CN203608464U - BGA chip bonding pad printing solder paste positioning tool - Google Patents
BGA chip bonding pad printing solder paste positioning tool Download PDFInfo
- Publication number
- CN203608464U CN203608464U CN201320728791.0U CN201320728791U CN203608464U CN 203608464 U CN203608464 U CN 203608464U CN 201320728791 U CN201320728791 U CN 201320728791U CN 203608464 U CN203608464 U CN 203608464U
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- steel plate
- group
- solder paste
- magnets
- pallet
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- Expired - Lifetime
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- 229910000679 solder Inorganic materials 0.000 title claims abstract description 24
- 238000007649 pad printing Methods 0.000 title abstract 4
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 49
- 239000010959 steel Substances 0.000 claims abstract description 49
- 230000004807 localization Effects 0.000 claims description 19
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 abstract 3
- 238000004458 analytical method Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model discloses a BGA chip bonding pad printing solder paste positioning tool. The BGA chip bonding pad printing solder paste positioning tool comprises a pedestal (1) and a pallet (2) installed on the pedestal (1), the pallet (2) is provided with a plurality of positioning grooves (4) used for the placement of chips (6), the pallet (2) is provided with a layer of steel plate (3), the steel plate (3) is provided with a plurality of openings (5) the positions of which correspond to the positioning grooves (4), and the chips (6) are partially pressed down by the steel plate (3) and are partially exposed out of the openings (5). Through the above way, the chips are positioned by the steel plate, and the chips are prevented from moving and shedding. The BGA chip bonding pad printing solder paste positioning tool is advantaged by simple structure, high precision and high stability, and the production efficiency and the product quality are substantially improved.
Description
Technical field
The utility model relates to SMT mount technology field, particularly relates to a kind of bga chip pad print solder paste localization tool.
Background technology
Current, because SMT patch type component structure is more and more various, the facilities and equipment on existing basis cannot meet growth requirement, so need to constantly update, continually develops novel auxiliary fixture and instrument, just can catch up with the paces of the development of technology.In SMT paster is produced, have the overlapping paster of the double-deck BGA of a kind of micro-spacing, the empty pad in the BGA of lower floor surface needs after print solder paste, to carry out paster in advance again.In original print solder paste technique, be completed for printing when rear steel mesh departs from and easily bga chip taken out of, affect product quality and production efficiency.Therefore, need to, according to characteristic and the Production requirement of novel B GA chip, develop a kind of special localization tool, compensate the scarce capacity problem of existing infrastructure device, meet and produce and quality requirement, promote integral production ability, meet customer need.
Utility model content
The technical problem that the utility model mainly solves is to provide a kind of bga chip pad print solder paste localization tool, by steel plate, chip is positioned, and prevents that chip from moving and coming off, have simple to operate, accuracy is high, and the advantage that stability is high has improved production efficiency and product quality greatly.
For solving the problems of the technologies described above, the technical scheme that the utility model adopts is: a kind of bga chip pad print solder paste localization tool is provided, comprise base and be arranged on the pallet on described base, described pallet is provided with multiple detents for chip placement, described pallet is provided with one deck steel plate, described steel plate is provided with multiple openings corresponding with detent position, and described chip part is pushed down by steel plate, and part is exposed from opening part.
In preferred embodiment of the utility model, described base is provided with multiple pallet reference columns, and tray sleeve is located on described pallet reference column.
In preferred embodiment of the utility model, described base is provided with multiple steel plate reference columns, and steel plate is set on described steel plate reference column.
In preferred embodiment of the utility model, between described pallet end face and steel plate bottom surface, be provided with multiple group of magnets that are fixed on pallet end face.
In preferred embodiment of the utility model, described group of magnets comprises the limit group of magnets on corner magnets group and the steel plate limit on parameatal opening group of magnets, steel plate angle.
In preferred embodiment of the utility model, described opening group of magnets is made up of by hexagonal array six magnet.
