CN202789934U - Automatic dispensing chip mounter - Google Patents

Automatic dispensing chip mounter Download PDF

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Publication number
CN202789934U
CN202789934U CN 201220421988 CN201220421988U CN202789934U CN 202789934 U CN202789934 U CN 202789934U CN 201220421988 CN201220421988 CN 201220421988 CN 201220421988 U CN201220421988 U CN 201220421988U CN 202789934 U CN202789934 U CN 202789934U
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CN
China
Prior art keywords
table board
substrate
chip mounting
glue
mobile slide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN 201220421988
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Chinese (zh)
Inventor
刘春发
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SHENZHEN ZHIYUAN PENGFA SCIENCE AND TECHNOLOGY Co Ltd
Original Assignee
SHENZHEN ZHIYUAN PENGFA SCIENCE AND TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SHENZHEN ZHIYUAN PENGFA SCIENCE AND TECHNOLOGY Co Ltd filed Critical SHENZHEN ZHIYUAN PENGFA SCIENCE AND TECHNOLOGY Co Ltd
Priority to CN 201220421988 priority Critical patent/CN202789934U/en
Application granted granted Critical
Publication of CN202789934U publication Critical patent/CN202789934U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model provides an automatic dispensing chip mounter which is used for attaching a crystal to a substrate. The automatic dispensing chip mounter comprises a stand, a tabletop board arranged on the stand as well as a dispensing mechanism and a chip mounting mechanism which are arranged on the tabletop board, wherein the dispensing mechanism comprises a rubber sleeve and a dispensing valve air cylinder; the dispensing valve air cylinder is used for driving the opposite rubber sleevetabletop board to do three-dimensional motion relative to the tabletop board and can control glue in the rubber sleeve to output at the fixed amount; and the chip mounting mechanism comprises an imaging part for imaging the substrate and a sucking nozzle which is used for sucking the crystal and can move on a plane where the tabletop is positioned. The imaging part of the chip mounting mechanism can shoot the substrate and two set reference points are found on the substrate, and thus other positions of the whole substrate are known and the crystal is accurately attached to the set position. The automatic dispensing chip mounter is simple and easily understood in operation; labor force is saved and work procedures of dispensing and chip mounting can be finished; and meanwhile, the automatic dispensing chip mounter is high in efficiency reaching over 1200/h.

