CN203722944U - Electronic device mechanism supporting embedded installation of embedded module - Google Patents
Electronic device mechanism supporting embedded installation of embedded module Download PDFInfo
- Publication number
- CN203722944U CN203722944U CN201320838980.3U CN201320838980U CN203722944U CN 203722944 U CN203722944 U CN 203722944U CN 201320838980 U CN201320838980 U CN 201320838980U CN 203722944 U CN203722944 U CN 203722944U
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- Prior art keywords
- shell
- inner casing
- embedded
- cavity
- functional module
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- 238000009434 installation Methods 0.000 title claims abstract description 35
- 230000007246 mechanism Effects 0.000 title claims abstract description 24
- 238000007789 sealing Methods 0.000 claims description 7
- 230000008054 signal transmission Effects 0.000 claims description 6
- 238000002347 injection Methods 0.000 claims description 2
- 239000007924 injection Substances 0.000 claims description 2
- 230000006870 function Effects 0.000 description 7
- 239000000428 dust Substances 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 230000005670 electromagnetic radiation Effects 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- 230000006978 adaptation Effects 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000284 extract Substances 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 208000002925 dental caries Diseases 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002991 molded plastic Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000010137 moulding (plastic) Methods 0.000 description 1
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- Casings For Electric Apparatus (AREA)
Abstract
The utility model relates to an electronic device mechanism supporting embedded installation of an embedded module. The mechanism includes an outer shell for placement of electronic components of a host and an inner shell with an opening in one side for inserting installation of an embedded functional module, wherein the inner shell is at least partially arranged inside a cavity of the outer shell. When the inner shell is completely inside the cavity of the outer shell, the side of the inner shell with the opening is in the same plane with a side plate of the outer shell, wherein the opening is directly formed in the side plate of the outer shell. When the inner shell is partially exposed outside the outer shell, the side of the inner shell with the opening is directly exposed outside the outer shell. Compared to the prior art, the shielding property of each shell ensures that no electromagnetic interference is generated between the electronic components inside the inner shell and the outer shell. When the embedded functional module is inserted or dismounted, it is only necessary to insert the module into the opening in one side of the inner shell or pull the module out of the opening, so that it is ensured that the electronic components inside the outer shell cavity are not exposed outside due to installation of the embedded functional module and are not polluted by the environment.
Description
Technical field
The utility model relates to a kind of electronic equipment, particularly a kind of electronic equipment mechanism that supports the embedded installation of flush bonding module for computer, instrument, communication apparatus etc.
Background technology
Casing, is often referred to the shell that various electronic products or electronic equipment use.Can be divided into according to purposes: computer chassis, television cabin, hand set machine shell, instrument and meter casing, motor case etc.Can be divided into cabinet, alloy housing, composite material casing etc. according to material.
At present, main frame electronic unit and the embedded functional module of existing electronic equipment or electronic product are generally adopted in two ways in the time being linked and packed with casing, the first mode of being linked and packed is that main frame electronic unit is arranged in casing, and embedded functional module is arranged on outside casing, the embedded functional module being positioned at outside casing is carried out communication by the main frame electronic unit of data wire and power line and casing.The defect of this casing is, due to main frame electronic unit and embedded functional module is mounted respectively in casing and casing outside, cause the non-constant of integrated level of whole electronic equipment.And can greatly increase the volume of whole electronic equipment, reduce its convenience.
The second mode of being linked and packed is that main frame electronic unit and embedded functional module are all arranged in same casing, although this way can reduce the volume of whole electronic equipment, but the difficulty that has improved electromagnetic Compatibility Design between the interior original host electronic unit of casing and flush bonding module, very easily causes mutual electromagnetic between the two to be disturbed.In the time that embedded functional module is mounted and dismounted, be also easy to make the main frame electronic unit in casing to be exposed in external environment, the pollution of exposure to electromagnetic radiation, water and dust.
Utility model content
The purpose of this utility model is to provide a kind of electronic equipment mechanism that supports the embedded installation of flush bonding module, embedded functional module can be facilitated, is integrated in reliably in the casing of whole electronic equipment, having overcome current electronic equipment, connect the level of integrated system that embedded functional module causes in outside low, is inconvenient to carry and cannot moves the defect of use.Also overcome at casing simultaneously inner install, dismounting embedded functional module easily cause former internal components be subject to environment in electromagnetic radiation and dust pollute, and between former internal components and embedded functional module, easily mutually cause the defects such as electromagnetic interference.
