CN203689308U - Heat dissipation module for computer - Google Patents

Abstract

The utility model discloses a heat dissipation module for a computer, which comprises a heat dissipation plate body, a copper sheet, two heating pipes, a fan and heat dissipation fin groups, wherein a rectangular hole in the length direction is formed in the middle part of the heat dissipation body; bulges are arranged on two sides of the long edge of the rectangular hole; two sides of the copper sheet are riveted on lower surfaces of the bulges on two sides; a baffle is arranged on one side, near to the rectangular hole, of each bulge; bend parts are arranged on the left side and the right side of the heat dissipation plate body; mounting lugs are arranged on the bend parts; mistake proofing codes are arranged at four corners of the heat dissipation plate; the two heating pipes are clamped between the two baffles in parallel; the two heating pipes are connected with the heat dissipation fin groups; the heat dissipation fin groups are mounted at the air outlet of the fan; the heat dissipation fin groups are manufactured into two different specifications; first, the heat dissipation fins with same specification are fastened together; then the two groups of heat dissipation fins fastened in a reversed direction are buckled into a whole. According to the heat dissipation module for the computer, the design is reasonable, the structure is simple, the implementation is easy, the use is convenient, the assembly is convenient, the assembly intensity is good and the heat dissipation effect is good.

Description

A kind of computer heat radiation module

Technical field

The utility model relates to a kind of computer heat radiation module.

Background technology

Along with improving constantly of the heat-generating electronic elements power such as central processing unit (CPU), heat dissipation problem is more and more subject to people's attention, all the more so in notebook computer.

In field of radiating, technology adopts heat radiation module to dispel the heat to heat-generating electronic elements conventionally now, at present, the heat radiation module that most of notebook computers use is generally made up of the heat radiation plate body of fan, heat pipe, copper sheet, fin and aluminum etc., the two ends of this heat pipe are separately fixed in heat radiation plate body and fins group, and fins group is arranged on the air outlet of fan.Copper sheet is welded on heat radiation plate body, and molten heat-conducting cream adhering chip is passed through on the surface of copper sheet, because the heat sink surface of aluminum can form highly stable oxide layer, and therefore usually bad welding of the welding of copper sheet, weld strength is poor, is prone to loosening.Secondly, existing heat pipe is to be also welded on heat radiation plate body, and welding effect is poor, heat radiation module assembly process complexity.On existing heat radiation plate body, there is no mistake proofing mark, when processing, assembling, easily make mistakes.

Existing heat radiation fin assemblies is to be all made up of multiple radiating fins, conventionally snap together and form in the mode of vertical stack by a kind of radiating fin of specification, one sidewall of radiating fin is plane, and another sidewall is buckling surface, and a side of buckling surface has the fastening point of multiple protrusion buckling surfaces.After installation, there will be radiating fin group front end smooth, tail end fastens the phenomenon that point protrudes, and one side affects attractive in appearance, on the other hand also can scratch setter or damage computer inner body.

Utility model content

Technical problem to be solved in the utility model is to provide a kind of copper sheet and heat radiation plate body to be connected firmly, heat pipe does not need welding, and a button computer heat radiation module that the phenomenon of protruding occurs appears in the tail end that assembly process is simple, good heat dissipation effect can effectively be avoided heat radiation fin assemblies.

The technical solution of the utility model is as follows: a kind of computer heat radiation module, comprise heat radiation plate body (1), copper sheet (2), two heat pipes (8), fan (9) and heat radiation fin assemblies (10), it is characterized in that: described heat radiation plate body (1) comprises a rectangular slab, be provided with along its length rectangular opening (1a) at the middle part of rectangular slab, the both sides on the long limit of described rectangular opening (1a) are provided with convex closure (3), the both sides of described copper sheet (2) are riveted on the lower surface of the convex closure (3) of rectangular opening (1a) both sides, the upper side near rectangular opening (1a) of each described convex closure (3) is provided with baffle plate (4), a left side for described heat radiation plate body (1), right side is respectively equipped with downward bending (5), on a left side for described heat radiation plate body (1), the two ends of the bending (5) on right side are respectively equipped with installs journal stirrup (6), on described installation journal stirrup (6), be provided with mounting hole (7), on four angles of described heat radiation plate body (1), be respectively equipped with anti-miscoding (A, B, C, D), described heat pipe (8) is flat, two described heat pipes (8) are contained on copper sheet (2) side by side along the length direction of heat radiation plate body (1), and all stretch out outside copper sheet (2) at the two ends of described heat pipe (8), two described heat pipes (8) are clamped between two baffle plates (4), wherein one end of two described heat pipes (11) is connected with heat radiation fin assemblies (10), described heat radiation fin assemblies (10) is arranged on the air outlet of described fan (9), described heat radiation fin assemblies (10) comprises the first radiating fin (10-1) and the second radiating fin (10-2), described the first radiating fin (10-1) snaps together and forms the first radiating fin group in the mode of vertical stack, described the second radiating fin (10-2) snaps together and forms the second radiating fin group in the mode of vertical stack, the tail end of the tail end of described the first radiating fin group and the second radiating fin group is relative and be buckled into one, described the first radiating fin (10-1) equates with the height of the second radiating fin (10-2), the width of the second radiating fin (10-2) is less than the width of the first radiating fin (10-1), thereby the side in the second radiating fin group forms heat-transfer pipe arrangement space (F), two described heat pipes (8) are arranged in the heat-transfer pipe arrangement space (F) of heat radiation fin assemblies (10).

