CN203085512U - Servo amplifier - Google Patents

Servo amplifier Download PDF

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Publication number
CN203085512U
CN203085512U CN2012207066970U CN201220706697U CN203085512U CN 203085512 U CN203085512 U CN 203085512U CN 2012207066970 U CN2012207066970 U CN 2012207066970U CN 201220706697 U CN201220706697 U CN 201220706697U CN 203085512 U CN203085512 U CN 203085512U
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CN
China
Prior art keywords
mentioned
fin
heat
conducting plate
plate
Prior art date
Application number
CN2012207066970U
Other languages
Chinese (zh)
Inventor
泷川宏
奥秋兼一
Original Assignee
发那科株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2012003103A priority Critical patent/JP5249434B2/en
Priority to JP2012-003103 priority
Application filed by 发那科株式会社 filed Critical 发那科株式会社
Application granted granted Critical
Publication of CN203085512U publication Critical patent/CN203085512U/en

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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209Heat transfer by conduction from internal heat source to heat radiating structure
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2215/00Fins
    • F28F2215/04Assemblies of fins having different features, e.g. with different fin densities
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

The utility model provides a servo amplifier which is provided with a heat radiator for radiating heat. The heat radiator for radiating heat is provided with the following components: a substrate board; a heat conduction board which is in thermal connection with the substrate board; a plurality of first heat radiating fins which extend from the substrate board; and a plurality of second heat radiating fins which extend from the heat conduction board. The first heat radiating fins are vertically equipped from a second main surface of the substrate board in a manner of extending along the vertical direction. The second heat radiating fins are vertically equipped in row in a manner of extending parallelly with the second main surface approximately from the areas on two surfaces of the heat conduction board, namely the area at the position which is larger than the height of the first radiating fins. The servo amplifier has the following advantages: high safety in high-temperature environment, high heat radiating performance, high reliability, and low total cost which comprises assembling cost.