For achieving the above object, the utility model provides a kind of electronic equipment mechanism that supports the embedded installation of flush bonding module, comprises the shell for placing main frame electronic unit, the N group inner casing with a side opening for plug-in mounting embedded functional module; Wherein, described N is natural number, and described inner casing has at least part to be arranged in the cavity of described shell.
In the time that described inner casing is positioned at the cavity of described shell completely, described inner casing is in the same plane with a side of opening and the side plate of described shell, and described opening is formed on the side plate of described shell; In the time that described inner casing has part to be exposed to outside described shell, described inner casing is directly exposed to outside described shell with a side of opening;
Described embedded functional module is inserted in the cavity of described inner casing from the opening of described inner casing one side;
The base plate that described inner casing deviates from described opening one side is provided with the hole that contacts being communicated with described shell cavity; Described contact is provided with connector in hole, and the main frame electronic unit in described shell cavity is powered and the transmission of signal to the embedded functional module in described inner casing cavity by described connector.
Execution mode of the present utility model in terms of existing technologies, because whole casing is made up of shell and inner casing, wherein main frame electronic unit is installed in the enclosure, and embedded functional module is arranged in inner casing, by the shielding properties of housing self separately, guarantee can not produce mutually between main frame electronic unit and embedded functional module electromagnetic interference.And due to can be by inner casing setting in the enclosure, inner casing overlaps with the partial shell of shell, can make the volume of whole electronic equipment greatly reduce, inside and outside shell bonding strength improves greatly.In addition, in the time that the embedded functional module to electronic equipment is carried out installation or removal, only its opening from inner casing one side need be inserted or extracts, without shell is removed, thereby guarantee easily embedded functional module integration in casing of the present utility model, and guarantee that the main frame electronic unit in shell cavity can, because the installation or removal of embedded functional module are exposed in external environment condition, not avoid it to be subject to the pollution of electromagnetic radiation, water and dust.
Preferably, in order to meet the needs of practical set, described shell and described inner casing can adopt integral die-cast moulding or adopt injection mo(u)lding.So in the time that embedded functional module is plugged, can bear the active force of embedded functional module in the time that plug passes in and out inner casing by shell, thereby further improve the fastness of whole electronic device shell.
In addition, the cavity both sides of described inner casing arrange floor, and described floor is provided with guide rail.Embedded functional module, in the time of actual installation, can be inserted in the cavity of described inner casing along the guide rail on described floor.Because the cavity both sides at inner casing are provided with floor, and floor is provided with guide rail, when embedded functional module is in the time installing with inner casing, can embedded functional module be guided with position and located inserting the direction of installing and extracting while removing stage makeup and costume by guide rail.
Further, the both sides of described embedded functional module are provided with bayonet lock, and on described floor, corresponding described bayonet lock place is provided with hole clipping.Hence one can see that, when described embedded functional module is inserted to by the guide rail on floor after the cavity of inner casing, bayonet lock in described embedded functional module can directly be buckled in the hole clipping of described floor, thereby described embedded functional module is fixed in the cavity of described inner casing, further ensures the fastness of whole embedded functional module after installation with this.
Wherein, in order to meet the demand of assembling, the shape of described hole clipping can be carried out adaptation to it according to the concrete shape of described bayonet lock, can be processed into the through-hole structure of circle, square or other shapes.Because the shape of hole clipping and bayonet lock is suitable, thereby ensure the laminating degree after bayonet lock is connected with hole clipping, make bayonet lock after being connected with hole clipping, bayonet lock can not produce loosening in hole clipping, has further guaranteed that embedded functional module is in the fastness of inserting after inner casing cavity.
And in the time that shell has waterproof requirement, the junction of described contact hole and described connector can be provided with sealing ring.Can realize the isolation completely of water and dust between inner casing and shell cavity by sealing ring, thereby further improve the sealing property of whole casing.
Further, in order to meet actual installation requirements, described connector can adopt DB9 type connector or column type aviation connector.Main frame electronic unit in shell cavity completes power supply and the signal transmission to the embedded functional module in inner casing cavity by DN9 type connector or column type aviation connector.And in order to meet actual assembling demand, that the shape in described contact hole can adopt is square, circular or other through-hole structure, and the shape of described connector and the described shape that contacts hole match.Thereby ensured connector with contact hole to complete assembling after can not produce loosening and gaps and omissions, the tightness degree after further having improved connector and having contacted hole and assembled.
In addition, described shell also has a upper cover, and described upper cover has a slotted eye being communicated with described shell cavity; Described main frame electronic unit comprises screen body: described screen body is embedded in the cavity of described shell by described slotted eye.Due to screen body being also installed in the enclosure, thereby make electronic equipment of the present utility model possess the Presentation Function of image information.
