CN203586429U - Electrical component module unit and outdoor unit of air conditioner - Google Patents

Electrical component module unit and outdoor unit of air conditioner Download PDF

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Publication number
CN203586429U
CN203586429U CN201320573446.4U CN201320573446U CN203586429U CN 203586429 U CN203586429 U CN 203586429U CN 201320573446 U CN201320573446 U CN 201320573446U CN 203586429 U CN203586429 U CN 203586429U
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China
Prior art keywords
electric component
modular unit
component modular
heat sink
heat
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CN201320573446.4U
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Chinese (zh)
Inventor
富田雅史
青木正则
青木久美
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Priority to JP2012-223217 priority Critical
Priority to JP2012223217A priority patent/JP5721682B2/en
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Abstract

The utility model provides a small electrical component module unit and an outdoor unit of an air conditioner, wherein the electrical component module unit is arranged in the outdoor unit and has high set degree of freedom and high reliability, and the outdoor unit is provided with the electrical component module unit. The electrical component module unit (1) is arranged in the outdoor unit of the air conditioner and contains a control base board (an electric base board (10) and a control base board (11)) for controlling the outdoor unit. An electric element (4) is mounted in the control base board (11) and comprises a wide band gap semiconductor, and the electric base board (10) and the control base board (11) are contained in a frame to form a waterproof sealed structure.

Description

The off-premises station of electric component modular unit and air conditioner
Technical field
The off-premises station that the utility model relates to electric component modular unit (module unit) and has the air conditioner of this electric component modular unit, the substrate that has the off-premises station of pair air conditioner to control in the internal configurations of electric component modular unit.
Background technology
The off-premises station of existing air conditioner possesses Air Blast fan (fan), heat exchanger and compressor etc., also possesses for the control substrate of inverter (inverter) circuit is installed.
In recent years, the tendency that exists the heat waste (caloric value) of the electric component modular unit that the inverter circuit for compressor etc. is controlled is representative to increase.Especially in the air conditioner of using in business, existence makes the running of a plurality of off-premises stations or carries out the situation etc. of the air conditioning of larger space, when the air conditioner of using when business carries out the compressor operation based on inverter control, the tendency that exists the heat waste of the control substrate that drives inverter circuit to increase.Therefore,, for take the electric component module (module) that inverter circuit is representative, configure radiating fin (fin) etc. simultaneously.
In the off-premises station of existing air conditioner, disclose following structure: utilize demarcation strip to mark off for the chamber of compressor and the setting of electric component case and the chamber of heat exchanger and Air Blast fan setting, power module in being disposed at electric part box (power module) is provided with radiator (heat sink), the radiating fin of this radiator exposes to comprising the indoor of heat exchanger, thereby utilizes the cooling air being formed by Air Blast fan to carry out cooling (with reference to patent documentation 1,2) to above-mentioned radiating fin.
And, also disclose following structure: the framework of taking in the circuit substrate that inverter circuit is installed is installed on to the shell of compressor, and makes itself and the cold-producing medium thermo-contact that is directed to compressor, promote thus cooling (with reference to patent documentation 3).
Patent documentation 1: TOHKEMY 2009-192145 communique
Patent documentation 2: TOHKEMY 2010-236781 communique
Patent documentation 3: TOHKEMY 2003-153552 communique
As mentioned above, in recent years, in the off-premises station of the air conditioner of particularly using in business, according to the necessity etc. that makes the situation of a plurality of off-premises stations running or carry out the air conditioning of larger space, in order to carry out coolingly to carrying out the inverter circuit of the control of compressor etc., need large-scale fin.
Therefore, the allocation position of the electric component module in off-premises station produces restriction, is difficult to realize the miniaturization of off-premises station.
And, as mentioned above, in the off-premises station of existing air conditioner, exist and utilize the cooling air being produced by Air Blast fan or the cooling construction that utilizes the cold-producing medium of heat exchanger, yet, no matter be which kind of cooling construction, all can cause because of the restriction of the type of cooling allocation position of electric component module in off-premises station to produce restriction.
On the other hand, in the off-premises station of existing air conditioner, also need for preventing that dust and moisture from sneaking into the structure of electric component module.
Utility model content
The utility model completes in view of the above problems, its object be to provide a kind of small-sized, in off-premises station the electric component modular unit that the free degree is high and reliability is high and the off-premises station that possesses the air conditioner of this electric component modular unit be set.
In order to solve above-mentioned problem, reach above-mentioned purpose, the related electric component modular unit of the utility model is disposed in the off-premises station of air conditioner, and, internal configurations at this electric component modular unit has the control substrate that above-mentioned off-premises station is controlled, above-mentioned electric component modular unit is characterised in that, at above-mentioned control substrate, electric power (power) element is installed, this force device forms and comprises that broad stopband (wide band gap) semiconductor, above-mentioned control substrate are incorporated in and form water-proof sealing structure in framework.
