magnesium and alloy thereof, graphite and goods thereof.
7. fin according to claim 6, is characterized in that:
Described heat-radiating substrate and heat generating components contact-making surface are provided with adhesive layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420118988.7U CN203859968U (en) | 2014-03-14 | 2014-03-14 | Heat radiation piece |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420118988.7U CN203859968U (en) | 2014-03-14 | 2014-03-14 | Heat radiation piece |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203859968U true CN203859968U (en) | 2014-10-01 |
Family
ID=51609810
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420118988.7U Expired - Lifetime CN203859968U (en) | 2014-03-14 | 2014-03-14 | Heat radiation piece |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203859968U (en) |
-
2014
- 2014-03-14 CN CN201420118988.7U patent/CN203859968U/en not_active Expired - Lifetime
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A heat sink Effective date of registration: 20220623 Granted publication date: 20141001 Pledgee: Shenzhen small and medium sized small loan Co.,Ltd. Pledgor: PROVENCE TECHNOLOGY (SHENZHEN) Co.,Ltd. Registration number: Y2022440020106 |
|
| CX01 | Expiry of patent term |
Granted publication date: 20141001 |