CN203397297U - 1U high-configuration server radiating device - Google Patents

Abstract

The utility model discloses a 1U high-configuration server radiating device. The 1U high-configuration server radiating device comprises an upper cover radiating area on a case and an air guide cover which is arranged in the case and is used for a reducing air duct, wherein the upper cover radiating area comprises a front radiating area and a back radiating area; the front radiating area is arranged in front of a server fan and at the back of a hard disk; the back radiating area is arranged in front of a server IO (input/output) interface and at the back of a CPU (central processing unit) radiator; the air guide cover has a cover structure which is arranged on a server board and comprises a smooth top plate; the air guide cover comprises a front large-diameter area and a back small-diameter area; the front end of the large-diameter area is opposite to the server fan; the small-diameter area only covers the CPU radiator. By using the radiating device, the flow resistance of a 1U server is reduced; the radiating air amount is increased effectively; the radiating conditions of a product are improved; the temperature cannot exceed a standard when the rotating speed of the fan is reduced; noises of the server are reduced; the 1U server is compatible with a high-power CPU; product universality is enhanced; the satisfaction degree of customers is improved.

Description

1U high configuration server heat sink

technical field

The utility model relates to the technical field of computer heat dissipation, in particular to a heat dissipation device for a 1U high-configuration server.

Background technique

The 1U height server itself has a large flow resistance, and the size of the fan used is too small, resulting in less internal air volume. In addition, there are many IO interface components on the rear of some motherboards, so it is impossible to open more ventilation holes. When the whole machine is equipped with a high-power CPU, often Insufficient cooling air volume of the CPU causes the temperature to exceed the standard, affecting the normal use of the product.

Utility model content

In order to solve the problem of insufficient heat dissipation of existing 1U height servers, the utility model improves a heat dissipation device for 1U height configuration servers.

The 1U high-configuration server cooling device disclosed by the utility model adopts the following technical scheme to solve the technical problem: the device is installed in a 1U high-configuration server, and the front part of the 1U high-configuration server is provided with a server fan and a hard disk. The CPU radiator and the server IO interface are provided, and the upper cover of the chassis is arranged on the top. The heat dissipation area and the rear heat dissipation area, the front heat dissipation area is arranged behind the hard disk position before the server fan, and the rear heat dissipation area is arranged behind the CPU radiator before the server IO interface; the wind guide cover is arranged on the server motherboard The cover structure is divided into a front large-diameter area and a rear small-diameter area. If the air guide cover is installed on the server motherboard, the front end of the large-diameter area corresponds to all server fans, and the small-diameter area Only the cover covers the CPU cooler.

Further, the heat dissipation area of the upper cover of the chassis includes two heat dissipation strips, and the heat dissipation strips contain a plurality of heat dissipation holes, and the heat dissipation holes adopt square, rectangular, circular or oval heat dissipation holes.

Further, the wind guide cover includes a smooth top plate, through which the large-diameter area and the small-diameter area smoothly transition.

The beneficial effect of the 1U high-configuration server cooling device disclosed by the utility model is: the use of the cooling device reduces the flow resistance of the 1U server, effectively increases the heat dissipation air volume and improves the heat dissipation of the product, and realizes that the cooling speed of the fan does not increase when the fan speed is reduced. The temperature will exceed the standard, reduce the server noise, and ensure that the 1U server is compatible with high-power CPUs, which enhances product versatility and improves customer satisfaction.

Description of drawings

Accompanying drawing 1 is the installation diagram of described 1U high configuration server cooling device;

Notes on attached drawings: 1. Chassis top cover; 2. Front heat dissipation area; 3. Rear heat dissipation area; 4. Air guide cover; 5. Hard disk; 6. Server fan; 7. Memory; 8. Server IO interface; 9. Large diameter area; 10. Small diameter area; 11. 1U server.

Detailed ways

The device for preventing wrong parts on the memory slot disclosed by the utility model will be described in further detail below in conjunction with the accompanying drawings and embodiments.

The 1U high-configuration server cooling device disclosed by the utility model is arranged in the 1U high-configuration server to improve the heat dissipation effect. The top of the 1U high-configuration server is provided with a chassis cover 1, and the front part of the server is provided with a server fan 6 and a hard disk 5. The rear part is provided with a CPU radiator and a server IO interface 8 . The heat dissipation device includes two parts, one is located at the front and rear heat dissipation areas of the upper cover of the chassis, and the other is the wind guide cover 4 for variable diameter air ducts arranged inside the chassis. The heat dissipation area of the upper cover of the chassis is shown in Figure 1. The positions of the heat dissipation areas are: the front heat dissipation area 2 is located in front of the server fan 6 and behind the hard disk 5; the rear heat dissipation area 3 is located in front of the server IO interface 8 and behind the CPU radiator. The wind guide cover 4 is installed in the chassis as shown in Figure 1, the front end of the large-diameter area 9 is close to the server fan 6, and just corresponds to all server fans; the small-diameter area 10 only covers the CPU radiator part, and is for reducing Flow resistance in the area of small and large apertures The wind deflector is provided with a smooth top plate.

The size of the front heat dissipation area on the upper cover of the chassis needs to consider the flow resistance of the hard disk area. In order to avoid too little airflow in the hard disk area, there should not be too many heat dissipation holes at this position; the rear heat dissipation area should not be too far behind and should not be located on the IO interface. The top affects the air volume. The optimal design of the heat dissipation area of the upper cover of the chassis in the utility model is that the front and rear heat dissipation areas of the upper cover of the chassis include two heat dissipation strips, and the heat dissipation strips contain a plurality of heat dissipation holes, and the heat dissipation holes adopt a square, rectangular, circular or oval shape. Vents.

Using this 1U high-configuration server cooling device, the 1U server can dissipate heat through the heat dissipation areas at the front and rear of the chassis top cover, and at the same time, inside the chassis, the wind from the server fan is more efficiently directed to the rear CPU radiator through the air guide cover. Through the above design improvements made by this cooling device, the flow resistance of the 1U server is reduced, the cooling air volume is effectively increased, the fan speed is reduced, and the CPU specification supported by the 1U server is increased from 95W to 130W, which enhances the versatility of the product , enriching the choices of customers.

Except technical characterictic described in the utility model, be the known technology of those skilled in the art.

Claims (3)

1. 1U high-configuration server cooling device, its structure includes 1U server, the server fan and hard disk are arranged in the front of the 1U server, the CPU radiator and server IO interface are arranged in the rear, and the upper cover of the chassis is arranged on the top, which is characterized in that , the heat dissipation device also includes a heat dissipation area on the upper cover of the chassis and an air guide cover for variable-diameter air ducts arranged in the chassis, wherein the heat dissipation area of the upper cover includes a front heat dissipation area and a rear heat dissipation area, and the front heat dissipation area is set on the server In front of the fan and behind the hard disk, the rear heat dissipation area is set behind the CPU radiator in front of the server IO interface; the air guide cover is a cover structure arranged on the server motherboard, and the air guide cover is divided into a front large-diameter area and a rear small area In the diameter area, the front end of the large diameter area corresponds to all server fans, and the small diameter area only covers the CPU radiator. 2. The heat dissipation device according to claim 1, wherein the heat dissipation area of the upper cover of the chassis includes two heat dissipation strips, and the heat dissipation strips contain a plurality of heat dissipation holes, and the heat dissipation holes are square, rectangular, circular or Oval cooling holes. 3 . The heat dissipation device according to claim 1 , wherein the wind guide cover comprises a smooth top plate, and the large-diameter area and the small-diameter area smoothly transition through the smooth top plate. 4 .