According to the utility model, form the control substrate of installing for the force device that comprises wide bandgap semiconductor is enclosed within to the structure in framework, can the power loss of force device be suppressed lowlyer thus, can will in framework, remain suitable temperature by the heat radiation of carrying out via framework wall, and realize the miniaturization of electric component modular unit.In addition, by the miniaturization of electric component modular unit, the restriction of its setting position in off-premises station is relaxed, and the configuration free degree improves.And, by the miniaturization of electric component modular unit, can realize the miniaturization that this electric component modular unit is accommodated in to inner off-premises station.And, by electric component modular unit is formed to water proof structure, can prevent sneaking into of dust and moisture, the reliability of electric component modular unit and off-premises station improves.
Accompanying drawing explanation
Fig. 1 is the cutaway view that the structure of the related electric component modular unit of embodiment 1 is shown.
Fig. 2 is the cutaway view that the structure of the related electric component modular unit of the variation of embodiment 1 is shown.
Fig. 3 A is the cutaway view that the structure of the related electric component modular unit of embodiment 2 is shown.
Fig. 3 B is the plane that the structure of the related electric component modular unit of embodiment 2 is shown.
Fig. 4 is the cutaway view that the structure of the related electric component modular unit of embodiment 3 is shown.
Fig. 5 is the cutaway view that the structure of the related electric component modular unit of embodiment 4 is shown.
Fig. 6 is the stereogram that the structure of the related electric component modular unit of embodiment 5 is shown.
Fig. 7 A is the stereogram that the structure of the related electric component modular unit of embodiment 6 is shown.
Fig. 7 B is the stereogram that the structure of the related electric component modular unit of the variation of embodiment 6 is shown.
Fig. 7 C is the stereogram that the structure of the related electric component modular unit of other variation of embodiment 6 is shown.
Fig. 7 D is the side view that the structure of the related electric component modular unit of other variation of embodiment 6 is shown.
Fig. 8 A is the side view that the structure of the related electric component modular unit of embodiment 7 is shown, and the example that the side wall surface of electric component modular unit and off-premises station is connected airtight is shown.
Fig. 8 B is the side view that the structure of the related electric component modular unit of embodiment 7 is shown, and the example that the upper wall surface of electric component modular unit and off-premises station is connected airtight is shown.
Fig. 8 C is the side view that the structure of the related electric component modular unit of embodiment 7 is shown, and the example that the diapire face of electric component modular unit and off-premises station is connected airtight is shown.
Fig. 9 is the figure that the configuration structure example of the electric component modular unit in off-premises station is shown.
Figure 10 be average air temperature in heat waste [W] that electric component modular unit inside is shown and framework [℃] between the chart of relation.
Figure 11 A is the top view of structure that the off-premises station of existing air conditioner is shown.
Figure 11 B is the stereogram of structure that the off-premises station of existing air conditioner is shown.
Figure 12 A illustrates existing other the top view of structure of off-premises station of air conditioner.
Figure 12 B illustrates existing other the stereogram of structure of off-premises station of air conditioner.
Label declaration:
1,20: electric component modular unit; 1a, 1b: subelement; 2: housing section; 2a: power substrate housing section; 2b: control substrate housing section; 3: heat sink; 4: force device; 5: fans drive element; 6: capacitor; 7: coil; 8: heat conductivity parts; 9,29,39: water proof rubber; 10: power substrate; 11: control substrate; 12,13: heat sink; 14: resin window; 15: radiator; 16: wall; 17,117: off-premises station; 18: Air Blast fan; 19: heat exchanger; 21: radiator; 22: compressor; 40: connected entrance.
The specific embodiment
Below, based on accompanying drawing, the embodiment of the off-premises station of the related electric component modular unit of the utility model and air conditioner is described.In addition, the utility model is not limited to this embodiment.
Embodiment 1
Fig. 1 is the cutaway view that the structure of the related electric component modular unit of present embodiment is shown.Electric component modular unit 1 is disposed in the off-premises station of air conditioner, and takes in for controlling the electric component of the various devices such as Air Blast fan in off-premises station, compressor, heat exchanger.
Electric component modular unit 1 disposes for example a plurality of substrates that comprise for the power substrate 10 of the installations such as force device 4 in the framework consisting of housing (case) portion 2, heat sink (plate) 3 and water proof rubber (rubber) 9, forms the structure that these substrates is carried out to airtight waterproof.
Housing section 2 is the box that the material by heat conductivity forms, such as being made by metals such as iron.Housing section 2 is an opening for example, and is fixed with heat sink 3 via waterproof part (water proof rubber 9) configuration, to seal above-mentioned opening.Heat sink 3 is formed by the good for example metal of heat conductivity.In addition, heat sink 3 can have heat pipe (heat pipe) structure, as long as heat conductivity well, can be also other parts.Water proof rubber 9 is sandwiched between housing section 2 and heat sink 3, thereby electric component modular unit 1 is formed to airtight waterproof structure.Water proof rubber 9 as shown example forms the surperficial sheet that roughly covers heat sink 3 like that, and, also can form the band shape that for example comprises the composition surface between housing section 2 and heat sink 3.Heat sink 3 is fixed in housing section 2 via water proof rubber 9.Heat sink 3 is configured to be roughly parallel to the wall with the opposed housing section 2 of this heat sink 3.
