CN202709541U - Semiconductor temperature adjusting system - Google Patents
Semiconductor temperature adjusting system Download PDFInfo
- Publication number
- CN202709541U CN202709541U CN 201220405632 CN201220405632U CN202709541U CN 202709541 U CN202709541 U CN 202709541U CN 201220405632 CN201220405632 CN 201220405632 CN 201220405632 U CN201220405632 U CN 201220405632U CN 202709541 U CN202709541 U CN 202709541U
- Authority
- CN
- China
- Prior art keywords
- refrigerating sheet
- cooling piece
- protective ring
- utility
- model
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004065 semiconductor Substances 0.000 title abstract description 12
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 11
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 11
- 238000001816 cooling Methods 0.000 claims description 33
- 239000004020 conductor Substances 0.000 claims description 13
- 230000001105 regulatory effect Effects 0.000 claims description 13
- 239000004411 aluminium Substances 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 230000006835 compression Effects 0.000 abstract description 3
- 238000007906 compression Methods 0.000 abstract description 3
- 230000001681 protective effect Effects 0.000 abstract 5
- 238000009434 installation Methods 0.000 abstract 3
- 239000000919 ceramic Substances 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 3
- 238000005057 refrigeration Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000011982 device technology Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
Images
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a semiconductor temperature adjusting system, which comprises a refrigerating sheet and heat radiators arranged at two sides of the refrigerating sheet, wherein the refrigerating sheet and the heat radiators are fixed through screws, the periphery of the refrigerating sheet is provided with a protective ring which is as high as the refrigerating sheet. According to the utility model, one protective ring is added based on the traditional manufacturing process, because the height of the protective ring is the same as that of the refrigerating sheet, the protective ring and the refrigerating sheet are located on the same horizontal plane after installation, when the refrigerating sheet is damaged easily due to single-side stress and slightly bigger installation angle with an aluminum product, the protective ring is about to share a compression area and bears most pressure, so that ceramic sheets at two faces of the refrigerating sheet are prevented from being damaged due to nonuniform stress, thus, the role of protecting a refrigerating chip is played, and the problem that a semiconductor refrigerating sheet is damaged due to nonuniform stress during installation of the refrigerating sheet is solved.
Description
Technical field
The utility model relates to semi-conductor device technology field, more particularly, and particularly a kind of conductor temperature regulating system.
Background technology
Semiconductor chilling plate is being comprised of on two parallel very thin potsherds up and down many semiconductor PN joint sintering, and the cold of its generation and heat are transmitted to the function that reaches refrigeration and heating on the metal heat sink by potsherd.The manufacture craft of at present traditional semiconductor refrigeration system generally is that cooling piece and Aluminium Radiator are directly fitted, this wherein, cooling piece is to be installed between two Aluminium Radiators, adopts screw fixing method in both sides with two Aluminium Radiators and refrigeration mortice lock jail.Because the both sides screw has fixedly the time succession, cooling piece to be easy to because screw is monolateral stressed, the up and down monolateral extruding of Aluminium Radiator and produce unbalance stress causes the potsherd on refrigerating chip both sides to crush and damage.
In sum, how to solve the problem that semiconductor chilling plate that cooling piece causes owing to unbalance stress when mounted damages, become those skilled in the art's problem demanding prompt solution.
The utility model content
The technical problems to be solved in the utility model is for providing a kind of conductor temperature regulating system, and this conductor temperature regulating system can solve cooling piece when mounted because the problem of the semiconductor chilling plate damage that unbalance stress causes by its structural design.
For solving the problems of the technologies described above; the utility model provides a kind of conductor temperature regulating system; comprise cooling piece and the radiator that is arranged at described cooling piece both sides, described cooling piece and described radiator screw are fixed, and the periphery of described cooling piece is provided with and its highly identical guard circle.
Preferably, described radiator is Aluminium Radiator.
