CN202681597U

CN202681597U - High thermal conductivity insulation cookware

Info

Publication number: CN202681597U
Application number: CN 201220357339
Authority: CN
Inventors: 冯达发
Original assignee: Individual
Current assignee: Individual
Priority date: 2012-07-23
Filing date: 2012-07-23
Publication date: 2013-01-23
Anticipated expiration: 2022-07-23

Abstract

The utility model discloses a high thermal conductivity insulation cookware which comprises a pot body. The pot body comprises an inner layer pot body, an outer layer pot body, a vacuum cavity layer and a thermal conduction layer, wherein the pot body is sequentially provided with the outer layer pot body, the vacuum cavity layer, the thermal conduction layer and the inner layer pot body from outside to inside; and the thermal conduction layer is arranged on the surface of the inner layer pot body. The high thermal conductivity insulation cookware not only has more rapid and convenient thermal conduction performance and can be used for uniformly heating food, but also has a heat preservation function and can be used for improving the utilization rate of energy.

Description

High heat conductivity heat-insulating pan

Technical field

The utility model relates to a kind of high heat-conducting kitchen ware, relates in particular to a kind of high heat conductivity heat-insulating pan, belongs to the kitchen tool apparatus technical field.

Background technology

The pot body of the widely used pan of people all adopts the single-layer metal material to make at present.Adopt the pan of this kind structure, metal material is the conductor of heat energy, but heat conductivility is not high, causes heat-energy losses more, and energy resource consumption is larger, can not play the effect of energy savings.

In order to solve the problems of the technologies described above, China Patent No. " 201020685189.X " discloses a kind of high heat-conducting kitchen ware, open day is on December 14th, 2011, and this high heat-conducting kitchen ware is by internal layer, skin, and heat radiation sandwich layer three parts that are enclosed between internal layer and the skin form.Corresponding described high heat-conducting kitchen ware also is provided with ring-type flame limit body.Described flame limit body is comprised of metal outer and limit body heat-conducting layer two parts.

Although the heat conductivility of above-mentioned patent increases, also still there is following deficiency: one, its pan good heat conduction effect of making than existing single-layer metal material, but heat-conducting effect does not have substantial change, and heat utilization rate is still not high.Two, the pan heat-insulating property in the above-mentioned patented technology is lower, is therefore using function to have larger limitation.

Summary of the invention

The purpose of this utility model is to overcome the problems referred to above that existing pan exists, and a kind of high heat conductivity heat-insulating pan is provided, and the utility model not only has more efficiently heat conductivility, can be to the food homogeneous heating, and have heat insulation function, improve energy utilization rate.

A kind of high heat conductivity heat-insulating pan, comprise a pot body, described pot body comprises internal layer pot body and outer pot body, it is characterized in that: described pot body also comprises vacuum chamber layer and heat-conducting layer, the pot body is followed successively by outer pot body, vacuum chamber layer, heat-conducting layer and internal layer pot body from outside to inside, and heat-conducting layer is arranged on the internal layer pot surface.

The thickness of described heat-conducting layer is 80-120 microns.

Described heat-conducting layer is graphite rete or Graphene rete.

Described heat-conducting layer is bonded on the internal layer pot surface.

The thickness of described vacuum chamber layer is 200-300 microns.

Described internal layer pot body and outer pot body are aluminium or stainless steel or copper, and internal layer pot body is identical with the material of outer pot body.

Employing the utility model has the advantage of:

One, in the utility model, described pot body also comprises vacuum chamber layer and heat-conducting layer, the pot body is followed successively by outer pot body from outside to inside, the vacuum chamber layer, heat-conducting layer and internal layer pot body, heat-conducting layer is arranged on the internal layer pot surface, adopt this structure, the heat-conducting layer that arranges makes a pot body have more efficiently heat conductivility, can also evenly conduct heating to the food in the pot body, reduced energy resource consumption, and the vacuum chamber layer that arranges, make again a pot body have heat insulation function, improve energy utilization rate, arrange in the time of heat-conducting layer and vacuum chamber layer, make pot body possess simultaneously heat conductivility and heat-insulating property, and heat conductivility obviously is better than pan of the prior art.

Two, in the utility model, the thickness of described heat-conducting layer is 80-120 microns, and the heat-conducting layer of this thickness is combined with other layer structure, makes conductive force bring into play bestly, too thick or too thin thermal conductivity and the heat insulating ability that all can affect pot body.

