CN203715776U - Novel vacuum electroplating device - Google Patents
Novel vacuum electroplating device Download PDFInfo
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- CN203715776U CN203715776U CN201420068275.4U CN201420068275U CN203715776U CN 203715776 U CN203715776 U CN 203715776U CN 201420068275 U CN201420068275 U CN 201420068275U CN 203715776 U CN203715776 U CN 203715776U
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- electroplating
- novel vacuum
- plating tank
- plating device
- liquid outlet
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Abstract
The utility model discloses a novel vacuum electroplating device comprising an electroplating tank, a temperature control system and a circulating filtration system, wherein the electroplating tank is provided with a sealed hollow inner cavity at least used for containing an electroplating solution, a cathode and an anode, and the sealed hollow inner cavity is communicated with a vacuumizing device; the temperature control system is at least used for regulating the temperature of electrolyte contained in the electroplating tank; the circulating filtration system is at least used for circularly filtering the electrolyte contained in the electroplating tank. The novel vacuum electroplating device is simple in structure, convenient to use, capable of exhausting gas generated in an electroplating process, realizing temperature control and circulating filtration for the electroplating solution, improving the electroplating environment, reducing the electroplating cost, ensuring the qualities of electroplated parts and the electroplating solution and prolonging the service life of the electroplating solution, and particularly suitable for deep hole electroplating.
Description
Technical field
The utility model is specifically related to a kind of novel vacuum plating device, and it is applicable to for depth-to-width ratio and the higher micro-nano device electroplating process of plated item specification of quality.
Technical background
In electroplating process, due to redox reaction and polarizing effect, can produce the gases such as hydrogen, particularly in micro-nano device electrodeposition process, because the size of hole is very little, if the gas producing not got rid of in time, gas sticks to settled layer surface, has hindered the further reduction of metal ion, finally causes by metallized surfaces and occurs pit, affect depositing metal layers quality, when serious, can make metal level occur that Hydrogen Brittleness Phenomena even can not get electroplating device.When carrying out high aspect ratio plating, the discharge of hydrogen is more difficult, traditional solution is by changing alr mode as ultrasonic agitation, mechanical stirring and add some additives in plating solution, but result shows not can solve the problem of the delay hydrogen that remains in deep hole inside.
Utility model content
The purpose of this utility model is to provide a kind of novel vacuum plating device, to overcome deficiency of the prior art.
For realizing aforementioned goal of the invention, the technical solution adopted in the utility model is as follows:
A novel vacuum plating device, comprising:
Plating tank, it has at least in order to the airtight hollow cavity of accommodating electroplate liquid, negative electrode, anode, and described airtight hollow cavity is communicated with vacuum extractor;
At least in order to regulate the temperature control system of the electrolyte temperature of splendid attire in plating tank;
And, at least in order to splendid attire, the electrolytic solution in plating tank carries out the circulated filter system of circulating filtration.
Further, on the cell wall of described plating tank, and the position that is positioned at liquid level of electrolyte top is respectively equipped with vacuum pumping hole and release of pressure hole, and described vacuum pumping hole and release of pressure hole are also respectively with vacuum extractor with the pipeline connection of pressure relieving valve.
Further, the bottom of described plating tank is respectively equipped with fluid inlet and liquid outlet, and described fluid inlet and liquid outlet are communicated with the circulated filter system outside plating tank.
Further, described liquid outlet and liquid outlet are arranged at respectively the relative cell wall bottom, both sides of plating tank.
Further, described circulated filter system comprise filter core, in order to pipeline that filter core is communicated with described fluid inlet and liquid outlet and be arranged on the pump housing on the pipeline between described fluid inlet and filter core and/or between described liquid outlet and filter core.
Further, described temperature control system comprises thermopair and the temperature detecting resistance that the electrolytic solution in electrolyzer contacts with splendid attire respectively, and described thermopair is also connected with the temperature controller outside electrolyzer with temperature detecting resistance.
Further, described novel vacuum plating device also comprises and being arranged in plating tank, and is fixed on the conductive mechanism of liquid level of electrolyte top, and an end of described negative electrode and anode is connected with described conductive mechanism, and can in described conductive mechanism, slide, the other end is stretched in electrolytic solution.
Further, described conductive mechanism can adopt horizontally disposed conduction rack.
Further, described negative electrode comprises in order to the pressure ring of fixation workpiece and support, and described support one end is fixedly connected with fixed pressure ring, and described support one end is also connected with in order to workpiece is pressed in to the conduction compressing tablet on fixed pressure ring, meanwhile, between described workpiece and pressure ring, be also provided with seal washer.