In housing section 2, take in and be useful on a plurality of control substrates that off-premises station is controlled.In illustrated example, for example dispose two control substrates, one of them is power substrate 10, another is for controlling substrate 11.Power substrate 10 and control substrate 11 are all installed on housing section 2.The electronic units such as force device 4, fans drive element 5, capacitor (capacitor) 6, coil (coil) 7 are installed at power substrate 10.Force device 4 carries as power supply.And force device 4 is configured to and comprises wide bandgap semiconductor, thereby has realized low-power consumption.Force device 4 comprises switch (switching) element, diode (diode) element that is formed in the power conversion circuits such as inverter circuit that use when the motor in off-premises station is supplied with to electric power.Fans drive element 5 is for driving Air Blast fan.Fans drive element 5 also can be used wide bandgap semiconductor.At control substrate 11, be equipped with the electronic unit for off-premises station is controlled.In addition, at control substrate 11, also can carry the element that comprises wide bandgap semiconductor.
In housing section 2, dispose heat sink 12(internal heat dissipating plate), this heat sink 12 becomes to supply to control the inner space and the inner space configuring for power substrate 10 of substrate 11 configurations by the spatial separation of framework inside.Heat sink 12 is for example formed by metal, is hot good conductor.Heat sink 12 for example with heat sink 3 almost parallels.And, control substrate 11 and power substrate 10 also for example with heat sink 3 almost parallels.It is isolated from the inner space configuring for power substrate 10 that heat sink 12 will be controlled substrate 11, and power substrate 10 is completely cut off from the inner space for controlling substrate 11 configurations.Power substrate 10 is disposed in the confined space being separated out by heat sink 12 and heat sink 3.That is to say, power substrate 10 is configured in to compare controls substrate 11 by the position of heat sink 3 sides, forms the structure more effectively dispelling the heat via heat sink 3 from the heating of force device 4 grades.
Herein, wide bandgap semiconductor is such as being SiC(carborundum (silicon carbide)), GaN(gallium nitride (gallium)) or diamond (diamond) etc.By using wide bandgap semiconductor, proof voltage improves, allows current density also to improve, therefore can realize the miniaturization of switch element, diode element, and, by using the above-mentioned switch element of realizing miniaturization, diode element, can realize the miniaturization of the semiconductor module that is assembled with these elements.
And the heat resistance of wide bandgap semiconductor is also high, therefore can realize the further miniaturization of semiconductor module.
In addition,, because the power loss of wide bandgap semiconductor is low, therefore can realize the high efficiency of switch element, diode element, and then can realize the high efficiency of semiconductor module.
In addition, although preferred switch element and diode element both sides form by wide bandgap semiconductor, can be also that either party's element is formed by wide bandgap semiconductor, also can obtain the effect that present embodiment is recorded in this case.
Capacitor 6 and coil 7 are for example installed on leaning on the face of heat sink 12 sides of power substrate 10.Between the top of capacitor 6 and heat sink 12, dispose heat conductivity parts 8, capacitor 6 contacts via these heat conductivity parts 8 with heat sink 12.That is to say, heat conductivity parts 8 are sandwiched between the top and heat sink 12 of capacitor 6.Equally, between the top of coil 7 and heat sink 12, dispose heat conductivity parts 8, coil 7 contacts via these heat conductivity parts 8 with heat sink 12.Herein, heat conductivity parts 8 are for example heat conductivity sheet (sheet) or heat conductivity fat (grease).Like this, form the structure that capacitor 6 and coil 7 contact with heat sink 12 via heat conductivity parts 8, can, via heat sink 12 heating of self-capacitance device 6 and coil 7 in the future from framework towards external cooling, can improve radiating effect thus.
Force device 4 and fans drive element 5 are for example installed on leaning on the face of heat sink 3 sides of power substrate 10.Between the top of force device 4 and heat sink 3, dispose heat conductivity parts 8, force device 4 contacts via these heat conductivity parts 8 with heat sink 3.That is to say, heat conductivity parts 8 are sandwiched between the top and heat sink 3 of force device 4.Equally, between the top of fans drive element 5 and heat sink 3, dispose heat conductivity parts 8, fans drive element 5 contacts via these heat conductivity parts 8 with heat sink 3.Herein, heat conductivity parts 8 are for example heat conductivity sheet or heat conductivity fat.Like this, form the structure that force device 4 and fans drive element 5 contact with heat sink 3 via heat conductivity parts 8, can, by the heating from force device 4 and fans drive element 5 from heat sink 3 towards external cooling, can improve radiating effect thus.
In addition, usually, by configuring heat conductivity parts 8 between the heating position on power substrate 10 (heat generating components) and heat sink 12 or configure heat conductivity parts 8 between heating position (heat generating components) and heat sink 3, can improve radiating effect.Equally, by configuring heat conductivity parts 8 between heating position (heat generating components) on substrate 11 and heat sink 12 or configure heat conductivity parts 8 between the wall of heating position (heat generating components) and framework (framework and the opposed wall of heat sink 3) controlling, can improve radiating effect.