Description

Servo amplifier
Technical field
The utility model relates to and possesses the servo amplifier that is used for heat transmission radiator that the heat that the inscape from power semiconductor etc. produces is dispelled the heat.
Background technology
Usually, in servo amplifier, be accompanied by its high outputization, the caloric value of the power semiconductor that uses in the next comfortable servo amplifier etc. increases.Therefore, in the servo amplifier of height output, carried out: install and be used for the heat that will produce radiator, strengthen the surface area of the radiating surface of this radiator, improve radiating efficiency to the outside heat radiation as inferior trial.
For example, in the servo amplifier as Fig. 7 simplified schematic illustration 1, the heat transmission radiator 3 with big volume is installed on servo amplifier main body 2, and is used fan 4 in order to increase from the heat radiation power of radiator 3.In addition,, generally carry out following configuration: dispose a plurality of thin fin 5 and increase its number with thin space, and increase the height (in Fig. 7, being left and right directions length) of each fin 5 in order in limited volume, to guarantee the cooling surface area of wide expansion.But in the structure of existing radiator shown in Figure 7, if each fin 5 attenuation uprises, then heat is difficult to be delivered to the end of fin 5, and so-called fin efficiency reduces, so the effect that the surface area that can't fully obtain increasing fin of becoming brings.
In order to prevent the reduction of this fin efficiency, for example Japanese kokai publication hei 3-96258 communique has been put down in writing following thermal conductance chimney cooler, and this thermal conductance chimney cooler comprises: have the evaporation part at the back side that is installed in parent plate and from the heat pipe of the condensation part that the parent plate bending erects; And many fin that are provided with across with the condenser of heat pipe.
In addition, TOHKEMY 2001-196511 communique has been put down in writing following radiator: heat transfer part is made the pillar of column structure, improve the thermal diffusion effect from heater, and set pin shape fin in the side of pillar, thereby realize guaranteeing area of dissipation.
Though the radiator of Japanese kokai publication hei 3-96258 communique record is considered to heat dissipation characteristics (cooling performance) height, but assembly cost height, in addition, be considered to: because at high temperature long-term use and performance that might this heat pipe reduces because of the non-condensing gas of emitting in heat pipe.In addition, in the radiator that has used heat pipe, only carry out hot linked occasion, can not carry out heat radiation effectively from the periphery of parent plate at the middle body of parent plate at this heat pipe.
In addition, the radiator of TOHKEMY 2001-196511 communique record is so-called tower heat sink, can be interpreted as: effectively reduce with the temperature at the position of the heater of pillar 2 butts, but compare with the size of radiator, little with the area of the leg portion of heater butt.Therefore, in the big occasion of the specification of heater, the leg portion of radiator only with a part of butt of this heater, the problem that the temperature that the periphery of this heater might take place can not fully reduce etc.Perhaps, need to use the radiator bigger than this heater.
Therefore, the servo amplifier of following radiator has been used in expectation exploitation, and promptly this radiator does not use assembly cost high and at high temperature use heater that the heat pipe that leaves worry etc. can also corresponding can't realize in common tower heat sink, can realize and use the equal or heat dissipation characteristics more than it of radiator of heat pipe etc.
The utility model content
So, the scheme that the utility model proposes in view of the above problems, purpose is to provide the servo amplifier that has used following radiator, and promptly this radiator also can relieved use under hot environment and such large-scale high heating semiconductor device such as power semiconductor can be remained low temperature equably and have high heat dispersion and high reliability and to comprise assembly cost etc. low at interior cost.
For achieving the above object, the utility model provides a kind of servo amplifier (24), possesses heat transmission radiator (10), wherein, above-mentioned heat transmission radiator (10) possesses: parent plate (12), and it possesses as first interarea (20) that plays a role with the heating surface of heater thermo-contact, and as second interarea (22) at the back side of this first interarea (20); Heat-conducting plate (14), its on the line of the substantial middle of above-mentioned second interarea (22) by above-mentioned parent plate (12), from the end to end of above-mentioned second interarea to erect setting in the upwardly extending mode in side vertical with above-mentioned second interarea; A plurality of first fin (16), it is in the zone except the setting setting area of above-mentioned heat-conducting plate (14) of above-mentioned second interarea (22), with parallel with above-mentioned heat-conducting plate and in the upwardly extending mode in side vertical with above-mentioned second interarea, erect setting at interval with first fin, the above-mentioned heat-conducting plate of aspect ratio is low; And a plurality of second fin (18), it is from each face of being positioned at of above-mentioned heat-conducting plate (14) position higher than the summit of above-mentioned first fin (16), with the parallel and vertical all directions of above-mentioned second interarea (22) with each face of above-mentioned heat-conducting plate on, erect setting at interval and to extend to second fin in the mode of the bearing of trend of second fin position identical with the periphery of above-mentioned second interarea.