Further, described plating tank comprises cell body and groove lid, and described groove lid is tightly connected with cell body.
Compared with prior art, advantage of the present utility model comprises:
(1) can provide rough vacuum environment, can reduce electroplate liquid surface tension, make to be trapped in the gas evolution on settled layer, significantly improve electroplating quality, the forward that can accelerate galvanic deposit simultaneously carries out.
(2) by adopting circulated filter system, can impel electroplate liquid to flow, play stirring action, and the contaminant filter of bad student in electroplating process is fallen, guarantee the quality of electroplating solution.
(3) by adopting temperature control system, can guarantee optimum temps required in electroplating process, guarantee to electroplate the stable of environment.
Accompanying drawing explanation
Fig. 1 is the one-piece construction schematic diagram of embodiment 1;
Fig. 2 is the structural representation of plating tank in embodiment 1;
Fig. 3 is the structural representation of plating tank groove lid in embodiment 1;
Fig. 4 a-Fig. 4 b is respectively front view and the side sectional view of negative electrode in embodiment 1;
Fig. 5 a-Fig. 5 b is respectively front view and the side sectional view of pressure ring in embodiment 1;
In figure, the assembly of each Reference numeral and indication thereof is respectively: 1-vacuum valve, 2-plating tank, 3-groove lid, 4-conduction rack, 5-thermopair, 6-temperature detecting resistance, 7-temperature controller, 8-pressure relieving valve, 9-electroplate liquid, 10-anode, 11-circulated filter system, 12-negative electrode, 13-circulation valve, 14-sealing-ring, 15-temperature detecting resistance hole, 16-heats pore, 17-support, 18-threaded hole, 19-metal sheeting, 20-conductive hole, 21-counter sink, 22-seal washer.
Embodiment
Below in conjunction with drawings and Examples, the technical solution of the utility model is done to more specific detail.
A kind of novel vacuum plating device that the present embodiment relates to, the plating that it is suitable for high aspect ratio micro-nano device, comprises the integral parts such as plating tank, circulated filter system, temperature control system.
Wherein, plating tank comprises cell body and groove lid, and groove lid is tightly connected with cell body, and encloses formation sealed hollow cavity.
Consult shown in Fig. 1, plating tank 2 is as the place of electrodeposit reaction, and its inner chamber is provided with conductive mechanism, and on plating tank, be also distributed with vacuum pumping hole, release of pressure hole, fluid inlet, liquid outlet etc.
Further, on the cell wall of described plating tank, and the position that is positioned at liquid level of electrolyte top is respectively equipped with vacuum pumping hole and release of pressure hole, described vacuum pumping hole is communicated with vacuum extractor through the pipeline with vacuum valve 1, and release of pressure hole also with pipeline connection with pressure relieving valve 8.
Further, the cell wall bottom of the relative both sides of described plating tank is also respectively equipped with fluid inlet and liquid outlet, and described fluid inlet and liquid outlet are communicated with the circulated filter system 11 outside plating tank.
Obvious, for meeting the connection request of plating tank and vacuum extractor, pressure relieving valve, circulation filter etc., also vacuum valve port, release of pressure valve port, circulation valve port etc. can be set on plating tank.
Further, described conductive mechanism can adopt horizontally disposed conduction rack 4, described conduction rack is arranged in plating tank, and be fixed on liquid level of electrolyte top, one end of described negative electrode 12 and anode 10 is connected with described conductive mechanism, and can in described conductive mechanism, slide, the other end is stretched in electrolytic solution.
Further, described circulated filter system 11 can comprise filter core (such as filtering cotton core), in order to pipeline that filter core is communicated with described fluid inlet and liquid outlet and be arranged on pump housing on the pipeline between described fluid inlet and filter core and/or between described liquid outlet and filter core etc.
Further, described temperature control system can comprise thermopair 5 and the temperature detecting resistance 6 that the electrolytic solution in electrolyzer contacts with splendid attire respectively, and described thermopair is also connected with the temperature controller 7 outside electrolyzer with temperature detecting resistance.
Further, aforementioned vacuum extractor can comprise vacuum pump, vacuum feedback assembly and pipeline thereof etc.
Refer to shown in Fig. 2-3, groove lid 3 is fixed slot lid again, and outer ring is provided with sealing-ring 14, guarantees the vacuum tightness in plating tank in electroplating process.
Further, at groove tops, can be provided with temperature detecting resistance hole 15 and heating pore 16 etc., conveniently coordinate with outside temperature control device.
