CN202964945U - Glass plate deguming jig for cutting solar silicon wafer - Google Patents
Glass plate deguming jig for cutting solar silicon wafer Download PDFInfo
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- CN202964945U CN202964945U CN 201220750605 CN201220750605U CN202964945U CN 202964945 U CN202964945 U CN 202964945U CN 201220750605 CN201220750605 CN 201220750605 CN 201220750605 U CN201220750605 U CN 201220750605U CN 202964945 U CN202964945 U CN 202964945U
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- glass plate
- deguming
- tool body
- cutting
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Abstract
The utility model belongs to the technical field of cutting of solar silicon wafers and particularly relates to a glass plate deguming jig for cutting a solar silicon wafer. The glass plate deguming jig for cutting the solar silicon wafer comprises a jig body which is a rectangle plate. A handle is arranged at a first end of the jig body, and a second end of the jig body is bent towards one side of the jig body. A deguming plate is arranged at the second end of the jig body and of a wedge shape, one end of the deguming plate is fixedly connected with the jig body, and a gap is arranged in the middle of one end, away from the jig body, of the deguming plate. When the glass plate deguming jig is used, an operator holds the handle by a hand, a glass plate is separated from a metal plate by the deguming plate, and the gap on the deguming plate can conveniently turn over the glass plate so that a whole glass plate is separated from the metal plate in a prizing mode. The glass plate deguming jig for cutting the solar silicon wafer avoids that the hand is directly contacted with the glass plate and the metal plate, and solves the problems that scalding is caused by high-temperature braking in the process of deguming of the glass plate, cutting damage is caused by broken glass fragments, gloves are cumbersome to operate, and time and labor are wasted.
Description
Technical field
The utility model belongs to solar silicon wafers cutting technique field, relates in particular to a kind of solar silicon wafers cutting with the glass plate tool that comes unstuck.
Background technology
In the solar silicon wafers cutting process, the metallic plate of bonding silicon rod is reusable edible.During cutting, first metallic plate is cleaned out and be coated with gluing, the glass plate station is received on metallic plate, and then being coated with gluing on glass plate, the silicon rod of needs cutting is bonded on glass plate.Because metallic plate can recycle, cut complete after, the glass plate that must will be bonded at above metallic plate is removed, and toasts so the whole piece silicon rod is put into baking oven, makes gum softening, then the glass plate on metallic plate is split away off.
The operating personnel wears the gloves operation usually at present, and mainly there is following shortcoming in this operating type:
1) the glass plate glass fragment that comes unstuck and have high-temperature baking, break in process during operating personnel's operation, is easily scalded, incised wound;
2) the glass plate process of coming unstuck, the operating personnel wears gloves, and operation is heavy, underaction, wastes time and energy, and per capita benefit is descended.
The utility model content
The purpose of this utility model is to provide the cutting of a kind of solar silicon wafers with the glass plate tool that comes unstuck, be intended to solve glass plate comes unstuck high-temperature baking causes in process scald, the glass fragment that breaks causes incised wound, to wear the gloves operation heavy, the problem that wastes time and energy.
The utility model is to realize like this, the cutting of a kind of solar silicon wafers is with the glass plate tool that comes unstuck, the cutting of described solar silicon wafers comprises the tool body with the glass plate tool that comes unstuck, described tool body is rectangular slab, described tool body first end is provided with handle, and the second end of described tool body bends towards a side of described tool body; And the plate that comes unstuck that is arranged on described tool body the second end, the described plate that comes unstuck is made as wedge shape, and an end of the described plate that comes unstuck is fixedly connected with described tool body, and the described plate that comes unstuck is provided with breach away from the middle part of an end of described tool body.
As a kind of improvement, described breach is made as U-shaped.
As a kind of improvement, described plate and the described tool body of coming unstuck is split-type structural; The described plate that comes unstuck is provided with groove with the end that described tool body the second end is connected an end, and the cell wall of described groove is provided with the groove through hole of vertical channel wall; The end of described tool body the second end is provided with fin, and described fin is provided with the fin through hole of vertical fin face; Be connected with bolt between described groove through hole and described fin through hole.