Scheme 2 is according to scheme 1 described servo amplifier, and wherein, material, fin thickness, the fin height of above-mentioned first fin (16) and above-mentioned second fin (18) are identical, and first fin is identical at interval with second fin at interval.
Scheme 3 is according to scheme 1 or 2 described servo amplifiers, and wherein, above-mentioned heat-conducting plate (14) is copper coin or copper alloy plate, and the part of above-mentioned at least heat-conducting plate connects above-mentioned parent plate (12) and exposes at above-mentioned heating surface.
Scheme 4 is according to scheme 1~3 each described servo amplifier, wherein, at least a portion of above-mentioned first fin (16) and above-mentioned second fin (18) is chimeric with at least one side's who is formed at above-mentioned parent plate (12) and above-mentioned heat-conducting plate (14) groove, and utilizes riveted joint, solder, solder brazing or melting welding to fix.
Scheme 5 is according to scheme 1~4 each described servo amplifier, wherein, above-mentioned heat-conducting plate (14) is by constituting in upper portion (14a) and the lower portion (14b) that can cut apart with the position of the roughly the same height in summit of above-mentioned first fin (16), be provided with above-mentioned second fin (18) at above-mentioned upper portion, on the parent plate (12) that is connected with above-mentioned lower portion, be provided with above-mentioned first fin (16).
Thereby above-mentioned or other purposes, feature and advantage of the present utility model describe following preferential execution mode by the reference accompanying drawing and become clearer and more definite.
Description of drawings
Fig. 1 is the stereoscopic figure of structure of the heat transmission radiator of expression first execution mode of the present utility model.
Fig. 2 is the summary cutaway view of the heat transmission radiator of Fig. 1.
Fig. 3 is the stereoscopic figure that the state in the conduit that has connected fan is located at the heat transmission radiator of Fig. 1 in expression.
Fig. 4 is the summary cutaway view of the heat transmission radiator of second execution mode of the present utility model.
Fig. 5 is the summary cutaway view of the heat transmission radiator of the 3rd execution mode of the present utility model.
Fig. 6 is the installation diagram that is obtained by skin mode figure of the heat transmission radiator of the 4th execution mode of the present utility model.
Fig. 7 is the summary stereogram that expression is installed in the heat transmission radiator of prior art the example on the servo amplifier.
Embodiment
Fig. 1 is the stereoscopic figure of basic structure of the heat transmission radiator 10 used of servo amplifier of expression first execution mode of the present utility model.Fig. 2 be along with the summary cutaway view of the heat transmission radiator 10 of parallel plane of X-Z shown in Figure 1.Radiator 10 has: parent plate 12; With parent plate 12 hot linked heat-conducting plates 14; A plurality of first fin 16 from parent plate 12 extensions; And, all the plate-shaped member of the essentially rectangular that constitutes by thermally conductive materials in the execution mode of Fig. 1 from a plurality of second fin 18 that heat-conducting plate 14 extends.In detail, parent plate 12 has first interarea 20 that plays a role as the heating surface with the heater thermo-contact of servo amplifier main body etc. and as second interarea 22 at the back side of first interarea 20, in illustrative example, arbitrary interarea all extends abreast with X-Y plane.Heat-conducting plate 14 is along substantial middle (for example center of gravity) by second interarea and the straight line that extends from the end to end of second interarea 22 (illustrated example along the Y direction), and erects and be arranged on the parent plate 12 along extending ground with the direction (being the Z direction among Fig. 1) of second interarea, 22 approximate vertical.
As shown in Figure 2, each first fin 16 is in the roughly whole zone except the zone that connects heat-conducting plate 14 of second interarea 22, with be provided with in setting with heat-conducting plate 14 direction (Z direction) almost parallel and with the upwardly extending mode in side of second interarea, 22 approximate vertical, with predefined first fin S at interval 1With the direction (being the Z direction among Fig. 1) of the face approximate vertical of heat-conducting plate 14 on erect side by side and be provided with.In the present embodiment, the thickness setting with each first fin 16 is t 1, height (Z direction length) is set at h 1In addition, the height h of first fin 16 1Height than heat-conducting plate 14 is little.
On the other hand, each second fin 18 zone from the two sides of heat-conducting plate 14 promptly, separate height h than first fin 16 apart from second interarea 22 of parent plate 12 in the Z direction 1The zone of big distance is in the mode of extending with second interarea, 22 almost parallels (in Fig. 1 along directions X), with predefined second fin S at interval 2Setting at heat-conducting plate 14 is provided with setting setting side by side on the direction (being the Z direction in Fig. 1).In the present embodiment, the thickness setting with each second fin 18 is t 2, height (directions X length) is set at h 2In addition, the height h of second fin 18 2As shown in the figure, extend near the mode the roughly periphery of second interarea 22 with second fin 18, in other words, extend to the mode of roughly the same directions X position, the end of the parent plate 12 that extends in the Y direction with second fin 18 and to set.
