CN203423856U - Chip mounter platform - Google Patents

Chip mounter platform Download PDF

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Publication number
CN203423856U
CN203423856U CN201320472746.3U CN201320472746U CN203423856U CN 203423856 U CN203423856 U CN 203423856U CN 201320472746 U CN201320472746 U CN 201320472746U CN 203423856 U CN203423856 U CN 203423856U
Authority
CN
China
Prior art keywords
chip mounter
platform
induction device
anticollision
platform body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201320472746.3U
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Chinese (zh)
Inventor
李明锁
徐春明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDG TECHNOLOGY ZHEJIANG Co Ltd
Original Assignee
TDG TECHNOLOGY ZHEJIANG Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TDG TECHNOLOGY ZHEJIANG Co Ltd filed Critical TDG TECHNOLOGY ZHEJIANG Co Ltd
Priority to CN201320472746.3U priority Critical patent/CN203423856U/en
Application granted granted Critical
Publication of CN203423856U publication Critical patent/CN203423856U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model relates to a chip mounter platform. The chip mounter platform comprises a support, a platform body, a partition board and a first anticollision sensing device. The platform body is installed on the support. The partition board is arranged on the platform body for partitioning the platform body into a chip mounting region for chip mounting and a sensing region for arranging the sensing device. The first anticollision sensing device is installed in the sensing region. The first anticollision sensing device is provided with a sending unit which is towards the chip mounting region to prevent the chip mounter head from colliding onto the partition board. The chip mounter platform provided in the utility model can be used to prevent the chip mounter head from colliding onto the chip mounter platform by arranging the anticollision sensing device, and the chip mounter platform has advantages of simple structure and low cost.

Description

A kind of chip mounter platform
Technical field
The utility model relates to electronic product and manufactures field, especially relates to a kind of chip mounter platform.
Background technology
In the process of manufacturing at electronic product, conventionally need to use a large amount of tooling devices.For example, on circuit board, during welding electronic component, conventionally with chip mounter, weld, to enhance productivity.But, when chip mounter head carries out weld job on chip mounter platform, knock sometimes chip mounter platform, cause chip mounter to damage.Therefore, be necessary to develop and can prevent that chip mounter head from knocking the equipment of chip mounter platform, to prevent that chip mounter from damaging.
Utility model content
The purpose of this utility model is for the problems referred to above, provides a kind of and prevents and the chip mounter platform of chip mounter head collision, has solved the existing technical problem of prior art.
For achieving the above object, the utility model has adopted following technical proposal: a kind of chip mounter platform, it comprises bearing, platform body, dividing plate and the first anticollision induction device, described platform body is arranged on described bearing, described dividing plate is arranged on described platform body, described platform body is divided into for the Chip Area of paster and for the induction zone of sensing apparatus is set, described the first anticollision induction device is arranged in described induction zone, the sensing unit being provided with on described the first anticollision induction device towards described Chip Area knocks described dividing plate to prevent chip mounter head.
In above-mentioned chip mounter platform, preferably, described bearing comprises two back-up blocks, and the two ends of described platform body are arranged on described back-up block, and a part for described back-up block protrudes from the upper surface of described platform body.
In above-mentioned chip mounter platform, preferably, described dividing plate protrudes from the upper surface of described platform body, and two ends are connected with described back-up block respectively.
In above-mentioned chip mounter platform, preferably, in described induction zone, be also provided with for preventing that described chip mounter head from knocking the second anticollision induction device of described back-up block.
In above-mentioned chip mounter platform, preferably, described the second anticollision induction device is arranged on the inner surface of described back-up block.
In above-mentioned chip mounter platform, preferably, described the second anticollision induction device is infrared inductor.
In above-mentioned chip mounter platform, preferably, on described the first anticollision induction device, be provided with a plurality of sensing units, described a plurality of sensing units distribute along the direction that is parallel to described dividing plate.
The chip mounter platform that the utility model provides, by anticollision induction device is set, can prevent that chip mounter head from bumping against chip mounter platform, and the structure of this chip mounter platform is very simple, and cost is lower.
Accompanying drawing explanation
Fig. 1 is the structural representation of the chip mounter platform that provides of the utility model embodiment.
Embodiment
Please refer to Fig. 1, a kind of chip mounter platform that the utility model embodiment provides, it comprises bearing 11, platform body 12, dividing plate 13 and the first anticollision induction device 14.
Platform body 12 is roughly writing board shape, and it is arranged on bearing 11.Dividing plate 13 is arranged on platform body 12, and platform body 12 is divided into for the Chip Area of paster and for the induction zone of sensing apparatus is set.Particularly, in Chip Area, for putting the circuit board for the treatment of paster, chip mounter head also moves above this Chip Area.
The first anticollision induction device 14 is arranged in induction zone, is provided with the sensing unit 141 towards Chip Area on the first anticollision induction device 14, for preventing that chip mounter head from knocking dividing plate 13.Particularly, the first anticollision induction device 14 is connected with chip mounter controller, when chip mounter head is during near dividing plate 13, the sensing unit 141 of the first anticollision induction device 14 detects chip mounter head and arrives danger position, send signal to chip mounter controller, chip mounter head is halted, thereby prevent that collision accident from occurring.
In the present embodiment, this bearing 11 comprises two back-up blocks, and the two ends of platform body 12 are arranged on back-up block, and a part for back-up block protrudes from the upper surface of platform body 12.
Further, dividing plate 13 protrudes from the upper surface of platform body 12, and two ends are connected with back-up block respectively.
In order to prevent that chip mounter head from knocking back-up block, in induction zone, be also provided with the second anticollision induction device 15.Similarly, the second anticollision induction device 15 is connected with chip mounter controller, and when chip mounter head is during near back-up block, the second anticollision induction device 15 senses chip mounter head, to chip mounter controller, sends signal, makes chip mounter head stop to back-up block close.Particularly, the second anticollision induction device 15 is arranged on the inner surface of back-up block.
In a preferred embodiment, the second anticollision induction device 15 is infrared inductor.For example, the second anticollision induction device 15 can be infrared receiving device, and when chip mounter head is during near back-up block, the infrared ray that the infrared launcher that makes the second anticollision induction device 15 cannot receive its opposite sends, therefore sends signal to chip mounter controller.
In a preferred embodiment, be provided with a plurality of sensing units 141 on the first anticollision induction device 14, a plurality of sensing units 141 distribute along the direction that is parallel to dividing plate 13.By a plurality of sensing units 141 are set, can prevent better that chip mounter head from bumping against dividing plate 13.
The chip mounter platform that the utility model provides, by anticollision induction device is set, can prevent that chip mounter head from bumping against chip mounter platform, and the structure of this chip mounter platform is very simple, and cost is lower.
Specific embodiment described herein is only to the explanation for example of the utility model spirit.The utility model person of ordinary skill in the field can make various modifications or supplements or adopt similar mode to substitute described specific embodiment, but can't depart from spirit of the present utility model or surmount the defined scope of appended claims.
Although more used the terms such as chip mounter platform, anticollision induction device, dividing plate, platform body herein, do not got rid of the possibility of using other term.Use these terms to be only used to describe more easily and explain essence of the present utility model; They are construed to any additional restriction is all contrary with the utility model spirit.