Further, described screen body comprises touch-screen and display screen, thereby make electronic equipment of the present utility model outside the Presentation Function that possesses image information, also possesses the function of touch control operation, can directly operate electronic equipment by touch-screen, thereby further improve user's use impression.
Preferably, described main frame electronic unit also comprises: the parts such as master control borad, hard disk, internal memory and battery.Thereby make electronic equipment of the present utility model possess the function of a mobile terminal.
Brief description of the drawings
Fig. 1 is the structural representation of the electronic equipment mechanism of the embedded installation of support flush bonding module of the utility model the first execution mode;
Fig. 2 is the front side schematic diagram of supporting the electronic equipment mechanism of the embedded installation of flush bonding module in the utility model the first execution mode;
Fig. 3 supports the electronic equipment mechanism of the embedded installation of flush bonding module and the assembling schematic diagram of functional module in the utility model the first execution mode;
Fig. 4 is the structural representation of the electronic equipment mechanism of the embedded installation of support flush bonding module of the utility model the 3rd execution mode.
Embodiment
For making the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with accompanying drawing, each execution mode of the present utility model is explained in detail.But, persons of ordinary skill in the art may appreciate that in the each execution mode of the utility model, in order to make reader understand the application better, many ins and outs are proposed.But, even without these ins and outs and the many variations based on following execution mode and amendment, also can realize the each claim of the application technical scheme required for protection.
The first execution mode of the present utility model relates to a kind of electronic equipment mechanism that supports the embedded installation of flush bonding module, as shown in Figure 1 to Figure 3, comprise the shell 1 for placing main frame electronic unit, the inner casing 2 with a side opening 3 for plug-in mounting embedded functional module 7.
Wherein, inner casing 2 can arrange many groups according to the quantity of embedded functional module, and inner casing 2 can be arranged in the cavity of shell 1 completely, also can only the partial shell of inner casing 2 be arranged in the cavity of shell 1.
In the time that inner casing 2 is positioned at the cavity of shell 1 completely, inner casing 2 is positioned in same plane with a side of opening 3 and the side plate 4 of shell 1, and opening 3 is formed directly on the side plate 4 of shell 1.And in the time that inner casing 2 has part to be exposed to outside the housing of shell 1 or be exposed to outside the housing of shell 1 completely, inner casing 2 is to be directly exposed to outside the housing of shell 1 with a side of opening 3.And in the present embodiment, as shown in Figure 1, inner casing 2 is in the cavity being arranged on completely in shell 1, thereby can make the space utilization of shell 1 reach maximization, reduce the volume of whole electronic equipment.
And, as shown in Figure 3, in the time that embedded functional module and inner casing 2 assemble, it directly can be inserted in the cavity of inner casing 2 by opening 3 from inner casing 2 one sides, thereby complete the process of whole assembling.
In addition, on inner casing 2 deviates from the base plate of opening 3 one sides, be provided be communicated with shell cavity contact hole 5.Contact is provided with connector 6 in hole 5.Main frame electronic unit in shell 1 cavity can be powered and the transmission of signal to the embedded functional module 7 in inner casing 2 cavitys by connector 6.
Hence one can see that, due in the present embodiment, whole casing is made up of shell 1 and inner casing 2, wherein main frame electronic unit is arranged in shell 1, and embedded functional module 7 is arranged in inner casing 2, by the shielding properties of housing self separately, guarantee can not produce mutually between main frame electronic unit and embedded functional module 7 electromagnetic interference.And, owing to inner casing 2 can being arranged in shell 1 completely, thereby cause inner casing 2 to overlap completely with the partial shell of shell 1, can make the volume of whole electronic equipment greatly reduce by this kind of structure.In addition, in the time that the embedded functional module to electronic equipment is carried out installation or removal, only it need be inserted or extract by opening 3 from inner casing 2 one sides, without shell 1 is removed, thereby guarantee easily embedded functional module integration in the casing of present embodiment, and guarantee that the main frame electronic unit in shell 1 cavity can, because the installation or removal of embedded functional module are exposed in external environment condition, not avoid it to be subject to the pollution of electromagnetic radiation, water and dust.
Specifically, in the present embodiment, main frame electronic unit also comprises: the parts such as master control borad 8, hard disk, internal memory, battery and screen body 10.In actual assembling process, one end of connector 6 is connected with master control borad, and the other end is connected with embedded functional module 7, completes power supply and the signal transmission to embedded functional module by the control of master control borad 8.And the kind by main frame electronic unit is known, present embodiment electronic equipment possessed the function of a mobile terminal.
