CN202884853U - Planed and bendable LED radiator structure - Google Patents

Abstract

The utility model relates to a formula of planing LED radiator structure that can buckle the combination, supply to set up on a circuit board that has a plurality of emitting diode, it contains a heat conduction post and a formula of planing heat radiation fin group, this formula of planing heat radiation fin group has a flexible slab and a plurality of fins of integrated into one piece on this slab, this slab centers on for circular in order to form an accommodation space, this accommodation space and this formula of planing heat radiation fin group of in close contact with are put into to this heat conduction post, and a terminal surface of this heat conduction post supplies to set up this circuit board, in view of the above, this heat conduction post can absorb the used heat of this circuit board, and distribute away by these a plurality of fins, it forms high-efficient heat radiation structure, can reduce the temperature of these a plurality of emitting diode, and increase of service life.

Description

Planed and bendable LED radiator structure

technical field

The utility model relates to a light emitting diode, in particular to a radiator structure of the light emitting diode. the

Background technique

Lighting is a very important demand of human society. Whether it is tungsten bulbs, fluorescent lamps, halogen lamps, fluorescent lamps, cold cathode tubes, light-emitting diodes and other different light-emitting technologies, they can provide light sources to meet the needs of lighting. the

Different light-emitting methods have luminous characteristics and efficiencies, which can meet different needs. For light-emitting diodes, light-emitting diodes have extremely high energy conversion efficiency and can effectively use energy. It is applied to various lighting equipment to meet the needs of energy saving and carbon saving. the

Although light-emitting diodes have the characteristics of low power consumption and energy-saving use, however, the illuminance of individual light-emitting diodes is actually not large. If light-emitting diodes are to be used as the main lighting equipment in daily life, a considerable number of light-emitting diodes needs to be assembled to meet the actual needs. In use, the requirements for illumination. the

When a certain number of light-emitting diodes are assembled, the heat generated by the light-emitting diodes will accumulate to form a high-temperature environment, and the light-emitting diodes will emit light under high-temperature environments for a long time, and their lifespan will be greatly reduced, which will lead to light-emitting diodes. The service life of LEDs is not as expected, which greatly reduces the desire of the public to use light-emitting diodes as the main lighting equipment in daily life. the

Therefore, in order to reduce the temperature of the environment where the LEDs are located, the density that the LEDs can be placed in is limited. In other words, the lighting equipment made of LEDs is limited by the temperature relationship. , and cannot provide a high-illuminance lighting source, and cannot meet the actual use requirements when the environment requires high illumination. the

Utility model content

The main purpose of this utility model is to disclose a planing-type bendable LED radiator structure to effectively reduce the temperature of the LEDs. the

In order to achieve the above purpose, the utility model provides a light-emitting diode heat sink structure of a planing type that can be bent and combined, for setting a circuit board with a plurality of light-emitting diodes, which includes:

a thermal column;

A planed heat dissipation fin set, the planed heat dissipation fin set has a bendable plate and a plurality of fins integrally formed on the plate, and the plate is surrounded by a circle to form an accommodating space , the heat conduction column is placed into the accommodating space and closely contacts the planed heat dissipation fin group, and one end surface of the heat conduction column is used for setting the circuit board. the

In the planed-type bendable combined LED heat sink structure, the plurality of fins have a first edge close to the circuit board and a second edge opposite to the first edge, and the second The length of the edge is shorter than the first edge. the

In the planed-type bendable combined LED heat sink structure, the plate is surrounded by a circle and the plurality of fins diverge outward, and the heat conduction column is in close contact with the plate. the

In the planing-type bendable LED radiator structure described above, the plate is divided into a left arc and a right arc, and the left arc and the right arc are respectively arranged on both sides of the heat conduction column , and let the plurality of fins diverge outward. the

In the planed-type bendable combined LED heat sink structure, the plate is surrounded by a circle and the plurality of fins are drawn inward, and the heat conduction column is in close contact with the plurality of fins. the

In the planing-type bendable combined LED heat sink structure, the plurality of fins have a plurality of branches. the

In the planed-type bendable combined LED radiator structure, the heat conduction column has a heat conduction space, and the heat conduction space is filled with a heat conduction fluid. the

In the planed-type bendable LED heat sink structure described above, a fan is provided on the other end surface of the heat conduction column away from the circuit board. the

Accordingly, when the plurality of LEDs emit light to generate waste heat and accumulate on the circuit board, the waste heat will be quickly taken away by the heat conduction column and dissipated through the plurality of fins, thereby reducing the temperature of the circuit board , that is to say, the plurality of light emitting diodes can be placed in a relatively low temperature environment, thereby prolonging the service life of the plurality of light emitting diodes and meeting the requirements of use. the

The utility model will be described in detail below in conjunction with the accompanying drawings and specific embodiments, but not as a limitation of the utility model. the

Description of drawings

Fig. 1 is the three-dimensional structural diagram of the first embodiment of the utility model;

Fig. 2 is an exploded view of the three-dimensional structure of the first embodiment of the utility model;

Fig. 3 is a structural sectional view of the first embodiment of the utility model;

Fig. 4 is a structural sectional view of the second embodiment of the utility model;

Fig. 5 is a structural top view of the third embodiment of the utility model;

Figure 6 is a top view of the structure of the fourth embodiment of the utility model;

Figure 7 is a top view of the structure of the fifth embodiment of the utility model;