Adopt technique scheme, in the both sides of rectangular opening of heat radiation plate body, convex closure is set, copper sheet is fixed on to the lower surface of convex closure by the mode of riveted joint, do not need welding, constant intensity is good.Secondly, two heat pipes are contained on copper sheet, and before being stuck in the baffle plate of two convex closures, by two baffle plate stationary positioned, do not need welding, and assembly process is simple.Secondly, heat pipe directly contacts with copper sheet, and the heat that chip is delivered on copper sheet is taken away, and radiating effect is better.Finally, we arrange bending in the both sides of heat radiation plate body, at the two ends of bending, installation journal stirrup is set, increase on the one hand the intensity of plate body, on the other hand, the installed surface of journal stirrup and CPU is installed and can be realized well laminating, and directly more easily process than bending on journal stirrup is directly being installed in the both sides bending of heat radiation plate body.On four angles of heat radiation plate body, anti-miscoding is set respectively, avoids makeing mistakes in production run, while avoiding assembling, make mistakes.Heat radiation module good heat dissipation effect, easy to assembly.Heat radiation fin assemblies is divided into two kinds of different size manufactures, after first the radiating fin of specification of the same race being snapped together, oppositely be buckled into one by two groups again, the mode of this reverse fastening, has effectively avoided the phenomenon that the fastening point of radiating fin buckling surface protrudes to occur; And dexterously the width design of the second radiating fin is become to be less than the width of the first radiating fin, be used for arranging heat pipe thereby form heat pipe arrangement space in a side of the second radiating fin group.There is the features such as simple in structure, easy for installation, compact.

In technique scheme: the length of described convex closure (3) is less than the length of rectangular opening (1a), and described convex closure (3) is positioned at the middle part of rectangular opening (1a) both sides.

In technique scheme: described bending (5) is 100-120 degree with the angle (a) of heat radiation plate body (1).

In technique scheme: through salient point, riveted joint is fixed on convex closure (3) described copper sheet (2).

In technique scheme: described heat radiation plate body (1) is stamped to form by aluminium alloy.Easy to process, quality is light.

Be preferably, the aluminium sheet that described the first radiating fin (10-1), the second radiating fin (10-2) are 0.2mm by thickness L1 is respectively stamped to form, and the thickness L2 of described first, second radiating fin (10-1,10-2) is respectively 1.2mm.Aluminium sheet quality is light, simultaneously good heat dissipation effect.

Beneficial effect: the utility model is reasonable in design, simple in structure, enforcement is easy, easy to use, easy to assembly, and assembling intensity is good,, can effectively avoid the tail end of heat radiation fin assemblies to occur that a phenomenon for a button protrusion occurs.

Brief description of the drawings

Fig. 1 is structural representation of the present utility model;

Fig. 2 is the structural representation of heat radiation plate body;

Fig. 3 is the front elevation of the utility model heat radiation fin assemblies;

Fig. 4 is the upward view of Fig. 3;

Fig. 5 is the stereographic map of Fig. 3.

Embodiment

Below in conjunction with drawings and Examples, the utility model is described in further detail:

Upper and lower, left and right of the present utility model, front and back are the relative position in representative graph only, does not represent the absolute position of product.