According to present embodiment, owing to being enclosed in framework (housing section 2 and heat sink 3) and utilizing water proof rubber 9 to form water proof structure controlling substrate 11 and the control substrate of installing for the force device 4 that comprises wide bandgap semiconductor that is power substrate 10, therefore can the power loss of force device 4 be suppressed lowlyer, and can make by the heat radiation of carrying out via framework wall to keep in framework suitable temperature, thereby realize the miniaturization of electric component modular unit 1.
In addition, according to present embodiment, by the miniaturization of electric component modular unit 1, the restriction of the setting position in off-premises station is relaxed, and the configuration free degree uprises.And, by the miniaturization of electric component modular unit 1, can realize the miniaturization that this electric component modular unit 1 is accommodated in to inner off-premises station.And, by making electric component modular unit 1 form water proof structure, can prevent that dust and moisture from sneaking into, the reliability of electric component modular unit 1 improves.
On the other hand, Figure 11 A, Figure 11 B are the figure of structure that the off-premises station of existing air conditioner is shown, and Figure 12 A, Figure 12 B illustrate existing other the figure of structure of off-premises station of air conditioner.In addition, in each figure of Figure 11 A, Figure 11 B and Figure 12 A, Figure 12 B, Figure 11 A, Figure 12 A and Figure 11 B, Figure 12 B figure represent respectively top view, stereogram.In Figure 11 A, Figure 11 B, the electric component modular unit 20 that shows Air Blast fan 18, heat exchanger 19, compressor 22 and take in the control substrate that above-mentioned parts are controlled in the off-premises station 117 of air conditioner.In Figure 11 A, Figure 11 B, electric component modular unit 20 is incorporated in the housing of half opening and is disposed at the top in off-premises station framework.And, in Figure 12 A, Figure 12 B, the electric component modular unit 20 that shows Air Blast fan 18, heat exchanger 19 and take in the control substrate that above-mentioned parts are controlled in the off-premises station 117 of air conditioner.In Figure 12 A, Figure 12 B, electric component modular unit 20 is incorporated in the housing of half opening and is disposed at the top in off-premises station framework, possesses for force device is carried out to cooling radiator 21.No matter, in which kind of situation in Figure 11 A, Figure 11 B and Figure 12 A, Figure 12 B, adopted thus the type of cooling of the cooling air that utilizes Air Blast fan 18, therefore as shown example like that, there is restriction in the allocation position of electric component modular unit 20.And, owing to possessing radiator 21 etc., so 20 maximizations of electric component modular unit, this has further reduced the free degree of allocation position.And because the heating of force device is large, so housing forms the structure of half opening, thus, also exists dust or moisture to sneak into electric component modular unit 20, the misgivings that the reliability of electric component reduces.Present embodiment has solved such problem points in the past.
In addition, Fig. 2 is the cutaway view that the structure of the related electric component modular unit of modified embodiment of the present embodiment is shown.In Fig. 2, the inscape identical with Fig. 1 marked to identical label.The difference of Fig. 2 and Fig. 1 is, in Fig. 2, replaces the heat sink 12 of Fig. 1, is provided with the heat sink 13(internal heat dissipating plate that is for example provided with connected entrance in substantial middle portion).; the heat sink 12 of Fig. 1 forms the tabular isolated with the inner space that supplies power substrate 10 configurations of the inner space for controlling substrate 11 configurations, but is provided with at the heat sink 13 of Fig. 2 the connected entrance 40 that the inner space for controlling substrate 11 configurations is communicated with the inner space that supplies power substrate 10 configurations.By connected entrance 40 is set by this way, there is the effect that makes heat radiation equalization in framework of power substrate 10 by the convection current of air.In addition, other effect of present embodiment is identical with the effect forming in the situation of structure of Fig. 1.
Embodiment 2
Fig. 3 A is the cutaway view that the structure of the related electric component modular unit of present embodiment is shown, and Fig. 3 B is the plane that the structure of the related electric component modular unit of present embodiment is shown.In Fig. 3 A, Fig. 3 B, the inscape identical with Fig. 1 marked to identical label.
As shown in Figure 3A, in the related electric component modular unit 1 of present embodiment, as controlling substrate, be only provided with power substrate 10.Thereby, in Fig. 3 A, form from the structure shown in Fig. 1 and removed the structure of controlling substrate 11, heat sink 12.
And capacitor 6 and coil 7 are installed on power substrate 10 and faces heat sink 3 side opposition sides.And then, between the top of capacitor 6 and the wall of housing section 2 (housing section 2 and the opposed wall of heat sink 3), disposing heat conductivity parts 8, capacitor 6 contacts via these heat conductivity parts 8 with housing section 2.That is to say, heat conductivity parts 8 are sandwiched between the top of capacitor 6 and the wall of housing section 2.Equally, between the top of coil 7 and the wall of housing section 2 (housing section 2 and the opposed wall of heat sink 3), dispose heat conductivity parts 8, coil 7 contacts via these heat conductivity parts 8 with housing section 2.That is to say, heat conductivity parts 8 are sandwiched between the top of coil 7 and the wall of housing section 2.Heat conductivity parts 8 are identical with the heat conductivity parts in embodiment 1.