In preferred embodiment of the utility model, described corner magnets group is positioned on four angles of steel plate, and each corner magnets group is made up of by rounded projections arranged three magnet.
In preferred embodiment of the utility model, described limit group of magnets is positioned on one group of opposite side of steel plate, and each limit group of magnets is made up of by linear array four magnet.
In preferred embodiment of the utility model, it is square that described opening is that one group of diagonal angle is chamfering.
The beneficial effects of the utility model are: the utility model bga chip pad print solder paste localization tool positions chip by steel plate, prevent that chip from moving and coming off, have simple to operately, accuracy is high, the advantage that stability is high, has improved production efficiency and product quality greatly.
Accompanying drawing explanation
In order to be illustrated more clearly in the technical scheme in the utility model embodiment, below the accompanying drawing of required use during embodiment is described is briefly described, apparently, accompanying drawing in the following describes is only embodiment more of the present utility model, for those of ordinary skills, do not paying under the prerequisite of creative work, can also obtain according to these accompanying drawings other accompanying drawing, wherein:
Fig. 1 is the structural representation of a kind of bga chip pad of the utility model print solder paste localization tool one preferred embodiment.
Fig. 2 is the hatch frame schematic diagram of a kind of bga chip pad of the utility model print solder paste localization tool one preferred embodiment.
In accompanying drawing, the mark of each parts is as follows: 1, base, 2, pallet, 3, steel plate, 4, detent, 5, opening, 6, chip, 7, opening group of magnets, 8, corner magnets group, 9, limit group of magnets, 10, pallet reference column, 11, steel plate reference column.
Embodiment
To the technical scheme in the utility model embodiment be clearly and completely described below, obviously, described embodiment is only a part of embodiment of the present utility model, rather than whole embodiment.Based on the embodiment in the utility model, those of ordinary skills are not making all other embodiment that obtain under creative work prerequisite, all belong to the scope of the utility model protection.
Refer to Fig. 1-Fig. 2, the utility model embodiment comprises:
A kind of bga chip pad print solder paste localization tool, comprise base 1 and be arranged on the pallet 2 on described base 1, described pallet 2 is provided with multiple detents 4 for chip placement 6, described pallet 2 is provided with one deck steel plate 3, and described steel plate 3 is provided with multiple openings 5 corresponding with detent 4 positions, and described chip 4 parts are pushed down by steel plate 3, part is exposed from opening 4, described detent 4 is the rectangular array that three row six are listed as, and Stability Analysis of Structures is stressed even.
Described base 1 is provided with multiple pallet reference columns 10, and pallet 2 is set on described pallet reference column 10, and described pallet reference column has two, is separately positioned on one group of opposite side of pallet.
Described base 1 is provided with multiple steel plate reference columns 11, and steel plate 3 is set on described steel plate reference column 11, and described steel plate reference column has three and not on same straight line.
Between described pallet 2 end faces and steel plate 3 bottom surfaces, be provided with multiple group of magnets that are fixed on pallet 2 end faces, group of magnets holds the bottom surface of steel plate, plays the effect of fixation steel plate.
Described group of magnets comprises the limit group of magnets 9 on corner magnets group 8 and the steel plate limit on parameatal opening group of magnets 7, steel plate angle.
Described opening group of magnets 7 is made up of by hexagonal array six magnet, and Stability Analysis of Structures is even to the suction of steel plate.
Described corner magnets group 8 is positioned on four angles of steel plate, and each corner magnets group 8 is made up of by rounded projections arranged three magnet, and Stability Analysis of Structures is even to the suction of steel plate.
Described limit group of magnets 9 is positioned on one group of opposite side of steel plate, and each limit group of magnets 9 is made up of by linear array four magnet, and Stability Analysis of Structures is even to the suction of steel plate.
It is square that described opening 4 is that one group of diagonal angle is chamfering, and chamfering place pushes down one group of diagonal angle of chip, prevents that chip from coming off from detent.
The beneficial effect of the utility model bga chip pad print solder paste localization tool is:
By steel plate, chip is positioned, prevent that chip from moving and coming off, have simple to operately, accuracy is high, and the advantage that stability is high has improved production efficiency and product quality greatly.