Postscript, in the utility model, negative electrode also can be described as cathode fixture, and it can be used for the workpiece of electroplated to fix, and being connected of realization and power supply.
Consult Fig. 4 a-5b, this negative electrode 12 can comprise pressure ring and the support in order to fixation workpiece, described support one end is fixedly connected with fixed pressure ring, and described support one end is for example also connected with, in order to workpiece is pressed in to the conduction compressing tablet (metal sheeting 19) on fixed pressure ring, meanwhile, between described workpiece and pressure ring, be also provided with seal washer 22.Its medium-height trestle can comprise shell parts prepared by an insulating material (as PP material), and its upper end is provided with conductive hole 20.When electroplating, can conductive mechanism be electrically connected to conduction compressing tablet and workpiece by this conductive hole and the wire that is fixed on internal stent, assurance workpiece and external circuit can form loop.And by aforementioned pressure ring and sealing-ring, can contain plating solution infiltration while preventing from electroplating and arrive fixture inside.Aforementioned brackets and pressure ring two portions can connect by insulating nut.
The process of utilizing this vacuum plating device to carry out rough vacuum galvanic deposit is:
Before plating starts, by workpiece, for example, put among cathode fixture at the bottom of electroplating silicon wafer-based, then metal sheeting is fixed to silicon chip, with insulating nut, tighten.
The electroplate liquid configuring is poured in plating tank, cathode and anode is placed on the conduction rack in plating tank by suitable distance, groove is covered to airtight covering.
Open vacuum suction device, set vacuum values, opening temp. control system, sets temperature of electroplating solution, and ON cycle filtering system, after electroplated liquid temp is stable, is connected cathode and anode electroplating power supply.
In electroplating process, the gas of generation, due to the capillary reason of electroplate liquid, can overflow, and gas can be extracted in ventilation hole along with vacuum extractor.
After plating finishes, close circulated filter system, vacuum extractor and circulated filter system, open pressure relieving valve, electroplated groove recovers after normal pressure, opens groove lid, and the workpiece of having electroplated is taken out.
The utility model is simple in structure, easy to use, not only the gas producing in electroplating process can be discharged, and can carry out temperature control and circulating filtration to plating solution, improve and electroplate environment, save electroplating cost, guarantee the quality of plated item and electroplate liquid, and promote work-ing life of electroplate liquid, and be especially applicable to Deep hole electroplating.
It is to be noted, the utility model example only for convenience of description, not to any pro forma restriction of the utility model, if carry within the scope of technical characterictic not departing from the utility model, utilize technology contents that the utility model discloses to do local change or modified equivalent embodiment, and do not depart from the utility model technical characterictic content, all still belong within the scope of the utility model technical characterictic.
Claims (10)
1. a novel vacuum plating device, is characterized in that comprising:
Plating tank, it has at least in order to the airtight hollow cavity of accommodating electroplate liquid, negative electrode, anode, and described airtight hollow cavity is communicated with vacuum extractor;
At least in order to regulate the temperature control system of the electrolyte temperature of splendid attire in plating tank;
And, at least in order to splendid attire, the electrolytic solution in plating tank carries out the circulated filter system of circulating filtration.
2. novel vacuum plating device according to claim 1, it is characterized in that, on the cell wall of described plating tank, and the position that is positioned at liquid level of electrolyte top is respectively equipped with vacuum pumping hole and release of pressure hole, described vacuum pumping hole and release of pressure hole are also respectively with vacuum extractor with the pipeline connection of pressure relieving valve.
3. novel vacuum plating device according to claim 1, is characterized in that, described plating tank bottom is respectively equipped with fluid inlet and liquid outlet, and described fluid inlet and liquid outlet are communicated with the circulated filter system outside plating tank.
4. novel vacuum plating device according to claim 3, is characterized in that, described liquid outlet and liquid outlet are arranged at respectively the relative cell wall bottom, both sides of plating tank.
5. according to the novel vacuum plating device described in claim 3 or 4, it is characterized in that, described circulated filter system comprises filter core, in order to pipeline that filter core is communicated with described fluid inlet and liquid outlet and be arranged on the pump housing on the pipeline between described fluid inlet and filter core and/or between described liquid outlet and filter core.
6. novel vacuum plating device according to claim 1, it is characterized in that, described temperature control system comprises thermopair and the temperature detecting resistance that the electrolytic solution in electrolyzer contacts with splendid attire respectively, and described thermopair is also connected with the temperature controller outside electrolyzer with temperature detecting resistance.