Description

Automatic glue-dispersion chip mounting machine
Technical field
The utility model relates to automation equipment point sticker sheet field, relates in particular to a kind of automatic glue-dispersion chip mounting machine.
Background technique
In industrial production, generally pack for crystal such as mobile phone button, display devices, crystal need to be attached on the substrate, at first need described substrate is carried out a glue, and traditional processing method is to adopt manually substrate is carried out a glue, crystal is fitted on the substrate, this operating type troublesome poeration, efficient is low and be unfavorable for saving human resources again.
The model utility content
The purpose of this utility model is to overcome the defective of prior art, and a kind of automatic glue-dispersion chip mounting machine of finishing paster, some glue is provided, and it is simple to operate, efficient is high, save human resources.
The utility model provides a kind of automatic glue-dispersion chip mounting machine, be used for crystal is fitted in substrate, comprise frame, be located at table board on the described frame, be located at glue applying mechanism and plaster mechanism on the described table board, described glue applying mechanism comprises packing element, drive the relatively described table board of described packing element do three dimensional motion and can control glue fixed amount output in the described packing element the glue dispensing valve cylinder; Described plaster mechanism comprise the imaging part that can be used for described substrate imaging and be used for drawing described crystal, can be at the suction nozzle of described table board place planar movement.
Further, described table board is provided with for first Mobile Slide, second Mobile Slide of described plaster mechanism at described table board place planar movement, and described the first Mobile Slide and the second Mobile Slide are arranged on the described table board.
Further, described table board is provided with the 3rd Mobile Slide that moves up and down for the relatively described table board of described glue applying mechanism, and described the 3rd Mobile Slide is arranged on the described table board.
Further, described plaster mechanism is installed on described the first Mobile Slide by a mounting plate, and described imaging part is the CCD camera lens, and it arranges on the described assembly department, and described suction nozzle is installed below described mounting plate.
Further, also comprise the parts feeder for delivery of described substrate, described parts feeder is located on the described frame.
A kind of automatic glue-dispersion chip mounting machine that the utility model provides, it comprises glue applying mechanism and plaster mechanism, imaging part by plaster mechanism can be taken pictures to substrate, find the reference point of two settings at substrate, thereby know other position of whole substrate, reach crystal is attached on the position of setting accurately, substrate has been put partially as described, which some the imaging part can identify is in for which position, needs the great angle of rotation etc., allows crystal be attached to the position that substrate is set, reach technological requirement, compared with prior art, automatic glue-dispersion chip mounting machine is simple to operate understandable, only needs substrate is put on the station, press the button and get final product, also save human resources, only need a people can finish simultaneously a glue and paster operation, can alternation, make machine always in running order, simultaneously, automatic glue-dispersion chip mounting machine efficient is high, and efficient can reach more than 1200/hour.
Description of drawings
In order to be illustrated more clearly in the utility model embodiment or technological scheme of the prior art, the below will do to introduce simply to the accompanying drawing of required use in embodiment or the description of the Prior Art, apparently, accompanying drawing in the following describes only is embodiments more of the present utility model, for those of ordinary skills, under the prerequisite of not paying creative work, can also obtain according to these accompanying drawings other accompanying drawing.
The automatic glue-dispersion chip mounting machine schematic perspective view that Fig. 1 provides for the utility model embodiment;
The plaster mechanism schematic perspective view that Fig. 2 provides for the utility model embodiment;
The glue applying mechanism schematic perspective view that Fig. 3 provides for the utility model embodiment.
Embodiment
Below in conjunction with the accompanying drawing among the utility model embodiment, the technological scheme among the utility model embodiment is clearly and completely described, obviously, described embodiment only is the utility model part embodiment, rather than whole embodiments.Based on the embodiment in the utility model, those of ordinary skills are not making the every other embodiment who obtains under the creative work prerequisite, all belong to the scope of the utility model protection.
Referring to Fig. 1-shown in Figure 3, the utility model embodiment provides a kind of automatic glue-dispersion chip mounting machine 1, be used for crystal (diagram is shown) is fitted in substrate (diagram is shown), comprise frame 11, be located at table board 111 on the described frame 11, be located at glue applying mechanism 12 and plaster mechanism 13 on the described table board 111, described glue applying mechanism 12 comprises packing element 121, drive the relatively described table board 1111 of described packing element 121 do three dimensional motion and can control described packing element 121 interior glue fixed amounts outputs glue dispensing valve cylinder 122; Described plaster mechanism 13 comprise the imaging part 131 that can be used for described substrate imaging and be used for drawing described crystal, can be at the suction nozzle 132 of described table board 111 place planar movements.Imaging part 131 by described plaster mechanism 13 can be taken pictures to described substrate, find the reference point of two settings at described substrate, thereby know other position of whole substrate, reach described crystal to be attached to accurately on the position of setting, substrate has been put partially as described, which point described imaging part 131 can identify is in for which position, need the great angle of rotation etc., allow described crystal be attached to the position that described substrate is set, reach technological requirement, compared with prior art, automatic glue-dispersion chip mounting machine described in the utility model 1 is simple to operate understandable, only needs be put into described substrate on the station, press the button and get final product, also save human resources, only need a people can finish simultaneously a glue and paster operation, can alternation, make machine always in running order, simultaneously, described automatic glue-dispersion chip mounting machine 1 efficient is high, and efficient can reach more than 1200/hour.
Particularly, such as Fig. 1, described table board 111 is provided with for first Mobile Slide 14, second Mobile Slide 15 of described plaster mechanism 13 at described table board 111 place planar movements, and described the first Mobile Slide 14 and the second Mobile Slide 15 are arranged on the described table board 111.Described the first Mobile Slide 14, described the second Mobile Slide 15 structural similarities comprise fixing base, sliding substrate, linear rail, cylinder, locking mechanism, arrive digit buffer and drag chain box; The parallel correspondence in both sides is provided with two linear rails on the described fixing base, which is provided with sliding substrate and is slidingly matched with it; Article two, one end of the fixing base between the linear rail is provided with cylinder, and sliding substrate is connected with the cylinder termination, and the corresponding cylinder of the fixing base the other end is provided with digit buffer; An adjacent straight line guide rail termination to digit buffer is provided with locking mechanism, is provided with drag chain box below sliding substrate one side, and this mechanism adopts the mode of linear rail to carry out the slip of front end and back end, can effectively guarantee its validity, has guaranteed traveling comfort and accuracy; This mechanism structure is simple, and is reasonable in design, practical, has design technology optimization, the advantages such as manufacture difficulty reduction.
Particularly, as shown in Figure 1 and Figure 2, described table board 111 is provided with the 3rd Mobile Slide 16 that moves up and down for the relatively described table board 111 of described glue applying mechanism 12, and described the 3rd Mobile Slide 16 is arranged on the described table board 111.More specifically, described plaster mechanism 13 is installed on described the first Mobile Slide 14 by a mounting plate 133, and described imaging part 131 is CCD camera lenses, and it arranges on the described assembly department 133, and described suction nozzle 132 is installed below described mounting plate 133.Rely on the generation vacuum of blowing to draw crystal by described suction nozzle 132, described automatic glue-dispersion chip mounting machine 1 also comprises the parts feeder 17 for delivery of described substrate, described parts feeder 17 is located on the described frame 11, and described suction nozzle 132 is drawn crystal to the desired location of described substrate from described parts feeder 17 fixed positions.
The above only is preferred embodiment of the present utility model; not in order to limit the utility model; all within spirit of the present utility model and principle, any modification of doing, be equal to replacement, improvement etc., all should be included within the protection domain of the present utility model.