And, in the present embodiment, identical with embodiment 1, between the top of force device 4 and heat sink 3, dispose heat conductivity parts 8, force device 4 contacts via these heat conductivity parts 8 with heat sink 3.In addition, between the top of fans drive element 5 and heat sink 3, dispose heat conductivity parts 8, fans drive element 5 contacts via these heat conductivity parts 8 with heat sink 3.
Fig. 3 B is the plane when power substrate 10 is observed electric component modular unit 1 from the allocation position of the heat conductivity parts 8 of heat sink 3 sides.In Fig. 3 B, show the heat conductivity parts 8 that are disposed at the top of force device 4 and the top of fans drive element 5 etc.
Like this, form the structure that capacitor 6 and coil 7 contact with housing section 2 via heat conductivity parts 8, thus, the heating of self-capacitance device 6 and coil 7 in the future, from housing section 2 towards external cooling, can improve radiating effect.Other structure and the effect of present embodiment are identical with embodiment 1.
In addition, although be illustrated only disposing in framework as the structure of controlling the power substrate 10 of substrate in the present embodiment, and, in embodiment 1, to dispose the structure of two control substrates (power substrate 10, control substrate 11) in framework, be illustrated, but, for disposing 3 above situations of controlling substrate, also can form in the same way.For example, in the situation that disposing 3 control substrates, can on the basis of the structure of Fig. 1, form following structure: the 3rd control substrate is disposed at and controls between substrate 11 and the wall of housing section 2, and utilize internal heat dissipating plate will the 3rd control substrate and control substrate 11 between separate.That is to say, as long as form a plurality of control substrates in the interior structure that mutually configures and utilize inner panel that above-mentioned a plurality of control substrates are separated mutually substantially in parallel of housing section 2.
Embodiment 3
Fig. 4 is the cutaway view that the structure of the related electric component modular unit of present embodiment is shown.In Fig. 4, the inscape identical with Fig. 1 marked to identical label.
In the related electric component modular unit 1 of present embodiment, between control substrate 11 and heat sink 12, dispose heat conductivity parts 8, control substrate 11 and contact via these heat conductivity parts 8 with heat sink 12.According to this structure, can be by the heating from controlling substrate 11 via heat conductivity parts 8, heat sink 12 from housing section 2 towards external cooling, can improve radiating effect.Like this, according to present embodiment, can provide and improve the electric component modular unit 1 of controlling the cooling effect of substrate 11.In addition, other structure of present embodiment is identical with the structure of the embodiment 1 shown in Fig. 1, and can play same effect.
Embodiment 4
Fig. 5 is the cutaway view that the structure of the related electric component modular unit of present embodiment is shown.In Fig. 5, the inscape identical with Fig. 1 marked to identical label.
In the present embodiment, form subelement (subunit) 1a(the first subelement that comprises power substrate 10) with comprise subelement 1b(the second subelement of controlling substrate 11) structure that can mutually load and unload, electric component modular unit 1 forms by assembling subelement 1b at subelement 1a.
That is, subelement 1a is by utilizing housing section 2a(the first housing section for power substrate), heat sink 3 and water proof rubber 9 form and in the framework of airtight waterproof structure, configure power substrate 10 and form.And subelement 1b is by utilize controlling housing section 2b(the second housing section substrate for), heat sink 12 and water proof rubber 9 form and in the framework of airtight waterproof structure, configure control substrate 11 and form.
The structure of subelement 1a is identical with the structure shown in Fig. 3 A.Power substrate has heat conductivity and is box with housing section 2a, for example, be made of metal.A power substrate for example opening of housing section 2a, heat sink 3 is fixed on power substrate housing section 2a via water proof rubber 9, so that airtight above-mentioned opening.At power substrate 10, force device 4, fans drive element 5, capacitor 6 and coil 7 etc. are installed.Between the top of force device 4 and heat sink 3, dispose heat conductivity parts 8.Fans drive element 5 is configuration in the same way also.The wall of housing section 2a for the top of capacitor 6 and power substrate (power substrate with housing section 2a's and the opposed wall of heat sink 3) between dispose heat conductivity parts 8.Coil 7 is configuration in the same way also.
Control substrate and there is heat conductivity and be box with housing section 2b, for example, be made of metal.Control a substrate for example opening of housing section 2b, heat sink 12 is fixed on and controls substrate housing section 2b via water proof rubber 9, so that airtight above-mentioned opening.In addition, the water proof rubber 9 in this situation is for example banded centered by with the junction surface between housing section 2b and heat sink 12 and configures to control substrate.