Claims (7)

1. a chip mounter platform, it is characterized in that, comprise bearing, platform body, dividing plate and the first anticollision induction device, described platform body is arranged on described bearing, described dividing plate is arranged on described platform body, described platform body is divided into for the Chip Area of paster and for the induction zone of sensing apparatus is set, described the first anticollision induction device is arranged in described induction zone, and the sensing unit being provided with on described the first anticollision induction device towards described Chip Area knocks described dividing plate to prevent chip mounter head.
2. chip mounter platform according to claim 1, is characterized in that, described bearing comprises two back-up blocks, and the two ends of described platform body are arranged on described back-up block, and a part for described back-up block protrudes from the upper surface of described platform body.
3. chip mounter platform according to claim 2, is characterized in that, described dividing plate protrudes from the upper surface of described platform body, and two ends are connected with described back-up block respectively.
4. chip mounter platform according to claim 2, is characterized in that, is also provided with for preventing that described chip mounter head from knocking the second anticollision induction device of described back-up block in described induction zone.
5. chip mounter platform according to claim 4, is characterized in that, described the second anticollision induction device is arranged on the inner surface of described back-up block.
6. chip mounter platform according to claim 5, is characterized in that, described the second anticollision induction device is infrared inductor.
7. according to the chip mounter platform described in claim 1 to 6 any one, it is characterized in that, on described the first anticollision induction device, be provided with a plurality of sensing units, described a plurality of sensing units distribute along the direction that is parallel to described dividing plate.
CN201320472746.3U 2013-08-05 2013-08-05 Chip mounter platform Expired - Fee Related CN203423856U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201320472746.3U CN203423856U (en) 2013-08-05 2013-08-05 Chip mounter platform

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201320472746.3U CN203423856U (en) 2013-08-05 2013-08-05 Chip mounter platform

Publications (1)

Publication Number Publication Date
CN203423856U true CN203423856U (en) 2014-02-05

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201320472746.3U Expired - Fee Related CN203423856U (en) 2013-08-05 2013-08-05 Chip mounter platform

Country Status (1)

Country Link
CN (1) CN203423856U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116136673A (en) * 2023-04-19 2023-05-19 合肥安迅精密技术有限公司 Chip mounter complete machine control system and method and chip mounter

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116136673A (en) * 2023-04-19 2023-05-19 合肥安迅精密技术有限公司 Chip mounter complete machine control system and method and chip mounter

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C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20140205

Termination date: 20160805