7. novel vacuum plating device according to claim 1, it is characterized in that, it also comprises and being arranged in plating tank, and be fixed on the conductive mechanism of liquid level of electrolyte top, one end of described negative electrode and anode is connected with described conductive mechanism, and can in described conductive mechanism, slide, the other end is stretched in electrolytic solution.
8. novel vacuum plating device according to claim 7, is characterized in that, described conductive mechanism adopts horizontally disposed conduction rack.
9. according to the novel vacuum plating device described in claim 1 or 7, it is characterized in that, described negative electrode comprises in order to the pressure ring of fixation workpiece and support, described support one end is fixedly connected with fixed pressure ring, and described support one end is also connected with in order to workpiece is pressed in to the conduction compressing tablet on fixed pressure ring, meanwhile, between described workpiece and pressure ring, be also provided with seal washer.
10. novel vacuum plating device according to claim 1, is characterized in that, described plating tank comprises cell body and groove lid, and described groove lid is tightly connected with cell body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420068275.4U CN203715776U (en) | 2014-02-18 | 2014-02-18 | Novel vacuum electroplating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420068275.4U CN203715776U (en) | 2014-02-18 | 2014-02-18 | Novel vacuum electroplating device |
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| Publication Number | Publication Date |
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| CN203715776U true CN203715776U (en) | 2014-07-16 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201420068275.4U Expired - Fee Related CN203715776U (en) | 2014-02-18 | 2014-02-18 | Novel vacuum electroplating device |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104532333A (en) * | 2014-12-06 | 2015-04-22 | 苏州欣航微电子有限公司 | Electrolysis treatment apparatus of interior surface of bicycle cartridge headset |
| CN105063735A (en) * | 2015-08-07 | 2015-11-18 | 东北石油大学 | Anode rotary vacuum plating device based on PLC (Programmable Logic Controller) control |
| CN106283169A (en) * | 2016-10-10 | 2017-01-04 | 贵州电网有限责任公司电力科学研究院 | A kind of equipment plating ceramic membrane on turbine runner blade |
| CN106757242A (en) * | 2015-11-20 | 2017-05-31 | 中国科学院大连化学物理研究所 | It is a kind of for porous mass electro plating device and the method for plating or chemical deposition |
| CN109881241A (en) * | 2018-12-19 | 2019-06-14 | 西安赛尔电子材料科技有限公司 | A kind of electroplating solution of cyclic filtering system |
| CN113502528A (en) * | 2021-07-14 | 2021-10-15 | 江苏浩博塑业有限公司 | Electroplating device for improving surface smoothness of electroplated part and continuous electroplating method thereof |
-
2014
- 2014-02-18 CN CN201420068275.4U patent/CN203715776U/en not_active Expired - Fee Related
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104532333A (en) * | 2014-12-06 | 2015-04-22 | 苏州欣航微电子有限公司 | Electrolysis treatment apparatus of interior surface of bicycle cartridge headset |
| CN104532333B (en) * | 2014-12-06 | 2017-01-18 | 廖志辉 | Electrolysis treatment apparatus of interior surface of bicycle cartridge headset |
| CN105063735A (en) * | 2015-08-07 | 2015-11-18 | 东北石油大学 | Anode rotary vacuum plating device based on PLC (Programmable Logic Controller) control |
| CN105063735B (en) * | 2015-08-07 | 2017-09-29 | 东北石油大学 | A kind of anode rotatory vacuum electroplanting device controlled based on PLC |
| CN106757242A (en) * | 2015-11-20 | 2017-05-31 | 中国科学院大连化学物理研究所 | It is a kind of for porous mass electro plating device and the method for plating or chemical deposition |
| CN106757242B (en) * | 2015-11-20 | 2018-11-02 | 中国科学院大连化学物理研究所 | A method of for porous mass electro plating device and plating or chemical deposition |
| CN106283169A (en) * | 2016-10-10 | 2017-01-04 | 贵州电网有限责任公司电力科学研究院 | A kind of equipment plating ceramic membrane on turbine runner blade |
| CN109881241A (en) * | 2018-12-19 | 2019-06-14 | 西安赛尔电子材料科技有限公司 | A kind of electroplating solution of cyclic filtering system |
| CN113502528A (en) * | 2021-07-14 | 2021-10-15 | 江苏浩博塑业有限公司 | Electroplating device for improving surface smoothness of electroplated part and continuous electroplating method thereof |
| CN113502528B (en) * | 2021-07-14 | 2022-06-24 | 江苏磊霆精密新材料有限公司 | Electroplating device for improving surface smoothness of electroplated part and continuous electroplating method thereof |
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Legal Events
| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140716 Termination date: 20170218 |