CN203350800U - Computer radiating device - Google Patents
Computer radiating device Download PDFInfo
- Publication number
- CN203350800U CN203350800U CN 201320466409 CN201320466409U CN203350800U CN 203350800 U CN203350800 U CN 203350800U CN 201320466409 CN201320466409 CN 201320466409 CN 201320466409 U CN201320466409 U CN 201320466409U CN 203350800 U CN203350800 U CN 203350800U
- Authority
- CN
- China
- Prior art keywords
- water tank
- fan
- heat conduction
- conduction block
- fixedly connected
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 40
- 238000001816 cooling Methods 0.000 claims abstract description 18
- 238000007664 blowing Methods 0.000 claims abstract description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 239000000741 silica gel Substances 0.000 claims description 3
- 229910002027 silica gel Inorganic materials 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 abstract description 4
- 238000000034 method Methods 0.000 abstract description 4
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
一种计算机散热装置。本实用新型属于计算机科学技术领域。为解决目前计算机处理大型程序时,中央处理器温度急剧升高,散热量不足,当风扇故障时,没有缓冲时间给操作者快速保存重要信息的问题。导热块设置在机箱内部,导热块固定于中央处理器上,中央处理器设置在机箱内的底面上,导热块为倒置的圆台形状,导热块上表面固定有水箱,水箱侧壁的偏上位置与蒸汽排出管的一端固定连接,蒸汽排出管的另一端穿过机箱设置在机箱外部,水箱与蒸汽排出管相通,水箱侧壁上固定连接有散热片,散热片下端穿过水箱侧壁进入水箱内部,风扇固定连接于风扇固定架内部,风扇的吹风方向朝向散热片,风扇固定架与机箱内侧壁可拆卸连接,电机固定连接于风扇固定架内,电机驱动风扇转动。本实用新型用于计算机硬件的散热。
A computer cooling device. The utility model belongs to the technical field of computer science. In order to solve the problem that the temperature of the central processing unit rises sharply and the heat dissipation is insufficient when the computer processes large-scale programs, and when the fan fails, there is no buffer time for the operator to quickly save important information. The heat conduction block is arranged inside the chassis, the heat conduction block is fixed on the central processing unit, the central processing unit is arranged on the bottom surface of the case, the heat conduction block is in the shape of an inverted round table, the upper surface of the heat conduction block is fixed with a water tank, and the upper position of the side wall of the water tank One end of the steam discharge pipe is fixedly connected, and the other end of the steam discharge pipe passes through the case and is installed outside the case. The water tank communicates with the steam discharge pipe. The side wall of the water tank is fixedly connected with a heat sink, and the lower end of the heat sink passes through the side wall of the water tank and enters the water tank. Inside, the fan is fixedly connected to the inside of the fan holder, and the blowing direction of the fan faces the heat sink. The fan holder is detachably connected to the inner wall of the chassis, and the motor is fixedly connected to the fan holder, and the motor drives the fan to rotate. The utility model is used for heat dissipation of computer hardware.
Description
技术领域 technical field
本实用新型属于计算机科学技术领域,具体涉及一种计算机散热置。 The utility model belongs to the technical field of computer science, and in particular relates to a computer cooling device.
背景技术 Background technique
目前的计算机散热装置采用纯风冷技术,在计算机运行大型程序时,中央处理器温度会急剧升高,而此时纯风冷的散热方式散走热量的速度会跟不上中央处理器产生热量的速度,造成硬件寿命的加速损耗,而当风扇发生故障停转时,中央处理器很容易达到高温并且自动停止工作,这样就造成了没有一个给操作者快速保存重要信息的缓冲时间,易造成不必要的损失。 The current computer cooling device adopts pure air-cooling technology. When the computer is running a large program, the temperature of the central processing unit will rise sharply. At this time, the speed of the pure air-cooling heat dissipation method will not keep up with the heat generated by the central processing unit. The speed will cause accelerated loss of hardware life, and when the fan fails and stops, the CPU will easily reach high temperature and stop working automatically. This will result in no buffer time for the operator to quickly save important information, which will easily cause unnecessary loss.
发明内容 Contents of the invention
本实用新型提供一种计算机散热装置,为解决目前计算机处理大型程序时,中央处理器温度急剧升高,散热量不足,当风扇故障时,没有缓冲时间给操作者快速保存重要信息的问题。 The utility model provides a cooling device for a computer, in order to solve the problem that the temperature of the central processing unit rises sharply and the cooling capacity is insufficient when the computer processes large-scale programs, and when the fan fails, there is no buffer time for the operator to quickly save important information.