Heat sink 12 is identical with the heat sink of inside of housing section 2 that is disposed at Fig. 1 in fact.By make the upper surface of housing section 2a for power substrate (power substrate with housing section 2a with the opposed wall of heat sink 3) coordinate with heat sink 12 and subelement 1b be assemblied in to subelement 1a, form thus electric component modular unit 1.At subelement 1b, be assemblied under the state of subelement 1a, utilize to control substrate with housing section 2b and power substrate the housing section 2 with side wall surface (power substrate is removed and the opposed wall of heat sink 12 wall in addition with the housing section 2a's) pie graph 1 of housing section 2a.And, can carry out via not shown handling position the handling of subelement 1a and subelement 1b.For example, can be by utilizing connecting member linker unit 1a, 1b or connecting member being unloaded and subelement 1a, 1b are loaded and unloaded.
Except electric component modular unit 1 by subelement 1a, the 1b that mutually can load and unload form this point, the effect of present embodiment is identical with embodiment 1.In addition, although to controlling substrate, be for example that the situation of two is illustrated in the present embodiment,, usually, when there is N(N, be more than 2) and in the situation of individual control substrate, can utilize removably N sub-cell formation electronic modular unit 1.
Embodiment 5
Fig. 6 is the stereogram that the structure of the related electric component modular unit of present embodiment is shown.In addition, in Fig. 6, the inscape identical with Fig. 1 marked to identical label.
As shown in Figure 6, in the present embodiment, electric component modular unit 1 possesses resin window 14 in housing section 2.Specifically, housing section 2 and parts heat sink 3 opposed walls are the orthogonal shape of opening for example, and resin window 14 is embedded in above-mentioned opening to be folded with the mode of water proof rubber 29 between this resin window 14 and above-mentioned opening, thus airtight above-mentioned opening.Water proof rubber 29 can be realized the airtight waterproof structure at the position arranging for resin window 14, thereby electric component modular unit 1 is realized airtight waterproof as a whole.In addition, although resin window 14 is arranged on to housing section 2 in illustrated example with the opposed wall of heat sink 3, also this resin window 14 can be arranged to other position.Other structure of present embodiment is identical with the structure in embodiment 1.
According to present embodiment, owing to being provided with resin window 14 in housing section 2, therefore have and can easily via this resin window 14, control the maintenance of substrate 11, power substrate 10 and the effect that data (data) are taken out.Other effect of present embodiment is identical with the effect of embodiment 1.In addition, also can be by present embodiment and embodiment 2~4 combinations.
Embodiment 6
Fig. 7 A is the stereogram that the structure of the related electric component modular unit of present embodiment is shown.Fig. 7 B is the stereogram that the structure of the related electric component modular unit of modified embodiment of the present embodiment is shown.Fig. 7 C is the stereogram that the structure of the related electric component modular unit of other variation of present embodiment is shown.Fig. 7 D is the side view that the structure of the related electric component modular unit of other variation of present embodiment is shown.In addition, in Fig. 7 A, Fig. 7 B, Fig. 7 C, Fig. 7 D, the inscape identical with Fig. 1, Fig. 6 marked to identical label.
The structure of the electric component modular unit 1 that present embodiment shown in Fig. 7 A is related.As shown in Figure 7 A, electric component modular unit 1 possesses the radiator 15 being arranged on heat sink 3.Radiator 15 has radiating fin.Between heat sink 3 and radiator 15, dispose heat conductivity parts 8, heat sink 3 is in contact with one another via heat conductivity parts 8 with radiator 15.In addition, heat conductivity parts 8 are identical with the heat conductivity parts that illustrated in embodiment 1.By radiator 15 is set by this way, to compare with the structure of Fig. 1~Fig. 6, the radiating effect of electric component modular unit 1 further improves.Shown in Fig. 7 B, in the structure of Fig. 7 A, added the structure after resin window 14, the structure shown in the structure shown in constitutional diagram 7A and Fig. 6 forms.
Fig. 7 C is the stereogram that the structure of the related electric component modular unit 1 of modified embodiment of the present embodiment is shown, and Fig. 7 D is its side view.In this case, although electric component modular unit 1 possesses radiator 15, this radiator 15 is arranged to contact with force device 4 via the opening that is arranged at heat sink 3.; in the structure of Fig. 7 A or Fig. 7 B; form radiator 15 and the Surface Contact of heat sink 3 and the structure contacting with force device 4 via heat sink 3, but in the structure of Fig. 7 C and Fig. 7 D, connect airtight on radiator 15 top not direct via heat sink 3 and force device 4.Now, in order further to improve heat conductivity, can be between radiator 15 and force device 4 sandwiched heat conductivity parts 8.Heat conductivity parts 8 are identical with the heat conductivity parts that illustrated in embodiment 1.And, in order to ensure the airtight waterproof of electric component modular unit 1, can in the gap between radiator 15 and the peristome of heat sink 3, clamp water proof rubber 39 and stop up this gap.According to this variation, owing to forming not via the structure that heat sink 3 makes radiator 15 directly and force device 4 connects airtight, so the radiating effect of electric component modular unit 1 improves.
In addition, replace, at electric component modular unit 1, radiator 15 is set, can also form the structure that links refrigerant piping.In this structure, compare with the structure of Fig. 1~Fig. 6, by cold-producing medium mobile in refrigerant piping, the radiating effect of electric component modular unit 1 further improves.