Claims (5)

1. automatic glue-dispersion chip mounting machine, be used for crystal is fitted in substrate, it is characterized in that, comprise frame, be located at table board on the described frame, be located at glue applying mechanism and plaster mechanism on the described table board, described glue applying mechanism comprises packing element, drive the relatively described table board of described packing element do three dimensional motion and can control glue fixed amount output in the described packing element the glue dispensing valve cylinder; Described plaster mechanism comprise the imaging part that can be used for described substrate imaging and be used for drawing described crystal, can be at the suction nozzle of described table board place planar movement.
2. automatic glue-dispersion chip mounting machine as claimed in claim 1, it is characterized in that: described table board is provided with for first Mobile Slide, second Mobile Slide of described plaster mechanism at described table board place planar movement, and described the first Mobile Slide and the second Mobile Slide are arranged on the described table board.
3. automatic glue-dispersion chip mounting machine as claimed in claim 1, it is characterized in that: described table board is provided with the 3rd Mobile Slide that moves up and down for the relatively described table board of described glue applying mechanism, and described the 3rd Mobile Slide is arranged on the described table board.
4. automatic glue-dispersion chip mounting machine as claimed in claim 1, it is characterized in that: described plaster mechanism is installed on described the first Mobile Slide by a mounting plate, described imaging part is the CCD camera lens, and it arranges on the described assembly department, and described suction nozzle is installed below described mounting plate.
5. automatic glue-dispersion chip mounting machine as claimed in claim 1, it is characterized in that: also comprise the parts feeder for delivery of described substrate, described parts feeder is located on the described frame.
CN 201220421988 2012-08-23 2012-08-23 Automatic dispensing chip mounter Expired - Fee Related CN202789934U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201220421988 CN202789934U (en) 2012-08-23 2012-08-23 Automatic dispensing chip mounter

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 201220421988 CN202789934U (en) 2012-08-23 2012-08-23 Automatic dispensing chip mounter

Publications (1)

Publication Number Publication Date
CN202789934U true CN202789934U (en) 2013-03-13

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Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103287642A (en) * 2013-06-24 2013-09-11 苏州速腾电子科技有限公司 Operating table for gluing of film
CN103660514A (en) * 2013-12-06 2014-03-26 苏州逸美德自动化科技有限公司 Glue punching, film pasting and glue adding integration machine
CN103824754A (en) * 2014-03-15 2014-05-28 深圳市鹰眼在线电子科技有限公司 Intelligent laminating machine for quartz crystal oscillator
CN103987204A (en) * 2014-05-15 2014-08-13 陈智荣 Novel surface mounting system
CN104889014A (en) * 2014-10-09 2015-09-09 苏州富强科技有限公司 Dispensing and assembling apparatus
CN104889015A (en) * 2014-10-09 2015-09-09 苏州富强科技有限公司 Dispensing and assembling apparatus
CN105364457A (en) * 2015-06-21 2016-03-02 阮林亚 Automatic assembly line for lamp magnetic sheets
CN105499067A (en) * 2015-11-27 2016-04-20 新奥光伏能源有限公司 Automatic dispensing chip mounter for manufacturing trays
CN105720169A (en) * 2016-04-06 2016-06-29 捷讯精密橡胶(苏州)有限公司 Automatic dispensing placement machine for circuit board LED lamp
CN106890760A (en) * 2017-03-07 2017-06-27 东莞市嘉腾仪器仪表有限公司 Automatic chip mounting point gum machine
CN107249262A (en) * 2017-07-06 2017-10-13 无锡市莱科自动化科技有限公司 A kind of FPC Full-automatic spot gluing and patch LED equipment
CN108323152A (en) * 2018-01-24 2018-07-24 宁波禹泰自动化科技有限公司 Point tin cream chip mounter
CN109174557A (en) * 2018-09-14 2019-01-11 克诺尔商用车系统(重庆)有限公司 Viscose glue system for Pneumatic reversal valve
CN109904097A (en) * 2019-03-04 2019-06-18 东莞倍胜智能科技有限公司 A kind of modular multi-function IC chip mounting device
CN111306156A (en) * 2019-12-10 2020-06-19 东莞市众虎智能科技有限公司 Semi-automatic magnet sticking equipment
CN113163703A (en) * 2021-04-23 2021-07-23 深圳市健仕达电子有限公司 LED chip mounter

