CN202741311U - Diode spin coating device - Google Patents

Diode spin coating device Download PDF

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Publication number
CN202741311U
CN202741311U CN 201220376675 CN201220376675U CN202741311U CN 202741311 U CN202741311 U CN 202741311U CN 201220376675 CN201220376675 CN 201220376675 CN 201220376675 U CN201220376675 U CN 201220376675U CN 202741311 U CN202741311 U CN 202741311U
Authority
CN
China
Prior art keywords
baffle plate
adhesive tape
baffles
diode
main adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN 201220376675
Other languages
Chinese (zh)
Inventor
陈钢全
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SHANDONG DIYI ELECTRONIC SCIENCE AND TECHNOLOGY Co Ltd
Original Assignee
SHANDONG DIYI ELECTRONIC SCIENCE AND TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SHANDONG DIYI ELECTRONIC SCIENCE AND TECHNOLOGY Co Ltd filed Critical SHANDONG DIYI ELECTRONIC SCIENCE AND TECHNOLOGY Co Ltd
Priority to CN 201220376675 priority Critical patent/CN202741311U/en
Application granted granted Critical
Publication of CN202741311U publication Critical patent/CN202741311U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Abstract

The utility model relates to a diode spin coating device which comprises a main glue tape, wherein a rack is arranged on the main glue tape, baffles are respectively arranged on two sides of the main glue tape, thread holes are respectively arranged on the baffles and the main glue tape, a screw penetrating through the baffles and the main glue tape is connected into the thread holes in threaded mode, fastening nuts are connected at two ends of the screw, a gasket sleeved on the screw is arranged between the baffles and the main glue tape, a fixing clamp groove is arranged at the bottom of each baffle, and an inclined wedge surface meshed with a glue spreader is arranged at one ends of the baffles. The diode spin coating device has the advantages of being capable of effectively avoiding vertical moving of diode assemblies after being additionally provided with the baffles, leading pipe cores to pass through a glue injection port constantly, and accordingly reducing defective products and rework rate and improving production efficiency.

Description

Diode glue-evening device
Technical field
The utility model relates to a kind of even adhesive dispenser, and is particularly a kind of for the even required diode glue-evening device of glue process of diode.
Background technology
At present, diode need to be spared glue at gluing machine and processes, but in the gluing process, and therefore the diode gluing of need to rolling very easily produces the up and down phenomenon of play, produces defective products, thereby must do over again, and has so just reduced production efficiency.
Summary of the invention
For solving above technical deficiency, the utility model provides a kind of diode glue-evening device that can improve diode gluing efficient.
The utility model is realized by following measures:
A kind of diode glue-evening device of the present utility model, comprise main adhesive tape, be provided with tooth bar on the described main adhesive tape, the both sides of described main adhesive tape are respectively arranged with baffle plate, be provided with screwed hole on described baffle plate and the main adhesive tape, described screwed hole internal thread is connected with the screw rod that runs through baffle plate and main adhesive tape, the screw rod two ends are connected with clamp nut, be provided with the packing ring that is enclosed within on the screw rod between described baffle plate and the main adhesive tape, the baffle plate bottom is provided with fixed card slot, and an end of baffle plate is provided with the slope that agrees with mutually with gluing machine.
Distance between above-mentioned baffle plate and the main adhesive tape is 0.8 ~ 1.5mm.
The vertical height that the height of above-mentioned baffle plate is lower than main adhesive tape is 0.6 ~ 1.2mm.
The beneficial effects of the utility model are:
Even adhesive tape behind the increase baffle plate can effectively be avoided the up and down phenomenon of play of diode assembly, makes tube core can keep passing through gum-injecting port always, thereby reduces the purpose of defective products, reduces rework rate, enhances productivity.
Description of drawings
Fig. 1 is structural representation of the present utility model.
Fig. 2 is the structural representation of baffle plate.
Among the figure: 1 main adhesive tape, 2 baffle plates, 3 screw rods, 4 clamp nuts, 5 packing rings, 6 screwed holes, 7 fixed card slots, 8 slopes.
The specific embodiment
As shown in Figure 1, 2, a kind of diode glue-evening device of the present utility model, comprise main adhesive tape 1, be provided with tooth bar on the main adhesive tape 1, the both sides of main adhesive tape 1 are respectively arranged with baffle plate 2, be provided with screwed hole 6 on baffle plate 2 and the main adhesive tape 1, screwed hole 6 internal threads are connected with the screw rod 3 that runs through baffle plate 2 and main adhesive tape 1, screw rod 3 two ends are connected with clamp nut 4, be provided with the packing ring 5 that is enclosed within on the screw rod 3 between baffle plate 2 and the main adhesive tape 1, baffle plate 2 bottoms are provided be used to the fixed card slot 7 that is fixed on the gluing machine, and an end of baffle plate 2 is provided with the slope 8 that agrees with mutually with gluing machine.Distance between baffle plate 2 and the main adhesive tape 1 is 0.8 ~ 1.5mm.The vertical height that the height of baffle plate 2 is lower than main adhesive tape 1 is 0.6 ~ 1.2mm.
Above-described embodiment is described to be to specify this patent; though describe by specific term in the literary composition; but can not limit with this protection domain of this patent; being familiar with the personage of this technical field can be after the spirit of understanding this patent and principle change or revises it and reach equivalent purpose; and this equivalence change and modification all should be covered by the claim scope and define in the category.

Claims (3)

1. diode glue-evening device, comprise main adhesive tape, be provided with tooth bar on the described main adhesive tape, it is characterized in that: the both sides of described main adhesive tape are respectively arranged with baffle plate, be provided with screwed hole on described baffle plate and the main adhesive tape, described screwed hole internal thread is connected with the screw rod that runs through baffle plate and main adhesive tape, the screw rod two ends are connected with clamp nut, be provided with the packing ring that is enclosed within on the screw rod between described baffle plate and the main adhesive tape, the baffle plate bottom is provided with fixed card slot, and an end of baffle plate is provided with the slope that agrees with mutually with gluing machine.
2. described diode glue-evening device according to claim 1, it is characterized in that: the distance between described baffle plate and the main adhesive tape is 0.8 ~ 1.5mm.
3. described diode glue-evening device according to claim 1, it is characterized in that: the vertical height that the height of described baffle plate is lower than main adhesive tape is 0.6 ~ 1.2mm.
CN 201220376675 2012-08-01 2012-08-01 Diode spin coating device Expired - Fee Related CN202741311U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201220376675 CN202741311U (en) 2012-08-01 2012-08-01 Diode spin coating device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 201220376675 CN202741311U (en) 2012-08-01 2012-08-01 Diode spin coating device

Publications (1)

Publication Number Publication Date
CN202741311U true CN202741311U (en) 2013-02-20

Family

ID=47700759

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 201220376675 Expired - Fee Related CN202741311U (en) 2012-08-01 2012-08-01 Diode spin coating device

Country Status (1)

Country Link
CN (1) CN202741311U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106269388A (en) * 2016-08-19 2017-01-04 南通皋鑫电子股份有限公司 High-voltage diode inside courtyard apparatus for coating

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106269388A (en) * 2016-08-19 2017-01-04 南通皋鑫电子股份有限公司 High-voltage diode inside courtyard apparatus for coating
CN106269388B (en) * 2016-08-19 2019-08-20 南通皋鑫电子股份有限公司 High-voltage diode inside courtyard apparatus for coating

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
EXPY Termination of patent right or utility model
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20130220

Termination date: 20150801