CN203567046U - Upper cover mold of junction box - Google Patents

Upper cover mold of junction box Download PDF

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Publication number
CN203567046U
CN203567046U CN201320616311.1U CN201320616311U CN203567046U CN 203567046 U CN203567046 U CN 203567046U CN 201320616311 U CN201320616311 U CN 201320616311U CN 203567046 U CN203567046 U CN 203567046U
Authority
CN
China
Prior art keywords
board
insulation board
mold
thermal insulation
upper cover
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201320616311.1U
Other languages
Chinese (zh)
Inventor
许志君
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kunshan Gold 900 000 000 Feinmetall GmbH
Original Assignee
Kunshan Gold 900 000 000 Feinmetall GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kunshan Gold 900 000 000 Feinmetall GmbH filed Critical Kunshan Gold 900 000 000 Feinmetall GmbH
Priority to CN201320616311.1U priority Critical patent/CN203567046U/en
Application granted granted Critical
Publication of CN203567046U publication Critical patent/CN203567046U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model provides an upper cover mold of a junction box, which comprises a top board, an upper heat insulation board, an upper mold board, a lower mold board, a lower heat insulation board, a bottom board and a press mold groove, wherein the upper heat insulation board is arranged on the lower surface of the top board; the upper mold board is arranged on the lower surface of the upper heat insulation board; the lower mold board is arranged on the lower surface of the upper mold board; a cavity is defined between the upper mold board and the lower mold board; the lower heat insulation board is arranged on the lower surface of the lower mold board; the bottom board is arranged on the lower surface of the lower heat insulation board; the press mold groove is formed between the upper mold board and the lower mold board, and an inclination is increased on the press mold groove. The inclination is increased on the original press mold groove, so that the size of a press mold surface is increased, more than two plates can be pressed, the mold is guaranteed to be fixed firmly on a machine stand, and the displacement due to a poor fixation effect and the mold damage are avoided to improve the product quality.

Description

Upper cover of connecting box mould
Technical field
The utility model relates to a kind of upper cover of connecting box mould.
Background technology
Injection mold is the important process equipment of producing various industrial products, along with plastic mould design industry developing rapidly and plasthetics aviation, boat too, the applying of the industrial department such as electronics, machinery, boats and ships and automobile, product is more and more higher to the requirement of mould, and traditional plastic mould method for designing cannot adapt to model change and propose high-quality requirement.Computer aided engineering technology has become the most effective approach of these weak links in plastic cement products exploitation, Design of Dies and product processing.
Utility model content
The utility model provides a kind of upper cover of connecting box mould, and described mould comprises: top board; Upper thermal insulation board, described upper thermal insulation board is located on the lower surface of described top board; Cope match plate, described cope match plate is located on the lower surface of described upper thermal insulation board; Lower template, described lower template is located on the lower surface of described cope match plate, between wherein said cope match plate and described lower template, limits die cavity; Lower thermal insulation board, described lower thermal insulation board is located on the lower surface of described lower template; Base plate, described base plate is located on the lower surface of described lower thermal insulation board; Pressing mold groove, described pressing mold groove is located between cope match plate and lower template, on pressing mold groove, increases gradient.
Preferably, on four angles of described pressing mold groove, increase gradient.
Preferably, the gradient on four angles of described pressing mold groove and the angle between mould are 40 ° to 45 °.
Preferably, gradient and the angle between mould on four angles of pressing mold groove is 41.5 °.
Preferably, described top board, described upper thermal insulation board, described cope match plate, described lower template, described lower thermal insulation board and described base plate removably link together by bolt.
Preferably, described top board, described upper thermal insulation board, described cope match plate, described lower template, described lower thermal insulation board and described base plate removably link together by a plurality of described bolts.
Preferably, a plurality of described bolts are positioned on the first circumference.
Preferably, a plurality of described bolts are distributed on described the first circumference equally spacedly.
In common upper cover of connecting box Design of Dies, because needs are produced on 100T board, pressing mold groove is but because the reason of mould designs littlely, on 100T, produce and can only press a plate, causing mould to be loaded onto after board produces and has some setbacks very much, fixing not firm, the utility model increases gradient on original pressing mold groove, thereby increase the size of die pressing surface, and can press two above planks, guarantee that mould is fixed on board, can not damage because of the fixing not all right dislocation causing and mould, thereby improved the quality of product.
Accompanying drawing explanation
Above-mentioned and/or additional aspect of the present utility model and advantage accompanying drawing below combination obviously and is easily understood becoming the description of embodiment, wherein:
Fig. 1 is according to the structural representation of the mould of the utility model embodiment.
In figure: 1, mould; 10, pressing mold groove; 20, gradient.
The specific embodiment
Describe embodiment of the present utility model below in detail, the example of described embodiment is shown in the drawings, and wherein same or similar label represents same or similar element or has the element of identical or similar functions from start to finish.Below by the embodiment being described with reference to the drawings, be exemplary, only for explaining the utility model, and can not be interpreted as restriction of the present utility model.
Below with reference to Fig. 1, describe according to the mould 1 of the utility model embodiment.As shown in Figure 1, according to the mould 1 of the utility model embodiment, comprise top board, upper thermal insulation board, cope match plate, lower template, lower thermal insulation board, base plate and pressing mold groove 10.
Upper thermal insulation board is located on the lower surface of top board, and cope match plate is located on the lower surface of thermal insulation board.Lower template is located on the lower surface of cope match plate, wherein between cope match plate and lower template, limits the die cavity being communicated with hot flow path.Lower thermal insulation board is located on the lower surface of lower template, and base plate is located on the lower surface of lower thermal insulation board.Pressing mold groove 10 is located between cope match plate and lower template.
In common upper cover of connecting box Design of Dies, because needs are produced on 100T board, pressing mold groove 10 is but because the reason of mould 1 designs littlely, on 100T, produce and can only press a plate, cause mould 1 to be loaded onto after board and produce and have some setbacks very much, fixing not firm, preferably, on four angles of described pressing mold groove 10, increase gradient 20, gradient 20 and the angle between mould 1 on 10 4 angles of described pressing mold groove are 41.5 °.
Top board, described upper thermal insulation board, described cope match plate, described lower template, described lower thermal insulation board and described base plate removably link together by bolt.Particularly, described top board, described upper thermal insulation board, described cope match plate, described lower template, described lower thermal insulation board and described base plate can removably link together by a plurality of described bolts.
Advantageously, a plurality of described bolts are positioned on the first circumference.Preferably, a plurality of described bolts are distributed on described the first circumference equally spacedly.Can improve the assembly precision of mould 1 thus.
In the description of this description, the description of reference term " embodiment ", " some embodiment ", " example ", " concrete example " or " some examples " etc. means to be contained at least one embodiment of the present utility model or example in conjunction with specific features, structure, material or the feature of this embodiment or example description.In this manual, the schematic statement of above-mentioned term is not necessarily referred to identical embodiment or example.And the specific features of description, structure, material or feature can be with suitable mode combinations in any one or more embodiment or example.
Although illustrated and described embodiment of the present utility model, those having ordinary skill in the art will appreciate that: in the situation that not departing from principle of the present utility model and aim, can carry out multiple variation, modification, replacement and modification to these embodiment, scope of the present utility model is limited by claim and equivalent thereof.

