CN202662676U - Light emitting diode device - Google Patents
Light emitting diode device Download PDFInfo
- Publication number
- CN202662676U CN202662676U CN 201220242081 CN201220242081U CN202662676U CN 202662676 U CN202662676 U CN 202662676U CN 201220242081 CN201220242081 CN 201220242081 CN 201220242081 U CN201220242081 U CN 201220242081U CN 202662676 U CN202662676 U CN 202662676U
- Authority
- CN
- China
- Prior art keywords
- emitting diode
- light
- diode chip
- backlight unit
- light emitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000002184 metal Substances 0.000 claims abstract description 25
- 239000000084 colloidal system Substances 0.000 claims description 38
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 22
- 238000009413 insulation Methods 0.000 claims description 6
- 238000001746 injection moulding Methods 0.000 claims description 4
- 230000000712 assembly Effects 0.000 claims 1
- 238000000429 assembly Methods 0.000 claims 1
- 230000004907 flux Effects 0.000 abstract description 10
- 239000003292 glue Substances 0.000 abstract 5
- 239000011159 matrix material Substances 0.000 description 19
- 230000000630 rising effect Effects 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 3
- 229920006375 polyphtalamide Polymers 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000002699 waste material Substances 0.000 description 3
- 238000007598 dipping method Methods 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000004643 material aging Methods 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
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- Led Device Packages (AREA)
- Planar Illumination Modules (AREA)
Abstract
The utility model discloses a light emitting diode device which comprises a light emitting diode chip, a glue housing and a lens. The light emitting diode device also comprises a metal heat conduction body and an electrode pin insulated from the metal heat conduction body, wherein the metal heat conduction body and the glue housing form a light emitting diode device bowl cup structure, an electrode on one end of the light emitting diode chip is electrically connected with the metal heat conduction body, an electrode on the other end of the light emitting diode chip is electrically connected with the electrode pin; meanwhile, the other scheme is as follows: the light emitting diode device has the structure that the two electrode pins are adopted for electrically connecting the light emitting diode chip with an external circuit, the glue housing forms the light emitting diode device bowl cup structure. Meanwhile, the light emitting diode device also comprises a heat conduction body, wherein the heat conduction body is penetrated and arranged on the bottom of the glue housing bowl cup structure. In the two schemes, the light emitting diode chip is arranged on the heat conduction body; and the height of the surface of the light emitting diode chip is larger than that of the glue housing. The light emitting diode device has the advantages of long service life and large light flux.
Description
Technical field
The utility model relates to light-emitting diode assembly, especially relates to a kind of long service life, the light-emitting diode assembly that luminous flux is large.
Background technology
Light-emitting diode (LED) is high because of its luminous efficiency, power consumption is few, safe and reliable and environmentally friendly advantage is subject to people and pays close attention to.Along with the development of LED technology, the application of LED is also more and more wider, and along with the extensive use of LED, the useful life of light-emitting diode and luminous flux also more and more are subject to people and pay close attention to.
In the use of LED, the principal element that affects the LED life-span is heat.In the LED course of work, the normal resistance energising can produce Joule heat, the PN junction heating of LED, and photon is absorbed and can produces heat, the led chip energising also can produce heat, and along with the accumulation of heat, the temperature of LED matrix raises, thereby make the performance degradation of chip, material aging, sex change.And along with the rising of LED matrix temperature, the firing rate of fluorescent material also can descend thereupon, and the decline of the firing rate of fluorescent material is irrecoverable, causes the LED luminosity constantly to reduce, photochromic changing.Therefore, the too high internal work temperature of LED matrix has shortened the useful life of LED matrix.
In the conventional art LED matrix, the bowl cup structure bottom that led chip places support and substrate to consist of, namely led chip places on the substrate, base plate for packaging material heat-conducting effect is bad, heat can't in time be derived, and causes the LED matrix temperature to raise, and has shortened LED matrix useful life.Simultaneously, the light that the conventional art led chip sends is subject to stopping of support and substrate, and the LED lighting angle generally is no more than 120 degree, has caused the bright dipping waste, causes the LED matrix luminous flux to reduce.
Therefore, be necessary to provide a kind of improved LED matrix, to overcome defects.
The utility model content
Technical problem to be solved in the utility model provides a kind of long service life, the light-emitting diode assembly that luminous flux is large.
To achieve these goals, the utility model is by the following technical solutions: a kind of light-emitting diode assembly, comprise light-emitting diode chip for backlight unit, colloid shell and lens, described lens are installed on described colloid shell and install, and: also comprise metal guide hot body and an electrode pin that arranges with the insulation of metal guide hot body; Described metal guide hot body and described colloid shell consist of light-emitting diode assembly bowl cup structure, and described light-emitting diode chip for backlight unit places on the described metal guide hot body; Described light-emitting diode chip for backlight unit one termination electrode is electrically connected with the metal guide hot body, and other end electrode is electrically connected with described electrode pin; Described light-emitting diode chip for backlight unit apparent height is higher than described colloid outer cover height.
