CN203191512U - Device applied to testing organic thin-film field effect transistor - Google Patents

Device applied to testing organic thin-film field effect transistor Download PDF

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Publication number
CN203191512U
CN203191512U CN 201320197516 CN201320197516U CN203191512U CN 203191512 U CN203191512 U CN 203191512U CN 201320197516 CN201320197516 CN 201320197516 CN 201320197516 U CN201320197516 U CN 201320197516U CN 203191512 U CN203191512 U CN 203191512U
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CN
China
Prior art keywords
circuit board
test
printed circuit
probe
probes
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN 201320197516
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Chinese (zh)
Inventor
甘平
李奋展
童中华
吴立强
余欢
刘涛
刘冬翠
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Chongqing University
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Chongqing University
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Priority to CN 201320197516 priority Critical patent/CN203191512U/en
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Publication of CN203191512U publication Critical patent/CN203191512U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model relates to a device applied to testing an organic thin-film field effect transistor. The device comprises a printed circuit board and a supporting platform supporting a device being tested, wherein the printed circuit board comprises three sub-circuits which are a common source test circuit, a common drain test circuit and a common gate test circuit; at least one group of probe assemblies is welded on the inner side surface of the printed circuit board; each group of the probe assemblies comprises six probes which adopt an arrangement mode of '1+5 ', the distance between the supporting platform and the printed circuit board is adjusted through a screw or a bolt, thereby enabling the probe assemblies to be tightly contacted with the device being tested on the supporting platform. The device connects an input end of the circuit to a signal output end of a function type generator or a sweep generator according to requirement of the test content and connects an output end of the circuit to an oscilloscope, and test operations can be carried out. The device provided by the utility model has the characteristics of simple structure, low cost and easiness in manufacture, and is relatively high in precision and strong in applicability.