Fig. 3 is the stereoscopic figure that heat transmission radiator 10 shown in Figure 1 is applied to servo amplifier 24 occasions of simplified schematic illustration.Servo amplifier 24 possesses power semiconductor (not shown), and radiator 10 is used for the heat that is produced by this power semiconductor is dispelled the heat.Heat transmission radiator 10 forms guide-tube structure by housing 26 coverings of the tubular of both ends open, thereby can make air between each of first fin 16 and the both sides between each of second fin 18 flow (in illustrated example, being the Y direction), near an openend of housing 26 or its, be provided with cooling fan 28.By making cooling fan 28 work, use direction airflow flowing shown in the arrow among Fig. 3 thereby be created in, this air-flow is captured heat in the Surface runoff of fin from fin surface, reduces the temperature of fin.Thus, the heat as the servo amplifier 24 of heater flow into fin via parent plate 12 or heat-conducting plate 14.
Usually, if the height of fin uprises, then the root from fin becomes big near the thermal resistance the front end of fin, thereby thermal change must be difficult to be delivered near the end of fin.Therefore, even increase the surface area that the height of fin increases fin, from the also less increase of heat dissipation capacity (being that fin efficiency reduces) of fin.But, in the first embodiment, because must be lower with the height setting of first fin 16, specifically set lowlyer, thereby can keep fin efficiency higher than heat-conducting plate 14.But, from the heat dissipation capacity of fin and fin surface is long-pending and fin efficiency long-pending proportional, thereby only in first fin, the heat dissipation capacity minimizing.
So, in the utility model, vertical and erect by the substantial middle of parent plate 12 and from the end to end of parent plate 12 abreast with first fin 16 and to be provided with the heat-conducting plate 14 higher from parent plate 12 than the height of first fin 16, on the two sides of the heat-conducting plate 14 that is positioned at the position higher, be provided with second fin 18 of the roughly periphery that extends to parent plate 12 abreast with parent plate 12 than the top of first fin 16.The heat-conducting plate 14 that second fin 18 and thermal conductivity are high is connected, and the height of second fin 18 is equated or below it with first fin 16, thereby can access high fin efficiency.Like this, the surface area of radiator integral (summation of first fin 16 and the surface area of second fin 18) can not become big with existing comparing, and just can be improved from the radiator of the radiating efficiency of fin.
First fin 16 is erect setting at the whole regional of second interarea 22 of parent plate 12, thereby can also fully be carried out near the heat radiation the circumference of parent plate 12 except the setting setting area of heat-conducting plate 14.Therefore, even large-scale heater is installed on the heating surface, also be difficult to take place the problem that the temperature of the circumference of this heater rises and so on than other parts.In addition, because the middle body of the large-scale heater that typical temperature rises easily dispels the heat via heat-conducting plate 14 usefulness second heating panel 18, thereby the rising of temperature is suppressed.The problem that its result, the excessive temperature that can prevent the part of large-scale heater rise and so on.Have again,,, thereby can realize the heat transmission radiator of high-performance and high reliability with low cost then owing to can obtain not having the heat-conducting plate of performance degradation with low cost if make heat-conducting plate 14 by the metallic plate of integral body.
Have again, in Fig. 2, expect that first fin 16 is identical with the material of second fin 18, and, the fin thickness t of first fin 1Fin thickness t with second fin 2Equate the fin height h of first fin 1Fin height h with second fin 2Equate, and first fin interval s 1With second fin interval s 2Equate.Like this, if the material of fin, fin thickness, fin height equate that then the heat conduction condition in each fin is much the same, can more effectively dispel the heat.If it is biased that the flow velocity of cooling air produces sheet, then can't efficiently radiates heat in certain fin, the problem of whole heat dissipation characteristics reduction and so on may take place, if but fin is equated at interval, becoming in the flow velocity of the cooling air that is obtained by cooling fan that then flows between fin, it is biased to be difficult to produce, and can make the fin efficiency of each fin roughly certain.
Fig. 4 represents second execution mode of the heat transmission radiator that servo amplifier of the present utility model is used.In second execution mode, heat-conducting plate 14 is copper coin or copper alloy plate, and the part of heat-conducting plate (being bottom 30 in illustrated example) connects parent plate 12 at least, and exposes at heating surface (first interarea 20).By by thermal conductivity high copper or copper alloy made heat-conducting plate 14, thereby the rising of weight or cost can be suppressed to Min., and the thermal resistance between second fin 18 and the heating surface reduces, can more effective heat radiation of carrying out from second fin 18, improve the heat dissipation characteristics of radiator.In addition,, thereby flow directly into heat-conducting plate 14, further dispel the heat effectively from the heat of the heater of servo amplifier etc. because heat-conducting plate 14 connects parent plates 12, and exposes at heating surface.On the other hand, as the material of parent plate 12,, can use aluminum or aluminum alloy, but can also use copper or copper alloy in the same manner with heat-conducting plate 14 in order to realize the lightweight of radiator.