As a kind of optimal technical scheme, described metal guide hot body is provided with conduction and extends, and described conduction is extended, described electrode pin is electrically connected described light-emitting diode chip for backlight unit with external circuit.
With the same design philosophy of such scheme, also can be by the following technical solutions: a kind of light-emitting diode assembly comprises light-emitting diode chip for backlight unit, colloid shell, lens and electrode pin; Described light-emitting diode chip for backlight unit is electrically connected with external electronic circuits by described electrode pin; Described colloid shell forms the bowl cup structure of light-emitting diode assembly; Described lens are installed on described colloid shell; And: also comprise heat carrier, described heat carrier is arranged at colloid shell bowl cup structure bottom; Described heat carrier and the insulation of described conductive electrode arrange, and described light-emitting diode chip for backlight unit places on the described heat carrier; Described light-emitting diode chip for backlight unit apparent height is higher than described colloid outer cover height.
As a kind of preferred technical scheme, described heat carrier runs through described colloid shell bowl cup structure bottom; Described heat carrier consists of by the first pedestal and with integrated the second pedestal of the first pedestal, described the first pedestal and the second pedestal are flat, described the first pedestal length is less than described the second pedestal length, and described light-emitting diode chip for backlight unit places described the first base-plates surface.
Preferred as above two kinds of technical schemes, described colloid shell, heat carrier and electrode pin integrated injection molding.
Light-emitting diode chip for backlight unit places on the heat carrier, can guarantee that the heat that produces in the led chip course of work in time conducts, and avoids the LED matrix excess Temperature that the LED life-span is exerted an influence; Led chip is higher than the colloid pedestal, and rising angle that can the Effective Raise LED matrix has been avoided the waste of bright dipping, has improved the luminous flux of LED matrix.Therefore, the utlity model has long service life, the advantage that luminous flux is large.
Description of drawings
Fig. 1 is the utility model light-emitting diode assembly embodiment one vertical view.
Fig. 2 is the utility model light-emitting diode assembly embodiment one cutaway view.
Fig. 3 is the utility model light-emitting diode assembly embodiment two vertical views.
Fig. 4 is the utility model light-emitting diode assembly embodiment two cutaway views.
Embodiment
Below in conjunction with accompanying drawing, introduce in detail the utility model light-emitting diode assembly.
Embodiment one: see also Fig. 1 and Fig. 2, a kind of light-emitting diode assembly, include colloid shell 1, in the present embodiment, colloid shell 1 adopts polyphtalamide (PPA) material, and PPA shell 1 forms the indent opening and forms the printing opacity mouth of light-emitting diode assembly bowl cup structures with metal guide hot body 5.Light-emitting diode chip for backlight unit 2 is arranged on above-mentioned bowl cup structure bottom, is arranged on metal guide hot body 5 surfaces; One termination electrode of light-emitting diode chip for backlight unit 2 is electrically connected with metal guide hot body 5, and the other end is electrically connected with electrode pin 4.Electrode pin 4 arranges with 5 insulation of metal guide hot body.As shown in Figure 2, colloid shell 1 is equipped with lens 3, and lens 3 place light-emitting diode assembly bowl cup structure top.The present embodiment light-emitting diode assembly is provided with the packaging plastic (not shown), fills bowl cup structure and lens 3 and applies light-emitting diode chip for backlight unit 2, according to the luminous needs of light-emitting diode assembly, is mixed with fluorescent material in the packaging plastic.
As shown in Figure 2, metal guide hot body 5 is provided with and extends 51, extends 51 another electrode pins relative with electrode pin 4 that are the utility model light-emitting diode assembly.Light-emitting diode chip for backlight unit 2 extends 51 by electrode pin 4 and metal guide hot body 5 top electrodes and is electrically connected with external circuit.
As shown in Figure 2, light-emitting diode chip for backlight unit 2 upper surfaces are higher than colloid shell 1 sidewall height, can effectively avoid stopping and absorbing of 1 pair of light of colloid shell, increase the LED matrix rising angle, improve the LED matrix luminous flux.
In the utility model light-emitting diode assembly, colloid shell 1, electrode pin 4 and metal guide hot body 5 integrated injection moldings are simplified production technology, simultaneously, can guarantee the installation of LED matrix each several part firmly, improve the LED matrix reliability.
In the present embodiment, metal guide hot body 5 is the good metallic conductor of thermal conductivity.Light-emitting diode chip for backlight unit 2 places on the metal guide hot body 5, and the heat that produces in the time of can guaranteeing light-emitting diode chip for backlight unit 2 energising is in time derived, and effectively reduces the light-emitting diode assembly temperature, improves light-emitting diode assembly useful life.
Embodiment two: the difference of the present embodiment and embodiment one is the heat carrier shape.As shown in Figures 3 and 4, the present embodiment LED matrix comprises colloid shell 1,2, two electrode pins 4 of light-emitting diode chip for backlight unit and heat carrier 52.Colloid shell 1 forms the bowl cup structure; Light-emitting diode chip for backlight unit 2 is arranged on the heat carrier 52, and is electrically connected with external circuit by electrode pin 4.