Description

Be applied to the device of organic film FET test
Technical field
The utility model relates to photoelectricity test equipment, is specifically related to a kind of multi-function device that is applied to the organic film FET test.
Background technology
At present the research majority for organic film FET lays particular emphasis on voltage-current characteristic, voltage-capacitance characteristic etc., and less for the research in the field of the amplitude versus frequency characte of the research of organic film FET.In the prior art, voltage-to-current for organic film FET, voltage-capacitance characteristics etc. are directly tested by the combination of semi-conductor test instrument and probe station usually, and comparatively advanced at present testing tool is the 4200scs semi-conductor test instrument of Keithley company.
Because the 4200scs semi-conductor test instrument is comparatively expensive, be not suitable for widely in the basic research work.In addition, at present semiconductor test instrument such as 4200scs can not directly be tested the amplitude versus frequency characte of organic film FET at present.
The utility model content
At the technology above shortcomings are arranged, the purpose of this utility model is to provide a kind of device of the amplitude versus frequency characte test for organic film FET simple in structure, lower-cost.
Realize above-mentioned purpose, the utility model adopts following technical scheme: a kind of device that is applied to the organic film FET test, it is characterized in that, and comprise P.e.c. and be used for supporting the brace table of the device of surveying;
Wherein, printed circuit board (PCB) comprises three electronic circuits, is respectively common source test circuit, common drain test circuit and common gate test circuit; Each electronic circuit all comprises an input end, an output terminal; Three electronic circuits share a VCC and GND, and VCC is 12V; The wiring of grid is one in the P.e.c., and source electrode and drain electrode are a plurality of, decides the electrode pin of selecting that group adjacent by wire jumper;
The medial surface of described printed circuit board (PCB) welds at least one group of probe assembly; Every group of probe assembly comprises 6 probes, and 6 probes are taked " 1+5 " arrangement mode, Yi Bian namely be 1 probe, is used for pricking the grid at measured device; Another side is 5 probes, is used for pricking at the test component that has a plurality of source electrodes and drain electrode; The needle point of 6 probes remains on same surface level.Afterbody and the circuit board of probe weld together, and realize wire jumper by the positive equipotential contact pin of circuit board, are connected with grid access point, source electrode access point, drain electrode access point in the circuit respectively.
Described brace table is that rectangular aluminum sheet is made, four jiaos of aluminium sheet for being equipped with screw, aluminium sheet links to each other with printed circuit board (PCB) by screw/bolt, and the spacing of regulating printed circuit board (PCB) and brace table by screw/bolt, and the realization probe assembly closely contacts with tested device on the brace table.
Further, it is that material is made that described probe adopts tungsten, and the hardness of tungsten pin is enough big, and the tip shape is made on the top easily, and the resistivity of tungsten material is low, little etc. to the influence of test.
Compared to existing technology, the utlity model has following advantage:
1, utility model has characteristics simple in structure, with low cost, that be easy to make.
2, utility model is used for the amplitude versus frequency characte of test organic film FET cooperating digital sweep generator to use, and precision is higher relatively, and application is strong.
Description of drawings
Fig. 1 is the structural representation that the utility model is used for the amplitude versus frequency characte proving installation of organic film FET;
Fig. 2 is the structural representation of printed circuit board (PCB) and probe assembly among Fig. 1;
Fig. 3 is the common source test circuit schematic diagram of printed circuit board (PCB) in the utility model;
Fig. 4 is the common drain test circuit schematic diagram of printed circuit board (PCB) in the utility model;
Fig. 5 is the common gate test circuit schematic diagram of printed circuit board (PCB) in the utility model.
Embodiment
As shown in Figure 1, a kind of multi-function device that is applied to the organic film FET test, comprise P.e.c. 1, be used for supporting the brace table 2 of the organic film FET of testing, P.e.c. 1 is provided with at least one group of probe assembly 3, be used for pricking the corresponding electrode at thin-film device, as the media that connects thin-film device electrode and test circuit.
Wherein, printed circuit board (PCB) 1 comprises three electronic circuits, is respectively " common source test circuit ", " common drain test circuit " and " common gate test circuit ".Each electronic circuit all comprises an input end, an output terminal.Three electronic circuits share a VCC and GND.Usually VCC's is set to 12V.The wiring of grid has only one in the circuit, and the selection of source electrode and drain electrode then decides the electrode pin of selecting that group adjacent by wire jumper.The concurrent working simultaneously of these three electronic circuits does not exert an influence mutually.Resistance in the schematic diagram, the value of electric capacity can be adjusted according to actual needs, and resistance, electric capacity all adopt high precision components (maximum error is per mille).
Referring to Fig. 2, weld probe assembly 3 on the printed circuit board (PCB) 1, every group comprises 6 probes, 6 probes are taked " 1+5 " arrangement mode, Yi Bian namely be 1 probe, another side is 5 probes; One end of 1 independent probe is used for the grid of correspondence (prick and exist) measured device; One end of 5 probes of another side is used for, and corresponding (bundle) has the test component of a plurality of source electrodes and drain electrode.The needle point of 6 probes remains on same surface level.Afterbody and the circuit board of probe weld together, and realize wire jumper by the positive equipotential contact pin of circuit board, are connected with grid access point, source electrode access point, drain electrode access point in the circuit respectively.
Spacing between the probe satisfies the typical sizes of the pin of present most of organic film FET.
(remarks: probe refers to the end with device contacts, namely pricks the end on device)
Referring to Fig. 1, brace table 2 is made by the rectangular aluminum sheet of a customization, four jiaos of aluminium sheet is four screw holes, aluminium sheet links to each other with printed circuit board (PCB) 1 by the screw of these four screw holes, and the spacing of regulating printed circuit board (PCB) and brace table by screw, thereby the realization probe closely contacts mutually with organic film FET to be tested on the brace table.
This device is according to the needs of content measurement, and the input end of circuit inserts function model generator or sweep generator signal output part etc., and circuit output end connects oscillograph.After input end and output terminal connected corresponding instrument, this device just can carry out test job.
Adopt the utility model to be applied to the multi-function device of organic film FET test, test is the method for the organic film FET of charge carrier with the hole, comprises the steps:
1, utilize this mutual conductance of multifunction system test organic film FET under the circuit of three kinds of configurations:
After being pressed in organic film FET to be measured under the probe, the VCC termination of this system is gone into 12V voltage, insert the different passages of high accuracy number function signal generators at three input ends of this system, parameters such as the amplitude Vin of corresponding AC-input voltage and frequency are set.Three output terminals connect three passages of high-precision digital oscilloscope respectively.Gate contact in the wire jumper connecting circuit is to the grid of device, and the source electrode in the wire jumper selection connecting circuit and the contact branch of drain electrode are clipped in source electrode to be measured and the drain electrode.Read output voltage amplitude Vou.The resistance of supposing the resistance of load is RL, then can calculate the mutual conductance Gm=vout/RL/Vin of organic film FET under the circuit of different configuration.
2, utilize this multi-function device test organic film FET in the amplitude versus frequency characte of three kinds of configurations:
After being pressed in organic film FET to be measured under the probe, go into 12V voltage in the VCC of this system termination, insert the signal output part of three different sweep generators at three input ends of this system, connect three of digital sweep generator independently output terminals respectively at three output terminals of this system.Gate contact in the wire jumper connecting circuit is to the grid of device, and the source electrode in the wire jumper selection connecting circuit and the contact branch of drain electrode are clipped in source electrode to be measured and the drain electrode.After setting the starting point of frequency sweeping, begin scanning.At the amplitude-versus-frequency curve that just can obtain organic film FET under three kinds of configurations on the screen of digital sweep generator.Thereby determine the cutoff frequency of organic film FET under three kinds of configurations, characteristic frequency.
Printed circuit board (PCB) after the wiring, the three saffron lines in the left side are three input lines, the line of three yellow in the right is three output lines.The black line meets VCC, and white wire meets GND.In medium blue be wire jumper, the wire jumper on right side is pegged graft and is represented to select different electrodes into the interface of different contact pins.
Need to prove at last, above embodiment is only in order to illustrate technical scheme of the present invention but not the restriction technologies scheme, those of ordinary skill in the art is to be understood that, those are made amendment to technical scheme of the present invention or are equal to replacement, and do not break away from aim and the scope of the technical program, all should be encompassed in the middle of the claim scope of the present invention.

