CN202741311U - Diode spin coating device - Google Patents
Diode spin coating device Download PDFInfo
- Publication number
- CN202741311U CN202741311U CN 201220376675 CN201220376675U CN202741311U CN 202741311 U CN202741311 U CN 202741311U CN 201220376675 CN201220376675 CN 201220376675 CN 201220376675 U CN201220376675 U CN 201220376675U CN 202741311 U CN202741311 U CN 202741311U
- Authority
- CN
- China
- Prior art keywords
- baffle plate
- adhesive tape
- baffles
- diode
- main adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004528 spin coating Methods 0.000 title abstract 3
- 239000002390 adhesive tape Substances 0.000 claims description 26
- 238000004026 adhesive bonding Methods 0.000 claims description 8
- 239000003292 glue Substances 0.000 abstract description 10
- 230000002950 deficient Effects 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 230000000712 assembly Effects 0.000 abstract 1
- 238000002347 injection Methods 0.000 abstract 1
- 239000007924 injection Substances 0.000 abstract 1
- 230000000149 penetrating Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 description 3
- 206010046270 Up and down phenomenon Diseases 0.000 description 2
- 208000008425 Protein Deficiency Diseases 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002708 enhancing Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006011 modification reaction Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
Abstract
The utility model relates to a diode spin coating device which comprises a main glue tape, wherein a rack is arranged on the main glue tape, baffles are respectively arranged on two sides of the main glue tape, thread holes are respectively arranged on the baffles and the main glue tape, a screw penetrating through the baffles and the main glue tape is connected into the thread holes in threaded mode, fastening nuts are connected at two ends of the screw, a gasket sleeved on the screw is arranged between the baffles and the main glue tape, a fixing clamp groove is arranged at the bottom of each baffle, and an inclined wedge surface meshed with a glue spreader is arranged at one ends of the baffles. The diode spin coating device has the advantages of being capable of effectively avoiding vertical moving of diode assemblies after being additionally provided with the baffles, leading pipe cores to pass through a glue injection port constantly, and accordingly reducing defective products and rework rate and improving production efficiency.
Description
Technical field
The utility model relates to a kind of even adhesive dispenser, and is particularly a kind of for the even required diode glue-evening device of glue process of diode.
Background technology
At present, diode need to be spared glue at gluing machine and processes, but in the gluing process, and therefore the diode gluing of need to rolling very easily produces the up and down phenomenon of play, produces defective products, thereby must do over again, and has so just reduced production efficiency.
Summary of the invention
For solving above technical deficiency, the utility model provides a kind of diode glue-evening device that can improve diode gluing efficient.
The utility model is realized by following measures:
A kind of diode glue-evening device of the present utility model, comprise main adhesive tape, be provided with tooth bar on the described main adhesive tape, the both sides of described main adhesive tape are respectively arranged with baffle plate, be provided with screwed hole on described baffle plate and the main adhesive tape, described screwed hole internal thread is connected with the screw rod that runs through baffle plate and main adhesive tape, the screw rod two ends are connected with clamp nut, be provided with the packing ring that is enclosed within on the screw rod between described baffle plate and the main adhesive tape, the baffle plate bottom is provided with fixed card slot, and an end of baffle plate is provided with the slope that agrees with mutually with gluing machine.
Distance between above-mentioned baffle plate and the main adhesive tape is 0.8 ~ 1.5mm.
The vertical height that the height of above-mentioned baffle plate is lower than main adhesive tape is 0.6 ~ 1.2mm.
The beneficial effects of the utility model are:
Even adhesive tape behind the increase baffle plate can effectively be avoided the up and down phenomenon of play of diode assembly, makes tube core can keep passing through gum-injecting port always, thereby reduces the purpose of defective products, reduces rework rate, enhances productivity.
Description of drawings
Fig. 1 is structural representation of the present utility model.
Fig. 2 is the structural representation of baffle plate.
Among the figure: 1 main adhesive tape, 2 baffle plates, 3 screw rods, 4 clamp nuts, 5 packing rings, 6 screwed holes, 7 fixed card slots, 8 slopes.
The specific embodiment
As shown in Figure 1, 2, a kind of diode glue-evening device of the present utility model, comprise main adhesive tape 1, be provided with tooth bar on the main adhesive tape 1, the both sides of main adhesive tape 1 are respectively arranged with baffle plate 2, be provided with screwed hole 6 on baffle plate 2 and the main adhesive tape 1, screwed hole 6 internal threads are connected with the screw rod 3 that runs through baffle plate 2 and main adhesive tape 1, screw rod 3 two ends are connected with clamp nut 4, be provided with the packing ring 5 that is enclosed within on the screw rod 3 between baffle plate 2 and the main adhesive tape 1, baffle plate 2 bottoms are provided be used to the fixed card slot 7 that is fixed on the gluing machine, and an end of baffle plate 2 is provided with the slope 8 that agrees with mutually with gluing machine.Distance between baffle plate 2 and the main adhesive tape 1 is 0.8 ~ 1.5mm.The vertical height that the height of baffle plate 2 is lower than main adhesive tape 1 is 0.6 ~ 1.2mm.
Above-described embodiment is described to be to specify this patent; though describe by specific term in the literary composition; but can not limit with this protection domain of this patent; being familiar with the personage of this technical field can be after the spirit of understanding this patent and principle change or revises it and reach equivalent purpose; and this equivalence change and modification all should be covered by the claim scope and define in the category.
Claims (3)
1. diode glue-evening device, comprise main adhesive tape, be provided with tooth bar on the described main adhesive tape, it is characterized in that: the both sides of described main adhesive tape are respectively arranged with baffle plate, be provided with screwed hole on described baffle plate and the main adhesive tape, described screwed hole internal thread is connected with the screw rod that runs through baffle plate and main adhesive tape, the screw rod two ends are connected with clamp nut, be provided with the packing ring that is enclosed within on the screw rod between described baffle plate and the main adhesive tape, the baffle plate bottom is provided with fixed card slot, and an end of baffle plate is provided with the slope that agrees with mutually with gluing machine.
2. described diode glue-evening device according to claim 1, it is characterized in that: the distance between described baffle plate and the main adhesive tape is 0.8 ~ 1.5mm.
3. described diode glue-evening device according to claim 1, it is characterized in that: the vertical height that the height of described baffle plate is lower than main adhesive tape is 0.6 ~ 1.2mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220376675 CN202741311U (en) | 2012-08-01 | 2012-08-01 | Diode spin coating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220376675 CN202741311U (en) | 2012-08-01 | 2012-08-01 | Diode spin coating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202741311U true CN202741311U (en) | 2013-02-20 |
Family
ID=47700759
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220376675 Expired - Fee Related CN202741311U (en) | 2012-08-01 | 2012-08-01 | Diode spin coating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202741311U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106269388A (en) * | 2016-08-19 | 2017-01-04 | 南通皋鑫电子股份有限公司 | High-voltage diode inside courtyard apparatus for coating |
-
2012
- 2012-08-01 CN CN 201220376675 patent/CN202741311U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106269388A (en) * | 2016-08-19 | 2017-01-04 | 南通皋鑫电子股份有限公司 | High-voltage diode inside courtyard apparatus for coating |
| CN106269388B (en) * | 2016-08-19 | 2019-08-20 | 南通皋鑫电子股份有限公司 | High-voltage diode inside courtyard apparatus for coating |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| EXPY | Termination of patent right or utility model | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130220 Termination date: 20150801 |