CN202709541U - Semiconductor temperature adjusting system - Google Patents

Semiconductor temperature adjusting system Download PDF

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Publication number
CN202709541U
CN202709541U CN 201220405632 CN201220405632U CN202709541U CN 202709541 U CN202709541 U CN 202709541U CN 201220405632 CN201220405632 CN 201220405632 CN 201220405632 U CN201220405632 U CN 201220405632U CN 202709541 U CN202709541 U CN 202709541U
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CN
China
Prior art keywords
refrigerating sheet
cooling piece
protective ring
utility
model
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN 201220405632
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Chinese (zh)
Inventor
程鸿翔
潘魁
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NINGBO TINGWEI ELECTROC TECHNOLOGY Co Ltd
Original Assignee
NINGBO TINGWEI ELECTROC TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NINGBO TINGWEI ELECTROC TECHNOLOGY Co Ltd filed Critical NINGBO TINGWEI ELECTROC TECHNOLOGY Co Ltd
Priority to CN 201220405632 priority Critical patent/CN202709541U/en
Application granted granted Critical
Publication of CN202709541U publication Critical patent/CN202709541U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model discloses a semiconductor temperature adjusting system, which comprises a refrigerating sheet and heat radiators arranged at two sides of the refrigerating sheet, wherein the refrigerating sheet and the heat radiators are fixed through screws, the periphery of the refrigerating sheet is provided with a protective ring which is as high as the refrigerating sheet. According to the utility model, one protective ring is added based on the traditional manufacturing process, because the height of the protective ring is the same as that of the refrigerating sheet, the protective ring and the refrigerating sheet are located on the same horizontal plane after installation, when the refrigerating sheet is damaged easily due to single-side stress and slightly bigger installation angle with an aluminum product, the protective ring is about to share a compression area and bears most pressure, so that ceramic sheets at two faces of the refrigerating sheet are prevented from being damaged due to nonuniform stress, thus, the role of protecting a refrigerating chip is played, and the problem that a semiconductor refrigerating sheet is damaged due to nonuniform stress during installation of the refrigerating sheet is solved.