Fig. 5 represents the 3rd execution mode of the heat transmission radiator that servo amplifier of the present utility model is used.At least a portion of first fin 16 and second fin 18 is chimeric with at least one side's who is formed at parent plate 12 and heat-conducting plate 14 groove, and utilizes riveted joint, solder, solder brazing or melting welding to fix.Have, in illustrated example, first fin 16 is entrenched in the groove 32 that is formed on the parent plate 12 again, and second fin 18 is entrenched in the groove 34 that is formed on the heat-conducting plate 14.In the 3rd execution mode, if occasion fin and parent plate or heat-conducting plate is integrally manufactured with utilizing the extrusion molding that obtained by mould is compared, then can easily be manufactured on and make the fin of difficult high tongue in the extrusion molding that obtains by mould, can obtain high heat dissipation characteristics than (=fin height/fin interval).In addition, if the 3rd execution mode with compare with the cutting occasion that fin and parent plate or heat-conducting plate is integrally manufactured, then have the advantage that suppresses manufacturing cost lower.Have again,, thereby also have it is selected best material respectively, improve heat dissipation characteristics, realize the advantage of lightweight, cost degradation because fin, parent plate and heat-conducting plate can be respectively by different material.
Have again, in first~the 3rd execution mode,,, can also in heat-conducting plate, imbed (not shown) such as high heat pipe of thermal conductivity or carbon fibres in order to obtain higher thermal conductivity though heat-conducting plate is recited as simple metallic plate.
In addition, in first~the 3rd execution mode, though heat-conducting plate 14 is recited as one plate in fact, even but arbitrary execution mode, to form or the fixing difficulty in the manufacturing of two groups of fin of quadrature in order relaxing, as shown in Figure 6, radiator 10 can be divided into two parts.Specifically, heat-conducting plate 14 is being divided into upper portion 14a and lower portion 14b with the position of the summit height about equally of first fin 16 (from the height that equates with this summit to than the position the low position of second fin of below), can implement direction at upper portion 14a and other and be uniformly set second fin 18, can with parent plate 12 that lower portion 14b is connected on be uniformly set first fin 16 with other execution modes.Like this, the heat transmission radiator is being divided into the formation of carrying out fin under the two-part state respectively up and down or is fixing, then, enough screw 36 secure components such as grade of energy are in conjunction with the upper portion 14a and the lower portion 14b of heat-conducting plate.
According to the utility model, because the aspect ratio heat-conducting plate of first fin is low, so because heat is difficult to be delivered to fully cooling fin front end, thereby can prevent the reduction of fin effect (=effectively the surface area of the surface area/geometric fin of fin), on the other hand, can second fin that erect setting from heat-conducting plate be set in the space that does not have first fin of leaving parent plate.Its result can suppress the height of fin, and can not reduce the summation of the surface area of entire heat dissipation sheet, and can keep each fin efficiency of first fin and second fin than the highland, as a result of, improves the heat dissipation characteristics of radiator.Especially, owing to utilize first fin to reduce near the temperature of circumference of parent plate, utilize and erect near the temperature of central authorities that second fin that is arranged on heat-conducting plate reduces parent plate, even thereby do not use radiator to move with the same operating principle of heat pipe, also can cool off the such large-scale heater of power semiconductor that in servo amplifier, uses equably.
By in first fin and second fin, making fin thickness and fin height identical, thereby the heat conduction condition in each fin can be roughly the same, in addition, by fin is equated at interval, thereby because the flow velocity of the cooling air that is obtained by cooling fan that flows between fin is difficult to produce biased, thereby can make the fin efficiency of each fin roughly even in radiator, can realize more effective heat radiation.
In addition, making heat-conducting plate is copper or copper alloy plate, and, make the part of heat-conducting plate connect parent plate and expose at heating surface, thereby the weight of fin or the rising of cost can be suppressed to Min., and reduce the thermal resistance between second fin and the heating surface, can more effectively carry out heat radiation from second fin.Especially, if heat-conducting plate connects parent plate and exposes at heating surface,, thereby can more effectively dispel the heat then owing to the heat from heater flows directly into heat-conducting plate.
By at least a portion of first fin and second fin is chimeric with a side who is formed at parent plate and heat-conducting plate or both sides' groove, and fix with riveted joint, solder, solder brazing or melting welding, if thereby occasion fin and parent plate or heat-conducting plate is integrally manufactured with utilizing extrusion molding or cutting is compared, the tongue that then can improve each fin improved heat dissipation characteristics and can suppress manufacturing cost lower than (=fin height/fin at interval).Have again, can select best material respectively, can realize raising, lightweight, the cost degradation of heat dissipation characteristics fin, parent plate and heat-conducting plate.
By heat-conducting plate being made the structure that can cut apart up and down near the summit of first fin, thereby the manufacturing of radiator becomes and is more prone to.