实现上述目的,本实用新型采取的技术方案如下: Realize above-mentioned purpose, the technical scheme that the utility model takes is as follows:
一种计算机散热装置,包括散热片、风扇、电机、风扇固定架、机箱、水箱、蒸汽排出管、导热块及中央处理器,导热块设置在机箱内部,导热块固定于中央处理器上,中央处理器设置在机箱内的底面上,导热块为倒置的圆台形状,导热块上表面固定有水箱,水箱侧壁的偏上位置与蒸汽排出管的一端固定连接,蒸汽排出管的另一端穿过机箱设置在机箱外部,水箱与蒸汽排出管相通,水箱侧壁上固定连接有散热片,散热片下端穿过水箱侧壁进入水箱内部,风扇固定连接于风扇固定架内部,风扇的吹风方向朝向散热片,风扇固定架与机箱内侧壁可拆卸连接,电机固定连接于风扇固定架内,电机驱动风扇转动。 A cooling device for a computer, comprising a cooling fin, a fan, a motor, a fan fixing frame, a case, a water tank, a steam discharge pipe, a heat conduction block and a central processing unit, the heat conduction block is arranged inside the case, the heat conduction block is fixed on the central processing unit, and the central processing unit The processor is arranged on the bottom surface of the chassis, the heat conduction block is in the shape of an inverted circular table, the upper surface of the heat conduction block is fixed with a water tank, the upper position of the side wall of the water tank is fixedly connected with one end of the steam discharge pipe, and the other end of the steam discharge pipe passes through The chassis is set outside the chassis, the water tank is connected to the steam discharge pipe, the side wall of the water tank is fixedly connected with a heat sink, the lower end of the heat sink passes through the side wall of the water tank and enters the inside of the water tank, the fan is fixedly connected to the inside of the fan fixing frame, and the blowing direction of the fan is towards the heat dissipation The fan fixing frame is detachably connected to the inner wall of the chassis, the motor is fixedly connected in the fan fixing frame, and the motor drives the fan to rotate.
导热块与水箱连接处以及散热片与水箱的连接处均通过耐热硅胶充填密封。 The connection between the heat conduction block and the water tank and the connection between the heat sink and the water tank are filled and sealed with heat-resistant silica gel.
本实用新型相对于现有技术的有益效果是:本实用新型由于有水箱,中央处理器在产热量急剧增加时,热量会通过导热块传导给水箱内的水,利用水的大比热容属性可以在短时间内容纳大量热量,从而起到了缓冲的作用,避免了中央处理器温度的瞬间增高,另外水中的热量传导给散热片,散热片良好的布局能更加充分地将热量散发至空气中。 Compared with the prior art, the beneficial effect of the utility model is that since the utility model has a water tank, when the heat output of the central processing unit increases sharply, the heat will be conducted to the water in the water tank through the heat conduction block, and the large specific heat capacity of the water can be used in the water tank. It can accommodate a large amount of heat in a short period of time, which acts as a buffer and avoids an instantaneous increase in the temperature of the CPU. In addition, the heat in the water is transferred to the heat sink. The good layout of the heat sink can more fully dissipate the heat into the air.
附图说明 Description of drawings
图1是本实用新型的一种计算机散热装置的主视图; Fig. 1 is the front view of a kind of computer cooling device of the present utility model;
图2是本实用新型的一种计算机散热装置的右视图; Fig. 2 is the right side view of a kind of computer cooling device of the present utility model;
图3是本实用新型的一种计算机散热装置的俯视图。 Fig. 3 is a top view of a computer cooling device of the present invention.