Embodiment 7
Fig. 8 A is the side view that the structure of the related electric component modular unit of present embodiment is shown, and the example that the side wall surface of electric component modular unit and off-premises station is connected airtight is shown.Fig. 8 B is the side view that the structure of the related electric component modular unit of present embodiment is shown, and the example that the upper wall surface of electric component modular unit and off-premises station is connected airtight is shown.Fig. 8 C is the side view that the structure of the related electric component modular unit of present embodiment is shown, and the example that the diapire face of electric component modular unit and off-premises station is connected airtight is shown.Although the structure of electric component modular unit 1 itself is identical with the structure of the electric component modular unit of Fig. 1~Fig. 6,, in the present embodiment, specially the wall 16 of the framework of electric component modular unit 1 and off-premises station is connected airtight to setting.In this case, for example can make connecting airtight by the face of heat sink 3 sides and the wall 16 of framework of electric component modular unit 1.
Fig. 8 A is the example that the side wall surface of electric component modular unit 1 and off-premises station is connected airtight, and Fig. 8 B is the example that the upper wall surface of electric component modular unit 1 and off-premises station is connected airtight, and Fig. 8 C is the example that the diapire face of electric component modular unit 1 and off-premises station is connected airtight.In this structure, owing to the heating from electric component modular unit 1 can being dispelled the heat outward towards off-premises station by the wall 16 via the framework of off-premises station, so the radiating effect of electric component modular unit 1 further improves.
Fig. 9 is the figure that the configuration structure example of the electric component modular unit 1 in off-premises station is shown.In Fig. 9, in the off-premises station 17 of air conditioner, dispose Air Blast fan 18 equipment such as grade, electric component modular unit 1 for example can be with the arbitrary configuration mode configuration in 1a~1d.; 1a is the example that electric component modular unit 1 is installed on the upper wall surface of off-premises station 17; 1b is the example that electric component modular unit 1 is installed on the side wall surface of off-premises station 17; 1c is the example that electric component modular unit 1 is installed on the wall of the demarcation strip in off-premises station 17, and 1d is the example that electric component modular unit 1 is installed on the diapire face of off-premises station 17.In addition, demarcation strip is the plate that the inside of off-premises station 17 is separated, and this demarcation strip is connected with the framework of off-premises station.Even if with the arbitrary configuration mode configuration electric component modular unit 1 in 1a~1d, also can realize the effect identical with situation illustrated in Fig. 8 A, Fig. 8 B, Fig. 8 C.
Figure 10 be average air temperature in heat waste [W] that electric component modular unit 1 inside is shown and framework [℃] between the chart of relation.Heat waste represents the parts heating aggregate value in framework.Although form the control substrates such as power substrate 10 be enclosed within to the structure in framework in embodiment 1~7, in the situation that in framework within the scope of the allowable temperature of regular event of average air temperature in guaranteeing each element, can form above-mentioned airtight construction.In Figure 10, the scope of the heat waste corresponding with the allowable temperature scope of element is shown with A.By the wide bandgap semiconductor of having realized low-power consumption is applied to force device 4, and form the structure of embodiment 1~5, average air temperature in the framework of electric component modular unit 1 can be maintained within the scope of allowable temperature.In framework, in the situation of average air temperature higher than allowable temperature scope, by adopting in the lump the cooling construction of embodiment 6 or 7, average air temperature in framework can be maintained within the scope of allowable temperature.Thus, can improve the reliability of electric component.
In industry, utilize possibility
The utility model is useful as the off-premises station of electric component modular unit and air conditioner.

Claims (16)

1. an electric component modular unit, this electric component modular unit is disposed in the off-premises station of air conditioner, and, in the internal configurations of this electric component modular unit, there is the control substrate that described off-premises station is controlled,
Described electric component modular unit is characterised in that,
At described control substrate, force device is installed, this force device forms and comprises wide bandgap semiconductor, and described control substrate is incorporated in and forms water-proof sealing structure in framework.
2. electric component modular unit according to claim 1, is characterized in that,
Described framework is configured to be possessed: the housing section of case shape, and this housing section is formed by thermally-conductive materials, and an opening; And heat sink, this heat sink is via the airtight described opening of waterproof part.
3. electric component modular unit according to claim 2, is characterized in that,
In described framework, dispose other that be different from described control substrate and control substrate, and, internal heat dissipating plate is installed in described framework, this internal heat dissipating plate will described control substrate with described other control substrate between separate.
4. electric component modular unit according to claim 3, is characterized in that,
At described internal heat dissipating plate, be provided with connected entrance, this connected entrance is communicated with for the inner space of described control substrate configuration controls the inner space of substrate configuration with supplying described other.
5. according to the electric component modular unit described in claim 3 or 4, it is characterized in that,
Described control substrate is configured in compares described other control substrate by the position of described heat sink side.
6. electric component modular unit according to claim 5, is characterized in that,
Described force device is installed on leaning on the face of described heat sink side of described control substrate,
Described force device contacts via heat conductivity parts with described heat sink.