The cutting of solar silicon wafers that the utility model provides comprises the tool body with the glass plate tool that comes unstuck, and described tool body is rectangular slab, and described tool body first end is provided with handle, and the second end of described tool body bends towards a side of described tool body; And the plate that comes unstuck that is arranged on described tool body the second end, the described plate that comes unstuck is made as wedge shape, and an end of the described plate that comes unstuck is fixedly connected with described tool body, and the described plate that comes unstuck is provided with breach away from the middle part of an end of described tool body; When this tool uses, the operating personnel holds handle, plate breaks away from glass plate from metallic plate with coming unstuck, glass plate is prized the monolithic glass plate from metallic plate thereby the breach on the plate that comes unstuck can overturn easily, avoid the direct contact glass plate of staff and metallic plate, solved glass plate comes unstuck high-temperature baking causes in process scald, the glass fragment that breaks causes incised wound, to wear the gloves operation heavy, the problem that wastes time and energy.
Description of drawings
Fig. 1 is the solar silicon wafers cutting that provides of the utility model the first embodiment with the come unstuck perspective view of tool of glass plate;
Fig. 2 is the solar silicon wafers cutting that provides of the utility model the second embodiment with the come unstuck perspective view of tool of glass plate;
Fig. 3 is the solar silicon wafers cutting that provides of the utility model the second embodiment with glass plate come unstuck the tool body of tool and the perspective view of handle;
Fig. 4 is the solar silicon wafers cutting that provides of the utility model the second embodiment with the come unstuck perspective view of the plate that comes unstuck of tool of glass plate;
Wherein, 1, the tool body, 11, fin, 12, the fin through hole, 2, handle, 3, the plate that comes unstuck, 31, groove, 32, the groove through hole, 4, connector.
The specific embodiment
In order to make the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein only in order to explaining the utility model, and be not used in restriction the utility model.
Fig. 1 shows solar silicon wafers cutting that the utility model the first embodiment provides with the come unstuck perspective view of tool of glass plate, the cutting of this solar silicon wafers comprises tool body 1 with the glass plate tool that comes unstuck, this tool body 1 is rectangular slab, the first end of this tool body 1 is provided with handle 2, and the second end of this tool body 1 bends towards a side of tool body 1; And the plate 3 that comes unstuck that is arranged on this tool body 1 second end, this plate 3 that comes unstuck is made as wedge shape, and the one end is fixedly connected with tool body 1, and this plate 3 that comes unstuck is provided with breach away from the middle part of an end of tool body 1, and in the present embodiment, this breach is set to U-shaped.
In this embodiment, when the solar silicon wafers cutting is come unstuck the tool use with glass plate, the operating personnel holds handle, plate breaks away from glass plate from metallic plate with coming unstuck, glass plate is prized the monolithic glass plate from metallic plate thereby the breach on the plate that comes unstuck can overturn easily, avoid the direct contact glass plate of staff and metallic plate, solved glass plate comes unstuck high-temperature baking causes in process scald, the glass fragment that breaks causes incised wound, to wear the gloves operation heavy, the problem that wastes time and energy.
Fig. 2 to Fig. 4 shows solar silicon wafers cutting that the utility model the second embodiment provides with the come unstuck perspective view of tool of glass plate, wherein, Fig. 2 shows solar silicon wafers cutting that the utility model the second embodiment provides with the come unstuck perspective view of tool of glass plate, Fig. 3 shows solar silicon wafers cutting that the utility model the second embodiment provides with glass plate come unstuck the tool body of tool and the perspective view of handle, Fig. 4 shows solar silicon wafers cutting that the utility model the second embodiment provides with the come unstuck perspective view of the plate that comes unstuck of tool of glass plate.