Fig. 8 is a cross-sectional view of the structure of the sixth embodiment of the present invention. the

Detailed ways

Below in conjunction with accompanying drawing, structural principle and working principle of the present utility model are specifically described:

Relevant detailed description and technical contents of the present utility model are as follows with regard to coordinating accompanying drawings now:

Please refer to Fig. 1, Fig. 2 and Fig. 3, the utility model is a light-emitting diode heat sink structure of planing type and bendable combination, for setting a circuit board 10 with a plurality of light-emitting diodes 11, which includes a The heat conduction column 20 and a planed heat dissipation fin group 30, the planed heat dissipation fin group 30 has a bendable plate 31 and a plurality of fins 32 integrally formed on the plate 31, the plate 31 is surrounded by a circle to form an accommodating space 40 and allow the plurality of fins 32 to diverge outward, and the heat conduction column 20 is placed in the accommodating space 40 and closely contacts the shaved heat dissipation fin group 30, also That is, the heat conducting post 20 is in close contact with the plate 31 , and an end surface 21 of the heat conducting post 20 is provided for the circuit board 10 . the

Please refer to FIG. 4, the plurality of fins 32 have a first edge 321 close to the circuit board 10 and a second edge 322 opposite to the first edge 321, and the length of the second edge 322 is short. According to the first edge 321 , the use of materials can be reduced without affecting the heat dissipation capability, so as to save cost and weight. the

Please refer to Fig. 5, in order to clearly show the structural features, this embodiment does not draw the circuit board 10, the plate 31 can also be divided into a left arc 311 and a right arc 312, the left arc 311 and The right arcs 312 are respectively disposed on two sides of the heat conduction column 20 , and let the plurality of fins 32 diverge outward, which can also reduce the use of materials, save costs, and reduce weight. the

Please refer to shown in Figure 6, in order to clearly show the structural features, this embodiment does not draw the circuit board 10, the utility model can also allow the plate 31 to be surrounded by a circle and allow the plurality of fins 32 to draw inwards, Moreover, the heat conduction column 20 is in close contact with the plurality of fins 32 , which can increase the structural strength and prevent the plurality of fins 32 from bending due to external force. the

Please refer to Fig. 7, in order to clearly show the structural features, this embodiment does not draw the circuit board 10, the utility model also allows the plurality of fins 32 to have a plurality of branches 323, the plurality of branches 323 The heat dissipation area can be increased, and the waste heat can be dissipated more quickly. the

Please refer to FIG. 8, the utility model can also allow the heat conduction column 20 to have a heat conduction space 22, and the heat conduction space 22 is filled with a heat conduction fluid 50, which can utilize the gaseous state and liquid state transition of the heat conduction fluid 50 to form rapid heat conduction tube, and the utility model also allows the heat conduction column 20 to be provided with a fan 60 on the other end surface 23 away from the circuit board 10, so as to improve the heat dissipation capability. the

As mentioned above, in the present utility model, the heat conduction column contacts the circuit board, so the heat conduction column can absorb the waste heat of the circuit board, and the heat conduction column is connected with the planed heat dissipation fin group, so the waste heat can pass through The plurality of fins spread out, which can form an efficient heat dissipation structure, which can reduce the operating temperature of the plurality of light emitting diodes, increase the service life, and meet the use requirements. the

Of course, the utility model can also have other various embodiments, and those skilled in the art can make various corresponding changes and deformations according to the utility model without departing from the spirit and essence of the utility model, but These corresponding changes and deformations should all belong to the protection scope of the appended claims of the present utility model. the

Claims (8)

1. the LED radiator structure of the bent combination of planing pattern has on the circuit board of a plurality of light emitting diodes for arranging, and it is characterized in that, comprises:

One heating column;

One planing pattern radiating fin group, this planing pattern radiating fin group has a flexible plate and a plurality of fins that are integrally formed on this plate, this plate centers on for circular to form an accommodation space, this heating column is inserted this accommodation space and this planing pattern radiating fin group of close contact, and an end face of this heating column is for this circuit board is set.

2. the LED radiator structure of the bent combination of planing pattern according to claim 1, it is characterized in that, these a plurality of fins have near one first edge of this circuit board and one second edge that is positioned at this first edge opposite face, and this second edge be shorter in length than this first edge.

3. the LED radiator structure of the bent combination of planing pattern according to claim 1 is characterized in that, this plate centers on for circle and allows these a plurality of fins disperse outwardly, and this this plate of heating column close contact.

4. the LED radiator structure of the bent combination of planing pattern according to claim 1, it is characterized in that, this plate is divided into a left arc sheet and a right arc sheet, and this left arc sheet and this right arc sheet are arranged at respectively the both sides of this heating column, and allow these a plurality of fins disperse outwardly.

5. the LED radiator structure of the bent combination of planing pattern according to claim 1 is characterized in that, this plate centers on for circle and allows these a plurality of fins draw in inwardly, and these a plurality of fins of this heating column close contact.

6. the LED radiator structure of the bent combination of planing pattern according to claim 1 is characterized in that, these a plurality of fins divide and have a plurality of differences and prop up.

7. the LED radiator structure of the bent combination of planing pattern according to claim 1 is characterized in that, this heating column has a heat conduction space, and this heat conduction space filling one heat-conducting fluid.

8. the LED radiator structure of the bent combination of planing pattern according to claim 1 is characterized in that, this heating column arranges a fan away from the other end of this circuit board.

Images