And connector 6 can adopt DB9 type connector or column type aviation connector.And in the present embodiment, what connector 6 adopted is DB9 type connector.Master control borad 8 in shell 1 cavity completes power supply and the signal transmission to the embedded functional module in inner casing cavity by DN9 type connector.And in order to meet actual assembling demand, the shape in contact hole 5 can adopt square, circular or other through-hole structure, and the shape of connector 6 matches with the shape that contacts hole 5.Thereby ensured connector 6 with contact hole 5 to complete assembling after can not produce loosening and gaps and omissions, further improved connector 6 and contacted the tightness degree after has assembled in hole 5.
In addition, it is worth mentioning that, as shown in Figure 2, in the present embodiment, shell 1 also has a upper cover 9, and upper cover 9 has a slotted eye being communicated with the cavity of shell 1.Wherein, the screen body 10 of main frame electronic unit is to be embedded in the cavity of shell 1 by slotted eye, completes thus the installation of whole screen body 10.And, this screen body 10 is to be made up of touch-screen and display screen, thereby make the electronic equipment of present embodiment outside the Presentation Function with image information, also possesses the function of touch control operation, can directly operate electronic equipment by touch-screen, thereby further improve user's use impression.
In addition, according to the type difference of electronic equipment, the cavity body structure of shell and inner casing also can be adjusted according to actual situation, the casing of present embodiment also be can be applicable in the equipment of electronic units such as thering is no touch-screen, display screen and battery, thereby make the casing of present embodiment there is application scenarios widely.
The second execution mode of the present utility model relates to a kind of electronic equipment mechanism that supports the embedded installation of flush bonding module, the second execution mode is on the basis of the first execution mode, to have done further improvement, it mainly improves and is: in the present embodiment, shell 1 adopts integral die-cast or integral molded plastic moulding with inner casing 2.So in the time that embedded functional module 7 is plugged, can bear the active force of embedded functional module 7 in the time that plug passes in and out inner casing 2 by shell 1, thereby further improve the fastness of whole electronic device shell.
The 3rd execution mode of the present utility model relates to a kind of electronic equipment mechanism that supports the embedded installation of flush bonding module, the 3rd execution mode is on the basis of the first execution mode, to have done further improvement, it mainly improves and is: as shown in Figure 4, in the present embodiment, the cavity both sides of inner casing 2 also arrange floor 11, and are also provided with guide rail 12 on floor 11.Embedded functional module 7, in the time of actual installation, can be inserted in the cavity of inner casing 2 along the guide rail 12 on floor 11.
Hence one can see that, in the present embodiment, because the cavity both sides at inner casing 2 are provided with floor 11, and floor 11 is provided with guide rail 12, when embedded functional module 7 is in the time installing with inner casing 2, can embedded functional module 7 be guided with position and located inserting the direction of installing and extracting while removing stage makeup and costume by guide rail 12.
In addition, be provided with bayonet lock (not indicating in figure) in the both sides of embedded functional module, and on floor 11, be provided with the hole clipping 13 coordinating with bayonet lock.Hence one can see that, when embedded functional module 7 is inserted to after the cavity of inner casing by the guide rail 12 on floor 11, bayonet lock in embedded functional module 7 can directly be buckled in the hole clipping 13 of floor 11, thereby embedded functional module 7 is fixed in the cavity of inner casing 2, further ensures the fastness of whole embedded functional module after installation with this.
And in order to meet the demand of assembling, the shape of hole clipping 13 can be carried out adaptation to it according to the concrete shape of bayonet lock, can be processed into the through-hole structure of circle, square or other shapes.Hence one can see that, because the shape of hole clipping 13 and bayonet lock is suitable, thereby ensure the laminating degree after bayonet lock is connected with hole clipping 13, make bayonet lock after being connected with hole clipping 13, bayonet lock can be not loosening in the interior generation of hole clipping 13, further guaranteed that embedded functional module is in the fastness of inserting after inner casing cavity.
The 4th execution mode of the present utility model relates to a kind of electronic equipment mechanism that supports the embedded installation of flush bonding module, the 4th execution mode is on the basis of the 3rd execution mode, to have done further improvement, it mainly improves and is: in the present embodiment, in the time that shell 1 has waterproof requirement, contact hole 5 also can be provided with sealing ring (not indicating in figure) with the junction of connector 6.Can realize the isolation completely of water and dust between inner casing 2 and shell 1 cavity by sealing ring, thereby further improve the sealing property of whole casing.