As shown in Figure 4, in the present embodiment, heat carrier 52 is arranged at the bowl cup structure bottom that colloid shell 1 forms, and arranges by colloid shell 1 and electrode pin 4 insulation.Heat carrier 52 runs through the bowl cup structure bottom that colloid shell 1 forms, heat carrier 52 consists of by the first pedestal and with integrated the second pedestal of the first pedestal, described the first pedestal and the second pedestal are flat, described the first pedestal length is less than described the second pedestal length, described the first base-plates surface is higher than 1 bowl of cup structure bottom surface of colloid shell, light-emitting diode chip for backlight unit 2 places described the first base-plates surface, light-emitting diode chip for backlight unit 2 upper level are higher than colloid shell 1 sidewall height, to avoid stopping and absorbing of 1 pair of light of colloid shell, increase rising angle.
In the present embodiment, heat carrier 52 is the good material of thermal conductivity.Light-emitting diode die 2 places on the heat carrier 52, and the heat that produces during light-emitting diode die 2 work can in time conduct by heat carrier 52, can effectively reduce the light-emitting diode assembly temperature, prolongs light-emitting diode assembly useful life.
The utility model light-emitting diode assembly, because led chip is arranged on the heat carrier, can in time the heat that produces in the LED course of work be passed by heat carrier, effectively reduce the light-emitting diode assembly internal temperature, reduce light decay and device aging that Yin Gaowen causes; Simultaneously, the led chip height is high in the utility model LED matrix, avoids shell that light is stopped, improves rising angle, reduces the light waste, increases luminous flux.Therefore, the utility model LED matrix physical life is long, and rising angle is high, and luminous flux is large.
Be the utility model case study on implementation only below, be not limited to the utility model, as long as the equivalence that those of ordinary skills do according to the utility model institute disclosure is modified or changed, all should include in the protection range of putting down in writing in claims.
Claims (5)
1. a light-emitting diode assembly comprises light-emitting diode chip for backlight unit, and colloid shell and lens, described lens are installed on the described colloid shell, it is characterized in that: also comprise metal guide hot body and an electrode pin that arranges with the insulation of metal guide hot body; Described metal guide hot body and described colloid shell consist of light-emitting diode assembly bowl cup structure, and described light-emitting diode chip for backlight unit places on the described metal guide hot body; Described light-emitting diode chip for backlight unit one termination electrode is electrically connected with the metal guide hot body, and other end electrode is electrically connected with described electrode pin; Described light-emitting diode chip for backlight unit apparent height is higher than described colloid outer cover height.
2. light-emitting diode assembly according to claim 1 is characterized in that: described metal guide hot body is provided with conduction and extends, and described conduction is extended, described electrode pin is electrically connected described light-emitting diode chip for backlight unit with external circuit.
3. a light-emitting diode assembly comprises light-emitting diode chip for backlight unit, colloid shell, lens and electrode pin; Described light-emitting diode chip for backlight unit is electrically connected with external electronic circuits by described electrode pin; Described colloid shell forms the bowl cup structure of light-emitting diode assembly; Described lens are installed on described colloid shell; It is characterized in that: also comprise heat carrier, described heat carrier is arranged at colloid shell bowl cup structure bottom; Described heat carrier and the insulation of described conductive electrode arrange, and described light-emitting diode chip for backlight unit places on the described heat carrier; Described light-emitting diode chip for backlight unit apparent height is higher than described colloid outer cover height.
4. light-emitting diode assembly according to claim 3 is characterized in that: described heat carrier runs through described colloid shell bowl cup structure bottom; Described heat carrier consists of by the first pedestal and with integrated the second pedestal of the first pedestal, described the first pedestal and the second pedestal are flat, described the first pedestal length is less than described the second pedestal length, and described light-emitting diode chip for backlight unit places described the first base-plates surface.
5. it is characterized in that: described colloid shell, heat carrier and electrode pin integrated injection molding according to claim 1 or 3 described light-emitting diode assemblies.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220242081 CN202662676U (en) | 2012-05-28 | 2012-05-28 | Light emitting diode device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220242081 CN202662676U (en) | 2012-05-28 | 2012-05-28 | Light emitting diode device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202662676U true CN202662676U (en) | 2013-01-09 |
Family
ID=47457560
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220242081 Expired - Lifetime CN202662676U (en) | 2012-05-28 | 2012-05-28 | Light emitting diode device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202662676U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110050382A (en) * | 2016-12-16 | 2019-07-23 | 三洋电机株式会社 | For motor vehicle electronic equipment battery |
-
2012
- 2012-05-28 CN CN 201220242081 patent/CN202662676U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110050382A (en) * | 2016-12-16 | 2019-07-23 | 三洋电机株式会社 | For motor vehicle electronic equipment battery |
| CN110050382B (en) * | 2016-12-16 | 2022-08-05 | 三洋电机株式会社 | Battery for electronic device for vehicle |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee after: Goertek Inc. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: Goertek Inc. |
|
| CX01 | Expiry of patent term |
Granted publication date: 20130109 |
|
| CX01 | Expiry of patent term |