Claims (7)

1. a servo amplifier (24) possesses heat transmission radiator (10), it is characterized in that,
Above-mentioned heat transmission radiator (10) possesses:
Parent plate (12), it possesses as first interarea (20) that plays a role with the heating surface of heater thermo-contact, and as second interarea (22) at the back side of this first interarea (20);
Heat-conducting plate (14), its on the line of the substantial middle of above-mentioned second interarea (22) by above-mentioned parent plate (12), from the end to end of above-mentioned second interarea to erect setting in the upwardly extending mode in side vertical with above-mentioned second interarea;
A plurality of first fin (16), it is in the zone except the setting setting area of above-mentioned heat-conducting plate (14) of above-mentioned second interarea (22), with parallel with above-mentioned heat-conducting plate and in the upwardly extending mode in side vertical with above-mentioned second interarea, erect setting at interval with first fin, the above-mentioned heat-conducting plate of aspect ratio is low; And
A plurality of second fin (18), it is from each face of being positioned at of above-mentioned heat-conducting plate (14) position higher than the summit of above-mentioned first fin (16), with the parallel and vertical all directions of above-mentioned second interarea (22) with each face of above-mentioned heat-conducting plate on, erect setting at interval and to extend to second fin in the mode of the bearing of trend of second fin position identical with the periphery of above-mentioned second interarea.
2. servo amplifier according to claim 1 is characterized in that,
Material, fin thickness, the fin height of above-mentioned first fin (16) and above-mentioned second fin (18) are identical, and first fin is identical at interval with second fin at interval.
3. servo amplifier according to claim 1 is characterized in that,
Above-mentioned heat-conducting plate (14) is copper coin or copper alloy plate, and the part of above-mentioned at least heat-conducting plate connects above-mentioned parent plate (12) and exposes at above-mentioned heating surface.
4. servo amplifier according to claim 2 is characterized in that,
Above-mentioned heat-conducting plate (14) is copper coin or copper alloy plate, and the part of above-mentioned at least heat-conducting plate connects above-mentioned parent plate (12) and exposes at above-mentioned heating surface.
5. according to each described servo amplifier of claim 1~4, it is characterized in that,
At least a portion of above-mentioned first fin (16) and above-mentioned second fin (18) is chimeric with at least one side's who is formed at above-mentioned parent plate (12) and above-mentioned heat-conducting plate (14) groove, and utilizes riveted joint, solder, solder brazing or melting welding to fix.
6. according to each described servo amplifier of claim 1~4, it is characterized in that,
Above-mentioned heat-conducting plate (14) is by constituting in upper portion (14a) and the lower portion (14b) that can cut apart with the position of the roughly the same height in summit of above-mentioned first fin (16), be provided with above-mentioned second fin (18) at above-mentioned upper portion, on the parent plate (12) that is connected with above-mentioned lower portion, be provided with above-mentioned first fin (16).
7. servo amplifier according to claim 5 is characterized in that,
Above-mentioned heat-conducting plate (14) is by constituting in upper portion (14a) and the lower portion (14b) that can cut apart with the position of the roughly the same height in summit of above-mentioned first fin (16), be provided with above-mentioned second fin (18) at above-mentioned upper portion, on the parent plate (12) that is connected with above-mentioned lower portion, be provided with above-mentioned first fin (16).
CN2012207066970U 2012-01-11 2012-12-19 Servo amplifier CN203085512U (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2012003103A JP5249434B2 (en) 2012-01-11 2012-01-11 Servo amplifier with heat sink for heat dissipation having two sets of heat dissipation fins orthogonal to each other
JP2012-003103 2012-01-11