By Fig. 2, Fig. 3 and Fig. 4 as can be known, the cutting of this solar silicon wafers with glass plate come unstuck the plate 3 that comes unstuck of tool with tool body 1 for split type, the end of the end that the plate 3 that comes unstuck is connected with tool body 1 second end is provided with groove 31, and the cell wall of this groove 31 is provided with the groove through hole 32 of vertical channel wall; The end of tool body 1 second end is provided with fin 11, and this fin 11 is provided with the fin through hole 12 of vertical fin face; Be connected with connector 4 between groove through hole 32 and fin through hole 12, in the present embodiment, this connector 4 is set to bolt.
In this embodiment, fin is reached in groove, pass groove through hole and fin through hole with bolt, plate and tool body are fixed together coming unstuck; This come unstuck plate and tool body are made as split-type structural and are convenient to change the plate that comes unstuck, the plate so that cleaning is come unstuck.
Solar silicon wafers cutting comprises the tool body with the glass plate tool that comes unstuck, and this tool body is rectangular slab, and the first end of this tool body is provided with handle, and the second end of this tool body bends towards a side of tool body; And the plate that comes unstuck that is arranged on this tool body the second end, this plate that comes unstuck is made as wedge shape, and the one end is fixedly connected with the tool body, and this plate that comes unstuck is provided with breach away from the middle part of an end of tool body; When this tool uses, the operating personnel holds handle, plate breaks away from glass plate from metallic plate with coming unstuck, glass plate is prized the monolithic glass plate from metallic plate thereby the breach on the plate that comes unstuck can overturn easily, avoid the direct contact glass plate of staff and metallic plate, solved glass plate comes unstuck high-temperature baking causes in process scald, the glass fragment that breaks causes incised wound, to wear the gloves operation heavy, the problem that wastes time and energy.
The above is only preferred embodiment of the present utility model; not in order to limit the utility model; all any modifications of doing within spirit of the present utility model and principle, be equal to and replace and improvement etc., within all should being included in protection domain of the present utility model.
Claims (3)
1. solar silicon wafers cutting is with the glass plate tool that comes unstuck, it is characterized in that, the cutting of described solar silicon wafers comprises the tool body with the glass plate tool that comes unstuck, described tool body is rectangular slab, described tool body first end is provided with handle, and the second end of described tool body bends towards a side of described tool body; And the plate that comes unstuck that is arranged on described tool body the second end, the described plate that comes unstuck is made as wedge shape, and an end of the described plate that comes unstuck is fixedly connected with described tool body, and the described plate that comes unstuck is provided with breach away from the middle part of an end of described tool body.
2. solar silicon wafers according to claim 1 cutting with the glass plate tool that comes unstuck, is characterized in that, described breach is made as U-shaped.
3. the cutting of the described solar silicon wafers of any one with the glass plate tool that comes unstuck, is characterized in that according to claim 1 and 2, and described plate and the described tool body of coming unstuck is split-type structural; The described plate that comes unstuck is provided with groove with the end that described tool body the second end is connected an end, and the cell wall of described groove is provided with the groove through hole of vertical channel wall; The end of described tool body the second end is provided with fin, and described fin is provided with the fin through hole of vertical fin face; Be connected with bolt between described groove through hole and described fin through hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220750605 CN202964945U (en) | 2012-12-31 | 2012-12-31 | Glass plate deguming jig for cutting solar silicon wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220750605 CN202964945U (en) | 2012-12-31 | 2012-12-31 | Glass plate deguming jig for cutting solar silicon wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202964945U true CN202964945U (en) | 2013-06-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220750605 Expired - Fee Related CN202964945U (en) | 2012-12-31 | 2012-12-31 | Glass plate deguming jig for cutting solar silicon wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202964945U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103895116A (en) * | 2014-03-28 | 2014-07-02 | 高佳太阳能股份有限公司 | Connecting plate drawing tool |
-
2012
- 2012-12-31 CN CN 201220750605 patent/CN202964945U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103895116A (en) * | 2014-03-28 | 2014-07-02 | 高佳太阳能股份有限公司 | Connecting plate drawing tool |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130605 Termination date: 20181231 |