The utility model provides a kind of conductor temperature regulating system, comprises cooling piece and the radiator that is arranged at the cooling piece both sides, and cooling piece and radiator screw are fixed, and the periphery of cooling piece is provided with and its highly identical guard circle.The utility model has increased a guard ring in traditional manufacture craft; because the height of guard circle is identical with the height of cooling piece; after installing and cooling piece be in the same level face; when cooling piece because monolateral stressed and and the setting angle of aluminum products is too bigger than normal when causing damage easily; this guard ring will be shared compression area; bear most of pressure; the potsherd that prevents the cooling piece two sides damages because pressurized is inhomogeneous; thereby played the effect of protection refrigerating chip, solved cooling piece when mounted because the problem of the semiconductor chilling plate that unbalance stress causes damage.
Description of drawings
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, the below will do to introduce simply to the accompanying drawing of required use in embodiment or the description of the Prior Art, apparently, accompanying drawing in the following describes only is embodiment of the present utility model, for those of ordinary skills, under the prerequisite of not paying creative work, can also obtain according to the accompanying drawing that provides other accompanying drawing.
Fig. 1 is the structural representation of conductor temperature regulating system among a kind of embodiment of the utility model;
The corresponding relation of component names and Reference numeral is among Fig. 1:
The specific embodiment
Core of the present utility model is for providing a kind of conductor temperature regulating system, and this conductor temperature regulating system can solve cooling piece when mounted because the problem of the semiconductor chilling plate damage that unbalance stress causes by its structural design.
In order to make those skilled in the art understand better the technical solution of the utility model, the utility model is described in further detail below in conjunction with the drawings and specific embodiments.
Please refer to Fig. 1, Fig. 1 is the structural representation of conductor temperature regulating system among a kind of embodiment of the utility model.
The utility model provides a kind of conductor temperature regulating system, comprises cooling piece 1 and the radiator 2 that is arranged at cooling piece 1 both sides, and cooling piece 1 is fixed with radiator 2 screws, and the periphery of cooling piece 1 is provided with and its highly identical guard circle 3.The utility model has increased a guard ring in traditional manufacture craft; because the height of guard circle 3 is identical with the height of cooling piece 1; after installing and cooling piece 1 be in the same level face; when cooling piece 1 because monolateral stressed and and the setting angle of aluminum products is too bigger than normal when causing damage easily; this guard ring will be shared compression area; bear most of pressure; the potsherd that prevents cooling piece 1 two sides damages because pressurized is inhomogeneous; thereby played the effect of protection refrigerating chip, solved cooling piece 1 when mounted because the problem of semiconductor chilling plate 1 damage that unbalance stress causes.
Particularly, radiator 2 is Aluminium Radiator, adopts aluminum design, can improve radiating efficiency of the present utility model, improves thermoregulator effect.Certainly, in another embodiment of the present utility model, also can adopt copper material, perhaps other has the alloy material of high heat dispersion.
Claims (2)
1. conductor temperature regulating system comprises cooling piece (1) and is arranged at the radiator (2) of described cooling piece (1) both sides that described cooling piece (1) is fixed with described radiator (2) screw, it is characterized in that,
The periphery of described cooling piece (1) is provided with and its highly identical guard circle (3).
2. conductor temperature regulating system according to claim 1 is characterized in that, described radiator (2) is Aluminium Radiator.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 201220405632 CN202709541U (en) | 2012-08-14 | 2012-08-14 | Semiconductor temperature adjusting system |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 201220405632 CN202709541U (en) | 2012-08-14 | 2012-08-14 | Semiconductor temperature adjusting system |
Publications (1)
Publication Number | Publication Date |
---|---|
CN202709541U true CN202709541U (en) | 2013-01-30 |
Family
ID=47589835
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 201220405632 Expired - Fee Related CN202709541U (en) | 2012-08-14 | 2012-08-14 | Semiconductor temperature adjusting system |
Country Status (1)
Country | Link |
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CN (1) | CN202709541U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103591728A (en) * | 2012-08-14 | 2014-02-19 | 宁波婷微电子科技有限公司 | Semiconductor temperature regulating system |
-
2012
- 2012-08-14 CN CN 201220405632 patent/CN202709541U/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103591728A (en) * | 2012-08-14 | 2014-02-19 | 宁波婷微电子科技有限公司 | Semiconductor temperature regulating system |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130130 Termination date: 20210814 |
|
CF01 | Termination of patent right due to non-payment of annual fee |