Claims (2)

1. a device that is applied to organic film FET test is characterized in that, comprises P.e.c. and is used for supporting the brace table of the device of surveying;
Wherein, printed circuit board (PCB) comprises three electronic circuits, is respectively common source test circuit, common drain test circuit and common gate test circuit; Each electronic circuit all comprises an input end, an output terminal; Three electronic circuits share a VCC and GND, and VCC is 12V; The wiring of grid is one in the P.e.c., and source electrode and drain electrode are a plurality of, decides the electrode pin of selecting that group adjacent by wire jumper;
The medial surface of described printed circuit board (PCB) welds at least one group of probe assembly; Every group of probe assembly comprises 6 probes, and 6 probes are taked " 1+5 " arrangement mode, Yi Bian namely be 1 probe, is used for pricking the grid at measured device; Another side is 5 probes, is used for pricking at the test component that has a plurality of source electrodes and drain electrode; The needle point of 6 probes remains on same surface level;
Afterbody and the circuit board of probe weld together, and realize wire jumper by the positive equipotential contact pin of circuit board, are connected with grid access point, source electrode access point, drain electrode access point in the circuit respectively;
Described brace table is that rectangular aluminum sheet is made, four jiaos of aluminium sheet for being equipped with screw, aluminium sheet links to each other with printed circuit board (PCB) by screw/bolt, and the spacing of regulating printed circuit board (PCB) and brace table by screw/bolt, and the realization probe assembly closely contacts with tested device on the brace table.
2. according to the described multi-function device that is applied to the organic film FET test of claim 1, it is characterized in that it is that material is made that described probe adopts tungsten.
CN 201320197516 2013-04-18 2013-04-18 Device applied to testing organic thin-film field effect transistor Expired - Fee Related CN203191512U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201320197516 CN203191512U (en) 2013-04-18 2013-04-18 Device applied to testing organic thin-film field effect transistor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 201320197516 CN203191512U (en) 2013-04-18 2013-04-18 Device applied to testing organic thin-film field effect transistor

Publications (1)

Publication Number Publication Date
CN203191512U true CN203191512U (en) 2013-09-11

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Application Number Title Priority Date Filing Date
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107422242A (en) * 2016-05-23 2017-12-01 北大方正集团有限公司 The test device and method of a kind of VDMOS chip
CN110911299A (en) * 2019-11-29 2020-03-24 株洲长河电力机车科技有限公司 IGBT module frequency sweep test bench
CN110927550A (en) * 2019-11-29 2020-03-27 株洲长河电力机车科技有限公司 IGBT module frequency sweep test bench

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107422242A (en) * 2016-05-23 2017-12-01 北大方正集团有限公司 The test device and method of a kind of VDMOS chip
CN110911299A (en) * 2019-11-29 2020-03-24 株洲长河电力机车科技有限公司 IGBT module frequency sweep test bench
CN110927550A (en) * 2019-11-29 2020-03-27 株洲长河电力机车科技有限公司 IGBT module frequency sweep test bench

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GR01 Patent grant
C14 Grant of patent or utility model
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20130911

Termination date: 20140418

C17 Cessation of patent right