The foregoing is only embodiment of the present utility model; not thereby limit the scope of the claims of the present utility model; every equivalent structure or conversion of equivalent flow process that utilizes the utility model description to do; or be directly or indirectly used in other relevant technical field, be all in like manner included in scope of patent protection of the present utility model.
Claims (9)
1. a bga chip pad print solder paste localization tool, it is characterized in that, comprise base (1) and be arranged on the pallet (2) on described base (1), described pallet (2) is provided with multiple detents for chip placement (6) (4), described pallet (2) is provided with one deck steel plate (3), described steel plate (3) is provided with multiple openings (5) corresponding with detent (4) position, and described chip (4) part is pushed down by steel plate (3), and part is exposed from opening (4).
2. bga chip pad print solder paste localization tool according to claim 1, is characterized in that, described base (1) is provided with multiple pallet reference columns (10), and pallet (2) is set on described pallet reference column (10).
3. bga chip pad print solder paste localization tool according to claim 1, is characterized in that, described base (1) is provided with multiple steel plate reference columns (11), and steel plate (3) is set on described steel plate reference column (11).
4. bga chip pad print solder paste localization tool according to claim 1, is characterized in that, is provided with multiple group of magnets that are fixed on pallet (2) end face between described pallet (2) end face and steel plate (3) bottom surface.
5. bga chip pad print solder paste localization tool according to claim 4, is characterized in that, described group of magnets comprises the limit group of magnets (9) on corner magnets group (8) and the steel plate limit on parameatal opening group of magnets (7), steel plate angle.
6. bga chip pad print solder paste localization tool according to claim 5, is characterized in that, described opening group of magnets (7) is made up of by hexagonal array six magnet.
7. bga chip pad print solder paste localization tool according to claim 5, is characterized in that, described corner magnets group (8) is positioned on four angles of steel plate, and each corner magnets group (8) is made up of by rounded projections arranged three magnet.
8. bga chip pad print solder paste localization tool according to claim 5, is characterized in that, described limit group of magnets (9) is positioned on one group of opposite side of steel plate, and each limit group of magnets (9) is made up of by linear array four magnet.
9. according to the bga chip pad print solder paste localization tool described in any one in claim 1-8, it is characterized in that, it is square that described opening (4) is that one group of diagonal angle is chamfering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320728791.0U CN203608464U (en) | 2013-11-19 | 2013-11-19 | BGA chip bonding pad printing solder paste positioning tool |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320728791.0U CN203608464U (en) | 2013-11-19 | 2013-11-19 | BGA chip bonding pad printing solder paste positioning tool |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203608464U true CN203608464U (en) | 2014-05-21 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320728791.0U Expired - Lifetime CN203608464U (en) | 2013-11-19 | 2013-11-19 | BGA chip bonding pad printing solder paste positioning tool |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203608464U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103635034A (en) * | 2013-11-19 | 2014-03-12 | 利华科技(苏州)有限公司 | BGA (ball grid array) chip bonding pad printing solder paste positioning jig |
-
2013
- 2013-11-19 CN CN201320728791.0U patent/CN203608464U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103635034A (en) * | 2013-11-19 | 2014-03-12 | 利华科技(苏州)有限公司 | BGA (ball grid array) chip bonding pad printing solder paste positioning jig |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: Xinglong Street Suzhou City Industrial Park, 215126 Jiangsu province No. 428 Suchun industrial workshop, 15A workshop Patentee after: RAYVAL (SUZHOU) TECHNOLOGIES CO.,LTD. Address before: Xinglong Street Suzhou City Industrial Park, 215126 Jiangsu province No. 428 Suchun industrial workshop, 15A workshop Patentee before: RAYVAL TECHNOLOGIES (SUZHOU) Co.,Ltd. |
|
| CX01 | Expiry of patent term |
Granted publication date: 20140521 |
|
| CX01 | Expiry of patent term |