Cited By (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103287642A (en) * 2013-06-24 2013-09-11 苏州速腾电子科技有限公司 Operating table for gluing of film
CN103660514A (en) * 2013-12-06 2014-03-26 苏州逸美德自动化科技有限公司 Glue punching, film pasting and glue adding integration machine
CN103824754A (en) * 2014-03-15 2014-05-28 深圳市鹰眼在线电子科技有限公司 Intelligent laminating machine for quartz crystal oscillator
CN103987204A (en) * 2014-05-15 2014-08-13 陈智荣 Novel surface mounting system
CN103987204B (en) * 2014-05-15 2017-07-28 深圳市三基色照明有限公司 Chip mounter
CN104889015A (en) * 2014-10-09 2015-09-09 苏州富强科技有限公司 Dispensing and assembling apparatus
CN104889014A (en) * 2014-10-09 2015-09-09 苏州富强科技有限公司 Dispensing and assembling apparatus
CN105364457A (en) * 2015-06-21 2016-03-02 阮林亚 Automatic assembly line for lamp magnetic sheets
CN105499067A (en) * 2015-11-27 2016-04-20 新奥光伏能源有限公司 Automatic dispensing chip mounter for manufacturing trays
CN105499067B (en) * 2015-11-27 2018-01-12 新奥光伏能源有限公司 A kind of automatic glue-dispersion chip mounting machine for being used to prepare pallet
CN105720169A (en) * 2016-04-06 2016-06-29 捷讯精密橡胶(苏州)有限公司 Automatic dispensing placement machine for circuit board LED lamp
CN106890760A (en) * 2017-03-07 2017-06-27 东莞市嘉腾仪器仪表有限公司 Automatic chip mounting point gum machine
CN107249262B (en) * 2017-07-06 2022-11-08 无锡市莱科自动化科技有限公司 Full-automatic point of flexible line way board is glued and is pasted LED lamp equipment
CN107249262A (en) * 2017-07-06 2017-10-13 无锡市莱科自动化科技有限公司 A kind of FPC Full-automatic spot gluing and patch LED equipment
CN108323152A (en) * 2018-01-24 2018-07-24 宁波禹泰自动化科技有限公司 Point tin cream chip mounter
CN108323152B (en) * 2018-01-24 2024-01-23 宁波禹泰自动化科技有限公司 Point tin cream chip mounter
CN109174557A (en) * 2018-09-14 2019-01-11 克诺尔商用车系统(重庆)有限公司 Viscose glue system for Pneumatic reversal valve
CN109174557B (en) * 2018-09-14 2020-05-15 克诺尔商用车系统(重庆)有限公司 Adhesive system for pneumatic control reversing valve
CN109904097A (en) * 2019-03-04 2019-06-18 东莞倍胜智能科技有限公司 A kind of modular multi-function IC chip mounting device
CN111306156A (en) * 2019-12-10 2020-06-19 东莞市众虎智能科技有限公司 Semi-automatic magnet sticking equipment
CN111306156B (en) * 2019-12-10 2022-03-15 东莞市众虎智能科技有限公司 Semi-automatic magnet sticking equipment
CN113163703A (en) * 2021-04-23 2021-07-23 深圳市健仕达电子有限公司 LED chip mounter

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Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20130313

Termination date: 20140823

EXPY Termination of patent right or utility model