Publications (1)

Publication Number Publication Date
CN203085512U true CN203085512U (en) 2013-07-24

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US (1) US20130175021A1 (en)
JP (1) JP5249434B2 (en)
CN (2) CN203085512U (en)
DE (1) DE102013000223A1 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9377828B2 (en) * 2013-08-12 2016-06-28 Dell Products L.P. Adjustable heat sink supporting multiple platforms and system configurations
US20150257249A1 (en) * 2014-03-08 2015-09-10 Gerald Ho Kim Heat Sink With Protrusions On Multiple Sides Thereof And Apparatus Using The Same
JP2017098274A (en) * 2014-03-27 2017-06-01 三菱電機株式会社 Heat sink device
US10692798B2 (en) * 2014-04-10 2020-06-23 Advanced Thermal Solutions, Inc. Multiple flow entrance heat sink
CN104602500A (en) * 2015-01-30 2015-05-06 周玉翔 Temperature visible double-layered heat radiation sheet
JP6126149B2 (en) * 2015-02-26 2017-05-10 ファナック株式会社 Air-cooled laser apparatus provided with a heat conducting member having a radiation fin
JP6062516B1 (en) * 2015-09-18 2017-01-18 古河電気工業株式会社 heatsink
US20180023895A1 (en) * 2016-07-22 2018-01-25 Trane International Inc. Enhanced Tubular Heat Exchanger
EP3510635A1 (en) * 2016-09-21 2019-07-17 Huawei Technologies Co., Ltd. Heatsink
US20180106500A1 (en) * 2016-10-18 2018-04-19 Trane International Inc. Enhanced Tubular Heat Exchanger
US20180192545A1 (en) * 2017-01-03 2018-07-05 Quanta Computer Inc. Heat dissipation apparatus
US20210051815A1 (en) * 2018-02-02 2021-02-18 Telefonaktiebolaget Lm Ericsson (Publ) Cooling device for dissipating heat from an object

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6138237Y2 (en) * 1978-11-17 1986-11-05
JPH054309Y2 (en) * 1984-07-26 1993-02-02
JP2685918B2 (en) 1989-09-08 1997-12-08 古河電気工業株式会社 Heat pipe cooler
US5542176A (en) * 1992-09-21 1996-08-06 Hideaki Serizawa Radiation plate and method of producing the same
JP3431004B2 (en) 2000-01-14 2003-07-28 松下電器産業株式会社 Heat sink and cooling device using the same
JP2006013296A (en) * 2004-06-29 2006-01-12 Fuji Electric Holdings Co Ltd Cooler for semiconductor element
US6945319B1 (en) * 2004-09-10 2005-09-20 Datech Technology Co., Ltd. Symmetrical heat sink module with a heat pipe for spreading of heat
CN100543972C (en) * 2005-08-08 2009-09-23 富准精密工业(深圳)有限公司 Heat-pipe radiating apparatus
US7690418B2 (en) * 2005-12-28 2010-04-06 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat sink
JP2007180453A (en) * 2005-12-28 2007-07-12 Nippon Densan Corp Heat sink cooling device
WO2007142023A1 (en) * 2006-06-02 2007-12-13 Kabushiki Kaisha Yaskawa Denki Motor controller
JP2009225497A (en) * 2008-03-13 2009-10-01 Fanuc Ltd Servo amplifier having power regenerating function

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US20130175021A1 (en) 2013-07-11
DE102013000223A1 (en) 2013-12-05

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