Three, in the utility model, described heat-conducting layer is graphite rete or Graphene rete, and graphite rete or Graphene rete have unique heat radiation and heat-proof quality, are combined with other layer structure, makes the thermal conductivity of pot body and heat insulating ability reach best.

Four, in the utility model, described heat-conducting layer is bonded on the internal layer pot surface, adopts bonding mode, make the integraty of heat-conducting layer and internal layer pot body better, and preparation technology is simpler.

Five, in the utility model, the thickness of described vacuum chamber layer is 200-300 microns, if too thick, the heat conductivility of impact pot body, therefore the heat-insulating property of too thin impact pot body adopts 200-300 microns to make heat conductivility or heat-insulating property reach balance.

Six, in the utility model, described internal layer pot body and outer pot body are aluminium or stainless steel or copper, adopt these materials to cooperate with heat-conducting layer, improve heat conduction and heat insulation effect, and internal layer pot body is identical with the material of outer pot body, makes internal layer pot body consistent with the heat conductivility of outer pot body.

Description of drawings

Fig. 1 is the utility model structural representation

Be labeled as among the figure: 1, internal layer pot body, 2, outer pot body, 3, the vacuum chamber layer, 4, heat-conducting layer.

The specific embodiment

A kind of high heat conductivity heat-insulating pan, comprise a pot body, described pot body comprises internal layer pot body 1 and outer pot body 2, described pot body also comprises vacuum chamber layer 3 and heat-conducting layer 4, the pot body is followed successively by outer pot body 2, vacuum chamber layer 3, heat-conducting layer 4 and internal layer pot body 1 from outside to inside, and heat-conducting layer 4 is arranged on internal layer pot body 1 surface.

Preferred embodiment of the present utility model is, the thickness of described heat-conducting layer 4 is 80-120 microns, for example, can select 80,100 or 120 microns, and this is optimal way, is not limited to these thickness.

Another preferred embodiment of the present utility model is, described heat-conducting layer 4 is graphite rete or Graphene rete, and this is preferred, but is not limited to these, and other Heat Conduction Material also can be selected.

Another preferred embodiment of the present utility model is, described heat-conducting layer 4 is bonded on internal layer pot body 1 surface, and bonding is best mode, but is not limited to bondingly, also can select the mode of plated film.

Another preferred embodiment of the present utility model is, the thickness of described vacuum chamber layer 3 is 200-300 microns, for example, can select 200,260 or 300 microns, and this is optimal way, is not limited to these thickness.

Another preferred embodiment of the present utility model is that described internal layer pot body 1 and outer pot body 2 are aluminium or stainless steel or copper, and internal layer pot body 1 is identical with the material of outer pot body 2, but are not limited to these materials.

Adopt the height heat radiation graphite rete that utilizes the carbon component made in the present embodiment, have very high heat-sinking capability, can reach: 1500～1750W/mK.

Obviously; those of ordinary skill in the art is according to the technological know-how of grasping and customary means; according to above said content, can also make the various ways that does not break away from the utility model basic fundamental thought, these pro forma conversion are all within protection domain of the present utility model.

Claims

1. one kind high heat conductivity heat-insulating pan, comprise a pot body, described pot body comprises internal layer pot body (1) and outer pot body (2), it is characterized in that: described pot body also comprises vacuum chamber layer (3) and heat-conducting layer (4), the pot body is followed successively by outer pot body (2), vacuum chamber layer (3), heat-conducting layer (4) and internal layer pot body (1) from outside to inside, and heat-conducting layer (4) is arranged on internal layer pot body (1) surface.

2. high heat conductivity heat-insulating pan according to claim 1, it is characterized in that: the thickness of described heat-conducting layer (4) is 80-120 microns.

3. high heat conductivity heat-insulating pan according to claim 1 and 2, it is characterized in that: described heat-conducting layer (4) is graphite rete or Graphene rete.

4. high heat conductivity heat-insulating pan according to claim 3, it is characterized in that: described heat-conducting layer (4) is bonded on internal layer pot body (1) surface.

5. according to claim 1,2 or 4 described high heat conductivity heat-insulating pans, it is characterized in that: the thickness of described vacuum chamber layer (3) is 200-300 microns.

6. high heat conductivity heat-insulating pan according to claim 5 is characterized in that: described internal layer pot body (1) and an outer pot body (2) are aluminium or stainless steel or copper, and the material of internal layer pot body and outer pot body is identical.