Persons of ordinary skill in the art may appreciate that the respective embodiments described above are to realize specific embodiment of the utility model, and in actual applications, can do various changes to it in the form and details, and do not depart from spirit and scope of the present utility model.
Claims (9)
1. an electronic equipment mechanism that supports the embedded installation of flush bonding module, is characterized in that: comprise the shell for placing main frame electronic unit, the N group inner casing with a side opening for plug-in mounting embedded functional module; Wherein, described N is natural number, and described inner casing has at least part to be arranged in the cavity of described shell;
In the time that described inner casing is positioned at the cavity of described shell completely, described inner casing is in the same plane with a side of opening and the side plate of described shell, and described opening is formed on the side plate of described shell; In the time that described inner casing has part to be exposed to outside described shell, described inner casing is directly exposed to outside described shell with a side of opening;
Described embedded functional module is inserted in the cavity of described inner casing from the opening of described inner casing one side;
The base plate that described inner casing deviates from described opening one side is provided with the hole that contacts being communicated with described shell cavity; Described contact is provided with connector in hole, and the main frame electronic unit in described shell cavity is powered and the transmission of signal to the embedded functional module in described inner casing cavity by described connector.
2. the electronic equipment mechanism of the embedded installation of support flush bonding module according to claim 1, is characterized in that: described shell and described inner casing are integral die-cast or injection mo(u)lding.
3. the electronic equipment mechanism of the embedded installation of support flush bonding module according to claim 1, is characterized in that: the cavity both sides of described inner casing arrange floor, and described floor is provided with guide rail;
Described embedded functional module is inserted in the cavity of described inner casing along the guide rail on described floor.
4. the electronic equipment mechanism of the embedded installation of support flush bonding module according to claim 3, is characterized in that: the both sides of described embedded functional module are provided with bayonet lock, and on described floor, corresponding described bayonet lock place is provided with hole clipping;
Bayonet lock in described embedded functional module is buckled in the hole clipping on described floor described embedded functional module is fixed in the cavity of described inner casing.
5. the electronic equipment mechanism of the embedded installation of support flush bonding module according to claim 4, is characterized in that: the shape of described hole clipping and the shape of described bayonet lock are suitable, for circular or square.
6. the electronic equipment mechanism of the embedded installation of support flush bonding module according to claim 1, is characterized in that: the junction of described contact hole and described connector is also provided with the sealing ring for waterproof.
7. the electronic equipment mechanism of the embedded installation of support flush bonding module according to claim 1, is characterized in that: described connector is DB9 type connector or column type aviation connector.
8. according to the electronic equipment mechanism of the embedded installation of support flush bonding module described in any one in claim 1 to 7, it is characterized in that: the shape in described contact hole and the shape of described connector match.
9. according to the electronic equipment mechanism of the embedded installation of support flush bonding module described in any one in claim 1 to 7, it is characterized in that: described shell also has a upper cover, described upper cover has a slotted eye being communicated with the cavity of described shell;
Described main frame electronic unit comprises screen body: described screen body is embedded in the cavity of described shell by described slotted eye.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320838980.3U CN203722944U (en) | 2013-12-18 | 2013-12-18 | Electronic device mechanism supporting embedded installation of embedded module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320838980.3U CN203722944U (en) | 2013-12-18 | 2013-12-18 | Electronic device mechanism supporting embedded installation of embedded module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203722944U true CN203722944U (en) | 2014-07-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320838980.3U Expired - Fee Related CN203722944U (en) | 2013-12-18 | 2013-12-18 | Electronic device mechanism supporting embedded installation of embedded module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203722944U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021190172A1 (en) * | 2020-03-26 | 2021-09-30 | 维沃移动通信有限公司 | Electronic device |
-
2013
- 2013-12-18 CN CN201320838980.3U patent/CN203722944U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021190172A1 (en) * | 2020-03-26 | 2021-09-30 | 维沃移动通信有限公司 | Electronic device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20190121 Address after: 511442 No. 12 Bowang Street, Nancun Town, Panyu District, Guangzhou City, Guangdong Province, 1631 Co-patentee after: Li Mingdong Patentee after: Guangzhou Danuo Intelligent System Co.,Ltd. Address before: Room B403-5, 456 Bibo Road, Zhangjiang High-tech Park, Pudong New Area, Shanghai, 201203 Co-patentee before: Li Mingdong Patentee before: SHANGHAI TAINELL INFORMATION TECHNOLOGY Co.,Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140716 Termination date: 20211218 |