Description

A kind of conductor temperature regulating system
Technical field
The utility model relates to semi-conductor device technology field, more particularly, and particularly a kind of conductor temperature regulating system.
Background technology
Semiconductor chilling plate is being comprised of on two parallel very thin potsherds up and down many semiconductor PN joint sintering, and the cold of its generation and heat are transmitted to the function that reaches refrigeration and heating on the metal heat sink by potsherd.The manufacture craft of at present traditional semiconductor refrigeration system generally is that cooling piece and Aluminium Radiator are directly fitted, this wherein, cooling piece is to be installed between two Aluminium Radiators, adopts screw fixing method in both sides with two Aluminium Radiators and refrigeration mortice lock jail.Because the both sides screw has fixedly the time succession, cooling piece to be easy to because screw is monolateral stressed, the up and down monolateral extruding of Aluminium Radiator and produce unbalance stress causes the potsherd on refrigerating chip both sides to crush and damage.
In sum, how to solve the problem that semiconductor chilling plate that cooling piece causes owing to unbalance stress when mounted damages, become those skilled in the art's problem demanding prompt solution.
The utility model content
The technical problems to be solved in the utility model is for providing a kind of conductor temperature regulating system, and this conductor temperature regulating system can solve cooling piece when mounted because the problem of the semiconductor chilling plate damage that unbalance stress causes by its structural design.
For solving the problems of the technologies described above; the utility model provides a kind of conductor temperature regulating system; comprise cooling piece and the radiator that is arranged at described cooling piece both sides, described cooling piece and described radiator screw are fixed, and the periphery of described cooling piece is provided with and its highly identical guard circle.
Preferably, described radiator is Aluminium Radiator.
The utility model provides a kind of conductor temperature regulating system, comprises cooling piece and the radiator that is arranged at the cooling piece both sides, and cooling piece and radiator screw are fixed, and the periphery of cooling piece is provided with and its highly identical guard circle.The utility model has increased a guard ring in traditional manufacture craft; because the height of guard circle is identical with the height of cooling piece; after installing and cooling piece be in the same level face; when cooling piece because monolateral stressed and and the setting angle of aluminum products is too bigger than normal when causing damage easily; this guard ring will be shared compression area; bear most of pressure; the potsherd that prevents the cooling piece two sides damages because pressurized is inhomogeneous; thereby played the effect of protection refrigerating chip, solved cooling piece when mounted because the problem of the semiconductor chilling plate that unbalance stress causes damage.
Description of drawings
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, the below will do to introduce simply to the accompanying drawing of required use in embodiment or the description of the Prior Art, apparently, accompanying drawing in the following describes only is embodiment of the present utility model, for those of ordinary skills, under the prerequisite of not paying creative work, can also obtain according to the accompanying drawing that provides other accompanying drawing.
Fig. 1 is the structural representation of conductor temperature regulating system among a kind of embodiment of the utility model;
The corresponding relation of component names and Reference numeral is among Fig. 1:
Cooling piece 1; Radiator 2; Guard circle 3.
The specific embodiment
Core of the present utility model is for providing a kind of conductor temperature regulating system, and this conductor temperature regulating system can solve cooling piece when mounted because the problem of the semiconductor chilling plate damage that unbalance stress causes by its structural design.
In order to make those skilled in the art understand better the technical solution of the utility model, the utility model is described in further detail below in conjunction with the drawings and specific embodiments.
Please refer to Fig. 1, Fig. 1 is the structural representation of conductor temperature regulating system among a kind of embodiment of the utility model.
The utility model provides a kind of conductor temperature regulating system, comprises cooling piece 1 and the radiator 2 that is arranged at cooling piece 1 both sides, and cooling piece 1 is fixed with radiator 2 screws, and the periphery of cooling piece 1 is provided with and its highly identical guard circle 3.The utility model has increased a guard ring in traditional manufacture craft; because the height of guard circle 3 is identical with the height of cooling piece 1; after installing and cooling piece 1 be in the same level face; when cooling piece 1 because monolateral stressed and and the setting angle of aluminum products is too bigger than normal when causing damage easily; this guard ring will be shared compression area; bear most of pressure; the potsherd that prevents cooling piece 1 two sides damages because pressurized is inhomogeneous; thereby played the effect of protection refrigerating chip, solved cooling piece 1 when mounted because the problem of semiconductor chilling plate 1 damage that unbalance stress causes.
Particularly, radiator 2 is Aluminium Radiator, adopts aluminum design, can improve radiating efficiency of the present utility model, improves thermoregulator effect.Certainly, in another embodiment of the present utility model, also can adopt copper material, perhaps other has the alloy material of high heat dispersion.

Claims (2)

1. conductor temperature regulating system comprises cooling piece (1) and is arranged at the radiator (2) of described cooling piece (1) both sides that described cooling piece (1) is fixed with described radiator (2) screw, it is characterized in that,
The periphery of described cooling piece (1) is provided with and its highly identical guard circle (3).
2. conductor temperature regulating system according to claim 1 is characterized in that, described radiator (2) is Aluminium Radiator.
CN 201220405632 2012-08-14 2012-08-14 Semiconductor temperature adjusting system Expired - Fee Related CN202709541U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201220405632 CN202709541U (en) 2012-08-14 2012-08-14 Semiconductor temperature adjusting system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 201220405632 CN202709541U (en) 2012-08-14 2012-08-14 Semiconductor temperature adjusting system

Publications (1)

Publication Number Publication Date
CN202709541U true CN202709541U (en) 2013-01-30

Family

ID=47589835

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 201220405632 Expired - Fee Related CN202709541U (en) 2012-08-14 2012-08-14 Semiconductor temperature adjusting system

Country Status (1)

Country Link
CN (1) CN202709541U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103591728A (en) * 2012-08-14 2014-02-19 宁波婷微电子科技有限公司 Semiconductor temperature regulating system

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103591728A (en) * 2012-08-14 2014-02-19 宁波婷微电子科技有限公司 Semiconductor temperature regulating system

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20130130

Termination date: 20210814

CF01 Termination of patent right due to non-payment of annual fee