7. electric component modular unit according to claim 6, is characterized in that,
Described control substrate by the heat generating components beyond described force device is installed on the face of described heat sink side,
Described heat generating components contacts via heat conductivity parts with described heat sink.
8. electric component modular unit according to claim 6, is characterized in that,
On described control substrate and face described heat sink side opposition side, heat generating components is installed,
Described internal heat dissipating plate contacts via heat conductivity parts with described heat generating components.
9. electric component modular unit according to claim 5, is characterized in that,
Described other controlled substrate and contacted via heat conductivity parts with described internal heat dissipating plate.
10. electric component modular unit according to claim 2, is characterized in that,
Leaning on the face of described heat sink side of described control substrate, described force device and other heat generating components are installed,
On described control substrate and face described heat sink side opposition side, heat generating components is also installed,
Described force device contacts via heat conductivity parts with described heat sink,
The heat generating components by the face of described heat sink side of described control substrate contacts via heat conductivity parts with described heat sink,
Described control substrate via heat conductivity parts, contact with the wall of described housing section with the heat generating components on face described heat sink side opposition side.
11. electric component modular units according to claim 5, is characterized in that,
Described electric component modular unit possesses:
The first subelement, described control substrate be disposed at by thermally-conductive materials, formed and first housing section that is case shape of an opening in state under, utilize described heat sink via airtight this opening of waterproof part, to form water-proof sealing structure; And
The second subelement, this second subelement can load and unload with respect to described the first subelement, described other control substrate be disposed at by thermally-conductive materials, formed and second housing section that is case shape of an opening in state under, utilize described internal heat dissipating plate via airtight this opening of waterproof part, to form water-proof sealing structure
Described electric component modular unit forms by described the second subelement is assemblied in to described the first subelement.
12. electric component modular units according to claim 2, is characterized in that,
In described housing section, be provided with resin window.
13. electric component modular units according to claim 2, is characterized in that,
Described electric component modular unit possesses radiator, and this radiator is installed on described heat sink.
14. according to the electric component modular unit described in any one in claim 1~4,10,12,13, it is characterized in that,
Described wide bandgap semiconductor is carborundum, gallium nitride or diamond.
The off-premises station of 15. 1 kinds of air conditioners, is characterized in that,
The off-premises station of described air conditioner possesses the electric component modular unit described in any one in claim 1~4,10,12,13.
The off-premises station of 16. air conditioners according to claim 15, is characterized in that,
The mode that described electric component modular unit connects airtight with the wall of the framework of the off-premises station with described air conditioner is installed.
CN201320573446.4U 2012-10-05 2013-09-16 Electrical component module unit and outdoor unit of air conditioner Active CN203586429U (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105827178A (en) * 2015-01-22 2016-08-03 山洋电气株式会社 Motor control device

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6214462B2 (en) * 2014-05-13 2017-10-18 三菱電機株式会社 Air conditioner outdoor unit
JP6435717B2 (en) * 2014-09-01 2018-12-12 ダイキン工業株式会社 Refrigeration equipment
JP6282208B2 (en) * 2014-09-26 2018-02-21 三菱電機株式会社 Outdoor unit and air conditioner
WO2017077647A1 (en) * 2015-11-06 2017-05-11 三菱電機株式会社 Outdoor unit and air-conditioner using same
JP2018175444A (en) * 2017-04-13 2018-11-15 東芝ライフスタイル株式会社 Clothes dryer

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0775215A (en) * 1993-09-03 1995-03-17 Seiko Epson Corp Electric vehicle motor drive unit
JP2802595B2 (en) * 1994-10-14 1998-09-24 株式会社ニューギン Control circuit device for pachinko machine
JP2003139352A (en) * 2001-11-02 2003-05-14 Daikin Ind Ltd Electric device unit for outdoor machine and outdoor machine for air conditioner
JP2005235929A (en) * 2004-02-18 2005-09-02 Mitsubishi Electric Corp Power converter
JP4383981B2 (en) * 2004-08-04 2009-12-16 トヨタ自動車株式会社 Inverter device
JP4404726B2 (en) * 2004-08-31 2010-01-27 三菱電機株式会社 Automotive power converter
JP4923106B2 (en) * 2007-09-28 2012-04-25 東芝キヤリア株式会社 Air conditioner outdoor unit
JP2009100638A (en) * 2007-09-28 2009-05-07 Toshiba Carrier Corp Inverter device, and outdoor unit for air-conditioner
JP2010145054A (en) * 2008-12-19 2010-07-01 Daikin Ind Ltd Refrigerating device
JP5532623B2 (en) * 2009-02-24 2014-06-25 ダイキン工業株式会社 Air conditioner electrical equipment
JP2011196558A (en) * 2010-03-17 2011-10-06 Panasonic Corp Electrical equipment box
JP5611084B2 (en) * 2011-03-08 2014-10-22 三菱電機株式会社 Air conditioner outdoor unit and air conditioner using the air conditioner outdoor unit

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105827178A (en) * 2015-01-22 2016-08-03 山洋电气株式会社 Motor control device

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