图中,散热片1、螺丝2、风扇3、电机5、风扇固定架6、机箱8、水箱9、蒸汽排出管10、导热块11、中央处理器12。
In the figure,
具体实施方式 Detailed ways
参见图1~图3说明,一种计算机散热装置,包括散热片1、风扇3、电机5、风扇固定架6、机箱8、水箱9、蒸汽排出管10、导热块11及中央处理器12,导热块11设置在机箱8内部,导热块11固定于中央处理器12上,中央处理器12设置在机箱8内的底面上,导热块11为倒置的圆台形状,导热块11上表面固定有水箱9,水箱9侧壁的偏上位置与蒸汽排出管10的一端固定连接,蒸汽排出管10的另一端穿过机箱8设置在机箱8外部,水箱9与蒸汽排出管10相通,水箱9侧壁上固定连接有散热片1,散热片1下端穿过水箱9侧壁进入水箱9内部,风扇3固定连接于风扇固定架6内部,风扇3的吹风方向朝向散热片1,风扇固定架6与机箱8内侧壁可拆卸连接,本实施方式中通过多个螺丝2将风扇固定架6连接固定在机箱8内侧壁上,电机5固定连接于风扇固定架6内,电机5驱动风扇3转动;导热块11与水箱9连接处以及散热片1与水箱9的连接处均通过耐热硅胶充填密封。
Referring to Figures 1 to 3, a computer cooling device includes a
Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320466409 CN203350800U (en) | 2013-08-01 | 2013-08-01 | Computer radiating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320466409 CN203350800U (en) | 2013-08-01 | 2013-08-01 | Computer radiating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203350800U true CN203350800U (en) | 2013-12-18 |
Family
ID=49750672
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320466409 Expired - Fee Related CN203350800U (en) | 2013-08-01 | 2013-08-01 | Computer radiating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203350800U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104216491A (en) * | 2014-09-23 | 2014-12-17 | 苏州云舒新材料科技有限公司 | Computer CPU (Central Processing Unit) raised heat radiation structure |
| CN106249829A (en) * | 2016-09-12 | 2016-12-21 | 芜湖能盟信息技术有限公司 | Computer cabinet radiator |
| CN107463217A (en) * | 2017-08-01 | 2017-12-12 | 合肥市漫通科技有限公司 | A kind of high efficiency main frame |
-
2013
- 2013-08-01 CN CN 201320466409 patent/CN203350800U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104216491A (en) * | 2014-09-23 | 2014-12-17 | 苏州云舒新材料科技有限公司 | Computer CPU (Central Processing Unit) raised heat radiation structure |
| CN104216491B (en) * | 2014-09-23 | 2017-08-25 | 青岛鸿润伟业散热科技有限公司 | A kind of raised radiator structure of computer CPU |
| CN106249829A (en) * | 2016-09-12 | 2016-12-21 | 芜湖能盟信息技术有限公司 | Computer cabinet radiator |
| CN107463217A (en) * | 2017-08-01 | 2017-12-12 | 合肥市漫通科技有限公司 | A kind of high efficiency main frame |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN204990176U (en) | Two coolings are from cooling down formula computer mainframe | |
| CN206726105U (en) | A kind of notebook computer hybrid heat sink | |
| CN205028233U (en) | Notebook computer water -cooling circulation heat abstractor | |
| CN203350800U (en) | Computer radiating device | |
| CN104898812B (en) | A kind of computer heat radiating device | |
| CN206249216U (en) | An electronic radiator | |
| CN209486605U (en) | A kind of high power consumption server temperature-uniforming plate module group radiator | |
| CN203276149U (en) | Multifunctional cooling pad of notebook computer | |
| CN204990152U (en) | Use cooling system on industry flat board / embedded computer | |
| CN206059322U (en) | A kind of heat abstractor of chopper | |
| CN204347737U (en) | A kind of computer radiator | |
| CN205302151U (en) | Computer heat dissipation and built -in temperature measuring system | |
| CN205105501U (en) | Temperature control equipment electric cabinet with outside heat abstractor | |
| CN210100823U (en) | A heat dissipation device for a silicone molding machine | |
| CN204695214U (en) | A kind of intelligent heat dissipation desktop computer mainframe box | |
| CN207397203U (en) | A kind of computer cabinet radiator structure | |
| CN201955722U (en) | Refrigeration type heat radiator for notebook computer | |
| CN220020229U (en) | Heat abstractor of computer processor | |
| CN207369511U (en) | A kind of liquid-gas phase transition cooling device | |
| CN204206716U (en) | Semiconductor refrigeration constant temperature control device | |
| CN104932643A (en) | Desktop computer mainframe box capable of dissipating heat intelligently | |
| CN211088314U (en) | A cooling device for LED chips | |
| CN202771362U (en) | Server cooling device | |
| CN202058087U (en) | Water-cooling head radiator for high-performance CPU | |
| CN202946456U (en) | Mine shaft ventilator |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20131218 Termination date: 20140801 |
|
| EXPY | Termination of patent right or utility model |