As Figure 1-5, computer heat radiation module of the present utility model mainly by heat radiation plate body 1, copper sheet 2, convex closure 3, baffle plate 4, bending 5, the parts such as journal stirrup 6, mounting hole 7, two heat pipes 8, fan 9 and heat radiation fin assemblies 10 be installed formed, described heat radiation plate body 1 is a rectangular slab of being made up of aluminium alloy, middle part at rectangular slab is provided with rectangular opening 1a along its length, the both sides on the long limit of described rectangular opening 1a are provided with convex closure 3, the length of described convex closure 3 is less than the length of rectangular opening 1a, and described convex closure 3 is positioned at the middle part of rectangular opening 1a both sides.The lower surface of the convex closure 3 that is riveted on rectangular opening 1a both sides is riveted in the both sides of described copper sheet 2 by salient point, a side near rectangular opening 1a on each described convex closure 3 is provided with baffle plate 4, described baffle plate 4 is positioned at the middle part of convex closure 3, the left and right side of described heat radiation plate body 1 is respectively equipped with downward bending 5, described bending 5 is 100-120 degree with the angle a of heat radiation plate body 1, be respectively equipped with journal stirrup 6 is installed at the two ends of the bending 5 of the left and right side of described heat radiation plate body 1, on described installation journal stirrup 6, be provided with mounting hole 7.Heat radiation plate body 1 is arranged on CPU above by the mounting hole 7 of installing on journal stirrup 6, on four angles of described heat radiation plate body 1, is respectively equipped with anti-miscoding A, B, C, D, avoids makeing mistakes in the time producing and assemble.Described heat pipe 8 is flat, two described heat pipes 8 are contained on copper sheet 2 side by side along the length direction of heat radiation plate body 1, and all stretch out outside copper sheet 2 at the two ends of described heat pipe 8, two described heat pipes 8 are clamped between two baffle plates 4, wherein one end of two described heat pipes 11 extends to heat radiation fin assemblies 10 and is connected, and described heat radiation fin assemblies 10 is arranged on the air outlet of described fan 9.Described heat radiation fin assemblies 10, is made up of some the first radiating fin 10-1, some the second radiating fin 10-2, and the first radiating fin 10-1 and the second radiating fin 10-2 are the radiating fin of two kinds of different sizes.The first radiating fin 10-1 snaps together and forms the first radiating fin group in the mode of vertical stack, the second radiating fin 10-2 also snaps together and forms the second radiating fin group in the mode of vertical stack, the tail end of the tail end of the first radiating fin group and the second radiating fin group is relative and be buckled into one, fastens direction as shown by arrows in FIG..The first radiating fin group and the second radiating fin group adopt the reverse direction assembling fastening, and make the both ends of the surface of whole computer heat radiation fins group not have button point protrusion.The first radiating fin 10-1 equates with the height of the second radiating fin 10-2, the width of the second radiating fin 10-2 is less than the width of the first radiating fin 10-1, thereby form heat-transfer pipe arrangement space F in a side of the second radiating fin group, heat-transfer pipe arrangement space F passes through for heat-transfer pipe.Preferably, the aluminium sheet that the first radiating fin 10-1, the second radiating fin 10-2 are 0.2mm by thickness L1 is respectively stamped to form, and the thickness L2 of first, second radiating fin 10-1,10-2 is respectively 1.2mm.Aluminium sheet quality is light, simultaneously good heat dissipation effect.One end of described two heat pipes 8 is contained in the heat-transfer pipe arrangement space F of heat radiation fin assemblies 10.

Claims (6)

1. a computer heat radiation module, comprise heat radiation plate body (1), copper sheet (2), two heat pipes (8), fan (9) and heat radiation fin assemblies (10), it is characterized in that: described heat radiation plate body (1) comprises a rectangular slab, be provided with along its length rectangular opening (1a) at the middle part of rectangular slab, the both sides on the long limit of described rectangular opening (1a) are provided with convex closure (3), the both sides of described copper sheet (2) are riveted on the lower surface of the convex closure (3) of rectangular opening (1a) both sides, the upper side near rectangular opening (1a) of each described convex closure (3) is provided with baffle plate (4), a left side for described heat radiation plate body (1), right side is respectively equipped with downward bending (5), on a left side for described heat radiation plate body (1), the two ends of the bending (5) on right side are respectively equipped with installs journal stirrup (6), on described installation journal stirrup (6), be provided with mounting hole (7), on four angles of described heat radiation plate body (1), be respectively equipped with anti-miscoding (A, B, C, D), described heat pipe (8) is flat, two described heat pipes (8) are contained on copper sheet (2) side by side along the length direction of heat radiation plate body (1), and all stretch out outside copper sheet (2) at the two ends of described heat pipe (8), two described heat pipes (8) are clamped between two baffle plates (4), wherein one end of two described heat pipes (11) is connected with heat radiation fin assemblies (10), described heat radiation fin assemblies (10) is arranged on the air outlet of described fan (9), described heat radiation fin assemblies (10) comprises the first radiating fin (10-1) and the second radiating fin (10-2), described the first radiating fin (10-1) snaps together and forms the first radiating fin group in the mode of vertical stack, described the second radiating fin (10-2) snaps together and forms the second radiating fin group in the mode of vertical stack, the tail end of the tail end of described the first radiating fin group and the second radiating fin group is relative and be buckled into one, described the first radiating fin (10-1) equates with the height of the second radiating fin (10-2), the width of the second radiating fin (10-2) is less than the width of the first radiating fin (10-1), thereby the side in the second radiating fin group forms heat-transfer pipe arrangement space (F), two described heat pipes (8) end is contained in the heat-transfer pipe arrangement space (F) of heat radiation fin assemblies (10).

2. a kind of computer heat radiation module according to claim 1, is characterized in that: the length of described convex closure (3) is less than the length of rectangular opening (1a), and described convex closure (3) is positioned at the middle part of rectangular opening (1a) both sides.

3. a kind of computer heat radiation module according to claim 1, is characterized in that: described bending (5) is 100-120 degree with the angle (a) of heat radiation plate body (1).

4. a kind of computer heat radiation module according to claim 1, is characterized in that: through salient point, riveted joint is fixed on convex closure (3) described copper sheet (2).

5. a kind of computer heat radiation module according to claim 1, is characterized in that: described heat radiation plate body (1) is stamped to form by aluminium alloy.

6. a kind of computer heat radiation module according to claim 1, it is characterized in that: the aluminium sheet that described the first radiating fin (10-1), the second radiating fin (10-2) are 0.2mm by thickness L1 is respectively stamped to form, the thickness L2 of described first, second radiating fin (10-1,10-2) is respectively 1.2mm.

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