Claims (8)

1. a upper cover of connecting box mould, is characterized in that, comprising:
Top board;
Upper thermal insulation board, described upper thermal insulation board is located on the lower surface of described top board;
Cope match plate, described cope match plate is located on the lower surface of described upper thermal insulation board;
Lower template, described lower template is located on the lower surface of described cope match plate, between wherein said cope match plate and described lower template, limits die cavity;
Lower thermal insulation board, described lower thermal insulation board is located on the lower surface of described lower template;
Base plate, described base plate is located on the lower surface of described lower thermal insulation board;
Pressing mold groove, described pressing mold groove is located between cope match plate and lower template, on pressing mold groove, increases gradient.
2. upper cover of connecting box mould according to claim 1, is characterized in that, on four angles of described pressing mold groove, increases gradient.
3. upper cover of connecting box mould according to claim 2, is characterized in that, the gradient on four angles of described pressing mold groove and the angle between mould are 40 ° to 45 °.
4. upper cover of connecting box mould according to claim 3, is characterized in that, gradient and the angle between mould on four angles of pressing mold groove are 41.5 °.
5. upper cover of connecting box mould according to claim 1, is characterized in that, described top board, described upper thermal insulation board, described cope match plate, described lower template, described lower thermal insulation board and described base plate removably link together by bolt.
6. upper cover of connecting box mould according to claim 5, is characterized in that, described top board, described upper thermal insulation board, described cope match plate, described lower template, described lower thermal insulation board and described base plate removably link together by a plurality of described bolts.
7. upper cover of connecting box mould according to claim 6, is characterized in that, a plurality of described bolts are positioned on the first circumference.
8. upper cover of connecting box mould according to claim 7, is characterized in that, a plurality of described bolts are distributed on described the first circumference equally spacedly.
CN201320616311.1U 2013-10-08 2013-10-08 Upper cover mold of junction box Expired - Fee Related CN203567046U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201320616311.1U CN203567046U (en) 2013-10-08 2013-10-08 Upper cover mold of junction box

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201320616311.1U CN203567046U (en) 2013-10-08 2013-10-08 Upper cover mold of junction box

Publications (1)

Publication Number Publication Date
CN203567046U true CN203567046U (en) 2014-04-30

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201320616311.1U Expired - Fee Related CN203567046U (en) 2013-10-08 2013-10-08 Upper cover mold of junction box

Country Status (1)

Country Link
CN (1) CN203567046U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103496091A (en) * 2013-10-08 2014-01-08 昆山金九亿精密金属有限公司 Mold for upper cover of junction box

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103496091A (en) * 2013-10-08 2014-01-08 昆山金九亿精密金属有限公司 Mold for upper cover of junction box

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C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20140430

Termination date: 20141008

EXPY Termination of patent right or utility model